TWI243856B - Method for reducing internal stress of electroplated layer made of nickel-based alloy material - Google Patents

Method for reducing internal stress of electroplated layer made of nickel-based alloy material Download PDF

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TWI243856B
TWI243856B TW91125397A TW91125397A TWI243856B TW I243856 B TWI243856 B TW I243856B TW 91125397 A TW91125397 A TW 91125397A TW 91125397 A TW91125397 A TW 91125397A TW I243856 B TWI243856 B TW I243856B
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Taiwan
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nickel
based alloy
reducing
patent application
internal stress
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TW91125397A
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Chinese (zh)
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Shr-Tzung Ke
Ren-Jr Li
Ming-Der Ger
Le-Min Wang
Yu Sung
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Ind Tech Res Inst
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Abstract

Provided is one kind of method for reducing the internal stress of electroplated layer made of nickel-based alloy material (such as nickel-tungsten electroplated layer) which comprises steps of: adding ceramic particles into an electroplating solution containing a nickel salt; and put a base material in the electroplating solution to carry on the pulse electric-current electroplating. The method for reducing the internal stress of the electroplated layer made of nickel-based alloy material can reduce the internal stress of the electroplated layer made of nickel-based alloy material, decrease or eliminate the crack lines of the electroplated layer, and further increase the durability of the electroplated layer made of nickel-based alloy material.

Description

1243856 丨五、發明說明(1) ----- 、【發明領域】 本發明降低鎳基合金鍍層内應力之方法,θ、、 — 微粒於含鎳離子及含鎢離子或磷離子的電鍍液=外加f瓷 脈衝電鍍及低溫熱處理的步驟,以應用於降低 f ^用 層(如鎳鵪合金鍍層、鎳鱗合金鍍層)的内靡力、 ^ 【發明背景】 〜° 鎳基合金鍍層中的一種鎳鎢合金鐘層具有高溶點、高 硬度及耐磨性佳之優良性能,故目前業界常用鎳鎢合金^ 曰曰代 4又间污染性的硬絡鍵層’且錄鶴合金錄層在經過 6 〇 0 °C、1小時的熱處理後其硬度值可提高至丨〇 〇 〇 H V以上, 故鎳鎢合金鍍層常用於汽車、航空、食品、印刷以及化工 等設備之汽缸、活塞、轉軸、壓縮機、壓滾或成型模具等 零件上之錢覆’且因其具有優良的耐钱性,故亦適用於石 油、化工、製鹽及醫藥等工業設備之容器、離心機篩網及 易受腐蝕零件之鍍覆,然而由於鎳鎢合金鍍層之内應力過 大’限制了其應用範圍及耐久性。 鎳鎢合金鍍層的硬度及耐磨性會隨著鍵層中鶴含量的 增加而增加,同時鍍層的内應力也相對的增加,若鏡層太 厚則會造成鍍層產生裂縫或與基材的附著力變差,因二降 低鎳鎢合金的内應力成為鎳鎢合金鍍層應用之重點,而目 前降低鎳鎢合金鍍層内應力的方法主要有兩種,較常被使 用的一種是於鍍液中添加應力消除劑來控制内應力,如U. S.patent 5 8 5 3 556 及 U.S.patent 6 045 6 8 2 等皆使用有機化 合物作為應力消除劑來降低鎳鎢合金鍍層的内應力,但由 12438561243856 丨 V. Description of the invention (1) -----, [Field of the invention] The method for reducing the internal stress of the nickel-based alloy coating of the present invention, θ ,,-Fine particles in a plating solution containing nickel ions and tungsten ions or phosphorus ions = Plus f porcelain pulse electroplating and low temperature heat treatment steps to reduce the internal force of f ^ layers (such as nickel quay alloy coating, nickel scale alloy coating), ^ [Background of the invention] ~ ° Ni-based alloy coating A nickel-tungsten alloy bell layer has excellent properties such as high melting point, high hardness, and good abrasion resistance. Therefore, nickel-tungsten alloys are commonly used in the industry at present. After heat treatment at 6,000 ° C for 1 hour, the hardness value can be increased to more than 1000HV. Therefore, nickel-tungsten alloy coating is often used in cylinders, pistons, shafts, The money on compressors, rollers, or forming molds is also suitable for containers, centrifuge screens, and susceptible to industrial equipment such as petroleum, chemical, salt, and pharmaceuticals because of their excellent money resistance. Corrosion of parts However, due to the excessive stress of the nickel-tungsten alloy plating layer 'limits its scope of application and durability. The hardness and wear resistance of the nickel-tungsten alloy coating will increase with the increase of the crane content in the key layer, and the internal stress of the coating will also increase relatively. If the mirror layer is too thick, it will cause cracks in the coating or adhesion to the substrate. The force becomes worse, because reducing the internal stress of nickel-tungsten alloys has become the focus of nickel-tungsten alloy coatings. At present, there are two main methods to reduce the internal stress of nickel-tungsten alloy coatings. One of the more commonly used is to add it to the plating solution. Stress relief agents to control internal stresses, such as USpatent 5 8 5 3 556 and USpatent 6 045 6 8 2 etc., all use organic compounds as stress relief agents to reduce the internal stress of nickel-tungsten alloy coatings, but by 1243856

五、發明說明(2) 於應力消除劑的有機化合物成份在電場作用下會分解成過 多的生成物,該生成物過多時會劣化錢層,需定時使用活 性炭或類似作用之物質將過多的生成物去除而如此會增加 錢液管理之負荷;且應力消除劑也會造成鎳鎢合金鍍層之 結構與組成發生變化,而降低鑛層之硬度。另一種習知降 低鎳鎢合金鑛層内應力之方法係利用脈衝電流(p u 1 s e current)電鍍來降低内應力,此方法雖不會造成上述的問 題,並可提高鍍層的均勻度和硬度,但其降低内應力的效 果有限。 所謂脈衝電流電鍍,是在電鍍過程中,一段時間通 電,一段時間不通電,類似交流電流的輸出方法,輸出一 非對稱的波形;一般脈衝電流電鍍的參數有:通電時間 (Ton )、不通電時間(Toff )、負載循環[Duty Cycle。V. Description of the invention (2) The organic compound components in the stress relief agent will be decomposed into too many products under the action of the electric field. When the products are too much, the money layer will be degraded. It is necessary to use activated carbon or similar substances regularly to generate too much Material removal will increase the load of money management; and the stress relief agent will cause the structure and composition of the nickel-tungsten alloy coating to change, and reduce the hardness of the ore layer. Another known method to reduce the internal stress of nickel-tungsten alloy ore layers is to reduce the internal stress by using pulse current (pu 1 se current) electroplating. Although this method does not cause the above problems, it can improve the uniformity and hardness of the coating. However, its effect of reducing internal stress is limited. The so-called pulse current plating is that during the plating process, the power is applied for a period of time and the power is not applied for a period of time. Similar to the output method of AC current, an asymmetric waveform is output. The parameters of general pulse current electroplating are: energization time (Ton), no power Time (Toff), load cycle [Duty Cycle.

Ton /(Ton +Toff)]、脈衝頻率[frequency = l/ (Ton + Toff)]及電流密度(peak current density)等 ° 並且為了提高鎳鎢合金鍍層的硬度,習知製造鎳鑄合 金鍍層,是將其在6 0 0 °C的高溫下,熱處理約1小時。雖然 鎳鎢合金鍍層會因鎢化鎳(N i 4 W)的析出,而使鍵層之微硬 度可高達1000 Hv以上,但由於熱處理溫度過高,易使某些 基材軟化與變形,進而導致鍍層與基材剝離。 【發明目的】 本發明之第一目的是將碳化矽、碳化鎢等陶瓷微粒均 勻的加入鎳基合金鑛層中(如鎳鐵合金鍍層),使其内應力 降低,以減少或消除鍍層的裂紋,卻不會降低其硬度。Ton / (Ton + Toff)], pulse frequency [frequency = l / (Ton + Toff)], and current density (peak current density), etc. In order to increase the hardness of nickel-tungsten alloy coatings, it is known to manufacture nickel-cast alloy coatings, It is heat-treated at a high temperature of 600 ° C for about 1 hour. Although the nickel-tungsten alloy plating layer can cause the micro hardness of the bond layer to be higher than 1000 Hv due to the precipitation of nickel tungsten (N i 4 W), due to the high heat treatment temperature, it is easy to soften and deform some substrates. As a result, the plating layer is separated from the substrate. [Objective of the Invention] The first object of the present invention is to uniformly add ceramic particles such as silicon carbide and tungsten carbide to a nickel-based alloy ore layer (such as a nickel-iron alloy coating) to reduce internal stress so as to reduce or eliminate cracks in the coating. It does not reduce its hardness.

第6頁 1243856 五、發明說明(3) 本發明之第二目的在提供一低溫熱處理步驟,使基材 不會有軟化與變形的情形發生,且鎳鎢合金鍍層的硬度亦 會微幅提高,同時也可消除鍍層中由氫氣所造成的氫脆, 從而降低鍵層的内應力。 【發明特徵】 一種降低鎳基合金電鍍層内應力之方法,其步驟包 括··添加陶瓷微粒於含鎳鹽的電鍍液中;及將一基材置於 該電鍍液令進行脈衝電流電鍍。 為使 貴審查委員能更進一步瞭解本發明之特徵及技 術内容,請參閱以下有關本發明之詳細内容與附圖,茲舉 較佳可行之實施例與比較例並配合圖式詳細說明如後,相 信對本發明之目的、特徵與優點,當可由此得一深入且具 體之瞭解。 【發明詳細說明】 本發明提供一種降低鎳基合金鍍層(如鎳鎢合金鍍層) 内應力之方法,該方法是將碳化物、金屬氮化物或金屬氧 化物等陶瓷微粒加在電鍍液中,並使用脈衝電鍍及低溫熱 處理步驟來降低鎳鎢合金鍍層的内應力。 本發明鍍液中所採用的鎳鹽,一般為硫酸鎳或胺基磺 酸鎳,包含的鎳離子濃度為0. 1M/L-0. 5M/L,鎢鹽則為鎢 酸鈉等鎢鹽型,且鎢離子濃度為0.2M/L-0.5M/L為佳,而 絡合劑一般採用檸檬酸鹽、酒石酸鹽或其他有機酸鹽,濃 度一般控制在0.2M/L-0.6M/L之間。且電鍍液中也可加入 些許的銨離子,如氯化胺等,此銨離子可刺激電鍍液中鎢Page 6 1243856 V. Description of the invention (3) The second object of the present invention is to provide a low temperature heat treatment step so that the substrate will not be softened and deformed, and the hardness of the nickel-tungsten alloy coating will be slightly increased. At the same time, the hydrogen embrittlement caused by hydrogen in the plating layer can be eliminated, thereby reducing the internal stress of the bond layer. [Inventive Features] A method for reducing the internal stress of a nickel-based alloy plating layer, the steps of which include adding ceramic particles to a plating solution containing a nickel salt; and placing a substrate in the plating solution to perform pulse current plating. In order to enable your reviewing committee to further understand the features and technical contents of the present invention, please refer to the following detailed contents and drawings of the present invention, and the preferred and feasible embodiments and comparative examples are described in detail below with reference to the drawings. It is believed that the purpose, features, and advantages of the present invention can be obtained through a deep and specific understanding. [Detailed description of the invention] The present invention provides a method for reducing the internal stress of nickel-based alloy coatings (such as nickel-tungsten alloy coatings). The method is to add ceramic particles such as carbides, metal nitrides, or metal oxides to a plating solution, and Pulse plating and low temperature heat treatment steps are used to reduce the internal stress of the nickel-tungsten alloy coating. 1M / L-0. 5M / L, The tungsten salt is a tungsten salt such as sodium tungstate, etc. The nickel salt used in the plating solution of the present invention is generally nickel sulfate or nickel sulfamate. Type, and the tungsten ion concentration is preferably 0.2M / L-0.5M / L, and the complexing agent generally uses citrate, tartrate or other organic acid salts, and the concentration is generally controlled between 0.2M / L-0.6M / L between. In addition, some ammonium ions can be added to the plating solution, such as amine chloride. This ammonium ion can stimulate tungsten in the plating solution.

1243856 五、發明說明(4) 的電鍍,且有利於電鍍過程中使金屬離子能穩定析出,並 提高析出速率,同時氯離子也有助於陽極鎳塊有效溶解’ 幫助平衡鍍液中鎳離子的濃度,但氯離子濃度過多易造成 鎳鎢合金鍍層内應力的增加,所以氯化胺之濃度為 0.5M/L-1.5M/L較佳。當電鍍溫度為4 0 - 7 0 °C、電鍍液PH值 為8-1 0時、脈衝電流密度為5-30A/dm2、負載循環 0.1-0. 5、頻率1-1000時,可降低'鎳鎢合金鍍層的内應力 值並提高鍍層硬度。 本發明所應用的陶瓷微粒,可用導電能力較好的碳化 物’如碳化碎、碳化欽或碳化鶴專’该陶免微粒的粒徑為 0. 1〜1 // m。因為陶瓷微粒吸附和鑲嵌在陰極表面時,氫離 子可以在陶瓷微粒的表面上放電,同時,由於陶瓷微粒的 位置常常是突出陰極表面,而且陶瓷微粒的吸氫、滲氫能 力也差,故能使析出的氫氣易於排出,遂可使鍍層的吸 氫、滲氫量減少,且也可減少鍵層的晶體缺陷,因此,導 電能力較強的陶瓷微粒所形成的鎳鎢合金鍍層之内應力, 比導電能力較弱的陶竟微粒要小的多。而陶竟微粒在加入 鍍液前需先以約5 0 %鹽酸、7 0 °C下處理1 5分鐘,並以純水 清洗。一般陶瓷微粒添加於電鍍液中的含量為 lg/L-50g/L° 本發明所採用的低溫熱處理步驟,主要是以高溫爐經 各種不同溫度(如2 0 0 °C、3 0 0 °C、4 0 0 °C )和不同時間處 理下,來提高鎳鎢合金鍍層的硬度,且不會造成鍍層下基 材的變形。在熱處理過程中,以每秒升溫5 °C的升溫速率1243856 V. Description of the invention (4) Electroplating, which is conducive to the stable precipitation of metal ions during the plating process, and improves the precipitation rate. At the same time, the chloride ions also help the anode nickel block to dissolve effectively. However, too much chloride ion concentration can easily increase the internal stress of the nickel-tungsten alloy coating, so the concentration of amine chloride is preferably 0.5M / L-1.5M / L. When the plating temperature is 40-70 ° C, the pH value of the plating solution is 8-10, the pulse current density is 5-30A / dm2, the load cycle is 0.1-0. 5. When the frequency is 1-1000, it can be reduced ' The internal stress value of the nickel-tungsten alloy coating increases the coating hardness. 1 ~ 1 // m。 Ceramic particles used in the present invention, can be used with better conductivity of carbonaceous materials such as carbonized particles, carbonized carbon, or carbonized crane's particle diameter of the ceramic free particles is 0. 1 ~ 1 // m. Because ceramic particles are adsorbed and embedded on the surface of the cathode, hydrogen ions can be discharged on the surface of the ceramic particles. At the same time, because the position of the ceramic particles is often protruding from the surface of the cathode, and the ceramic particles have poor hydrogen absorption and hydrogen permeability capabilities, they can The precipitated hydrogen is easily discharged, so that the amount of hydrogen absorption and hydrogen permeation of the coating can be reduced, and the crystal defects of the bond layer can also be reduced. Therefore, the internal stress of the nickel-tungsten alloy coating formed by the ceramic particles with strong conductivity, The particles are much smaller than the weaker ceramics. The ceramic particles need to be treated with about 50% hydrochloric acid, 70 ° C for 15 minutes, and washed with pure water before adding the plating solution. Generally, the content of ceramic particles added to the plating solution is lg / L-50g / L °. The low-temperature heat treatment step used in the present invention is mainly performed in a high-temperature furnace through various temperatures (such as 200 ° C, 300 ° C). , 400 ° C) and different time treatments to improve the hardness of the nickel-tungsten alloy coating without causing deformation of the substrate under the coating. During the heat treatment, the heating rate is 5 ° C per second.

1243856 i、發明說^[5) 一""""' ~~ '' ' -------- 至熱處理最適溫度,玉為 °C以内,藉以確保不同;ί理溫度之精確度需控制在土 5 性。 批=人的鎳鎢合金鍍層品質之均一 例(如^ 2 : : ^ Τ合金電鍍層内應力之方法的第-實施 130〜的i酸ί、^其,步驟包括:將25〜35g的硫酸鎳、 銨混合形成一 〜1 20g的檸檬酸鈉及20〜30g的氯化 的碳化矽微粒=^ ’该鍍液的PH值為9〜10 ;再添加10〜2〇g 的濃度為〇 i 〇 〇1^液中混合攪伴,形成該鍍液内鎳離子 棒檬酸鈉的:麓/L ’鎢離子的濃度為〇·34〜0.49M/L, 7M/L,碳化矽二澧声=〜〇· 47M/L,氣化銨的濃度為0· 5〜〇· 置於該鍍液中、隹二^為1〇〜2〇g/L ;及取一乾淨的鐵塊, 至l2. 5A/dm2 订脈衝電錢’該脈衝電鑛的電流密度調整 到本發明電ΥΛ載為0·2,電流頻率為1 0 0 0Hz,即得 電鍍屑用in 鐵基材上的鹤鎳合金電鍍層,該鎢鎳合金 且用& a 0倍電子顯微鏡放大的結果如第二圖所示’龙 時,发疑應力計量測該鎢鎳合金電鍍層之厚度為10 0 # m 2内應力值為2ikg/mm2、硬度為7 9 2HV。 使 f知降低鎳基合金電鍍層内應力之方法的比較例(只 (如,衝電流電鍍,但不添加陶瓷微粒),其步驟包括 麵 第二圖所示):將2 5〜3 5 g的硫酸鎳、1 3 0〜1 5 0 g的鎢酸 錢、、' 100〜12〇g的檸檬酸鈉及20〜30g的氯化銨混合,其中該 夜内鎳離子的濃度0· 1 0〜〇· 23M/L,鎢離子的濃度為 錢4:〇· 49 M/L,檸檬酸鈉的濃度為〇· 39〜〇· 47M/L,氯化 的濃度為〇· 5〜〇· 7M/L,該鍍液的PH值為9〜10 ;及取一乾1243856 i. Invention ^ [5)-"~~ '' '-------- To the optimal temperature for heat treatment, jade is within ° C, to ensure different temperatures; The accuracy needs to be controlled in the soil. Batch = uniform example of the quality of nickel-tungsten alloy coatings (such as ^ 2:: ^ T-thickness of the method of internal stress of the alloy plating layer of 130-130), the steps include: 25 ~ 35 g of sulfuric acid Nickel and ammonium are mixed to form 1 ~ 1 20g of sodium citrate and 20 ~ 30g of chlorinated silicon carbide particles = ^ 'The pH of the plating solution is 9 ~ 10; 10 ~ 20g is added at a concentration of 0% 〇〇1 ^ solution mixed and stirred to form the nickel ion sodium barium citrate in the plating solution: Lu / L 'The concentration of tungsten ions is 0.34 ~ 0.49M / L, 7M / L, silicon carbide = ~ 〇 · 47M / L, the concentration of gasified ammonium is 0.5 ~ 5 ~ placed in the plating solution, and the concentration is 10 ~ 20 g / L; and a clean iron block is taken to 12 5A / dm2 order pulse electricity money 'The current density of the pulse electricity ore is adjusted to the electric current load of the present invention is 0.2, and the current frequency is 100 Hz, and the crane nickel alloy on the iron substrate for electroplating scraps is obtained. Electroplated layer, the result of the tungsten nickel alloy and magnification with & a 0 times electron microscope is shown in the second figure 'Long Shi, the thickness of the tungsten nickel alloy electroplated layer was measured by a suspected stress measurement within 10 0 # m 2 Stress value is 2ikg / mm2, hardness is 7 9 2HV. Comparative example of the method for reducing the internal stress of the nickel-based alloy plating layer (only (eg, galvanic current plating, but without adding ceramic particles), the steps include the second picture shown): will be 2 5 ~ A mixture of 35 g of nickel sulfate, 130 to 150 g of tungstic acid, 100 to 120 g of sodium citrate, and 20 to 30 g of ammonium chloride is mixed, and the concentration of nickel ions during the night is 0. · 10 ~ 〇23M / L, the concentration of tungsten ions is 4: 49 · 49M / L, the concentration of sodium citrate is 0.39 ~ 0.47M / L, and the concentration of chlorination is 0.5 ~ 〇 · 7M / L, the pH value of the plating solution is 9 ~ 10; and take a dry

1243856 五、發明說明(6) 淨的鐵塊,置於該鍍液中進行脈衝電鍍,該脈衝電鍍的電 流密度調整至12. 5A/dm2,負載循環為0. 2,電流頻率為 1 0 0 0 Hz,即得到習知只使用脈衝電流電鍍所製造出的鎳鎢 合金電鍍層。該鎳鎢合金電鍍層用1 0 0倍電子顯微鏡放大 的結果如第四圖所示,並且用螺旋應力計量測比較例的鎳 鎢合金電鍍層,厚度於100//m時,其内應力值為 42kg/mm2、硬度為 745Hv 〇 實驗結果顯示本發明降低鎳基合金鍍層(如鎳鎢合金 鍍層)内應力之方法,所製造出來的錄鎢合金電鍍層具有 較細的裂紋、較低的内應力及較高的硬度,故本發明能有 效降低錄鎢合金鍍層的内應力。 當然,以上所述僅為本發明之較佳實施例,其不應用 以侷限本發明之實施範圍,任何熟習該項技藝者在不違背 本發明之精神所作之任何修改均應屬於本發明之範圍,因 此本發明之保護範圍當以下列所述之申請專利範圍做為依 據。1243856 V. Description of the invention (6) A clean iron block is placed in the plating solution for pulse plating, and the current density of the pulse plating is adjusted to 12. 5A / dm2, the load cycle is 0.2, and the current frequency is 1 0 0 At 0 Hz, a nickel-tungsten alloy plating layer that is conventionally manufactured using only pulsed current plating is obtained. This nickel-tungsten alloy electroplated layer was magnified by an electron microscope at a magnification of 100 times as shown in the fourth figure, and the nickel-tungsten alloy electroplated layer of the comparative example was measured by spiral stress. When the thickness was 100 // m, the internal stress was The value is 42kg / mm2, and the hardness is 745Hv. The experimental results show that the method for reducing the internal stress of the nickel-based alloy coating (such as nickel-tungsten alloy coating) of the present invention, the produced tungsten alloy plating layer has finer cracks and lower Internal stress and high hardness, so the present invention can effectively reduce the internal stress of the tungsten alloy coating. Of course, the above is only a preferred embodiment of the present invention, and it should not be used to limit the scope of implementation of the present invention. Any modification made by those skilled in the art without departing from the spirit of the present invention should fall within the scope of the present invention. Therefore, the protection scope of the present invention should be based on the patent application scope described below.

第10頁 1243856 圖式簡單說明 【圖式簡單說明】 第一圖為本發明降低鎳基合金電鍍層内應力之方法的步驟 流程圖。 第二圖為本發明降低鎳基合金電鍍層内應力之方法所製造 出的鎢鎳合金電鍍層放大1 0 0 0倍之電子顯微圖。 第三圖為習知降低鎳基合金電鍍層内應力之方法的步驟流 程圖。 第四圖為習知降低鎳基合金電鍍層内應力之方法所製造出 的鎢鎳合金電鍍層放大1 0 0倍之電子顯微圖。Page 10 1243856 Brief description of the drawings [Simplified description of the drawings] The first figure is a flowchart of the steps of the method for reducing the internal stress of the nickel-based alloy plating layer of the present invention. The second figure is an electron micrograph of a tungsten nickel alloy electroplated layer manufactured by the method for reducing the internal stress of a nickel-based alloy electroplated layer at a magnification of 1000 times. The third figure is a flowchart showing the steps of a conventional method for reducing the internal stress of a nickel-based alloy plating layer. The fourth figure is an electron micrograph of a tungsten nickel alloy plating layer produced by a conventional method for reducing the internal stress of a nickel-based alloy plating layer by a factor of 100.

第11頁Page 11

Claims (1)

1243856 六、申請專利範圍 • 1 · 一種降低錄基合金鍍層内應力之方法,其步驟包括: 添加陶瓷微粒於含鎳鹽的電鍍液中;及 將一基材置於該電鍍液中進行脈衝電流電鍍。 2 ·如申請專利範圍第1項所述之降低鎳基合金鍍層内應 力之方法,其中該鎳鹽的濃度為0.1M/L〜0.5M/L。 3 ·如申請專利範圍第2項所述之降低鎳基合金鍍層内應 力之方法,其中該鎳鹽為硫酸鎳或胺基磺酸鎳。 4 ·如申請專利範圍第1項所述之降低鎳基合金鍍層内應 力之方法’其中該電鑛液之成份更包括 0. 2M/L〜0. 5M/L的鎢鹽、0. 2M/L〜0. 6M/L的絡合劑及 0.3M/L〜1.5M/L的氯化銨。 5 ·如申請專利範圍第4項所述之降低鎳基合金鍍層内應 力之方法’其中該嫣鹽為鶴酸納。 6 ·如申請專利範圍第4項所述之降低鎳基合金鍍層内應 力之方法,其中該絡合劑為檸檬酸鹽、酒石酸鹽或有 機酸鹽。 7 ·如申請專利範圍第1項所述之降低鎳基合金鍍層内應 力之方法,其中該陶瓷微粒為碳化物、金屬氮化物或 金屬氧化物。 8 ·如申請專利範圍第7項所述之降低鎳基合金鍍層内應 力之方法,其中該碳化物為碳化矽、碳化鎢或碳化鈦1243856 6. Scope of patent application • 1 · A method for reducing the internal stress of the base alloy coating, the steps include: adding ceramic particles to a plating solution containing nickel salt; and placing a substrate in the plating solution for pulse current plating. 2. The method for reducing the stress in the nickel-based alloy plating layer as described in item 1 of the scope of the patent application, wherein the concentration of the nickel salt is 0.1M / L to 0.5M / L. 3. The method for reducing the stress in the nickel-based alloy plating layer as described in item 2 of the scope of the patent application, wherein the nickel salt is nickel sulfate or nickel aminosulfonate. 4 · The method for reducing the internal stress of the nickel-based alloy coating as described in the scope of the patent application No. 1 'wherein the composition of the electric ore liquid further comprises 0.2M / L ~ 0. 5M / L tungsten salt, 0.2M / L ~ 0. 6M / L complexing agent and 0.3M / L ~ 1.5M / L ammonium chloride. 5. The method for reducing the internal stress of the nickel-based alloy coating as described in item 4 of the scope of the patent application, wherein the salt is sodium crane acid. 6. The method for reducing the stress in the nickel-based alloy coating as described in item 4 of the scope of the patent application, wherein the complexing agent is citrate, tartrate or organic acid salt. 7. The method for reducing the stress in the nickel-based alloy coating as described in the first item of the patent application scope, wherein the ceramic particles are carbides, metal nitrides or metal oxides. 8 · The method for reducing stress in a nickel-based alloy coating as described in item 7 of the scope of the patent application, wherein the carbide is silicon carbide, tungsten carbide or titanium carbide 第12頁 1243856 六、申請專利範圍 • 1 0 ·如申請專利範圍第1項所述之降低鎳基合金鍍層内 應力之方法,其中該脈衝電流電鍍的電流密度為 5〜3 0 A/dm2,負載循環為0. 1〜1. 5,脈衝頻率為 1-lOOOHz ° 1 1 ·如申請專利範圍第1項所述之降低鎳基合金鍍層内 應力之方法,其中將一基材置於該電鍍液中進行脈衝 電流電鍍的步驟之後,更包括一低溫熱處理的步驟。Page 1243856 VI. Patent application scope • 1 0 · The method for reducing the internal stress of the nickel-based alloy coating as described in item 1 of the patent application scope, wherein the current density of the pulse current plating is 5 ~ 3 0 A / dm2, The load cycle is from 0.1 to 1.5, and the pulse frequency is from 1 to 1000 Hz. 1 1 The method for reducing the internal stress of the nickel-based alloy coating as described in the first patent application scope, wherein a substrate is placed on the plating After the step of performing pulse current plating in the liquid, a step of low-temperature heat treatment is further included. 第13頁Page 13
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI506727B (en) * 2012-05-03 2015-11-01 Nat Univ Chung Hsing Semiconductor components High aspect ratio (HAR) hole or trough of the nickel-tungsten alloy filling plating solution and filling process
CN115074729A (en) * 2022-06-07 2022-09-20 国网福建省电力有限公司 High-hot-hardness Ni-W-based high-hardness ceramic phase composite coating and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI506727B (en) * 2012-05-03 2015-11-01 Nat Univ Chung Hsing Semiconductor components High aspect ratio (HAR) hole or trough of the nickel-tungsten alloy filling plating solution and filling process
CN115074729A (en) * 2022-06-07 2022-09-20 国网福建省电力有限公司 High-hot-hardness Ni-W-based high-hardness ceramic phase composite coating and preparation method thereof

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