TWI263766B - Heat pipe - Google Patents

Heat pipe

Info

Publication number
TWI263766B
TWI263766B TW93105066A TW93105066A TWI263766B TW I263766 B TWI263766 B TW I263766B TW 93105066 A TW93105066 A TW 93105066A TW 93105066 A TW93105066 A TW 93105066A TW I263766 B TWI263766 B TW I263766B
Authority
TW
Taiwan
Prior art keywords
pipe
wick
heat pipe
layer
conductive materials
Prior art date
Application number
TW93105066A
Other languages
Chinese (zh)
Other versions
TW200528679A (en
Inventor
Wen-Jeng Huang
Chuan-De Huang
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW93105066A priority Critical patent/TWI263766B/en
Publication of TW200528679A publication Critical patent/TW200528679A/en
Application granted granted Critical
Publication of TWI263766B publication Critical patent/TWI263766B/en

Links

Landscapes

  • Thermal Insulation (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat pipe includes a pipe, a wick and an operating fluid. The wick is disposed inside the pipe and contacted to inside walls of the pipe; and the operating fluid is sealed in the pipe and soaked in the wick. The pipe includes a thermal conductive materials layer and a carbon nanomaterials layer formed on an outer surface of the thermal conductive materials layer. Due to the carbon nanomaterials layer, a thermal resistant of the pipe is decreased and a surface area of the pipe is increased. In addition, a promoted thermal conductivity of the heat pipe is achieved.
TW93105066A 2004-02-27 2004-02-27 Heat pipe TWI263766B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93105066A TWI263766B (en) 2004-02-27 2004-02-27 Heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93105066A TWI263766B (en) 2004-02-27 2004-02-27 Heat pipe

Publications (2)

Publication Number Publication Date
TW200528679A TW200528679A (en) 2005-09-01
TWI263766B true TWI263766B (en) 2006-10-11

Family

ID=37967157

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93105066A TWI263766B (en) 2004-02-27 2004-02-27 Heat pipe

Country Status (1)

Country Link
TW (1) TWI263766B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479114B (en) * 2012-04-09 2015-04-01 Heat transfer structure, method of manufacturing heat transfer structure and heat dissipating device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108627038A (en) * 2018-06-15 2018-10-09 杭州熵能热导科技有限公司 A kind of heat pipe

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479114B (en) * 2012-04-09 2015-04-01 Heat transfer structure, method of manufacturing heat transfer structure and heat dissipating device

Also Published As

Publication number Publication date
TW200528679A (en) 2005-09-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees