TWI238578B - Memory module which includes a form factor connector - Google Patents
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Description
1238578 五、發明說明ο) [發明所屬之技術領域] 本發明大致上係關於記憶體模組,詳言之,係關於經 由單一連接器耦接之記憶體模組。 [先前技術] 已知快閃媒體可以使用於各種環境中,迄今,快閃媒 體提供用為裝置之分離媒體。於如此之使用方式,必須設 有不同型式的模組陣列以允許連接至譬如數位相機、MP3 遊戲機和快閃閱讀機之裝置。希望能夠提供一種能夠使用 於各種裝置之記憶體模組,該記憶體模組必須與現有的標 準相容,並能夠以一個模組操作之。 因此,所需要的是一種能夠用來提供複數個記憶體至 不需要多個連接器之裝置,或至在記憶體模組内之控制器 之系統和方法。該系統將能夠有效地降低成本、簡化修 改、和可容易地與現有的裝置相結合而實施,本發明可滿 足此等需求。 [發明内容] 複數個快閃媒體係耦接至單一個形狀因數(f orm f a c t o r )連接器以提供一個稱之為智慧型堆疊 (S m a r t S t a c k )模組之模組,該模組能夠直接搞接至智慧型 堆疊致能裝置。該智慧型堆疊模組並不包含有控制器,並 能夠由主機側加以控制。形狀因數連接器一般為小型快閃 (CompactFlash,CF)形狀因數,或為用於各種不同裝置之 其他的形狀因數。於一個較佳的實施例中,智慧型堆疊記 憶體模組包含有寫入保護開關,該寫入保護開關允許在智1238578 V. Description of the invention ο [Technical field to which the invention belongs] The present invention relates generally to a memory module, and in particular, it relates to a memory module coupled via a single connector. [Prior Art] It is known that flash media can be used in various environments. To date, flash media has been provided as a separate medium for devices. For such use, different types of module arrays must be provided to allow connection to devices such as digital cameras, MP3 game consoles and flash readers. It is desirable to be able to provide a memory module that can be used in various devices. The memory module must be compatible with existing standards and be able to operate as a module. Therefore, what is needed is a system and method that can be used to provide multiple memories to a device that does not require multiple connectors, or to a controller within a memory module. The system will be able to effectively reduce costs, simplify modification, and be easily implemented in combination with existing devices, and the present invention can meet these needs. [Summary of the Invention] A plurality of flash media are coupled to a single form factor connector to provide a module called a smart stack module, which can directly Connect to the smart stack enabler. The smart stack module does not include a controller and can be controlled by the host side. The form factor connector is typically a compact flash (CF) form factor, or other form factor used in a variety of different devices. In a preferred embodiment, the smart stack memory module includes a write protection switch, which allows the
92332.ptd 第7頁 1238578 五 、發明說明 (2) 慧 型 堆 疊 模 組 内 的 某 itb 記 憶 體 部 分 將 不 會 寫 入 〇 此 外 , 快 閃 記 憶 體 之 部 分 將 分 配 到 用 來 儲 存 資 訊 之 保 密 區 , 以 施 行 各 種 形 式 之 保 密 工 作 Ο 快 閃 記 憶 體 之 另 一 部 分 係 分 配 為 可 選 擇 儲 存 譬 如 使 用 者 指 紋 或 者 視 網 膜 掃 描 資 訊 等 之 生 物 辨 識 資 訊 0 於 較 佳 實 施 例 中 9 智 慧 型 堆 疊 模 組 為 第 一 型 (Type I) 或 第 型 (Type I [) CF格 式 之 快 閃 記 憶 卡 〇 此 卡 將 不 與 CF 閱 讀 機 相 容 但 是 將 與 智 慧 型 堆 疊 閱 讀 機 相 容 〇 當 可 得 到 較 大 的 快 閃 記 憶 體 晶 片 時 則 可 獲 得 較 大 的 記 憶 體 大 小 〇 最 後 5 智 慧 型 堆 疊 模 組 將 包 括 寫 入 保 護 開 關 〇 [實施方式: 本 發 明 大 致 上 係 關 於 記 憶 體 模 組 , 尤 指 經 由 單 一 連 接 器 耦 接 之 記 憶 體 模 組 〇 下 列 所 呈 現 之 說 明 可 使 熟 習 該 項 技 藝 者 製 造 並 使 用 本 發 明 並 提 供 作 為 專 利 中 請 的 内 容 和 其 說 明 書 〇 對 於 較 佳 實 施 例 之 各 種 不 同 修 飾 和 在 此 所 說 明 之 一 般 原 理 和 特 徵 對 於 熟 習 該 項 技 藝 者 而 是 容 易 明 白 的 〇 因 此 5 本 發 明 並 不 欲 受 所 示 實 施 例 之 限 制 , 反 之 9 本 發 明 將 與 按 日召 在 此 所 述 原 理 和 特 徵 之 最 廣 範 圍 相 一 致 0 複 數 個 快 閃 (固態)媒 體 係 耦 接 到 單 一 形 狀 因 數 連 接 器 以 提 供 模 組 (即, ,稱之為智慧型堆疊模組: ), 該 模 組 能 夠 直 接 耦 接 到 裝 置 Ο 智 慧 型 堆 疊 模 組 不 包 含 控 制 器 並 能 夠 由 主 機 側 加 以 控 制 〇 形 狀 因 數 連 接 器 一 般 為 小 型 快 閃 形 狀 因 數 , 或 為 用 於 各 種 不 同 裝 置 之 一 些 其 他 的 形 狀 因 數 0 於 一 個 較 佳 的 實 施 例 中 9 智 慧 型 堆 疊 記 憶 體 模 組 包 含 有 寫 入 保92332.ptd Page 7 1238578 V. Description of the invention (2) An itb memory part in the smart stack module will not be written. In addition, the flash memory part will be allocated to a secure area for storing information. In order to perform various forms of confidentiality work 0 Another part of the flash memory is allocated to select biometric information such as user fingerprints or retinal scan information 0 In the preferred embodiment, 9 smart stacking modules are the first Type I (Type I) or Type I () CF flash memory card. This card will not be compatible with CF readers but will be compatible with smart stack readers. A larger memory size can be obtained when flashing a memory chip. Finally, the smart stack module will include a write-protect switch. [Embodiment: The present invention is generally related to memory modules, especially memory modules coupled through a single connector. The description presented below will enable those skilled in the art to make and use the invention and provide it as part of a patent claim And its description. Various modifications to the preferred embodiments and the general principles and features described herein are easily understood by those skilled in the art. Therefore, the present invention is not intended to be limited by the illustrated embodiments. Conversely, the present invention will be consistent with the widest range of principles and features described herein by day. A plurality of flash (solid-state) media are coupled to a single form factor connector to provide a module (ie, called It is a smart stacking module:). This module can be directly coupled to the device. 0 The smart stacking module does not include a controller and can be controlled by the host side. Shape because the number of connectors typically small type quick flash shape number by, or is used for various different means of some of its his shape due to a number of 0 for coverage in Example 9 wise type stack mind mold pack, memory and contained in a relatively good real write
92332.ptd 第 8 頁 1238578 五、發明說明(3) 遵開關,该寫入保谁開 記憶體部分不合寫:允許在智慧型堆疊模組内的某些 用來儲存資訊之保穷區^外’快閃記憶體之部分將分配到 閃記憶體之另一邻,m以施行各種形式之保密工作。快 或者視網膜掃描㈡::為可選擇儲存譬如使用者指紋 1西?人6: 生物辨識(biometric)資訊。 蟑音之說明。筮1闰% …、下列之况明,來對本發明作更 ^ ηη弟1圖颁不智慧型堆疊模組1 0 0。該智禁创谁 疊模組1 0 0包括耦接到連拯— 〜、支隹 文』恧筏态1 0 4之稷數個記憶體裝詈 (即,快閃晶片 1 0 2 a、 1 〇 2 b $ 1 η 9 η 1 & π y ζ 1 0 2 η ) 0於較佳的實施例中, 快閃晶片係耦接在一起,而使得對於各區段具有冗位 (redundancy)° 於較佳貫施例中,智慧型堆疊模組將具有如小型快閃 (C F )卡相同之开> 狀因數,然後模組能插入任何c F槽中。第 2圖顯示此種應用之例子,該等應用可使用譬如快閃閱讀 機2 0 2、數位相機2 0 4或Μ P 3遊戲機2 〇 6之智慧型堆疊模組 1 00。於較佳實施例中,僅基於以閱讀機之智慧型堆疊模 組2 0 2能夠項取/寫入至智慧型堆叠媒體,而且將智慧型堆 疊模組插入標準CF閱讀機並不會損及該智慧型堆疊。如所 示之,智慧型堆疊模組並不包括控制器,且能由主機側所 控制。因為模組其本身並沒有任何控制器,因此能容易地 擴充而加上額外的記憶體。 土肩JL· 第3圖顯示如何由裝置積測特定之卡的表。於此實施 例中,當智慧型堆疊模組(即,智慧型堆疊反及(NAND)或92332.ptd Page 8 1238578 V. Description of the invention (3) Comply with the switch, the write should ensure that the part of the memory that is opened is not compatible: some of the poor areas used to store information within the smart stack module are allowed ^ 'A part of the flash memory will be allocated to another neighbor of the flash memory, and m will perform various forms of confidentiality work. Quick or retinal scan㈡ :: for optional storage such as user fingerprint 1 West? Person 6: Biometric information. Explanation of cock sound.筮 1 闰%…, the following conditions will be explained, the present invention will be further modified ^ ηη brother 1 figure awarded unintelligent stacking module 100. The intellectual forbidden wound stack module 1 0 0 includes a plurality of memory devices (ie, flash chips 1 0 2 a, 1 〇 2 b $ 1 η 9 η 1 & π y ζ 1 0 2 η) 0 In a preferred embodiment, the flash chips are coupled together, so that redundancy is provided for each section. In a preferred embodiment, the smart stack module will have the same opening factor as a Compact Flash (CF) card, and then the module can be inserted into any c F slot. Figure 2 shows an example of such an application, which may use a smart stacking module 100 such as a flash reader 202, a digital camera 204, or a MP3 gaming machine 2006. In the preferred embodiment, only the smart stack module 202 based on the reader can be accessed / written to the smart stack media, and inserting the smart stack module into a standard CF reader will not damage it. The smart stack. As shown, the smart stack module does not include a controller and can be controlled by the host side. Because the module itself does not have any controller, it can be easily expanded with additional memory. Soil Shoulder JL. Figure 3 shows how to measure a specific card by the device. In this embodiment, when a smart stack module (that is, a smart stack inverse (NAND) or
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1238578 五、發明說明(4) 智慧型堆疊反或(NOR))插入槽中時,卡偵測接腳(CD1和 CD2 )將為低。用來與能讀取智慧型堆疊模組卡之裝置相容 時,卡致能接腳(CE1和CE2)亦將為低。亦如所示,其他的 記憶體模組將具有用於偵測之不同的接腳配置。 定址 第4圖顯示定址智慧型堆疊模組之表。於較佳實施例 中,智慧型堆疊模組將以相似於習知的記憶體模組之方式 而程式化,僅有的差別是在於晶片選擇。 第4A圖顯示智慧型堆疊模組位址線(SO··· S3)和於小型 快閃卡上之其等效接腳之間的關係。 保密和生物辨識資訊 第5圖顯示包括寫入保護機構3 0 2、保密區3 0 4和生物 辨識區3 0 6之智慧型堆疊模組3 0 0。能夠將寫入保護機構予 以鎖住或解開,以允許寫入至模組。於較佳實施例中之寫 入保護機構可由軟體讀取以防止寫入於使用者區。必須將 空間分配用於在各個別快閃媒體之保密和生物辨識,於此 情況將使用相同的表以建立此資訊。於此實施例中將可以 看出,保密區3 0 4和生物辨識區3 0 6分配於1 0 2 a ’。熟習該 項技藝者將認知到區域3 0 2和3 0 4能夠分配於任何的或所有 之快閃晶片1 0 2 a ’至1 0 2 η ’,而且其仍在本發明之精神和範 圍内。 第6圖為顯示用於智慧型堆疊模組中以設定保密區之 資料的表。對於提供於智慧型堆疊模組之保密區,於較佳 實施例中,係依著下列方法:將前二個位元組(位元組0和1238578 V. Description of the invention (4) When the intelligent stacking inverse (NOR) is inserted into the slot, the card detection pins (CD1 and CD2) will be low. When compatible with devices that can read smart stacked module cards, the card enable pins (CE1 and CE2) will also be low. As also shown, other memory modules will have different pin configurations for detection. Addressing Figure 4 shows the table of the addressing smart stack module. In the preferred embodiment, the smart stack module will be programmed in a manner similar to conventional memory modules, with the only difference being the chip selection. Figure 4A shows the relationship between the smart stack module address line (SO ··· S3) and its equivalent pins on a small flash card. Confidential and biometric information Figure 5 shows the smart stack module 300, which includes the write protection mechanism 3 02, the security zone 3 04, and the biometric zone 3 06. The write-protection mechanism can be locked or unlocked to allow writing to the module. The write protection mechanism in the preferred embodiment can be read by software to prevent writing in the user area. Space allocation must be used for confidentiality and biometrics on individual flash media, in which case the same table will be used to create this information. In this embodiment, it can be seen that the security area 304 and the biometric area 306 are allocated to 10 2 a ′. Those skilled in the art will recognize that regions 3 2 and 3 4 can be allocated to any or all flash chips 1 2 a 'to 10 2 η', and they are still within the spirit and scope of the present invention. . Fig. 6 is a table showing data used for setting a security zone in a smart stack module. For the security area provided in the smart stack module, in the preferred embodiment, the following method is adopted: the first two bytes (bytes 0 and 0)
92332.ptd 第10頁 1238578 一 —— *----—_-—-—^^—— 五、發明說明(5) 位元組1 )設定於c 3 B 6,並將下〆個位元組(位元組2 )定義 功能。此外,位元組5 (區塊狀態旗標)將總是設定至〇x F 0 (或0F )以指示失效的區塊,使得作業系統或韌體將 不會無意地寫入於此失效的區塊。 對於額外的性能改進是將隨機存取記憶體加至該堆 疊,第7圖顯示將隨機存取記憶體4 0 2加至智慧型堆疊模組 4 0 0以改進性能之情形。藉由將隨機存取記憶體4 0 2加至模 組4 0 〇,可快取資料於隨機存取記憶體4 0 2,由此而使得可 較快速地存取於模組中之資料。 此外,能將智慧型堆疊模組設計成使其功能像是在基 線板(base board)上之子插件(daughter board),而使得 能以模組的方式增加容量。亦能設計智慧型堆疊模組使我 們能將一個卡插於先前一個卡的末端而形成鏈狀(或互相 聯繫的菊花鍵)。 田+第8圖顯示依照本發明之菊花狀鏈接複數個智慧型 疊模,5 0 0、5 0 2之情形。因此,於本實施例中,一個知 型堆疊模組5 〇 〇將包括於一端之母型連接器5 〇 6和於另二二 j ^型(擴充埠)連接器5 0 8,以允許插入更多之卡。於而 (母型連幻技中\擴充卡其本身可設計成具有若干個擴充埠 以疊模組。智慧型堆疊模組能夠選擇性地2 媒體之a用者旎夠具有在將其施行(儲存)於其本身之快閃 ’、★月’J即能夠檢視圖像之能力。 、巧 第9圖顯不作為擴充底板(expansi〇n bay)之智慧型堆92332.ptd Page 10 1238578 A—— * ----—_-—-— ^^ —— V. Description of the invention (5) Byte 1) Set to c 3 B 6 and place the next digit The tuple (byte 2) defines the function. In addition, byte 5 (block status flag) will always be set to 0x F 0 (or 0F) to indicate a failed block, so that the operating system or firmware will not inadvertently write in this failed block. Block. For additional performance improvements, add random access memory to the stack. Figure 7 shows the situation where random access memory 402 is added to the smart stack module 400 to improve performance. By adding random access memory 402 to the module 400, data can be cached in the random access memory 402, thereby enabling faster access to data in the module. In addition, the intelligent stacking module can be designed to function like a daughter board on a base board, so that the capacity can be increased in a modular manner. It is also possible to design smart stacking modules so that we can insert a card at the end of a previous card to form a chain (or interconnected daisy key). Tian + Fig. 8 shows the situation of a plurality of intelligent superimposed molds, 50 0, 50 2 according to the daisy-shaped link according to the present invention. Therefore, in this embodiment, a known stacking module 500 will include a female connector 5 06 on one end and a second j ^ (expansion port) connector 5 8 on the other end to allow insertion. More cards. Therefore, the (master-type magic card \ expansion card itself can be designed to have several expansion ports to stack modules. The intelligent stack module can optionally be used by 2 users of the media. ) In its own flash ', ★ month' J is the ability to view the image. Qiao Figure 9 is not a smart stack as an expansion board (expansioon bay)
1238578 五、發明說明(6) 疊模組6 0 0。於此實施例中,可將公型連接槽6 0 2插入於額 外的智慧型堆疊模組,而母型連接槽6 0 4將連接到智慧型 堆疊致能之小型快閃主機。 雖然本發明已依照所示實施例加以說明,但熟習該項 技藝者將容易瞭解到,對於各實施例可作各種的改變,而 該等改變將仍在本發明之精神和範圍内。因此,熟習該項 技藝者可作許多的修飾,而仍不偏離本發明所附申請專利 範圍之精神和範圍。1238578 V. Description of the invention (6) Stack module 6 0 0. In this embodiment, the male connection slot 602 can be inserted into an additional intelligent stacking module, and the female connection slot 604 is connected to a small flash host enabled by the intelligent stacking. Although the present invention has been described in accordance with the embodiments shown, those skilled in the art will readily recognize that various changes can be made to the embodiments, and such changes will still be within the spirit and scope of the present invention. Therefore, those skilled in the art can make many modifications without departing from the spirit and scope of the scope of patent application attached to the present invention.
92332.ptd 第12頁 1238578 圖式簡單說明 [圖式簡單說明] 第1圖顯示智慧型堆疊模組。 第2圖顯示能使用譬如快閃閱讀機、數位相機或MP3遊 戲機之智慧型堆疊模組之各種應用的範例。 第3圖顯示如何由裝置偵測特定之卡的表。 第4圖顯示定址該智慧型堆疊模組之表。 第4 A圖顯示智慧型堆疊模組位址線和於小型快閃卡上 之其等效接腳之間關係的表。 第5圖顯示智慧型堆疊模組,包括有寫入保護、保密 區和生物辨識區。 第6圖顯示設定用於智慧型堆疊模組之保密區的資料 之表。 第7圖顯示將隨機存取記憶體加至智慧型堆疊模組以 改進性能。 第8圖顯示依照本發明之菊花狀鏈接複數個智慧型堆 疊模組。 第9圖顧示作為擴充底板之智慧型堆疊模組。 100 智慧型堆疊模組 102a 、102b··· 102n、102a’、 102b’·· .· 102n’、102a' 102b ’’··· 10211”快閃晶片 104 連接器 202 快閃閱讀機 204 數位相機 206 MP3遊戲機 300 智慧型堆疊模組 302 寫入保護機構92332.ptd Page 12 1238578 Simple illustration [Schematic description] Figure 1 shows the intelligent stacking module. Figure 2 shows examples of various applications that can use smart stack modules such as flash readers, digital cameras or MP3 game machines. Figure 3 shows a table of how a particular card is detected by the device. Figure 4 shows a table addressing the smart stack module. Figure 4A shows a table of the relationship between the smart stack module address lines and their equivalent pins on a small flash card. Figure 5 shows the smart stack module, which includes a write protection, security area, and biometric area. Figure 6 shows a table of the data set for the security zone of the smart stack module. Figure 7 shows the addition of random access memory to the smart stack module to improve performance. FIG. 8 shows a daisy-chained smart stack module according to the present invention. Figure 9 shows the intelligent stacking module as an expansion backplane. 100 Smart Stacking Modules 102a, 102b ... 102n, 102a ', 102b' ... 102n ', 102a' 102b '' ... 10211 '' Flash Chip 104 Connector 202 Flash Reader 204 Digital Camera 206 MP3 game machine 300 smart stack module 302 write protection mechanism
92332.ptd 第13頁 123857892332.ptd Page 13 1238578
圖式簡單說明 304 保密 區 306 生 物 辨 識 400 智慧 型堆疊模 組 402 隨 機 存 取 記 憶 體 5 0 0 ^ 502 智慧型堆 疊 模 組 506 母 型 連 接 器 508 公型 (擴充埠: )連 接 器 600 智 慧 型 堆 疊 模 組 602 公型 連接槽 604 母 型 連 接 槽 92332.ptd 第14頁Schematic description 304 Confidential area 306 Biometrics 400 Smart stacking module 402 Random access memory 5 0 0 ^ 502 Smart stacking module 506 Female connector 508 Male (extension port:) Connector 600 Smart Stacking module 602 Male connection slot 604 Female connection slot 92332.ptd Page 14
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TWI447880B (en) * | 2007-08-31 | 2014-08-01 | Samsung Electronics Co Ltd | Stack-type semiconductor package, method of forming the same and electronic system including the same |
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TWI447880B (en) * | 2007-08-31 | 2014-08-01 | Samsung Electronics Co Ltd | Stack-type semiconductor package, method of forming the same and electronic system including the same |
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