1250705 九、發明說明： 【發明所屬之技術領域】 本發明為一種電連接器插腳之增益改良，特別是指一種電連接器之插 腳增益結構者。 【先前技術】1250705 IX. Description of the Invention: [Technical Field] The present invention is a gain improvement of an electrical connector pin, and more particularly to a pin gain structure of an electrical connector. [Prior Art]
按一般之（第一圖）電連接器10之插腳101或其金屬罩殼u之插腳 111與機板20之結合，係於機板20之表面刮覆上一層錫膏，再以電連接器 10之插腳101與各電子組件一一置入機板20之定位處，經輪送帶送入SMT (SURFACE MOUNT TECHNOLOGY)爐，以SMT爐空間室溫漸升至2Qyc，熔化 錫膏再經冷卻固化焊接電連接器與各電子組件於機板者。 其中，錫膏一般之主要成份係是鱗與齡，並另有其它之化學成分，其 焊接熔點一般約為180°C ,該錫膏之含鉛成份比例越高，則其炼點即越低 者。又電連接器10的絕緣殼體之插腳101或其金屬罩殼u之插腳lu均 鍍有一層含鉛量低之錫層，其熔點為21(TC，故得以約200°C之溫度來增進 焊接之效率者。In combination with the pin 101 of the electrical connector 10 of the general (first figure) or the pin 111 of the metal cover u and the board 20, the surface of the board 20 is scraped with a layer of solder paste, and then the electrical connector is used. The pin 101 of the 10 and the electronic components are placed into the positioning position of the board 20 one by one, and sent to the SMT (SURFACE MOUNT TECHNOLOGY) furnace through the belt, and the room temperature of the SMT furnace is gradually increased to 2Qyc, and the solder paste is melted and then cooled. Curing the soldered electrical connector with each electronic component on the board. Among them, the main components of solder paste are scaly and age, and other chemical components, the melting point of the solder is generally about 180 ° C, the higher the proportion of lead content of the solder paste, the lower the melting point By. Further, the pin 101 of the insulating case of the electrical connector 10 or the pin lu of the metal cover u are plated with a tin layer having a low lead content, and the melting point is 21 (TC, so that the temperature is increased by about 200 ° C. The efficiency of welding.
惟上述，所利用含鉛之錫膏焊接製品，不論是焊接過程或是成品長久 使用損壞回收處理，均無法符合環保之要求。按，現今國際環保之要求， 很多電子產品已被要求不得含鉛，故不得利用含有鉛之錫膏焊接產品，需 以純錫膏焊接，且電連接器10之插腳101或其金屬罩殼11之插腳lii均 需以鎳或其它耐高溫之金屬來電鍍，因該鎳或其它耐高溫之金屬之熔點為 600°C以上，如此才能耐純錫膏之高熔點2351以上，故SMT(SURFACE MOUNT 1250705 TECimOGY)爐之至溫可以達26〇。。以上來熔化純錫膏以順利焊接，而插腳 絲或/、匕耐W皿之金屬電鍍層具高耐溫（_。0即不會有電鑛層被溶飿 之現象。 惟’該電連接器10之插腳101或其金属罩殼11之插腳ill之銻或其 它耐高溫之金屬電鍍層姨膏之焊接相·不佳，故時有焊接不良之情事 者0 有姐於上述之缺失轉改善，故發明人不斷的思考，如何能以簡單 之結構與符合魏要求线騎焊騎財陳。經㈣人多賴思考與 實驗研究’終求件―簡易之結構得以達到完全之焊接相之功效者。 ;本發月之、、、Q構、目的、方式與精神，煩請鈞局委員參照下列之圖 式與說明即可完全的了解本發明者。 【發明内容】 。本發明為種電連接賭腳之增益改良，制是指—種㈣令電連接 器之插腳與機板確實焊接牢固之增益結構者。 本發明為-種電連接賭腳之增益改良，（第二圖）其主要係於電連接 ㈣之插謂輪屬祕Ga之插糊a設_箱，織部 係設於插糊、5Gla之驗（H如（第㈣之凹形體， 其中之絲502亦可為各種形體之（第四圖）穿孔者。 【實施方式】 藉由，（第五圖）機板20之各焊接點與插孔2〇1到覆上一層純錫膏6〇， 1250705 再以電連接器50之插腳501或其金屬罩殼娜之插腳5仙置入機板2〇之 插孔20!定位處，經SMT (瓣似贿職_)爐高溫溶化錫膏 60，（參照第六圖）其中熔化之錫膏6Q即渗入插腳则、驗之嵌部弧， 該錫膏60經冷卻固化後，固化之錫㈣與插腳则驗之嵌部哪即 形成頂嵌式之焊合，以達到強大之焊固功效者。 由此可知，本發明之結構精簡，確可形成強大之焊固功效，不論是以 錫或錄電鍍之插腳均可完全的焊固，且未見諸公開制者，符合專利實用 f生新穎J·生之要件，菱依法向鈞局提出專利申請，懇請釣局委員速予惠 審並准予本案專利權，實感德便。 需陳明者，以上所述乃是本創作之較佳實施例，如依本創作之構想所 作之改變，其產生之功能、作用仍未超出說明書與圖式所涵蓋之精神時， 一切應屬本創作之範圍内，合予陳明。 【圖式簡單說明】 第一圖為習知之電連接器之插腳與機板焊接示意圖 第二圖為本發明之電連接器之插腳與其金屬罩殼之插腳示意圖 第三圖為本發明之插腳另一實施例示意圖 第四圖為本發明之插腳又另一實施例示意圖 第五圖為本發明之電連接器之插腳及另電連接器之金屬罩殼之插腳與機板 插合焊接簡易不意圖 第六圖為本發明之各插腳實施例與機板焊接形成頂嵌焊固之簡易示意圖 1250705 【主要元件符號說明】 電連接器-------------10、50 金屬罩殼-------------11 ^ 50a 插腳-----------------101、111、501、501a 機板-----------------20 插孔-----------------201 嵌部-----------------502 錫膏-----------------60 8However, the use of lead-containing solder paste products, whether in the welding process or in the long-term use of damaged products, can not meet the requirements of environmental protection. According to the requirements of today's international environmental protection, many electronic products have been required not to contain lead, so solder products containing lead solder must not be used, soldering with pure solder paste, and the pin 101 of the electrical connector 10 or its metal casing 11 Pins lii need to be plated with nickel or other high temperature resistant metals. Because the melting point of the nickel or other high temperature resistant metals is above 600 °C, the high melting point of pure solder paste can be more than 2351, so SMT (SURFACE MOUNT 1250705) The temperature of the TECimOGY) furnace can reach 26 〇. . The above is to melt the pure solder paste for smooth soldering, and the metal plating layer of the pin or /, 匕 耐 耐 has a high temperature resistance (_. 0 will not have the phenomenon that the electric ore layer is dissolved. Only the electrical connection The pin 101 of the device 10 or the pin ill of the metal cover 11 or the other high temperature resistant metal plating layer is poorly soldered, so there is a case of poor soldering. Therefore, the inventor constantly thinks about how to ride the welding and finance with a simple structure and meet the Wei requirements. After the (four) people rely on thinking and experimental research, the final structure - the simple structure can achieve the full welding phase effect. The present invention is fully understood by the members of the Board of Directors with reference to the following drawings and descriptions. [Invention] The present invention is an electrical connection. The gain of the gambling foot is improved, and the system refers to the type of (four) gain structure in which the pin and the plate of the electrical connector are firmly welded. The invention is a gain improvement of the electric connection gambling foot, and the main system is (second figure) In the electrical connection (four), the insertion of the wheel is the secret of Ga a _ box, the woven part is set in the paste, 5Gla test (H such as (the fourth) concave body, wherein the wire 502 can also be a variety of shapes (fourth figure) perforator. [Embodiment] by (fifth figure) Each solder joint of the board 20 and the jack 2〇1 are covered with a layer of pure solder paste 6〇, 1250705 and then placed with the pin 501 of the electrical connector 50 or the metal cover of the pin 5 The machine board 2 〇 jack 20! Positioning, SMT (petal like bribe _) furnace high temperature melting solder paste 60, (refer to the sixth figure) where the molten solder paste 6Q is infiltrated into the pin, the embedded arc After the solder paste 60 is cooled and solidified, the solidified tin (four) and the pin are inspected to form a top-embedded solder joint to achieve a strong soldering effect. Thus, the structure of the present invention is simplified. It can form a strong welding and solidifying effect. Whether it is tin or recorded electroplating pins, it can be completely welded and solidified, and it has not seen any public system. It is in line with the patent and practicality. To file a patent application, I ask the Director of the Bureau of Fishing to give a quick review and grant the patent right in this case. It is really sensible. It is a preferred embodiment of the present invention. If the function and function produced by the concept of the creation are not beyond the spirit of the specification and the schema, everything should be within the scope of the creation. Chen Ming. [Simple description of the drawing] The first figure is a schematic diagram of the welding of the pin and the board of the conventional electrical connector. The second figure is the pin diagram of the pin of the electrical connector of the present invention and the metal cover thereof. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 4 is a schematic view showing another embodiment of the pin of the present invention. FIG. 5 is a view showing the pin of the electrical connector of the present invention and the pin and the plate of the metal cover of the other electrical connector.简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易 简易, 50 metal cover -------------11 ^ 50a pin-----------------101,111,501,501a board -- ---------------20 Jack-----------------201 Embedded ------------ -----502 Solder paste-----------------60 8