TWI256141B - Optoelectronic chip package and method for manufacturing the same - Google Patents

Optoelectronic chip package and method for manufacturing the same

Info

Publication number
TWI256141B
TWI256141B TW94118641A TW94118641A TWI256141B TW I256141 B TWI256141 B TW I256141B TW 94118641 A TW94118641 A TW 94118641A TW 94118641 A TW94118641 A TW 94118641A TW I256141 B TWI256141 B TW I256141B
Authority
TW
Taiwan
Prior art keywords
optoelectronic chip
chip
package
conductive wiring
layer
Prior art date
Application number
TW94118641A
Other languages
Chinese (zh)
Other versions
TW200644262A (en
Inventor
Yu-Tang Pan
Shih-Wen Chou
Cheng-Ting Wu
Ting-Yuan Chen
Original Assignee
Chipmos Technologies Inc
Chipmos Technologies Bermuda
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc, Chipmos Technologies Bermuda filed Critical Chipmos Technologies Inc
Priority to TW94118641A priority Critical patent/TWI256141B/en
Application granted granted Critical
Publication of TWI256141B publication Critical patent/TWI256141B/en
Publication of TW200644262A publication Critical patent/TW200644262A/en

Links

Landscapes

  • Led Device Packages (AREA)

Abstract

An optoelectronic chip package and a method for manufacturing the package are disclosed. The package mainly includes a film consisting of a conductive wiring layer and a solder resist without a substrate core layer, an optoelectronic chip, and an encapsulant. The cover layer has a chip-bonding permission opening such that the cover layer and the optoelectronic chip can be fixed on a temporary carrier when chip packaging. Upper surface of the conductive wiring layer is attached to the cover layer, and lower surface of the conductive wiring layer is covered by the encapsulant after electrically connecting the optoelectronic chip with the conductive wiring layer. Accordingly, the optoelectronic chip package has a thinner thickness without including that of conventional substrate core layer, and it can prevent the contamination of mold flash to the optoelectronic chip.
TW94118641A 2005-06-06 2005-06-06 Optoelectronic chip package and method for manufacturing the same TWI256141B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94118641A TWI256141B (en) 2005-06-06 2005-06-06 Optoelectronic chip package and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94118641A TWI256141B (en) 2005-06-06 2005-06-06 Optoelectronic chip package and method for manufacturing the same

Publications (2)

Publication Number Publication Date
TWI256141B true TWI256141B (en) 2006-06-01
TW200644262A TW200644262A (en) 2006-12-16

Family

ID=37614088

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94118641A TWI256141B (en) 2005-06-06 2005-06-06 Optoelectronic chip package and method for manufacturing the same

Country Status (1)

Country Link
TW (1) TWI256141B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408782B (en) * 2007-08-31 2013-09-11 Chipbond Technology Corp Sliding type thin fingerprint sensor package
TWI685066B (en) * 2019-03-26 2020-02-11 力成科技股份有限公司 Semiconductor package without substrate and manufacturing method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI458066B (en) * 2011-12-30 2014-10-21 矽品精密工業股份有限公司 Substrate structure, package structure and method of forming same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408782B (en) * 2007-08-31 2013-09-11 Chipbond Technology Corp Sliding type thin fingerprint sensor package
TWI685066B (en) * 2019-03-26 2020-02-11 力成科技股份有限公司 Semiconductor package without substrate and manufacturing method thereof

Also Published As

Publication number Publication date
TW200644262A (en) 2006-12-16

Similar Documents

Publication Publication Date Title
US8492181B2 (en) Embedded wafer level optical package structure and manufacturing method
TW200731503A (en) Stacked semiconductor structure and fabrication method thereof
WO2008093586A1 (en) Resin-encapsulated semiconductor device and its manufacturing method
TW200705519A (en) Semiconductor package without chip carrier and fabrication method thereof
SG170693A1 (en) Semiconductor package and method of mounting semiconductor die to opposite sides of tsv substrate
TW200620496A (en) Semiconductor package free of carrier and fabrication method thereof
TW200741902A (en) Semiconductor package and, chip carrier thereof and method for fabricating the same
TW200737472A (en) Leadless semiconductor package with electroplated layer embedded in encapsualnt and the method for fabricating the same
TW200623365A (en) Heat dissipating semiconductor package and fabrication method thereof
KR101690051B1 (en) Exposed, solderable heat spreader for integrated circuit packages
WO2010090820A3 (en) Ic package with capacitors disposed on an interposal layer
TW200729429A (en) Semiconductor package structure and fabrication method thereof
CN106560917A (en) Semiconductor Package Structure
SG153762A1 (en) Package-on-package semiconductor structure
TW200715503A (en) Semiconductor packaging process and carrier for semiconductor package
TW200614403A (en) Method of manufacturing semiconductor device, semiconductor device, and mounting structure of semiconductor device
TW201434121A (en) Package substrate, semiconductor package and methods of manufacturing the same
WO2009072493A1 (en) Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device
TW200729441A (en) Semiconductor devices and fabrication method thereof
TWI256141B (en) Optoelectronic chip package and method for manufacturing the same
WO2018113574A1 (en) Process method for mounting pre-encapsulated metal conductive three-dimensional packaging structure
KR20160016628A (en) Exposed, solderable heat spreader for flipchip packages
US20100230826A1 (en) Integrated circuit package assembly and packaging method thereof
TW200705682A (en) Manufacturing process for chip package without core
MY164814A (en) Leadframe area array packaging technology