TWI242751B - Fingerprint sensor panel - Google Patents

Fingerprint sensor panel

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Publication number
TWI242751B
TWI242751B TW93119542A TW93119542A TWI242751B TW I242751 B TWI242751 B TW I242751B TW 93119542 A TW93119542 A TW 93119542A TW 93119542 A TW93119542 A TW 93119542A TW I242751 B TWI242751 B TW I242751B
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TW
Taiwan
Prior art keywords
film layer
film
fingerprint reader
scope
substrate
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Application number
TW93119542A
Other languages
Chinese (zh)
Other versions
TW200601174A (en
Inventor
Chi-Chih Chu
Original Assignee
Advanced Semiconductor Eng
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Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW93119542A priority Critical patent/TWI242751B/en
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Publication of TWI242751B publication Critical patent/TWI242751B/en
Publication of TW200601174A publication Critical patent/TW200601174A/en

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  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

A fingerprint sensor panel mainly includes a substrate, a multi-layer pressure-transmitting film and a sealant. The substrate has a plurality of sensing electrodes protruded on its sensing surface. The multi-layer pressure-transmitting film is disposed above the sensing surface of the substrate and elastically touches the sensing electrodes. The multi-layer pressure-transmitting film has a first film layer and a second film layer. Since the second film layer is patterned and attached to the upper surface of the first film layer, the sealant applied around the pressure-transmitting film will not flowing into the upper surface of the first film layer.

Description

1242751 五、發明說明(1) 【發明所屬之技術領域】 本發明係有關於一種指紋辨識器面板構造,特別係有 關於一種具有多層壓力傳遞薄膜之指紋辨識器面板構造。 【先前技術】 習知指紋辨識器係用以辨認個人身份而裝設於特定電 子產品,例如將指紋辨識器裝設在一筆記型電腦、個人數 位助理裝置(PDA )或行動電話内,目前指紋辨識器係具有 一可感應指紋之面板,其感應方式係可區分為發光感測式 (optical sensing)、觸滑掃瞄式(sHding scanning)與 壓按式(pressure touching)幾種,其中依手指感測角 度、施力大小與觸滑速度之變化均會影響觸發光感測式盘 觸滑掃瞄式之指紋辨識判斷,而壓觸式指紋辨識器係在二 面Ϊ上設計有複數個密集排列之感測電極,並連接有對應 =谷,當手指壓按在該壓觸式指紋辨識器之該些感測電極 壓觸t :: Ϊ 2 ί壓力差產生電壓分布,以辨識指紋,故以 =觸式和、、文辨識器具有較佳之辨識能力,我國專利公止 % 伴習知指紋辨識器在面板構造上用以密封| 保遵其感測電極之機構。 /、 我國專利Α告第號「指紋辨識之丰w 揭示出-種指紋辨識器之封裝構造,導體裝置」 板係為一半導體a ,甘〆 作為辨識面板之基 面上,該感測表面設右篇叙加+ —固電日日體在一感測表 極),以靜電引绫f % \ 電何儲存電極(即感測電 電引線電性分開該些電荷儲存電極,並且-絕 1242751 五、發明說明(2) 緣膜係涵蓋該4b雷恭继产 4 #而/一电彳了錯存電極,而該基板在感測表面周邊 之塾狀電極係以鲜線遠技P 、迨 干艮運接至一導線架之引腳,以一封膠體 ^ Μ二腳之内鳊與該基板之側面、底面及感測表面周 、,而顯路出該感測表面,以供辨識指紋,該絕緣膜係以 化學氣相沉積(CVD)方式製作而全面無間隙地包覆於該感 測表面上之違些彈性電荷儲存電極,使得壓力感測效能變 差’故厚度需相當地薄(約1微米),極容易被磨耗。 清參閱第1圖’另一種習知指紋辨識器之面板構造丨〇 〇 係以一玻璃基板11 〇作為供指紋辨識之觸壓面板,該玻璃 基板11 0之一感測表面11 1設有複數個感測電極i丨2 ( 一般稱 其為Sylgard之彈性塊),其係稍凸起於該感測表面m, 以增進壓力感測效率,並將一壓力傳遞薄膜丨2〇 (一般稱其 為My lar膜)貼覆於該基板丨丨〇之感測表面丨n上並接觸該些 感測電極112,當手指壓按在該壓力傳遞薄膜12〇之上表面 1 2 1 ’該些感測電極11 2受到壓力並經該玻璃基板11 〇之電 容、電晶體轉換成電壓差並電性傳遞至在該感測表面丨i 1 周邊之特殊應用積體電路晶片140(ASIC chip),以辨識指 紋。在該基板11 0之感測表面111與該壓力傳遞薄膜丨2〇之 間應留有一間隙11 3,以供彈性傳遞壓力,當該壓力傳遞 薄膜1 2 0係預先貼覆於該基板11 0之感測表面111並適當定 位之後,再以手工切割在該基板110之壓力傳遞薄膜120, 並在該壓力傳遞薄膜1 2 0之周邊係點塗上一液態之密封膠 1 30,例如點塗UV膠,以密封在該間隙11 3内之該些感測電 極112,由於該壓力傳遞薄膜120相當柔軟,其邊緣會因切1242751 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a structure of a fingerprint reader panel, and more particularly to a structure of a fingerprint reader panel having a multilayer pressure transmission film. [Prior art] The conventional fingerprint reader is used to identify individuals and is installed in specific electronic products. For example, the fingerprint reader is installed in a notebook computer, a personal digital assistant (PDA), or a mobile phone. The identifier has a panel capable of sensing fingerprints, and its sensing methods can be divided into optical sensing, sHding scanning, and pressure touching. Changes in the sensing angle, the magnitude of the force applied, and the touch-slip speed will affect the fingerprint recognition judgment of the touch-sweep-scan scan-trigger, and the pressure-touch fingerprint reader is designed with a plurality of dense The aligned sensing electrodes are connected to corresponding valleys. When a finger is pressed on the sensing electrodes of the pressure-sensitive fingerprint reader, the pressure distribution t :: Ϊ 2 generates a voltage distribution to identify the fingerprint, so With = touch-type, and text-type identifiers have better identification capabilities, the patent of our country's patented fingerprint readers are used to seal the panel structure | guarantee the mechanism of its sensing electrodes. / 、 China ’s patent No. A “Fingerprint of fingerprint identification reveals a package structure of a fingerprint reader, a conductor device” The board is a semiconductor a, Gansu is used as the base surface of the identification panel, and the sensing surface is provided. In the right part, + + —Solid electricity sun body is on a sensing meter pole), the electrostatic charge f% \ electric storage electrode (that is, the sensing electric lead electrically separates these charge storage electrodes, and-definitely 1242751 five 、 Explanation of the invention (2) The limbal membrane system covers the 4b Lei Gong's successor 4 # and / a electric electrode staggered the stray electrodes, and the substrate-shaped electrode on the periphery of the sensing surface is fresh-lined P, dried. That is, the pins connected to a lead frame are surrounded by the inner side of a pair of gel ^ Μ feet and the sides, the bottom surface, and the sensing surface of the substrate, and the sensing surface is displayed for fingerprint identification. The insulating film is made by a chemical vapor deposition (CVD) method and is covered on the sensing surface without any elastic charge storage electrodes, which makes the pressure sensing performance worse, so the thickness needs to be relatively thin ( (Approximately 1 micron), it is very easy to wear. See Figure 1 'Another practice The panel structure of the pattern recognition device 〇〇〇 uses a glass substrate 11 〇 as a touch pressure panel for fingerprint identification, one sensing surface 11 1 of the glass substrate 110 is provided with a plurality of sensing electrodes i 2 (commonly known It is an elastic block of Sylgard), which is slightly raised on the sensing surface m to improve the pressure sensing efficiency, and a pressure transmission film (generally called My lar film) is attached to the substrate丨 丨 〇 on the sensing surface 丨 n and contact the sensing electrodes 112, when a finger is pressed on the pressure transmission film 12〇 surface 1 2 1 'the sensing electrodes 11 2 are under pressure and pass through the glass The capacitance and transistor of the substrate 11 are converted into a voltage difference and are electrically transmitted to the special application integrated circuit chip 140 (ASIC chip) around the sensing surface i 1 to identify the fingerprint. There should be a gap 11 3 between the measurement surface 111 and the pressure transmission film 丨 20 for elastic transmission of pressure. When the pressure transmission film 1 2 0 is pre-applied to the sensing surface 111 of the substrate 110 and is appropriate, After positioning, the pressure is transferred by manual cutting on the substrate 110 Film 120, and apply a liquid sealant 1 30 on the periphery of the pressure-transmitting film 120, for example, a UV sealant, to seal the sensing electrodes 112 in the gap 113. The pressure-transmitting film 120 is quite soft, and its edges

第7頁 1242751 五、發明說明(3) 割作業或溫度變化而產生任意趣曲,且因該密封膠13Q之 點塗高度會高於在該壓力傳遞薄膜1 2 0與該基板11 〇之感測 表面111間之間隙1 1 3,因此造成在該壓力傳遞薄膜丨2 〇周 邊之該密封膠1 3 0會不規則流動而沾染至該壓力傳遞薄膜 120之上表面121,當該密封膠130固化,該壓力傳遞薄模 1 2 0之周邊亦變得不靈敏,無法順利傳遞壓力至該些感測 電極112,導致指紋辨識失敗。 【發明内容】 本發明之主要目的係在於提供一種指紋辨識器面板構 造,主要包含有一基板以及一多層壓力傳遞薄膜,該基板 之一感測表面係凸設有複數個感測電極,該多層壓力傳遞 薄膜係設於該基板之感測表面上並彈性接觸該些感測電 極,其中該多層壓力傳遞薄膜係具有一第一膜層以及一第 二膜層,該第二膜層係圖案化貼附於該第一膜層之上表 面,以防止一在該壓力傳遞薄膜外周之密封膠流佈至該第 一膜層之上表面。 本發明之次一目的係在於提供一種多層膜之指紋辨識 器面板構造,其中該多層壓力傳遞薄膜之第二膜層係為框 條狀,而貼附於該第一膜層之上表面周邊,有效防止一密 封膠流佈至該第一膜層之上表面並增強該多層壓力傳遞薄 膜之強度。 依本發明之多層膜之指紋辨識器面板構造,其係主要 包含有一基板以及一多層壓力傳遞薄膜,其中該基板係具 有一感測表面,複數個感測電極係凸設於該感測表面,該Page 7 1242751 V. Description of the invention (3) Arbitrary music is generated by cutting operation or temperature change, and the spot coating height of the sealant 13Q will be higher than that of the pressure transmission film 1 2 0 and the substrate 11 〇 The gap 1 1 3 between the measuring surfaces 111 causes the sealant 1 3 0 around the pressure transmitting film 丨 2 0 to flow irregularly and contaminate the upper surface 121 of the pressure transmitting film 120. When the sealant 130 When cured, the periphery of the pressure transmitting thin mold 120 also becomes insensitive, and the pressure cannot be smoothly transmitted to the sensing electrodes 112, which results in fingerprint identification failure. [Summary of the Invention] The main object of the present invention is to provide a fingerprint reader panel structure, which mainly includes a substrate and a multilayer pressure transmitting film. One of the sensing surfaces of the substrate is convexly provided with a plurality of sensing electrodes, and the multilayer The pressure transmitting film is disposed on the sensing surface of the substrate and elastically contacts the sensing electrodes. The multilayer pressure transmitting film has a first film layer and a second film layer, and the second film layer is patterned. Attach to the upper surface of the first film layer to prevent a sealant on the periphery of the pressure transmitting film from flowing to the upper surface of the first film layer. A second object of the present invention is to provide a fingerprint reader panel structure of a multilayer film, wherein the second film layer of the multilayer pressure transmission film is frame-shaped and attached to the periphery of the upper surface of the first film layer. Effectively prevent a sealant from flowing to the upper surface of the first film layer and enhance the strength of the multilayer pressure transmission film. The multi-layer film fingerprint reader panel structure according to the present invention mainly includes a substrate and a multi-layer pressure transmitting film, wherein the substrate has a sensing surface, and a plurality of sensing electrodes are convexly disposed on the sensing surface. , The

1242751 五、發明說明(4) 多層壓力傳遞薄膜係設於該基板之感測表面上並彈性接觸 該些感測電極,其中該多層壓力傳遞薄膜係具有一第一膜 層以及一第二膜層,該第二膜層係圖案化貼附於該第一膜 層之上表面。 【實施方式】 參閱所附圖式,本發明將列舉以下之實施例說明。 依本發明之一具體實施例,請參閱第2及3圖,一種指 紋辨識器面板構造2〇〇係主要包含一基板210以及一多層壓 力傳遞薄膜2 2 0 ’該基板21 0係具有^一感測表面2 11,並且 複數個具有彈性之感測電極21 2係凸設於該感測表面21 1, 該些感測電極21 2係為一種钮知(but ton )狀之Sy 1 gard彈性 塊,該些感測電極2 1 2係連接在該基板21 〇内對應之電容與 電晶體(圖未繪出),此外,一用以接受電壓差而辨識壓力 位置之特殊應用積體電路晶片240係可利用覆晶接合方式 設在該基板2 1 0之感測表面2 11,在本實施例中,該基板 210係為一玻璃基板(giass substrate),該基板210之感 測表面211係包含有一感測區,該些感測電極21 2係密集地 設於該感測表面21 1之感測區,如格狀陣列方式,該些感 測電極21 2之形成方式係可先將一光阻形成於該基板2丨〇之 感測表面211,在預定位置上曝光顯影出沉洞之後,將形 成该些感測電極2 1 2之固化膠印刷於該光阻之沉洞再加以 固化成形,之後,去除該光阻,以顯露出該些突起狀之感 測電極212。 ~ 請再參閱第2及3圖,該多層壓力傳遞薄膜22〇係設於1242751 V. Description of the invention (4) A multilayer pressure transmitting film is disposed on the sensing surface of the substrate and elastically contacts the sensing electrodes, wherein the multilayer pressure transmitting film has a first film layer and a second film layer The second film layer is patterned and attached to the upper surface of the first film layer. [Embodiment] With reference to the drawings, the present invention will be described by the following embodiments. According to a specific embodiment of the present invention, please refer to FIGS. 2 and 3, a fingerprint reader panel structure 2000 series mainly includes a substrate 210 and a multilayer pressure transmission film 2 2 0 'The substrate 21 0 has ^ A sensing surface 2 11 and a plurality of elastic sensing electrodes 21 2 are convexly disposed on the sensing surface 21 1, and the sensing electrodes 21 2 are a but ton-shaped Sy 1 gard Elastic block, the sensing electrodes 2 1 2 are connected to the corresponding capacitor and transistor (not shown) in the substrate 21 〇 In addition, a special application integrated circuit for receiving the voltage difference and identifying the pressure position The chip 240 can be provided on the sensing surface 2 11 of the substrate 2 1 0 by a flip-chip bonding method. In this embodiment, the substrate 210 is a giass substrate, and the sensing surface 211 of the substrate 210 is The sensing area includes a sensing area. The sensing electrodes 21 2 are densely arranged on the sensing area of the sensing surface 21 1. For example, a grid array method may be used to form the sensing electrodes 21 2. A photoresist is formed on the sensing surface 211 of the substrate 2 in a predetermined position. After the exposure develops the cavities, the curing glue forming the sensing electrodes 2 1 2 is printed on the cavities of the photoresist and then cured, and then the photoresist is removed to expose the protruding sensing Electrode 212. ~ Please refer to Figures 2 and 3 again. The multilayer pressure transmission film 22 is located at

1242751 五、發明說明(5) 該基板2 1 〇之感測表面2 1 1上並彈性接觸該些感測電極 212,使在該壓力傳遞薄膜220與該基板21〇之感測表面211 之間係形成有一間隙213,其中該多層壓力傳遞薄膜22〇係 具有一第一膜層221以及一第二膜層222,該第一膜層221、 係為一 Mylar聚酯膜,該第一膜層221係具有一上表面221a 及一下表面221b,該第一膜層221之下表面221b係接觸該 些感測電極212,該第一膜層221之上表面221a係作為供手 指之觸壓,該第二膜層2 2 2係經圖案化並貼附於該第一膜 層221之上表面221a,在本實施例中,該第二膜層222係為 框條狀並具有一開口 2 2 2 a,其係貼附於該第一膜層2 21之 上表面221a周邊,以顯露該第一膜層221之上表面221a中 央區域,較佳地,該第二膜層222係具有不小於該第一膜 層221之厚度,以增強該多層壓力傳遞薄膜22〇之強度。該 第二膜層2 22係可與該第一膜層221為相同材質,而為一 My lar聚酯膜。 請再參閱第2及3圖,該指紋辨識器面板構造2〇〇係另 包含有一密封膠230,如UV膠,該密封膠2 30係形成於該多 層壓力傳遞薄膜2 2 0之周侧,以密封該些感測電極2 1 2在該 間隙213内,由於該第二膜層222係貼附於該第一膜層221 之上表面221a ’因此可阻隔該密封膠230溢流擴散,使得 該密封膠230係僅黏接至該第二膜層222而不擴散至該第一 膜層221之上表面221a,故該密封膠2 30將不易沾染至該第 一模層221之上表面221a。此外,請參閱第3圖,該基板 210可連接一軟性電路板2 50,其係電性導接至在該基板1242751 V. Description of the invention (5) The sensing surface 2 1 1 of the substrate 2 1 0 is in elastic contact with the sensing electrodes 212 so that it is between the pressure transmitting film 220 and the sensing surface 211 of the substrate 21 0 A gap 213 is formed. The multilayer pressure transmission film 22 has a first film layer 221 and a second film layer 222. The first film layer 221 is a Mylar polyester film and the first film layer. 221 has an upper surface 221a and a lower surface 221b. The lower surface 221b of the first film layer 221 is in contact with the sensing electrodes 212. The upper surface 221a of the first film layer 221 is used as a finger pressure. The second film layer 2 2 2 is patterned and attached to the upper surface 221a of the first film layer 221. In this embodiment, the second film layer 222 is frame-shaped and has an opening 2 2 2 a, which is attached to the periphery of the upper surface 221a of the first film layer 2 21 to expose the central area of the upper surface 221a of the first film layer 221, preferably, the second film layer 222 has a size not less than the The thickness of the first film layer 221 is used to enhance the strength of the multilayer pressure transmission film 22. The second film layer 22 can be made of the same material as the first film layer 221, and is a My lar polyester film. Please refer to FIGS. 2 and 3 again, the fingerprint reader panel structure 200 series further includes a sealant 230, such as UV glue, the sealant 2 30 is formed on the peripheral side of the multilayer pressure transmission film 2 2 0, In order to seal the sensing electrodes 2 1 2 in the gap 213, the second film layer 222 is attached to the upper surface 221a of the first film layer 221, so the overflow and diffusion of the sealant 230 can be blocked, so that The sealant 230 is only adhered to the second film layer 222 and does not diffuse to the upper surface 221a of the first film layer 221, so the sealant 2 30 will not easily stain the upper surface 221a of the first mold layer 221. . In addition, referring to FIG. 3, the substrate 210 can be connected to a flexible circuit board 2 50, which is electrically connected to the substrate.

第10頁 1242751 、發明說明(6) 210 ^测表面21丄上之特殊應用積體電路晶片 chip 以作為該指紋辨識器面板構造2〇〇對外之電性連 接0 p因此’在上述之該指紋辨識器面板構造2 〇 〇中,該多 層壓力傳遞薄膜22 0之第二膜層222係圖案化貼附於該第一 膜層221之上表面221a,而使得該多層壓力傳遞薄膜2 2〇在 其周邊係具有較強之結構,以減少不規則翹曲,並且,由 於4第—膜層222係貼附於該第一膜層221之上表面221&, 因此能防止該密封膠230溢流擴散沾染至該第一模層221之 上表面221a ’且該多層壓力傳遞薄膜22〇仍保有良好之壓 力傳遞性能,以提昇該指紋辨識器面板構造2 〇 〇之製程良 率與指紋辨識能力。 清參閱第4A至4C圖,其係為該多層膜式壓力傳遞薄膜 220在其中一種可具體實施之製程中之截面示意圖,首 先:請參閱第4A圖,先將一第一模層221與一未圖案化之 第=膜層222壓合在一起,之後,再以刀具或雷射切割該 第二膜層222,以形成該開口 22ia之溝槽;接下來,請參 閱第4B圖,由該第一膜層221撕離該第二膜層222之廢料, 以使该第二膜層222之開口 22 2a顯露出該第一模層221之上 表面221a,最後,將可形成如第4C圖所示之多層壓力傳遞 4膜220,在另一具體實施例中,該第二膜層222係可與該 第一模層221為一體成形,以構成該多層壓力傳遞薄膜 220。 、 本發明之保護範圍當視後附之申請專利範圍所界定者Page 10 1242751, description of the invention (6) 210 ^ special application integrated circuit chip chip on the test surface 21 丄 as the fingerprint reader panel structure 2000 external electrical connection 0 p. Therefore 'in the above-mentioned fingerprint In the identifier panel structure 2000, the second film layer 222 of the multilayer pressure transmission film 220 is patterned and attached to the upper surface 221a of the first film layer 221, so that the multilayer pressure transmission film 2 2 The surrounding system has a strong structure to reduce irregular warping. Moreover, since the fourth film layer 222 is attached to the upper surface 221 of the first film layer 221, the sealant 230 can be prevented from overflowing. The upper surface 221a 'of the first mold layer 221 is diffused and contaminated, and the multilayer pressure transmission film 22 still maintains good pressure transmission performance, so as to improve the process yield and fingerprint recognition ability of the fingerprint reader panel structure 2000. Refer to Figures 4A to 4C, which are schematic cross-sectional views of the multilayer film pressure transfer film 220 in one of the processes that can be implemented. First: Please refer to Figure 4A. First, a first mold layer 221 and a The unpatterned film layer 222 is pressed together, and then the second film layer 222 is cut with a cutter or laser to form a groove of the opening 22ia. Next, please refer to FIG. 4B, The first film layer 221 tears away the waste material of the second film layer 222, so that the opening 22 2a of the second film layer 222 exposes the upper surface 221a of the first mold layer 221, and finally, as shown in FIG. 4C The multi-layer pressure transmission 4 film 220 is shown. In another embodiment, the second film layer 222 can be integrally formed with the first mold layer 221 to form the multi-layer pressure transmission film 220. The scope of protection of the present invention shall be defined by the scope of the attached patent application

第11頁 1242751 五、發明說明(7) 為準,任何熟知此項技藝者,在不脫離本發明之精神和範 圍内所作之任何變化與修改,均屬於本發明之保護範圍。 I1B1 第12頁 1242751 圖式簡單說明 【圖式簡單說明】 第 1 圖:習知指紋辨識器面板構造之截面示意圖; 第 2 圖:依據本發明之一具體實施例,一種指紋辨識 器面板構造之截面示意圖; 第 3 圖:依據本發明之一具體實施例,該指紋辨識器 面板構造之感測表面示意圖;及 第4A至4C圖:依據本發明之一具體實施例,該指紋辨識器 面板構造之多層壓力傳遞薄膜在形成過程中之截面示意 圖。 元件符號簡單說明: 100 指紋辨識器 110 基板 111 感測表面 112 感測電極 113 間隙 120 壓力傳遞薄膜 121 上表面 130 密封膠 140 特殊應用積體電路晶片 200 指紋辨識器 210 基板 211 感測表面 212 感測電極 213 間隙 220 多層壓力傳遞薄膜 221 第一膜層 221a 上表面 221b 下表面 222 第二膜層 222a 開口 230 密封膠 240 特殊應用積體電路晶片 250 軟性電路板Page 11 1242751 V. Description of the invention (7) shall prevail. Any changes and modifications made by those skilled in the art without departing from the spirit and scope of the present invention shall fall within the protection scope of the present invention. I1B1 Page 12 1242751 Brief description of the drawings [Simplified description of the drawings] Figure 1: A cross-sectional view of a conventional fingerprint reader panel structure; Figure 2: A fingerprint reader panel structure according to a specific embodiment of the present invention Sectional schematic diagram; Figure 3: Schematic diagram of the sensing surface of the fingerprint reader panel structure according to a specific embodiment of the present invention; and Figures 4A to 4C: Structure of the fingerprint reader panel structure according to a specific embodiment of the present invention A schematic cross-sectional view of the multilayer pressure transmission film during its formation. Brief description of component symbols: 100 fingerprint reader 110 substrate 111 sensing surface 112 sensing electrode 113 gap 120 pressure transmitting film 121 upper surface 130 sealant 140 special application integrated circuit chip 200 fingerprint reader 210 substrate 211 sensing surface 212 sensing Measuring electrode 213 Gap 220 Multi-layer pressure transmission film 221 First film layer 221a Upper surface 221b Lower surface 222 Second film layer 222a Opening 230 Sealant 240 Special application integrated circuit chip 250 Flexible circuit board

第13頁Page 13

Claims (1)

1242751 六、申請專利範圍 【申請專利範圍】 1、一種指紋辨識器面板構造,包含: 一基板’其係具有一感測表面,複數個感 設於該感測表面;及 电位係凸 並彈:ic薄膜’其係設於該基板之感測表面上 ★接觸该些感测電極,其中該多層壓力傳遞薄膜係具 於二Ϊ一膜層以及一第二膜層,該第二膜層係圖案化貼附 %孩第一膜層之上表面。 i由f申請專利範圍第1項所述之指紋辨識器面板構造, :η i第—膜層係為框條狀,而貼附於該第一膜層之上表 W周逯。 甘士,申π專利範圍第1項所述之指紋辨識器面板構造, ^中該第f膜層係具有不小於該第一膜層之厚度。 1 申=專利範圍第1項所述之指紋辨識器面板構造, 而虡第一膜層係具有一開口,以顯露該 膜上表 面中央區域。 1+1 ί明專利範圍第1項所述之指紋辨識器面板構造, "中^第一膜層係為My 1 ar聚酯膜。 】由;ΐ請專利範圍第5項所述之指紋辨識器面板構造, 1中該第f膜層係與該第一膜層為相同材質。 1 +1 ί Γ專利範圍第1項所述之指紋辨識器面板構造, 其中該基板係為一玻璃基板。 範圍第1項所述之指紋辨識器面板構造, /、 03 费封膠,其係形成於該多層壓力傳遞薄臈之 六、申請專利範圍 周側,以密封該些感測電核 9、如申請專利範圍第8項 其中該密封膠係黏接至兮、之指紋辨識器面板構造, 之上表面。 该4二膜層而不擴散至該第一腠廣 1 〇、如申請專利範圍第丨項 豆另肖含至少^ $ $ 、斤述之扣紋辨識器面板構造, 具为2>3主夕一特殊應用積艚 · 係設於該基板之該感測表面。 阳 IC chip) ’、 11、如U la圍第1項所述之指紋辨識器面板構造, 其中該特殊應用積體電路晶片(ASIC chip)係覆晶接合於 該基板之該感測表面。 12、如申請專利範圍第1項所述之指紋辨識器面板構造 其中該第二膜層係與該第一模層為一體成形。1242751 6. Scope of patent application [Scope of patent application] 1. A fingerprint reader panel structure, including: a substrate 'which has a sensing surface, and a plurality of sensors are disposed on the sensing surface; and the potential system is convex and bounces: ic film 'is arranged on the sensing surface of the substrate ★ contacting the sensing electrodes, wherein the multilayer pressure transmission film is provided with a second film layer and a second film layer, the second film layer is patterned The top surface of the first film layer of %% is attached. i is constituted by the fingerprint reader panel described in item 1 of the patent application scope of f, and the η i-th film layer is frame-shaped, and is attached to the surface of the first film layer. Gan Shi, the fingerprint reader panel structure described in item 1 of the patent scope, wherein the f-th film layer has a thickness not less than that of the first film layer. 1 application = the fingerprint reader panel structure described in item 1 of the patent scope, and the first film layer has an opening to expose the central area of the surface on the film. 1 + 1 The structure of the fingerprint reader panel described in item 1 of the Ming patent scope, " the first film layer is a My 1 ar polyester film. ] The structure of the fingerprint reader panel described in item 5 of the patent scope. The f-th film layer in 1 is the same material as the first film layer. 1 +1 The fingerprint reader panel structure described in item 1 of the patent scope, wherein the substrate is a glass substrate. The structure of the fingerprint reader panel as described in the first item of the scope, /, 03 fee sealant, is formed on the multi-layer pressure transmission thin film No. 6, the side of the scope of the patent application, to seal the sensing electric cores 9, such as Item 8 of the scope of the patent application, wherein the sealant is adhered to the top surface of the fingerprint reader panel structure. The 42-layer film does not diffuse to the first one. If the number of patent applications in the scope of the patent application is at least ^ $ $, the structure of the button pattern identifier panel is 2 and 3 main eve A special application is provided on the sensing surface of the substrate. 11) The fingerprint reader panel structure as described in item 1 of Ula, wherein the special application integrated circuit chip (ASIC chip) is flip-chip bonded to the sensing surface of the substrate. 12. The fingerprint reader panel structure according to item 1 of the scope of patent application, wherein the second film layer is formed integrally with the first mold layer.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11144745B2 (en) 2018-07-23 2021-10-12 Egis Technology Inc. Optical fingerprint sensing module and electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11144745B2 (en) 2018-07-23 2021-10-12 Egis Technology Inc. Optical fingerprint sensing module and electronic device

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