1244606 玫、發明說明： 【發明所屬之技術領域】 本發明關於-種感應板及其製造方法 裝在液晶顯示裝$菩& $ 、 ^ a —種安 内容可用筆二:=的、根據其顯示面的顯示 【先前技厂“輸入的感應板及其製造方法。 子標輸入裝置的感應板廣泛用於例如以電 榀f具釩終端為代表的移動機哭。 =這些㈣機器等的感應板，例如安裝在液晶顯示裝 …側’並能夠使在透過感應板可見的顯示面上海 暦表、曰程表、通訊錄管理等各種功能進行切換:、 或者’ μ感應板的薄膜狀的透明電極板構 上，通過用筆或手指等壓住的狀態移 ： 望的文字或圖像等。 把輸入所希 或者，也可用筆等使顯示或移動 ~ 描緣軌跡。 顯…的游標來 這樣習知感應板，如圖3所示，在最下部配設有由透明樹 脂材料構成的平板狀下部電極板2卜在上述下部電極板2〗 的平坦狀的上面按規定的膜展户形/ 膜乓度形成由迓明ΙΤΟ膜構成的 下部導電膜22。 此外’在下部導電膜22上面，按規定的間隔和按χ方向及 Υ方向整齊排列形成在規定高度形成的由絕緣性材料構成 的多個點間隔件23。 此外，在下部導電膜22上的外周部，按規定的寬度形成 85114 1244606 厚度比點間隔件2 3高的厚絕緣圖案2 4。 此外，隔著外周部的絕緣圖案24，在 裤罢，A L 、 卜邙电極板2 1相 对置的上万配設由規^厚度的透明薄膜等構成的具有彈性 的上邵電極板2 5。在與下部導電膜2 2相對的整個上述上部 電t板25表面上’按規定厚度形成由與下部導電膜22相： 材質的ITO膜構成的上部導電膜26。 、：後’上部導電膜26的外周部接合在絕緣圖案Μ上，下 邵電極板21和上部電極板25形成一體化。 這樣的習知感應板的製造方法，首先 艽成形加工透明樹脂 材枓，形成外形大致為長方形形狀的下部電極板21。 2後’ *置規定的間隔，將多個下部電極板21放入蒸鍍 ^置内，在真空狀態的蒸鐘裝置内，在下部電極板21的表 同形成下部導電膜22。 此外，關於上邵導電膜的形成，在真空狀態的蒸鍍裝置 内拉轉卷為輥狀的片狀透明薄膜（無圖示），在透明薄膜的: 面形成規定厚度的上部導電膜2 6。 、J成上述上邵導電膜2 6的片狀透明薄膜切斷成大小與 下邵電極板2 1相同的尺寸，形成上部電極板25。 达後，利用光刻技術或遮罩印刷等，在下部導電膜7 2上 按X方向及Y方向等間隔地整列形成多個點間隔件23。 <後’利用遮罩印刷等，在下部導電膜22上的外周部形 成比點間隔件23高的絕緣圖案24。 、然後’將上部電極板25放置在下部電極板21上面，在下 巧導電膜22和上部導電膜26對置放置的狀態，採用熱溶敷 85114 I244606 等方法將上部導電膜26的外周部接合在絕緣圖案24上。 —於是，通過絕緣圖案24使下部電極板21與上部電極板25 體化，由此製造出習知感應板。 立’Η八種4知感應板，操作者通過用手指或筆等按壓上 兒極板25的表面’上邯導電膜26搭接在點間隔件23和點 g隔件23之間的下部導電膜22上，並導通。由此，可進行 所希望的座標輪入。 在上述習知感應板中，由於將下部電極板21彙集在多個 早元内—起投人蒸鍍裝置内，在下部電極板21的表面上形 成下4 izt明導電膜2 2，戶斤以在下部電極板2 }上形成下部透 月導電膜22的X序為分批方式，下部電極板21的製造工序 缽要停滯。 因此，生產率降低，習知感應板存在生產成本高的問題。 【發明内容】 本發明是針對上述問題而提出的，目的是通過預先在片 狀薄膜上形成下部導電膜，在下部電極板的成形加工時使 該片狀薄膜與下部電極板一體化，由此提供一種在下部電 極板上能連續不停頓地進行形成下部導電膜的工序的以高 生產率生產的感應板。 用於解決上述問題的第1解決手段之本發明的感應板之 特徵在於：包含：具有規定薄厚並互相對置配置的下部電 極板和上邵電極板、以及在各自電極板的相互對置面設置 的下邵導電膜和上部導電膜；且上述下部電極板係在與上 部電極板對應的一面上隔著規定厚度的薄膜形成上述下部 85114 1244606 導電膜。 此外’用於解決上逑問題的第2解決手段之特徵在於：在 上返薄月旲的-囬形成上述下部導電月莫，在另一面粘合上述 下部電極板。 …此外，用於解決上述問題的第3解決手段之特徵在於：上 述下邵電極板由樹脂材料構成’ ±述薄膜具有比上述樹脂 材料更優良的耐熱性。 此外，用於解決上逑問題的第4.解決手段之本發明的感應 板的製造方法之特徵在#:配設具有規定間隙並相互對置 的下邯電極板和上邵電極板以及在各自電極板的相互對置 面設置的下部導電膜和上部議；通過在一面預先形成 有下部導電膜的片狀薄膜上，將樹脂材料成形加工一體化 形成上述下部電極板。 此外，用於解決上述問題的第5解決手段之特徵在於：通 過在上述下部電極板上壓合上述片狀薄膜，成形加工上述 下部電極板。 此外，解決上述問題的第6解決手段之特徵在於··用於成 形加工上述下部電極板的成形金屬模，具有可充埴上述樹 脂材料的上部敞開的充填部及位於上述充填部上面的能夠 乙制上述片狀薄膜向上方一侧移動的上模；且 在以上述上模控制上述片狀薄膜向上 向上述充填部充填上述樹脂材料。 方一側移動的狀態 過 此外，用於 上述成形加 工，連續在上述片狀薄膜上形成上述下部 85114 1244606 極板；用切斷用金屬模切斷上述片狀薄膜，形成上述下部 電極板Q 【實施方式】 根據附圖說明本發明實施方式的感應板。圖1是本發明眘 施方式的主要部位剖面圖。圖2是說明本發明的製造方法的 示意圖。 首先’關於本發明的一實施方式的感應板，如圖1所示， 在最下部配設有由材質為丙烯酸或聚碳酸酯等透明樹脂材 料構成的下部電極板1。 通過成形加工等，使上述下部電極板1的外形成為大致長 方形的形狀’厚度達到〇 5〜1 m m。 .此外，通過厚度為40〜l〇〇e m的透明薄膜2，在下部電極 板1的作為一面的上面，利用蒸鍍等方法形成由透明 I丁〇（Indiun Tin Oxide)電阻膜構成的下部透明導電膜3。 上述透明薄膜2,由PE 丁薄膜等材料構成，比用於下部電 極板1的透明樹脂材料具有更優良的耐熱性。 此外，在利用後述的製造方法成形加工下部電極板i時， 通過在樹脂材料為熔融或軟化狀態的下部電極板丨的一面 的上面上壓合，枯合透明薄膜2，使下部電極_透明薄 膜2 —體化。 此外，在下部透明導電薄膜3上的外周圍#，按規定寬度 尺寸形成用規定厚度的保護膜覆蓋的絕緣圖案4。 在被上述絕緣圖案4圍著的下部透明導電旧上，利用光 刻技術等，按在X方向及Y方向以規定間隔整齊排列並突出 83114 1244606 形成多個點間隔件5。 上述點間隔件5的高度低於絕緣圖案4的厚度，在點間隔 件5的頂邵與後述的上部透明導電膜7之間形成規定尺寸的 間隙。 ' ' 此外，在與下部透明導電膜3具有規定尺寸空隙並對置的 上方’配设透明的薄膜狀的上部電極板6。 孩上部電極板6由具有彈性的ρΕΊΓ薄膜等材料構成，在與 下4透明導電膜3對置的下面，利用蒸鍍等方法形成規定厚 度的由與下部透明導電膜3同材質的丨丁 〇膜構成的上部透明 導電膜7。 …、後，用熱熔敷等方法將上部透明導電膜7的外周部接合 在絕緣圖案4上，使下部電極板丨與上部電極板6一體化，從 而構成本發明的感應板。 下面，參照附圖2說明上述本發明感應板的製造方法，首 先，在輥狀卷取部l〇a上配設卷取透明的片狀薄膜丨〇。 關於這種輥狀卷取的片狀薄膜1〇，預先在其—面的外面 用糸鍍等方法形成由規定厚度的IT〇膜構成的下部透明導 電膜3。在上述的片狀薄膜1〇中，預先蒸鍍下部透明導電膜 3的工序，通過在真空狀態的蒸鍍裝置（無圖示）内拉轉片狀 薄膜1〇’在片狀薄膜1〇的—面±蒸鍍由規定厚度的ιτ〇膜構 成的下部透明導電膜3。 從泰取引出在上述—面形成下部導 链狀的片狀薄膜1。，在-對傳送辕U上壓接咬合=: 互相反的方向即箭頭Α、Β方向轉動驅動各自的傳送輥η， 85114 -11 - I244606 可向箭頭C的下游傳送片狀薄膜丨〇。 使± 4 —對傳送輥11轉動驅動，通過向箭頭c方向拉伸片 狀薄膜1 0，則卷取部1 0a向箭頭e方向轉動。 此外，在片狀薄膜1 〇的箭頭C的傳送方向的傳送輥丨丨的下 游侧，配設有充填透明樹脂材料並成形加工下部電極板1的 成形金屬模1 2。 上逑成形金屬模1 2配置有充填部丨2a，其上部敞開，内部 為工洞狀，形狀為長方形，可充填聚碳酸脂等透明樹脂材 料。 此外，在成形金屬模1 2的圖示左側的側壁上，形成有可 向充填邵1 2a充填熔融或軟化的樹脂材料的口部丨2b。 '此外，在充填部12a的上面，配置有可按箭頭£方向即上 下方向私動的上模丨3。而且，在向充填部工h上面傳送片狀 薄膜1 0的狀怨下，如果一旦使上模1 3降下，通過片狀薄膜 10可使充填部12a密封。 這k ’在降下上模1 3，用片狀薄膜丨〇密封充填部1 2 a的狀 〜、 如果從口部1 2b充填熔融或軟化的樹脂材料，熔融或 库人化了的樹脂材料就壓合在片狀薄膜丨〇的另一面。 由此在片狀薄膜1 0的另一面上择合下部電極板1，使片 狀薄膜1 Q與了部電極板丨形成”體化。 此外’與片狀薄膜丨〇 一體化的下部電極板1由規定尺寸的 連接^ 1 〇b連接，這樣可連續形成下部電極板1。 此外’片狀薄膜丨〇的傳送方向的成形金屬模丨2的下游一 J則，g? °又有刀斷用金屬模1 4。該切斷用金屬模1 4由下部切1244606 Rose, description of the invention: [Technical field to which the invention belongs] The present invention relates to a kind of induction board and a method for manufacturing the same, which are mounted on a liquid crystal display device. $ Display on the display surface [Previous technology factory's input sensor board and its manufacturing method. The sensor board of the sub-standard input device is widely used, for example, in mobile phones such as electric terminals with vanadium terminals. Board, for example, installed on the LCD display device ... side, and can switch various functions such as Shanghai watch, schedule, address book management, etc. on the display surface visible through the sensor board: or the film-like transparent of the μ sensor board On the electrode plate structure, the state is moved by pressing with a pen or a finger, etc .: desired characters or images, etc. The input is desired, or you can use a pen or the like to display or move ~ trace the trajectory. As shown in FIG. 3, a conventional induction plate is provided with a flat lower electrode plate 2 made of a transparent resin material at the lowermost portion. The flat upper surface of the lower electrode plate 2 is formed in accordance with a predetermined film layout.The lower conductive film 22 is made of a thin film ITO. The upper conductive film 22 is formed on the lower conductive film 22 at regular intervals and aligned in the χ direction and the Υ direction. Dot spacer 23. In the outer peripheral portion of the lower conductive film 22, 85114 1244606 thick insulating patterns 2 4 having a thickness higher than that of the dot spacer 2 3 are formed. In addition, an insulating pattern 24 is interposed across the outer peripheral portion. In the pants, the upper and lower electrode plates 21, AL, and the electrode plate 21, which are opposite to each other, are provided with a flexible upper electrode plate 25, which is composed of a transparent film of a regular thickness, and the like. On the entire surface of the upper electric plate 25, an upper conductive film 26 composed of an ITO film having a phase with the lower conductive film 22 is formed to a predetermined thickness. The rear peripheral portion of the upper conductive film 26 is bonded to the insulation pattern M. The lower electrode plate 21 and the upper electrode plate 25 are integrated. In such a conventional method for manufacturing an induction plate, first, a transparent resin material is formed by molding to form a lower electrode plate 21 having a substantially rectangular shape. After two times, the lower electrode plate 21 is placed in a predetermined interval, and the lower conductive plate 22 is formed on the surface of the lower electrode plate 21 in a vacuum clock apparatus in a vacuum state. In addition, regarding the The upper conductive film is formed by rolling and rolling into a roll-shaped sheet-shaped transparent film (not shown) in a vacuum evaporation device, and an upper conductive film of a predetermined thickness is formed on the transparent surface of the transparent film 26. J The sheet-like transparent film formed into the above-mentioned conductive film 26 is cut into the same size as the lower electrode plate 21 to form the upper electrode plate 25. After reaching the upper electrode plate 25, it is conductive by photolithography or mask printing. A plurality of dot spacers 23 are formed on the film 72 in a line at regular intervals in the X direction and the Y direction. < Back 'An insulating pattern 24 higher than the dot spacer 23 is formed on the outer peripheral portion of the lower conductive film 22 by mask printing or the like. Then, 'the upper electrode plate 25 is placed on the lower electrode plate 21, and in a state where the lower conductive film 22 and the upper conductive film 26 are placed opposite to each other, the outer peripheral portion of the upper conductive film 26 is bonded to On the insulation pattern 24. -Then, the lower electrode plate 21 and the upper electrode plate 25 are integrated by the insulating pattern 24, thereby manufacturing a conventional induction plate. There are eight types of 4 known sensing plates. The operator conducts a conductive film 26 overlaid between the point spacer 23 and the point g spacer 23 by pressing the surface of the upper electrode plate 25 with a finger or a pen. The film 22 is turned on. Thereby, a desired coordinate rotation can be performed. In the above-mentioned conventional induction plate, since the lower electrode plate 21 is collected in a plurality of early cells—into a person's vapor deposition device, a lower conductive conductive film 22 is formed on the surface of the lower electrode plate 21. Taking the X sequence of forming the lower lunar conductive film 22 on the lower electrode plate 2} as a batch method, the manufacturing process bowl of the lower electrode plate 21 is stagnant. Therefore, productivity is reduced, and the conventional induction plate has a problem of high production cost. SUMMARY OF THE INVENTION The present invention is made in view of the above problems, and an object thereof is to form a lower conductive film on a sheet film in advance, and integrate the sheet film and the lower electrode plate during the forming process of the lower electrode plate, thereby Provided is an induction plate which can be produced on a lower electrode plate with high productivity while continuously performing a process of forming a lower conductive film. The induction plate of the present invention, which is the first solution for solving the above-mentioned problems, is characterized in that it includes a lower electrode plate and an upper electrode plate having a predetermined thickness and facing each other, and mutually facing surfaces of the electrode plates. The lower conductive film and the upper conductive film are provided; and the lower electrode plate is formed on the side corresponding to the upper electrode plate with a thin film of a predetermined thickness interposed therebetween to form the above-mentioned lower 85114 1244606 conductive film. In addition, the second solution means for solving the problem of the upper part is characterized in that the lower conductive part is formed on the upper part of the upper part, and the lower electrode plate is adhered on the other side. ... In addition, the third means for solving the above-mentioned problems is characterized in that the above-mentioned lower electrode plate is made of a resin material. The film has better heat resistance than the above-mentioned resin material. In addition, the method for manufacturing the induction plate according to the fourth aspect of the present invention for solving the problem of the upper part is characterized in that #: a lower electrode plate and an upper electrode plate having a predetermined gap and facing each other are provided, and The lower conductive film and the upper electrode are provided on opposite surfaces of the electrode plate; the resin material is integrally formed by forming and processing the resin material on a sheet-shaped film in which the lower conductive film is formed on one side in advance. A fifth means for solving the above-mentioned problem is characterized in that the lower electrode plate is formed by laminating the sheet-shaped film on the lower electrode plate. In addition, the sixth solution for solving the above-mentioned problems is characterized in that the forming metal mold used for forming and processing the lower electrode plate has a filling portion that can open the upper portion of the resin material and a filling portion on the filling portion. An upper mold for moving the sheet-shaped film to the upper side is prepared; and the sheet-shaped film is controlled by the upper mold to fill the resin material to the filling section. In addition, it is used in the forming process to continuously form the lower part 85114 1244606 electrode plate on the sheet film; cut the sheet film with a cutting mold to form the lower electrode plate Q [ Embodiment A sensor plate according to an embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a sectional view of a main part of a prudent embodiment of the present invention. Fig. 2 is a schematic diagram illustrating a manufacturing method of the present invention. First, as shown in FIG. 1, a sensor plate according to an embodiment of the present invention includes a lower electrode plate 1 made of a transparent resin material such as acrylic or polycarbonate. The outer shape of the lower electrode plate 1 is formed into a substantially rectangular shape by a forming process or the like, and its thickness is 0.5 to 1 m. In addition, a lower transparent film made of a transparent I-In (Odidi Tin Oxide) resistance film is formed by a method such as vapor deposition on a surface of the lower electrode plate 1 through a transparent film 2 having a thickness of 40 to 100 μm. Conductive film 3. The transparent film 2 is made of a material such as a PE film and has better heat resistance than the transparent resin material used for the lower electrode plate 1. In addition, when the lower electrode plate i is formed and processed by a manufacturing method described later, the transparent film 2 is dried by laminating the upper surface of the lower electrode plate with the resin material in a molten or softened state. 2 — Physicalization. In addition, on the outer periphery # on the lower transparent conductive film 3, an insulating pattern 4 covered with a protective film of a predetermined thickness is formed in a predetermined width dimension. On the lower transparent conductive substrate surrounded by the above-mentioned insulating pattern 4, a plurality of dot spacers 5 are formed by aligning and protruding at predetermined intervals in the X direction and the Y direction by using a photolithography technique or the like 83114 1244606. The height of the dot spacer 5 is lower than the thickness of the insulating pattern 4, and a gap of a predetermined size is formed between the top of the dot spacer 5 and an upper transparent conductive film 7 described later. '' Furthermore, a transparent thin-film-shaped upper electrode plate 6 is disposed above the surface of the lower transparent conductive film 3 and having a gap of a predetermined size. The upper electrode plate 6 is made of a material such as a flexible ρΕΊΓ thin film. The lower surface is opposite to the lower transparent conductive film 3, and a predetermined thickness of the same material as the lower transparent conductive film 3 is formed by a method such as evaporation. The film is composed of an upper transparent conductive film 7. After that, the outer peripheral portion of the upper transparent conductive film 7 is bonded to the insulating pattern 4 by a method such as thermal welding, and the lower electrode plate 丨 and the upper electrode plate 6 are integrated to constitute the induction plate of the present invention. Next, a method for manufacturing the above-mentioned induction plate of the present invention will be described with reference to FIG. 2. First, a roll-shaped roll-up portion 10a is provided with a roll-up transparent sheet-like film. With regard to such a roll-shaped sheet-like film 10, a lower transparent conductive film 3 made of an IT0 film having a predetermined thickness is formed on the outer surface of the one-side surface by a method such as plating. In the above-mentioned sheet film 10, the step of previously depositing the lower transparent conductive film 3 is performed by pulling and turning the sheet film 10 ′ on the sheet film 10 in a vacuum deposition apparatus (not shown). —Surface ± Evaporation The lower transparent conductive film 3 made of a ττ film with a predetermined thickness. A sheet-like film 1 having a lower guide chain shape formed on the above-mentioned surface was drawn out from Tai. , Compression nip on-pair of conveyance 辕 U =: The directions opposite to each other, that is, the directions of arrows A and B, rotate and drive the respective conveying rollers η, 85114 -11-I244606 can convey the sheet-shaped film downstream of arrow C. When the conveying roller 11 is driven to rotate by 4 and the sheet-like film 10 is stretched in the direction of the arrow c, the winding section 10a is rotated in the direction of the arrow e. Further, a molding die 12 filled with a transparent resin material and forming the lower electrode plate 1 is arranged on the downstream side of the transfer roller 丨 丨 in the transfer direction of the arrow C of the sheet-like film 10. The upper molding metal mold 12 is provided with a filling portion 2a, the upper portion of which is open, the inside of which is shaped like a hole, and the shape is rectangular, which can be filled with transparent resin materials such as polycarbonate. In addition, on the left side wall of the mold 12 shown in the drawing, a mouth portion 2b is formed in which the filling material 12a can be filled with a molten or softened resin material. 'In addition, an upper die 3 which can be moved privately in the direction of the arrow, i.e., the up and down direction, is disposed on the upper surface of the filling portion 12a. Furthermore, when the sheet-like film 10 is conveyed to the top of the filling section, if the upper mold 13 is lowered once, the sheet-shaped film 10 can seal the filling section 12a. When k ′ is lowered, the upper mold 13 is lowered, and the shape of the filling portion 12 a is sealed with a sheet-like film. If the molten or softened resin material is filled from the mouth portion 1 2b, the molten or pooled resin material is Laminated on the other side of the sheet-like film. Therefore, the lower electrode plate 1 is selected and assembled on the other surface of the sheet film 10, so that the sheet film 1 Q is integrated with the partial electrode plate. In addition, the lower electrode integrated with the sheet film 10 The plate 1 is connected by a connection of a prescribed size ^ 1 〇b, so that the lower electrode plate 1 can be continuously formed. In addition, a sheet metal film 丨 0 is formed in the downstream direction of the forming die ②, and there is a knife in g? ° Cutting metal mold 14. This cutting metal mold 14 is cut from the lower part
UIU -12 - 1244606 割及具1 4 a和卜却j t 1砸箭頭F方向：二:具⑷組成，通過^ 分離具有下部透二=:㈣ 沖切下部電極板}月吴的下邪電極板卜可按箭頭G方向 ，二卜在：卷取邵…用傳送輥11向下游引出的片狀薄膜10 置@形金屬模12及切斷用金屬模14中形成的載入裝 置 向箭4員C方向施力口 士 r . … Π施加張力，由此可通過傳送輥1 1向下游傳 送。 ^ 輯’就能在用切斷用金屬模14從片狀薄膜10切斷分離 的下邵電極1的-面接合外形大小與下部電極板1相同的透 明薄膜2。 j J返 .在用^万去製造的下部電極板1中，利用光刻技術或遮 罩P刷等在下部迓明導電膜3上按規定高度形成多個 隔件5。 … 然後，在下料電膜3上的外周部用抗姓層等形成規定高 度的絕緣圖案4。 之缘將預先在上邵電極板6上形成的上部透明導電膜7 與下邵透明導電膜3對置，在下部電極板1上面載置上部電 極板6。並且’通過採用熱熔敷等方法將載置在絕緣圖案4 上的上部電極板6接合在絕緣圖案4上，使下部電極板1與上 部電極板6—體化，由此製造出本發明的感應板。 關於這樣製造的本發明的感應板的操作，操作者利用手 指或筆等，用規定值以上的壓力按壓上部電極板6的表面， 按壓斗分的上邵電極板按規定量彈性降下，上部透明導電 mu -{3 1244606 膜7部分搭接在從多個點間隔件5露出的下部導電膜$ 、 導通。 寸私J上並 通過控制部（無圖示）檢測該下部和上部的透明導電膜3 邵分導通的位置，可進行所希望的座標輸入。 此外，在按壓上部電極板6的操作力低於規定值時，上部 電極板6的上部透明導電膜7只搭接在點間隔件5的頂部，、 能降到頂部以下的下方。因此，在操作力低於規定值時不 由於上部透明導電膜7與下部透明導電膜3不榫 。小能進 行座標輸入。 對於上述本發明的實施方式的感應板，由於是在預先形 成下部透明導電膜3的片狀薄膜1〇上成形加工下部電極板^ 、並使其一體化，所以具有下部透明導電膜3的下部電極板 1的製造不是象傳統那樣的分批生產方式，能夠連續生產， k烏了本發明的感應板的生產率。 此外，在本發明的實施方式的說明中，通過附加不同的 編號說明了壓合在下部電極板丨上並一體化的透明薄膜2和 上邵電極板6，但也可統一到任何一方的構件中。由此可削 減兀件的種類，進一步提高本發明的感應板的生產率。 本發明的感應板的下部電極板由於是借助在一面形成規 定厚度的薄膜形成下邵導電膜，在成形加工下部電極板時 ，預先形成的下邵導電膜的薄膜能夠在下部電極板上一體 他’能鞠振供生產拳好、可降低成本的感應板。 此外’由於在透明薄膜的一面形成下部透明導電膜，其 另一囬枯合在下邵電極板的一面，所以通過薄膜，能夠在 85114 -14 - 1244606 下部電極板的一面形成下部導電膜， a , 運續不間斷地製造 暴有Ψ 0聲電職_ T部電極板，提供 本的感應板。 〜產性妤、可降低成 此外，由於下部電極板由樹脂材料 — 月匕太十决本# /氣、 成，薄膜具有比樹 月田材枓更優艮的耐熱性，在成形加工 ，葺^ m, ^ 沣电極板的溫度下 4胺不會教化，下部電極板能夠與 豹如1丄a a 寻膜真正一體化，能 夠促供南性能的感應板。 此外，本發明的感應板的製造方法， T M ^ r, ,Λ u 在元、先在一面形成 下4導€挺的片狀薄膜上，成形加工 士 树知材料，與下部電 ϋπ ’能夠邊傳送片狀薄 不 叔，处热抱似 雙壤1形成下邵電極 此夠k供生產率好的感應板的製造方法。 、此外’在下邵電極板、 盥片妝i瞄μ /力工時，下邵電極板的一面 板一触仆处仏 、田a片狀溥膜與下部電極 乂"夠增強片狀薄膜與下部電極板的接合力。 下二：：於能在用上模控制片狀薄膜向上方移動的狀態 膜和充填樹脂材料’所以能夠強固枯合片狀薄 _合^%板，能夠進一步增強片狀薄膿與下部電極板 此外，由於利用成形加 ^ ^ 2 用連接邵連接片狀薄膜，連 、貝’成下部電極板，用 .¾ 断用主屬模切斷連接部，從片狀 辱誕切斷分離具有下部 有I+ 寸私I的下邵電極板，能夠提高具 有下#導電膜的下部電柄板 板。 狼的生屋率，提供低成本的感應 【圖式簡單說明】 85114 -15 - 1244606 圖1是本發明實施方式的主要部位剖面圖。 圖2是說明本發明的下部電極板製造方法的示意圖。 圖3是習知感應板的主要部位剖面圖。 【圖式代表符號說明】 1 下部電極板 2 透明薄膜 3 下部透明導電膜 4 絕緣圖案 5 點間隔件 6 上部電極板 7 上部導電膜 10 片狀薄膜 11 傳送輥 12 成形金屬模 12a 充填部 12b 口部 13 上模 14 切斷用金屬模 14a 下部切割刀具 14b 上部切割刀具 21 下部電極板 22 下部透明導電膜 23 點間隔件 24 絕緣圖案 1244606 25 26 上部電極板 上部透明導電膜。 umUIU -12-1244606 Cut the arrow F 1 with a 4 a and Bu jt 1 direction F: two: with ⑷ composition, separated by ^ with lower through two =: ㈣ die-cut lower electrode plate} Yue Wu's lower evil electrode plate You can follow the direction of the arrow G, and you can take the following: Take up the sheet ... Use the transfer roller 11 to bring the sheet-like film 10 downstream. Set the @ -shaped metal mold 12 and the cutting device 14 formed by the loading device to the arrow 4 members. The force is applied to the mouth C in the C direction.... Π, and the tension can be transmitted to the downstream by the conveying roller 11. ^ It is possible to bond the transparent surface 2 of the lower surface of the lower electrode 1 separated from the sheet film 10 with a cutting mold 14 to the same size as the lower electrode plate 1. In the lower electrode plate 1 manufactured by the method, a plurality of spacers 5 are formed on the lower conductive film 3 at a predetermined height by using a photolithography technique or a mask P brush or the like. … Then, an insulating pattern 4 having a predetermined height is formed on the outer peripheral portion of the blanking electric film 3 with a surname-resistant layer or the like. The upper transparent conductive film 7 formed on the upper electrode plate 6 and the lower transparent conductive film 3 in advance are opposed to each other, and the upper electrode plate 6 is placed on the lower electrode plate 1. And 'the upper electrode plate 6 placed on the insulating pattern 4 is bonded to the insulating pattern 4 by using a method such as thermal welding, so that the lower electrode plate 1 and the upper electrode plate 6 are integrated, thereby manufacturing the present invention Induction board. With regard to the operation of the induction plate of the present invention thus manufactured, the operator presses the surface of the upper electrode plate 6 with a pressure of a predetermined value or more using a finger or a pen, etc., and the upper electrode plate that is pressed down elastically falls by a predetermined amount, and the upper portion is transparent The conductive mu-{3 1244606 film 7 is partially overlapped with the lower conductive film $ exposed from the plurality of dot spacers 5 and is turned on. The control unit (not shown) can be used to detect the conductive position of the transparent conductive film 3 on the lower and upper parts, and the desired coordinates can be entered. In addition, when the operating force for pressing the upper electrode plate 6 is lower than a predetermined value, the upper transparent conductive film 7 of the upper electrode plate 6 only overlaps the top of the dot spacer 5 and can be lowered below the top. Therefore, when the operating force is lower than a predetermined value, the upper transparent conductive film 7 and the lower transparent conductive film 3 are not inferior. Small can enter coordinates. For the induction plate of the embodiment of the present invention described above, since the lower electrode plate ^ is formed on the sheet film 10 in which the lower transparent conductive film 3 is formed in advance and integrated, the lower portion of the lower transparent conductive film 3 is provided. The manufacturing of the electrode plate 1 is not a conventional batch production method, and can be continuously produced, which reduces the productivity of the induction plate of the present invention. In addition, in the description of the embodiment of the present invention, the transparent film 2 and the upper electrode plate 6 which are pressed and integrated on the lower electrode plate 丨 are described by adding different numbers, but they may be unified to any one of the members. in. This can reduce the number of elements and further increase the productivity of the induction plate of the present invention. Since the lower electrode plate of the induction plate of the present invention forms a lower conductive film by forming a thin film of a predetermined thickness on one side, a thin film of the lower conductive film formed in advance can be integrated on the lower electrode plate when forming the lower electrode plate. 'Nenju Zhen is used to produce induction boards with good punches and reduced costs. In addition, 'Because the lower transparent conductive film is formed on one side of the transparent thin film, and the other is closed on the side of the lower electrode plate, the lower conductive film can be formed on one side of the lower electrode plate through the film, a, Continue to make uninterrupted production of 0 sound and electric _ T electrode plate, provide the induction board. ~ Productivity 妤, can be reduced In addition, since the lower electrode plate is made of resin material-匕 月 太 十 定本 #, gas, the film has better heat resistance than Shuyue Tian 枓, in the forming process, 葺^ m, ^ 胺 4 amines will not be educated at the temperature of the electrode plate, the lower electrode plate can be truly integrated with the leopard such as 1 丄 aa seeking film, which can promote the performance of the sensor plate. In addition, in the manufacturing method of the induction plate of the present invention, TM ^ r,, Λ u are formed on a sheet of thin film on one side, and the material is formed by processing a tree material. It is a manufacturing method of the induction plate that conveys sheet-like thin uncles and heats them like double soil 1 to form lower electrodes. In addition, in the Xia Shao electrode plate, the toilet makeup mirror, and the working time, one panel of the Xia Shao electrode plate touches the server, the film and the lower electrode are enough to enhance the sheet film and Bonding force of the lower electrode plate. Next two: The film and the filling resin material can be used to control the upward movement of the sheet film with the upper mold. Therefore, the sheet sheet can be consolidated and strengthened, and the sheet sheet can be further strengthened and the lower electrode plate can be further strengthened. In addition, since the sheet film is connected by the connection of the forming element ^ ^ 2 and the bottom electrode plate is connected with the shell, the connection part is cut by the main mold, and the lower part is separated from the sheet shape. The lower Shao electrode plate of I + inch private I can improve the lower electric handle plate with lower # conductive film. The wolf's birth rate provides low-cost induction. [Brief description of the drawings] 85114 -15-1244606 Figure 1 is a cross-sectional view of the main parts of the embodiment of the present invention. FIG. 2 is a schematic diagram illustrating a method for manufacturing a lower electrode plate of the present invention. Fig. 3 is a sectional view of a main part of a conventional induction plate. [Representative symbols] 1 lower electrode plate 2 transparent film 3 lower transparent conductive film 4 insulation pattern 5 dot spacer 6 upper electrode plate 7 upper conductive film 10 sheet film 11 transfer roller 12 forming mold 12a filling portion 12b mouth Part 13 Upper mold 14 Cutting metal mold 14a Lower cutting tool 14b Upper cutting tool 21 Lower electrode plate 22 Lower transparent conductive film 23 Point spacer 24 Insulation pattern 1244606 25 26 Upper transparent conductive film on the upper electrode plate. um