TWI265595B - Method for fabricating conductive lines and shortening the spacing of conductive lines and pattern - Google Patents

Method for fabricating conductive lines and shortening the spacing of conductive lines and pattern

Info

Publication number
TWI265595B
TWI265595B TW94131988A TW94131988A TWI265595B TW I265595 B TWI265595 B TW I265595B TW 94131988 A TW94131988 A TW 94131988A TW 94131988 A TW94131988 A TW 94131988A TW I265595 B TWI265595 B TW I265595B
Authority
TW
Taiwan
Prior art keywords
conductive lines
conductive layer
spacing
shortening
pattern
Prior art date
Application number
TW94131988A
Other languages
English (en)
Other versions
TW200713496A (en
Inventor
Liang-Chuan Lai
Pin-Yao Wang
Shih-Chi Lin
Original Assignee
Powerchip Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Powerchip Semiconductor Corp filed Critical Powerchip Semiconductor Corp
Priority to TW94131988A priority Critical patent/TWI265595B/zh
Application granted granted Critical
Publication of TWI265595B publication Critical patent/TWI265595B/zh
Publication of TW200713496A publication Critical patent/TW200713496A/zh

Links

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
TW94131988A 2005-09-16 2005-09-16 Method for fabricating conductive lines and shortening the spacing of conductive lines and pattern TWI265595B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94131988A TWI265595B (en) 2005-09-16 2005-09-16 Method for fabricating conductive lines and shortening the spacing of conductive lines and pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94131988A TWI265595B (en) 2005-09-16 2005-09-16 Method for fabricating conductive lines and shortening the spacing of conductive lines and pattern

Publications (2)

Publication Number Publication Date
TWI265595B true TWI265595B (en) 2006-11-01
TW200713496A TW200713496A (en) 2007-04-01

Family

ID=38122254

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94131988A TWI265595B (en) 2005-09-16 2005-09-16 Method for fabricating conductive lines and shortening the spacing of conductive lines and pattern

Country Status (1)

Country Link
TW (1) TWI265595B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8440576B2 (en) 2008-04-25 2013-05-14 Macronix International Co., Ltd. Method for pitch reduction in integrated circuit fabrication

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI393216B (zh) * 2007-11-01 2013-04-11 Ind Tech Res Inst 電阻式記憶體以及其製造方法
KR102323251B1 (ko) 2015-01-21 2021-11-09 삼성전자주식회사 반도체 소자 및 반도체 소자의 제조방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8440576B2 (en) 2008-04-25 2013-05-14 Macronix International Co., Ltd. Method for pitch reduction in integrated circuit fabrication

Also Published As

Publication number Publication date
TW200713496A (en) 2007-04-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees