TWI257345B - Over-molding product and method of making same - Google Patents

Over-molding product and method of making same Download PDF

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Publication number
TWI257345B
TWI257345B TW93135069A TW93135069A TWI257345B TW I257345 B TWI257345 B TW I257345B TW 93135069 A TW93135069 A TW 93135069A TW 93135069 A TW93135069 A TW 93135069A TW I257345 B TWI257345 B TW I257345B
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Taiwan
Prior art keywords
molded article
polymer material
overmolded
encapsulated
rubber
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TW93135069A
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Chinese (zh)
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TW200616783A (en
Inventor
Wen-Hong Huang
Chun-Pao Chen
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Hannspree Inc
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Priority to TW93135069A priority Critical patent/TWI257345B/en
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Publication of TWI257345B publication Critical patent/TWI257345B/en

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  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

An over-molding product comprises: a polymer with a high flexural strength not less than 900 kg/cm<2>; and an over-molding layer on at least a portion of the polymer, the over-molding layer being a thermoplastic material.

Description

1257345 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種包膠成型品以及製作該包膠成型品之方法，特別 是有關於一種可達到被包膠之成型品大抵無翹曲之包膠成型品及其製法。 【先前技術】 隨著科技的演進，對於產品尤其係電子產品之包膠技術也不斷創新， 以提昇表面處理技術。 ，-般而言，為達成產品在絕緣、美觀等之目的，因此常需運用包膠技 術’習知常用之包膠方式，包括：以橡膠漆直接喷附於欲包膠之素材表面、 利用具黏轉材將包膠材料職於欲包膠之素材表面上n利用上述 兩種方式所形成之包膠成型品，易因熱脹冷縮錢度變鱗自朗素而造 ，附著力不足進而產生繼現象，導致產品使用壽命縮短。目前較佳之^ 勝方式為射i{成型，其可有效改善上述素材與包膠材附著力不足之缺點， 且更可提絲面美觀之包膠產品。f界相之包膠方式—般包含下列步驟·· -利用模具成型素材； 將欲包膠素材置於模具的凹孔中； -在高溫下導入包騎料於模具和欲包膠素材之間的凹孔中； -自凹孔鬆脫已包膠的元件。 材料2 “於⑽各種電子組件。而—般的被包膠素材係一塑 丙勝丁二渗苯乙浠(aC咖1她^㈣一，A峋 多“、、弟1A圖〜弟1B圖，其係顯干習知 素材變形^^ + 與齡碰讀收縮而此 文办之過私不思圖。在習知之夸好由顿^、本丨 H自之常材包I成型之過程t，包膠材5包j 箭頭方向所示。再者，加上鮮之產^度收縮，如第1场 素材7會沿_5之㈣之._度不足，_亥高分: 之收‘方向形成固定方向之嚴重的趣曲變形，如第^ 〇801-A311〇7TWF(5.0) 5 1257345 圖所示。 基於上述包膠成品錢形之闕，如何形成咖且不易變形之包膠成 型品，便成為業界亟需解決之重要課題。 【發明内容】 有鑑於此，本發明的目的係提供一種包膠成型品以及製作包膠成型品 之方法’以提供-種彎曲強度足以抵抗包膠材經冷卻產生之收縮力的包膠 素材，以形成耐用且不易變形之包膠成型品。 為達成上述目的，本發明係提供—種包膠成型品，包括：-彎曲強度 fexural Strength)不小於900kg/cm2之高強度高分子素材；以及，一包膠層， 設置於該素材之至少部份表面，該包縣係—熱塑性膠材。 為達成上述目的，本發明另提供一種製作包膠成型品之方法，包括·· 利用素材杈具成型彎曲強度不小於900kg/cm2之高強度高分子素材；取出 该南分子储，將其置人—具有凹孔之包賴具巾；在i85_2Q5c)c下導入 匕膠材料於該具有凹孔之包膠模具中’以使該包膠材料填人該凹孔中並 覆蓋於該高分子讀之—表面而職—包_，其巾該包縣係—熱塑性 膠材’硬化違包膠材料；以及，自該包膠模具取出已包勝的高分子素材並 施行一冷卻步驟，以得到一不翹曲變形之包膠成型品。 透過本發明利用成型彎曲強度不小於900kg/cm2之高強度高分子素 材可提供考曲強度足以抵抗包膠材經冷卻產生之收縮力的包膠素材組合 物’以形成耐用且不易變形之包膠成型品。 為使本赉明之上述及其他目的、特徵和優點能更明顯易懂，下文特舉 數個較佳實施例，並配合雌圖式做詳細說明。 【實施方式】 请參照第2圖，其係顯示本發明之高分子素材之成型步驟示意圖。利 〇801-A311〇7TWF(5.〇) 6 1257345 用-素材模具10細-彎㈣度不小於_kg/em2之高強度高分子素材 20 ’本發明係以使用彎曲強度為驚觸啤細2之素材較佳。二:分子素 材20可使用例如：聚苯醚(1)〇1勉_咖〇xide)，pp〇)、聚碳酸醋㈣ carbonate，PC)或PC/ABS複合材，其中並以聚碳_旨較佳。上述高分子素材 20更可視貫際情況之需要，添加〇1奶％至3_%之纖維以進一步地增加 其彎曲強度，其中上述纖維之含量係以素材之總重量為基準。除上述^高 分子素材2〇外，柯仙添加械狀了二秦苯ι〇η2 butadiene styrene，ABS)，ABS在添加〇.!树％至3_%之纖維後，其彎曲強 度亦可達至不小於900kg/cm2之高強度要求。本發明所添加之纖維係以無機 纖維較佳，例如：石棉、玻璃或碳。 … 此外，冋分子素材20亦可視實際需求，再添加填充料、補強劑、加工 助劑、流動促進劑或顏料。 請參照第3圖，其係顯示本發明之包膠成型品之包膠步驟示意圖。取 出高分子素材20，將其置入一具有凹孔之包膠模具中3〇，接著在i85_2〇5〇c 下導入-包膠材料40玲該具有凹孔50之包膠模具3〇巾，以使該包膠材料 40填入該凹孔50中並覆蓋於該高分子素材2〇之一表面而形成一包膠層 40。其中，當該包膠層40形成於該高分子素材2〇上時，該包膠層4〇與該 南分子素材20接觸之界面會形成一互融層(未圖示），該互融層係由該包膠 層40與該高分子素材20互相熔融形成。在此處，包膠層4〇係一熱塑性膠 材’其可擇自由t對本一曱酸二乙酯塑膠②咖故㈣⑽—哪她士把，pET)、 聚碳酸鹽、聚醯胺、聚酮、聚對苯二甲酸二丁酯塑膠 ㈣ybuthylenethereplithalate，PBT)、聚醚酮醚酮酮（p〇lyetherket〇ne etherket_ketone，PEKEKK)、聚醚酮、聚 笨硫化物、聚苯乙醚、聚苯硫化楓、聚楓、聚醚楓、聚醯亞胺、聚醚醯亞 胺、聚醯胺醯亞胺、聚醯亞胺碉、熱塑性聚胺基甲酸酯(therm〇plasiic polyurcthane，TPU)，和前述物質之組合物所組成之族群。於導入包膠材料 0801-A31107TWF(5.0) 7 1257345 〇至減後:接著於35_45〇c下硬化包膠材料恥。 請參照第4圖，其係顯示本發明之包膠成型 模具3〇取出已完成包膠而包覆有包膠材料4〇之特意圖。自包膠 材20未包膠之另—表面結合 '、材20並冷卻之，並於素 60。此外，構件7〇之—她6 ^到一不翹曲變形之⑽成型品 發明細_，餅7G 峨佳，但本 之材料組成。本發明之包膠成型品60可材2_ 件上，例如作為顯示器外殼的—部分 T- LCD)之外觀構 等等。然而包膠翻。6G之^、，χ 為液痛示器之功能鍵面板 之領域中。 述亚不以此為限，亦可應用至其他電子產品 由本t明之利用成型彎曲強度大_ 9()()_1()(K)kg/em2之高強度高分 έ可提供考曲強度足以抵抗包膠材經冷卻產生之收縮力的包膠素材 、、且a物，以形成耐用且不易變形之包膠成型品。 紀^本么月已以數個較佳實施例揭露如上，然其並非用以限定本發 明’任何«此微藝者，作些許的更動與潤飾應不脫離本發明之範圍， 本發明之賴翻當辦料娜騎狀者及其解物為準。 【圖式簡單說明】 第1A圖〜第1B _'顯示習知包膠材料經冷卻後大幅收縮而使得素材 變形之過程示意圖。 第2圖係顯示本發明之高分子素材之成型步驟示意圖。 第3圖係顯示本發明之包膠成型品之包膠步驟示意圖。 第4圖係顯示本發明之包膠成型品之剖面示意圖。 7〜素材； 【主要元件符號說明】 5〜包膠材； 0801-A31107TWF(5.0) 8 1257345 ίο〜素材模具； 30〜包膠模具； 50〜凹孔； 70〜構件0 20〜高分子素材； 40〜包膠材料， 60〜包膠成型品； 0801-A31107TWF(5.0)1257345 IX. Description of the Invention: [Technical Field] The present invention relates to an encapsulated molded article and a method of producing the same, and more particularly to a molded article which can be coated with a large amount without warping The rubberized molding and its preparation method. [Prior Art] With the evolution of technology, the encapsulation technology for products, especially electronic products, has been continuously innovated to enhance surface treatment technology. In general, in order to achieve the purpose of insulation, aesthetics, etc., it is often necessary to use the encapsulation technology of the conventionally used encapsulation method, including: directly spraying the rubber paint on the surface of the material to be coated, and utilizing With adhesive material, the rubber-coated material is used on the surface of the material to be encapsulated. The plastic-formed product formed by the above two methods is easy to be formed due to thermal expansion and shrinkage, and the adhesion is insufficient. This leads to a phenomenon that leads to a shortened product life. At present, the preferred method of winning is the injection molding, which can effectively improve the shortcomings of the above-mentioned materials and the insufficient adhesion of the rubber-clad material, and can also provide a rubber-coated product with a beautiful silk surface. The encapsulation method of the f-phase phase generally includes the following steps: - molding the material by using the mold; placing the material to be encapsulated in the concave hole of the mold; - introducing the package at a high temperature between the mold and the material to be coated In the recessed hole; - Loosen the encapsulated component from the recessed hole. Material 2 "In (10) various electronic components. And the general encapsulation material is a plastic Bingsheng Ding two infiltration benzene 浠 (aC coffee 1 her ^ (four) one, A 峋 more ",, brother 1A map ~ brother 1B map , the system is dry and well-known material deformation ^^ + and the age of the reading contraction and this article is too private to think about it. In the knowledge of the praise of the good ^, the original H from the constant material package I molding process t , the package of rubber material 5 package j arrow direction. In addition, plus the production of the new ^ degree contraction, such as the first field material 7 will be along _5 (four). _ degree is insufficient, _ hai high score: the collection ' The direction forms a serious distortion of the fixed direction, as shown in Fig. 〇 801-A311〇7TWF(5.0) 5 1257345. Based on the above-mentioned rubber-coated product, how to form a rubber-coated and non-deformable rubber-coated product SUMMARY OF THE INVENTION In view of the above, an object of the present invention is to provide an overmolded article and a method for producing an overmolded article to provide a bending strength sufficient to resist the rubberized material. The encapsulated material of the contraction force generated by cooling to form a durable and non-deformable encapsulated molded article. To achieve the above purpose, the present invention Providing a rubber-molded article comprising: - a flexural strength, a high-strength polymer material of not less than 900 kg/cm 2 ; and a rubber layer disposed on at least a portion of the surface of the material, the package county - Thermoplastic glue. In order to achieve the above object, the present invention further provides a method for producing an encapsulated molded article, comprising: forming a high-strength polymer material having a bending strength of not less than 900 kg/cm 2 using a material cooker; taking out the southern molecular reservoir and placing the same - a cover towel having a recessed hole; introducing a silicone material in the over-molded plastic mold under i85_2Q5c)c to fill the recessed hole with the encapsulated material and covering the polymer - the surface and the job - package _, the towel of the county - thermoplastic glue - hardening the plastic material; and, from the plastic mold to take out the winning polymer material and perform a cooling step to get a no Warped and deformed encapsulated molded article. By using the high-strength polymer material having a bending strength of not less than 900 kg/cm 2 by the present invention, an encapsulating material composition having a test strength sufficient to resist the shrinkage force generated by the cooling of the rubber material can be provided to form a durable and non-deformable rubber compound. Molded product. The above and other objects, features and advantages of the present invention will become more apparent and understood. [Embodiment] Please refer to Fig. 2, which is a schematic view showing a molding step of the polymer material of the present invention.利〇801-A311〇7TWF(5.〇) 6 1257345 Use - material mold 10 fine-bend (four) degree not less than _kg/em2 high-strength polymer material 20 'This invention uses bending strength as a shocking beer 2 material is better. 2: The molecular material 20 can be, for example, polyphenylene ether (1) 〇 1 勉 _ 〇 〇 ide , 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 旨 旨Preferably. The above polymer material 20 may further increase the flexural strength by adding 〇1% to 3% of the fiber according to the need of the continuous condition, wherein the content of the fiber is based on the total weight of the material. In addition to the above-mentioned 2 polymer material 2〇, Kexian added a mechanically shaped bismuth bis2 butadiene styrene (ABS), and the bending strength of ABS after adding 〇.! tree to 3% of the fiber High strength requirements of not less than 900kg/cm2. The fibers to be added in the present invention are preferably inorganic fibers such as asbestos, glass or carbon. In addition, the molecular material 20 can also be added with fillers, reinforcing agents, processing aids, flow promoters or pigments depending on actual needs. Please refer to Fig. 3, which is a schematic view showing the encapsulation step of the encapsulated molded article of the present invention. The polymer material 20 is taken out, placed in an encapsulating mold having a concave hole, and then introduced into the encapsulating material 40 under the i85_2〇5〇c, and the encapsulating mold 3 having the concave hole 50 is wiped. The encapsulating material 40 is filled in the recess 50 and covers one surface of the polymer material 2 to form an encapsulation layer 40. Wherein, when the encapsulation layer 40 is formed on the polymer material 2, an interface between the encapsulation layer 4 and the southern molecular material 20 forms an inter-melting layer (not shown), and the inter-melting layer The encapsulating layer 40 and the polymer material 20 are mutually melted. Here, the rubberized layer 4 is a thermoplastic rubber material, which can be selected as the free t-p-butyl phthalate plastic 2 (4) (10) - which she puts, pET), polycarbonate, polyamine, poly Ketone, polybutylene terephthalate plastic (4) ybuthylenethereplithalate, PBT), polyether ketone ether ketone ketone (p〇lyetherket〇ne etherket_ketone, PEKEKK), polyether ketone, poly sulphide, polyphenylene ether, polyphenyl sulfide , poly maple, polyether maple, polythenimine, polyether quinone imine, polyamidimide, polyamidoxime, thermoplastic polyurethane (therm〇plasiic polyurcthane, TPU), and the foregoing a group of substances composed of a composition. After the introduction of the rubber material 0801-A31107TWF (5.0) 7 1257345 〇 to the reduction: then harden the rubber material under 35_45 〇c. Referring to Fig. 4, there is shown the intention of the encapsulating mold 3 of the present invention to take out the encapsulation and enclose the encapsulating material. The self-encapsulating material 20 is not encapsulated with another surface-bonding material, 20 and cooled, and is 60. In addition, the member 7 — - she 6 ^ to a non-warped deformation of the (10) molded article invention _, cake 7G 峨 better, but the material composition. The overmolded article 60 of the present invention can be formed on a material such as, for example, a part of a T-LCD of a display casing, and the like. However, the rubber is turned over. 6G^,, χ is in the field of the function key panel of the liquid pain indicator. The description of Asia is not limited to this, it can also be applied to other electronic products. The high-strength and high-scoring of the bending strength of _ 9()()_1()(K)kg/em2 can be used to provide the test intensity enough. An encapsulating material that resists the contraction force of the rubberized material by cooling, and a substance, to form a durable and non-deformable encapsulated molded article. The present invention has been disclosed in several preferred embodiments as above, but it is not intended to limit the invention to any of the micro-artists, and a few modifications and refinements should be made without departing from the scope of the invention. The handle of the rider and its solution are subject to change. [Simple description of the drawings] Fig. 1A to Fig. 1B _' show a schematic diagram of the process of deforming the material by shrinking the conventional rubber material after cooling. Fig. 2 is a view showing a molding step of the polymer material of the present invention. Fig. 3 is a view showing the steps of encapsulation of the encapsulated molded article of the present invention. Fig. 4 is a schematic cross-sectional view showing the encapsulated molded article of the present invention. 7 ~ material; [main component symbol description] 5 ~ package rubber; 0801-A31107TWF (5.0) 8 1257345 ίο ~ material mold; 30 ~ plastic mold; 50 ~ concave hole; 70 ~ member 0 20 ~ polymer material; 40~ rubberized material, 60~ rubberized molding; 0801-A31107TWF(5.0)

Claims (1)

1257¾¾135069 號 申請專利範圍修正本 十、申請專利範圍： 1·一種製作包膠成型品之方法，包括： 利用一素材模具成型一彎曲強度為900-1000kg/cm2之高分子素材； 取出該咼分子素材，將其置入一具有凹孔之包膠模具中； 在185-205°C下導入一包膠材料於該具有凹孔之包膠模具中，以使該 包膠材料填人該凹孔巾域蓋於該高分子傭之—表面而形成_包膠層， 其中該包膠層係一熱塑性膠材； S 硬化該包膠材料；以及 自該包膠模具取出已包膠的高分子素材並施行一冷卻步驟，以得到一 不翹曲變形之包膠成型品。 2·如申請專利範圍第1項所述之製作包膠成型品之方法，其中當該包膠 層形成於鶴分子素材上時，該包騎與絲分子傭賴之界面會形成 一互融層，該互融層係由該包膠層與該高分子素材互相熔融形成。 3·如申請專利範圍第1項所述之製作包膠成型品之方法，其中該高分子 素材係聚碳酸醋(poly carbonate，PQ。 4_如申請專利範圍第1項所述之製作包膠成型品之方法，其中該高分子 素材更包括0_1 wt%至30wt%之纖維，該纖維之含量係以該高分子素材之總 重量為基準。 5·如申請專利範圍第4項所述之製作包膠成型品之方法，其中該高分子 素材係丙細腈_ 丁 一烯·苯乙烯(acrylonitrile butadiene styrene, ABS)。 6·如申請專利範圍第1項所述之製作包膠成型品之方法，其中該高分子 素材係聚苯醚(polyphenylene oxide), ΡΡΟ)、聚碳酸酯(p〇iy carbonate，pc)、 PC/ABS 〇 ’ 7.如申請專利範圍第4項所述之製作包膠成型品之方法，其中該纖維係 一無機纖維。 8·如申請專利範圍第7項所述之製作包膠成型品之方法，其中該無機纖 °8〇1-A3H〇7TWF1；I〇4〇〇6 10 1257345 維為石棉、玻璃或碳。 9·如申請專利範圍第1項所述之製作包膠成型品之方法，其中該素材更 包括填充料、補強劑、加工助劑、流動促進劑或顏料。 10·如申請專利範圍第9項所述之製作包膠成型品之方法，其中該熱塑 性膠材係一熱塑性聚氨基甲酸醋(thermoplastic polyurethane，TPU)。 11.如申請專利範圍第9項所述之製作包膠成型品之方法，其中該熱塑 性膠材係擇自由聚對苯二甲酸二乙酯塑膠(polyethylenetherephthalate， PET)、聚碳酸鹽、聚醯胺、聚酮、聚對苯二曱酸二丁酯塑膠 (polybuthylenetherephthalate，PBT)、聚醚酮醚酮顚](polyetherketone etherketone ketone，PEKEKK)、聚醚酮酮(polyetherketone ketone，PEKK)、聚 苯硫化物、聚苯乙醚、聚苯硫化硪、聚砜、聚醚颯、聚醯亞胺、聚醚醯亞 月女、聚酸胺酸亞胺、聚醯亞胺磯，和前述物質之組合物所組成之族群。 12·如申請專利範圍第丨項所述之製作包膠成型品之方法，其中該包膠 成型品係為液晶顯示器(LCD)之一外觀構件。 Π·如申請專利範圍第1項所述之製作包膠成型品之方法，其中該外觀 構件係為液晶顯示器之功能鍵面板。 14·一種包膠成型品，其係經由如申請專利範圍第丨項所述之製作包膠 成型品之方法所製得者。 夕 I5·如申請專利細第U項所述之包膠成型品，其巾該高分子素材係聚 碳酸酯(poly carbonate，PC)。 16. 如t請專麵圍第Η項·之包膠細品，其巾該高分子素材更包 括0.1 wt%至3〇wt%之纖維，該纖維之含量係以該素材之總重量為基準。L 17. 如申請專利範圍第16項所述之包膠成型品，其中該纖維係:無機纖 18·如申請專利範圍第 棉、玻璃或碳。 17項所述之包膠成型品，其中該無機纖維為石 0801-A31107TWF1;I04006 11 1257345 19.如申請專利範圍第14項所述之包膠成型品，其中該高分子素材係丙 烯腈-丁二烯-苯乙烯(acrylonitrile butadiene styrene，ABS)。 20·如申請專利範圍第14項所述之包膠成型品，其中該高分子素材係聚 苯醚(p〇ly(Phenyl㈣ oxide)，ΡΡΟ)、聚碳酸醋(p〇ly carb〇nate，pc)或 pc/ABs。 21·如申請專利範圍第14項所述之包膠成型品，其中該高分子素材更包 括填充料、補強劑、加工助劑、流動促進劑或顏料。 22·如申請專利範圍第14項所述之包膠成型品，其中更包括一互融層， 介於該高分子素材以及該包膠層之間。 23·如申請專利範圍第14項所述之包膠成型品，其中該包膠成型品係為 液晶顯示器(LCD)之一外觀構件。 24.如申請專利範圍第23項所述之包膠成型品，其中該外觀構件係為液 晶顯示器之功能鍵面板。 25_如申請專利範圍第η項所述之包膠成型品，其中該熱塑性膠材係熱 塑性聚胺基甲酸酯(thermoplastic polyurethane，TPU&gt;。 26.如申晴專利範圍第14項所述之包膠成型品，其中該熱塑性膠材係擇 自由水對本二甲酸二乙酯塑膠(polyethylenetherephthalate，PET)、聚碳酸鹽、 1酉脸月女、聚_、聚對苯二甲酸二丁酯塑膠⑽lybuthylenetherephthalate，PBT)、 聚醚酮醚酮酮(polyetherketone etherketone ketone，ΡΕΚΕΚΚ)、聚醚酮酮 (polyetherketone ketone，ΡΕΚΚ)、聚苯硫化物、聚苯乙醚、聚苯硫化颯、聚 砜、聚醚砜、聚醯亞胺、聚醚醯亞胺、聚醯胺醯亞胺、聚醯亞胺砜、熱塑 性聚胺基甲酸醋(thermoplastic polyurethane，TPU)，和前述物質之組合物所 組成之族群。 27·—種包膠成型品，包含·· 一經由模具成型之彎曲強度為9〇〇-i〇〇〇kg/cm2之高分子素材；以及 一包膠層，經由包膠模具設置於該高分子素材之至少部份表面，該包 膠層係一熱塑性膠材。 0801 -A31107TWF1 ;104006 12 1257345 28.如申請專利範圍第27項所述之包膠成型品，其中該高分子素材係聚 碳酸酯(poly carbonate，PC)。 29·如申請專利範圍第27項所述之包膠成型品，其中該高分子素材更包 括0.1 wt%至30wt%之纖維，該纖維之含量係以該素材之總重量為基準。 30·如申請專利範圍第29項所述之包膠成型品，其中該纖維係一無機纖 維。 31·如申請專利範圍第30項所述之包膠成型品，其中該無機纖維為石 棉、玻璃或碳。 32·如申請專利範圍第27項所述之包膠成型品，其中該高分子素材係丙 烯腈-丁二烯-苯乙烯(acrylonitrile butadiene styrene，ABS) 〇 33·如申請專利範圍第27項所述之包膠成型品，其中該高分子素材係聚 苯醚(poly(phenylene oxide)，ΡΡΟ)、聚碳酸醋(p〇ly carb〇nate，PC)或 PC/ABS。 34. 如申請專利範圍第27項所述之包膠成型品，其中該高分子素材更包 括填充料、補強劑、加工助劑、流動促進劑或顏料。 35. 如申請專利範圍第27項所述之包膠成型品，其中該熱塑性膠材係熱 塑性聚胺基曱酸酯(thermoplastic polyurethane，TPU)。 36. 如申請專利範圍第27項所述之包膠成型品，其中該熱塑性膠材係擇 自由聚對苯二曱酸二乙酯塑膠(polyethylenetherephthalate，PET)、聚碳酸鹽、 聚酉1^胺、聚酮I、聚對苯二曱酸二丁S旨塑膠(polybuthylenetherephthalate，PBT)、 聚驗酮_ 酮酮(polyetherketone etherketone ketone，ΡΕΚΕΚΚ)、聚 同酉同 (polyetherketone ketone，ΡΕΚΚ)、聚苯硫化物、聚苯乙醚、聚苯硫化颯、聚 礙、聚醚颯、聚醯亞胺、聚醚醯亞胺、聚醯胺醯亞胺、聚醯亞胺硬、熱塑 性聚胺基甲酸S旨(thermoplastic polyurethane，TPU)，和前述物質之組合物所 組成之族群。 0801 -A31107TWF1 ;104006 13Patent Application No. 12573⁄43⁄4135069 Revised 10, Patent Application Range: 1. A method for producing an encapsulated molded article, comprising: forming a polymer material having a bending strength of 900-1000 kg/cm2 by using a material mold; Putting it into a plastic mold with a concave hole; introducing a rubber material into the plastic mold having a concave hole at 185-205 ° C, so that the rubber material fills the concave hole The cover layer is formed on the surface of the polymer to form a rubber layer, wherein the rubber layer is a thermoplastic rubber; S hardens the rubber material; and the rubberized polymer material is taken out from the rubber mold. A cooling step is performed to obtain an overmolded article which is not warped. 2. The method for producing an encapsulated molded article according to claim 1, wherein when the rubberized layer is formed on the crane molecular material, the interface between the package riding and the silk molecule will form an intermingled layer. The interfacial layer is formed by melting the encapsulating layer and the polymer material. 3. The method for producing an encapsulated molded article according to claim 1, wherein the polymer material is poly carbonate (PQ. 4) as described in claim 1 of the scope of the invention. The method of molding a product, wherein the polymer material further comprises 0 to 1% by weight to 30% by weight of the fiber, and the content of the fiber is based on the total weight of the polymer material. 5. The production as described in claim 4 The method for producing an encapsulated molded article, wherein the polymer material is acrylonitrile butadiene styrene (ABS). 6. The method for producing an encapsulated molded article according to claim 1 , wherein the polymer material is polyphenylene oxide, ΡΡΟ), polycarbonate (p〇iy carbonate, pc), PC/ABS 〇' 7. The encapsulation is as described in claim 4 A method of molding a product, wherein the fiber is an inorganic fiber. 8. The method of producing an overmolded article according to claim 7, wherein the inorganic fiber is 石8〇1-A3H〇7TWF1; and I〇4〇〇6 10 1257345 is asbestos, glass or carbon. 9. The method of making an overmolded article of the invention of claim 1, wherein the material further comprises a filler, a reinforcing agent, a processing aid, a flow promoter or a pigment. The method of producing an overmolded article according to claim 9, wherein the thermoplastic adhesive is a thermoplastic polyurethane (TPU). 11. The method of producing an overmolded article according to claim 9, wherein the thermoplastic rubber is selected from polyethylene polyethylene terephthalate (polyethylene), polycarbonate, polyamine Polyketone, polyethylene terephthalate (PBT), polyetherketone etherketone ketone (PEKEKK), polyetherketone ketone (PEKK), polyphenyl sulfide , polyphenylene ether, polyphenylsulfonium sulfide, polysulfone, polyether oxime, polyimine, polyether oxime, polyamic acid imide, polyamidoxime, and a combination of the foregoing The ethnic group. The method of producing an overmolded article according to the invention of claim 2, wherein the overmolded article is an appearance member of a liquid crystal display (LCD). The method of producing an overmolded article according to the first aspect of the invention, wherein the appearance member is a function key panel of a liquid crystal display. An encapsulated molded article obtained by the method of producing an encapsulated molded article as described in the scope of the patent application. In the case of the overmolded article described in the U.S. Patent Application Serial No. U, the polymer material is poly carbonate (PC). 16. If you want to cover the cover of the second item, the polymer material further includes 0.1 wt% to 3% by weight of the fiber, and the fiber content is based on the total weight of the material. . L 17. The overmolded article of the invention of claim 16, wherein the fiber is: inorganic fiber 18, such as cotton, glass or carbon as claimed in the patent application. The encapsulated molded article of the above-mentioned item, wherein the inorganic fiber is a stone-shaped material, the acrylonitrile-butyl compound, wherein the inorganic material is acrylonitrile-butyl. Acrylonitrile butadiene styrene (ABS). 20. The encapsulated molded article according to claim 14, wherein the polymer material is polyphenylene ether (p〇ly (Phenyl) oxide, ΡΡΟ), polycarbonate (p〇ly carb〇nate, pc) ) or pc/ABs. 21. The encapsulated molded article of claim 14, wherein the polymeric material further comprises a filler, a reinforcing agent, a processing aid, a flow promoter or a pigment. 22. The overmolded article of claim 14, further comprising an interbed layer between the polymeric material and the encapsulating layer. The encapsulated molded article of claim 14, wherein the encapsulated molded article is an appearance member of a liquid crystal display (LCD). 24. The overmolded article of claim 23, wherein the appearance member is a function key panel of a liquid crystal display. The over-molded article according to claim n, wherein the thermoplastic rubber is a thermoplastic polyurethane (TPU). 26. As described in claim 14 of the Shenqing patent scope An overmolded molded article, wherein the thermoplastic adhesive is selected from the group consisting of polyethylene to polyethylene (polyethylene), polycarbonate, 1 酉 face, poly _, polybutylene terephthalate plastic (10) lybuthylenetherephthalate , PBT), polyetherketone etherketone ketone, polyetherketone ketone, polyphenylene ketone, polyphenylene sulfide, polyphenylene ether, polyphenylsulfonium sulfide, polysulfone, polyethersulfone, A group of polyimine, polyetherimide, polyamidimide, polyimine sulfone, thermoplastic polyurethane (TPU), and combinations of the foregoing. 27·—A type of encapsulated molded article, comprising: a polymer material having a bending strength of 9〇〇-i〇〇〇kg/cm2 formed by a mold; and a rubber layer disposed at the height via an overmold mold At least a portion of the surface of the molecular material, the rubberized layer is a thermoplastic adhesive. The encapsulated molded article according to claim 27, wherein the polymer material is poly carbonate (PC). The encapsulated article of claim 27, wherein the polymer material further comprises from 0.1 wt% to 30 wt% of the fiber, the fiber content being based on the total weight of the material. 30. The overmolded article of claim 29, wherein the fiber is an inorganic fiber. The encapsulated article of claim 30, wherein the inorganic fiber is asbestos, glass or carbon. 32. The encapsulated molded article according to claim 27, wherein the polymer material is acrylonitrile butadiene styrene (ABS) 〇 33, as claimed in claim 27 The encapsulated molded article, wherein the polymer material is poly(phenylene oxide, ΡΡΟ), polycarbonate (p〇ly carb〇nate, PC) or PC/ABS. 34. The overmolded article of claim 27, wherein the polymeric material further comprises a filler, a reinforcing agent, a processing aid, a flow promoter or a pigment. 35. The overmolded article of claim 27, wherein the thermoplastic rubber is a thermoplastic polyurethane (TPU). 36. The encapsulated molded article of claim 27, wherein the thermoplastic rubber is selected from polyethylene polyethylene terephthalate (polyethylene), polycarbonate, polyamine , polyketone I, polybutylene phthalate (PBT), polyetherketone etherketone ketone (polyetherketone etherketone ketone, 聚), polyetherketone ketone (ΡΕΚΚ), polyphenyl sulfide , polyphenylene ether, polyphenylsulfonium sulfide, polyhedral, polyether oxime, polyimine, polyether quinone imine, polyamidimide, polyimine hard, thermoplastic polyurethane A mixture of thermoplastic polyurethane, TPU), and a combination of the foregoing. 0801 -A31107TWF1 ;104006 13
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI451989B (en) * 2009-11-05 2014-09-11 Aisin Seiki Bumper device for vehicle

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI451989B (en) * 2009-11-05 2014-09-11 Aisin Seiki Bumper device for vehicle

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