TWI264267B - Dissipation module with noise reduction function - Google Patents

Dissipation module with noise reduction function

Info

Publication number
TWI264267B
TWI264267B TW093115561A TW93115561A TWI264267B TW I264267 B TWI264267 B TW I264267B TW 093115561 A TW093115561 A TW 093115561A TW 93115561 A TW93115561 A TW 93115561A TW I264267 B TWI264267 B TW I264267B
Authority
TW
Taiwan
Prior art keywords
noise reduction
centrifugal fan
reduction function
dissipation module
fin set
Prior art date
Application number
TW093115561A
Other languages
Chinese (zh)
Other versions
TW200539791A (en
Inventor
Ping-Sheng Kao
Yu-Nien Huang
Tsan-Nan Chien
Dennis Liu
Original Assignee
Quanta Comp Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Quanta Comp Inc filed Critical Quanta Comp Inc
Priority to TW093115561A priority Critical patent/TWI264267B/en
Priority to US11/034,859 priority patent/US20050263268A1/en
Publication of TW200539791A publication Critical patent/TW200539791A/en
Application granted granted Critical
Publication of TWI264267B publication Critical patent/TWI264267B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/66—Combating cavitation, whirls, noise, vibration or the like; Balancing
    • F04D29/661—Combating cavitation, whirls, noise, vibration or the like; Balancing especially adapted for elastic fluid pumps
    • F04D29/667—Combating cavitation, whirls, noise, vibration or the like; Balancing especially adapted for elastic fluid pumps by influencing the flow pattern, e.g. suppression of turbulence
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Abstract

A dissipation device includes a dissipation fin set and a centrifugal fan. The centrifugal fan outputs airflow toward the dissipation fin set to remove the heat from it. The centrifugal fan includes a centrifugal impeller mounted on a motor. An outer housing houses the motor and the centrifugal impeller therein. An inner wall of the housing's outlet has feathered structure to reduce noises. The dissipation fin set includes a fin structure adjacent to a heat source, as well as an airflow channel housing. The airflow channel includes featured structures for reducing noises.
TW093115561A 2004-05-31 2004-05-31 Dissipation module with noise reduction function TWI264267B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW093115561A TWI264267B (en) 2004-05-31 2004-05-31 Dissipation module with noise reduction function
US11/034,859 US20050263268A1 (en) 2004-05-31 2005-01-14 Heat dissipation module with noise reduction

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093115561A TWI264267B (en) 2004-05-31 2004-05-31 Dissipation module with noise reduction function

Publications (2)

Publication Number Publication Date
TW200539791A TW200539791A (en) 2005-12-01
TWI264267B true TWI264267B (en) 2006-10-11

Family

ID=35423933

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093115561A TWI264267B (en) 2004-05-31 2004-05-31 Dissipation module with noise reduction function

Country Status (2)

Country Link
US (1) US20050263268A1 (en)
TW (1) TWI264267B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100159816A1 (en) * 2008-12-23 2010-06-24 International Business Machines Corporation Converging segments cooling
WO2014175975A1 (en) * 2013-04-26 2014-10-30 CoolChip Technologies, Inc. Kinetic heat sink with stationary fins
CN111212544A (en) * 2018-11-21 2020-05-29 英业达科技有限公司 Electronic device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5418339A (en) * 1993-11-04 1995-05-23 Minnesota Mining And Manufacturing Company Pneumatic tool having noise reducing muffling structure
KR0136305Y1 (en) * 1996-09-10 1999-02-01 최진호 Suction nozzle of a vacuum cleaner
US6113485A (en) * 1997-11-26 2000-09-05 Advanced Micro Devices, Inc. Duct processor cooling for personal computer
US6422655B1 (en) * 1999-11-12 2002-07-23 Continental General Tire, Inc. Tire inside noise absorber
JP3690658B2 (en) * 2001-07-13 2005-08-31 インターナショナル・ビジネス・マシーンズ・コーポレーション Heat sink, cooling member, semiconductor substrate cooling apparatus, computer, and heat dissipation method

Also Published As

Publication number Publication date
US20050263268A1 (en) 2005-12-01
TW200539791A (en) 2005-12-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees