TWI265291B - Testing apparatus for measuring the bonding strength of solder balls - Google Patents

Testing apparatus for measuring the bonding strength of solder balls

Info

Publication number
TWI265291B
TWI265291B TW94135230A TW94135230A TWI265291B TW I265291 B TWI265291 B TW I265291B TW 94135230 A TW94135230 A TW 94135230A TW 94135230 A TW94135230 A TW 94135230A TW I265291 B TWI265291 B TW I265291B
Authority
TW
Taiwan
Prior art keywords
testing apparatus
measuring
bonding strength
solder balls
shank
Prior art date
Application number
TW94135230A
Other languages
Chinese (zh)
Other versions
TW200714895A (en
Inventor
Yi-Shao Lai
Wei-Chung Wang
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW94135230A priority Critical patent/TWI265291B/en
Application granted granted Critical
Publication of TWI265291B publication Critical patent/TWI265291B/en
Publication of TW200714895A publication Critical patent/TW200714895A/en

Links

Abstract

A testing apparatus is adapted to measuring the bonding strength of solder balls with a substrate. The testing apparatus comprises a base, a gripper and an impact head. The gripper has a shank and a jaw. The jaw is located at an end of the shank, and is used to fix clip the solders. The other end of the shank is mounted on the base. The impact head keeps a predetermined distance away from the substrate and accelerating in the predetermined distance to bump the substrate.
TW94135230A 2005-10-07 2005-10-07 Testing apparatus for measuring the bonding strength of solder balls TWI265291B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94135230A TWI265291B (en) 2005-10-07 2005-10-07 Testing apparatus for measuring the bonding strength of solder balls

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94135230A TWI265291B (en) 2005-10-07 2005-10-07 Testing apparatus for measuring the bonding strength of solder balls

Publications (2)

Publication Number Publication Date
TWI265291B true TWI265291B (en) 2006-11-01
TW200714895A TW200714895A (en) 2007-04-16

Family

ID=38122171

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94135230A TWI265291B (en) 2005-10-07 2005-10-07 Testing apparatus for measuring the bonding strength of solder balls

Country Status (1)

Country Link
TW (1) TWI265291B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107073527A (en) * 2014-07-25 2017-08-18 赛世铁克 Solder removes system

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105866022A (en) * 2016-05-31 2016-08-17 河南宝润机械有限公司 Steel bar mesh checking device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107073527A (en) * 2014-07-25 2017-08-18 赛世铁克 Solder removes system

Also Published As

Publication number Publication date
TW200714895A (en) 2007-04-16

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