TWI266392B - Stiffner ring and application thereof - Google Patents

Stiffner ring and application thereof

Info

Publication number
TWI266392B
TWI266392B TW94131536A TW94131536A TWI266392B TW I266392 B TWI266392 B TW I266392B TW 94131536 A TW94131536 A TW 94131536A TW 94131536 A TW94131536 A TW 94131536A TW I266392 B TWI266392 B TW I266392B
Authority
TW
Taiwan
Prior art keywords
stiffner
ring
application
adhesion layer
substrate
Prior art date
Application number
TW94131536A
Other languages
Chinese (zh)
Other versions
TW200713530A (en
Inventor
Chia-Hsu Lin
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW94131536A priority Critical patent/TWI266392B/en
Application granted granted Critical
Publication of TWI266392B publication Critical patent/TWI266392B/en
Publication of TW200713530A publication Critical patent/TW200713530A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Formation Of Insulating Films (AREA)

Abstract

A stiffner ring and an application thereof are described. The stiffner ring is suitable for adhering on a surface of a substrate of an electronic device, in which the surface of the substrate includes an adhesion layer formed thereon. The stiffner ring comprises a body and an arc portion set on a surface of the body. When the stiffner ring is adhered to the surface of the substrate by the adhesion layer, the arc portion is jointed with the adhesion layer.
TW94131536A 2005-09-13 2005-09-13 Stiffner ring and application thereof TWI266392B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94131536A TWI266392B (en) 2005-09-13 2005-09-13 Stiffner ring and application thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94131536A TWI266392B (en) 2005-09-13 2005-09-13 Stiffner ring and application thereof

Publications (2)

Publication Number Publication Date
TWI266392B true TWI266392B (en) 2006-11-11
TW200713530A TW200713530A (en) 2007-04-01

Family

ID=38191564

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94131536A TWI266392B (en) 2005-09-13 2005-09-13 Stiffner ring and application thereof

Country Status (1)

Country Link
TW (1) TWI266392B (en)

Also Published As

Publication number Publication date
TW200713530A (en) 2007-04-01

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