TWI263766B - Heat pipe - Google Patents
Heat pipeInfo
- Publication number
- TWI263766B TWI263766B TW93105066A TW93105066A TWI263766B TW I263766 B TWI263766 B TW I263766B TW 93105066 A TW93105066 A TW 93105066A TW 93105066 A TW93105066 A TW 93105066A TW I263766 B TWI263766 B TW I263766B
- Authority
- TW
- Taiwan
- Prior art keywords
- pipe
- wick
- heat pipe
- layer
- conductive materials
- Prior art date
Links
Landscapes
- Thermal Insulation (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat pipe includes a pipe, a wick and an operating fluid. The wick is disposed inside the pipe and contacted to inside walls of the pipe; and the operating fluid is sealed in the pipe and soaked in the wick. The pipe includes a thermal conductive materials layer and a carbon nanomaterials layer formed on an outer surface of the thermal conductive materials layer. Due to the carbon nanomaterials layer, a thermal resistant of the pipe is decreased and a surface area of the pipe is increased. In addition, a promoted thermal conductivity of the heat pipe is achieved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93105066A TWI263766B (en) | 2004-02-27 | 2004-02-27 | Heat pipe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93105066A TWI263766B (en) | 2004-02-27 | 2004-02-27 | Heat pipe |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200528679A TW200528679A (en) | 2005-09-01 |
TWI263766B true TWI263766B (en) | 2006-10-11 |
Family
ID=37967157
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW93105066A TWI263766B (en) | 2004-02-27 | 2004-02-27 | Heat pipe |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI263766B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI479114B (en) * | 2012-04-09 | 2015-04-01 | Heat transfer structure, method of manufacturing heat transfer structure and heat dissipating device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108627038A (en) * | 2018-06-15 | 2018-10-09 | 杭州熵能热导科技有限公司 | A kind of heat pipe |
-
2004
- 2004-02-27 TW TW93105066A patent/TWI263766B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI479114B (en) * | 2012-04-09 | 2015-04-01 | Heat transfer structure, method of manufacturing heat transfer structure and heat dissipating device |
Also Published As
Publication number | Publication date |
---|---|
TW200528679A (en) | 2005-09-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |