TWI256101B - An apparatus for clamping wafer with multiple groups of clamping fingers - Google Patents

An apparatus for clamping wafer with multiple groups of clamping fingers

Info

Publication number
TWI256101B
TWI256101B TW94106760A TW94106760A TWI256101B TW I256101 B TWI256101 B TW I256101B TW 94106760 A TW94106760 A TW 94106760A TW 94106760 A TW94106760 A TW 94106760A TW I256101 B TWI256101 B TW I256101B
Authority
TW
Taiwan
Prior art keywords
wafer
clamping
clamping fingers
fingers
multiple groups
Prior art date
Application number
TW94106760A
Other languages
Chinese (zh)
Other versions
TW200633111A (en
Inventor
Chia-Kang Wang
Chia-Cheng Wang
Yuan-Hsin Li
Liang-Yu Chang
Original Assignee
Grand Plastic Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Grand Plastic Technology Corp filed Critical Grand Plastic Technology Corp
Priority to TW94106760A priority Critical patent/TWI256101B/en
Application granted granted Critical
Publication of TWI256101B publication Critical patent/TWI256101B/en
Publication of TW200633111A publication Critical patent/TW200633111A/en

Links

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The present invention discloses an apparatus for clamping wafer with multiple groups of clamping fingers. Two or more groups of clamping fingers clamp the wafer alternatively in different time intervals, such that the metal or photo-resist under the clamping fingers can be etched or rinsed completely without any residue. Multiple groups of clamping fingers are installed on the chuck. The fingers can move to clamp or release the wafer. Every group of the clamping fingers clamps the wafer in a time interval during etching or cleaning, and release the wafer after the other group of clamping fingers clamped the wafer, then etches the metal or photo-resist under the clamping fingers of the previous group. Then change to another group of clamping finger. Thus every part of the wafer can be etched or rinsed.
TW94106760A 2005-03-07 2005-03-07 An apparatus for clamping wafer with multiple groups of clamping fingers TWI256101B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94106760A TWI256101B (en) 2005-03-07 2005-03-07 An apparatus for clamping wafer with multiple groups of clamping fingers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94106760A TWI256101B (en) 2005-03-07 2005-03-07 An apparatus for clamping wafer with multiple groups of clamping fingers

Publications (2)

Publication Number Publication Date
TWI256101B true TWI256101B (en) 2006-06-01
TW200633111A TW200633111A (en) 2006-09-16

Family

ID=37614072

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94106760A TWI256101B (en) 2005-03-07 2005-03-07 An apparatus for clamping wafer with multiple groups of clamping fingers

Country Status (1)

Country Link
TW (1) TWI256101B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI505904B (en) * 2012-02-17 2015-11-01 Beijing Sevenstar Electronics Co Ltd Device for clamping planar disk-shaped articles

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI505904B (en) * 2012-02-17 2015-11-01 Beijing Sevenstar Electronics Co Ltd Device for clamping planar disk-shaped articles

Also Published As

Publication number Publication date
TW200633111A (en) 2006-09-16

Similar Documents

Publication Publication Date Title
IL176568A (en) Method of processing a semiconductor wafer, a semiconductor wafer and an edge-bead removal system for use with an immersion lithography process
ATE400397T1 (en) FEED DEVICE FOR PLATE-SHAPED WORKPIECES
EP2607663A3 (en) Raft Assembly
DE112009000200A5 (en) Apparatus and method for aligning and holding a plurality of singulated semiconductor devices in receiving pockets of a clamp carrier
DE602005023156D1 (en) ARRANGEMENT DEVICE AND METHOD
DE60205040D1 (en) BY A MOVABLE ARM ACTIVATED TOOL CHANGER FOR A TOOL MACHINE SYSTEM WITH SPECIAL TOOL CLAMP
DE60308691D1 (en) METHOD AND DEVICE FOR CARRYING OUT A SIGNAL CORRELATION IN SEVERAL RESOLUTIONS FOR REDUCING MULTI-DISTANCE
DK2085177T3 (en) Clamping device for clamping workpieces
DE50001511D1 (en) METHOD FOR SEPARATING A WAFER
ATE478743T1 (en) METHOD FOR OBTAINING WORKPIECE CUTOUTS FROM A PLATE-LIKE WORKPIECE
WO2015036353A3 (en) Chucking device
TW200746942A (en) Apparatus and method for arranging devices for processing
PH12020551113A1 (en) Apparatus for handling various sized substrates
DE60120809D1 (en) Device for removing contact lenses
MX345016B (en) Apparatus for mounting process control devices to actuators.
CN204882628U (en) SF6 circuit breaker switch detects tight specialized tool of connector clamp
TWI256101B (en) An apparatus for clamping wafer with multiple groups of clamping fingers
DE502006007572D1 (en) Clamping device and method for processing clamped on such a clamping workpieces
TW200639966A (en) Gripper for holding semiconductor wafer and holding method, and shape measuring device
TW200635840A (en) Methods and apparatus for enhanced operation of substrate carrier handlers
DE29910130U1 (en) Clamping device for objects, e.g. for workpieces to be machined
DE502007002480D1 (en) Gripping device, in particular collet, for use in a feed device for plate-shaped workpieces
WO2010012269A3 (en) Holding device for holding a rotor
DE502007004409D1 (en) Touch protection for a rail
TW200633110A (en) Mechanical structure of apparatus for clamping wafer with multiple groups of clamping fingers