1237685 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種待制仏士 合白光垂直掃描干涉條紋、面輪庵分析方法，尤指一種結 確地量測待_表面輪目=分析的優點並可迅速且精 【先前技術】 目月ίι產業界對於經由息 ίο 15 品品質的需求日漸增加，=彳相物表面輪廓的方法而檢測產 測、覆晶製程中金球凸塊尺_；=表面粗糖度和平坦度的檢 之間隔柱尺寸和高度的量、、列^、平面度的量測、彩色遽光片 測等，所應用的範圍幾乎心及微光學元件表面的量 封靖、平面顯示器業;先=)科：業(半導雜業、 赠摘賴枝對於㈣軸—種^快速 提升產品的生產效率非常重 _ 、產成本及 研究，希望能改進產品檢剛方法“置業界無不投入資源努力 ' 目前一般量測待測物之# 光)垂直掃描干涉分析法，其係運主要為白光(寬頻 的特性，精確地量測待_之纟 痛光)之同調長度短 一待測物表面並被此表面反射之量測光:而另—則為::射2 :::面並被此參考鏡面反射之參考光，前述被反射之量= 及多考光並被此分合光元件合成為—合成光並產： =後位移器調變前述量測光與參考光=奸 差’造成寬頻光干涉條紋分佈的變化。最後，經由 20 1237685 之表面輪 ΐ干涉條紋對比時位移器的垂直位置，分析出待測物 廓。 10 15 如圖！所示，美國專利第5,471，3()3號揭露__種 ==干涉術(VSI)與單波長相移干涉術__ ^面輪置物財法。此專狀量财㈣分職一 t由白光垂直㈣干涉術量職分析所得的整數干涉階數值斑 2經由單波長相移干涉術㈣且分㈣得的小數干涉階數值 ^在-起’義在維持單波長相移量測的解析度的條件下， 糾出待測物之表面麵。妓，由於此專利之制方法在量 測日守需要依序切純頻光源112與單波長光源⑴做為量測光 源，才能進行上述兩種不同量測模式的量測，導致此專利之量 測裝置$架構㈣。此外，此專利之量測方法必序完成上 ^兩種1測後才能描綠出待測物14之表面輪廊，所需之量測 時=極長。因此，美國專利第5,471，3G3號所揭露之量測方法 及^置’不僅裝置架構複雜，且無法應用於需要迅速量測的線 上產品檢測場合。 ,此外，美國專利案第0，028,670號揭露了另一種結合白光 垂直掃描干涉術(VSI)與單波長相移干涉術(psi)而運算出待測 物之表面輪廓的演算法。此專利之演算法係運用如圖2所示之 衣置其中見頻光源21提供一寬頻光，此寬頻光均勻入射於 一分光鏡22。分光鏡22將入射之寬頻光反射至分合光元件 26，並被分合光元件26分為兩道光束，量測光及參考光。量 測光入射至待測物24之表面並被此表面反射，參考光入射至 蒼考鏡面25並被此參考鏡面反射。前述被反射之量測光及參 20 1237685 ^光經由分合光糾％合光後，形成—具有干涉狀之寬頻 =並入射㈣測器27。最後，經由位移 測光 5 ^考光之_具之光㈣，造成合成光之干涉狀的變^ 而此變化由_器2 7 _並送至電腦2 8進行處理。 接著，此專利（美國專利案第Μ28,6”號)之淹算法係先 用白光干涉同調函數峰值位置债測法(peak_sen 、 -ysis)，a,^ 10 =不同像素位置係對應於待測物表面的不： 叶异出一整數干涉階數值。接著，叙 I據此 測器像素的峰值位置並操取出位於==平均所有對應於说 涉強度資料進行-相移干涉分值位置前後幾筆之干 2。敢後’ μ整合^述所得的整數干涉階數值與小數干涉階 物之表面輪廓。 知里測的解析度下，分析出待測 15 —雖然此專利之演算法並不像前述美國專利第5仍如 函數峰值位置_出，;涉=== 2。Γ5ΓΓΤΓ附近的數筆干涉強度資料進行二 干涉強度資料時的掃描間距又必須小於白光之平 因此，運用此專利（美國專利案第6,028,670號）演算法的= 1237685 物表面輪廓量測需要極長的掃描時間及運算時間，並無法運用 於前述之產品線上量測的場合中。 如上所述，上述的兩種待測物之表面輪廓的量測技術及演 算法，皆需要較長的量測時間及較繁複的運算步驟，並無法應 5 用於需要快速量測的線上產品檢測場合中。因此，產業界亟需 一種可迅速量測待測物之表面輪廓且具有極佳解析度的量測方 式及分析方法。 【發明内容】 10 本發明之主要目的係在提供一種待測物表面輪廓分析方 法，俾能在不需要切換掃描裝置硬體架構的情況下，即可迅速 地計算出對應於待測物之表面輪廓的一整數干涉相位階數及一 小數干涉相位階數，並可精確地描繪出待測物之表面輪廓，有 效地簡化量測裝置的複雜度及縮短量測所需的時間。 15 本發明之另一目的係在提一種待測物表面輪廓分析方法， 俾能在維持單波長相位量測解析度佳之優點的情況下，僅運用 —筆干涉強度資料即可運算出待測物之表面輪廓，有效地減化 量測所需之運算程序並縮短量測所需的時間。 為達成上述目的，本發明之運算法，係配合一分光干涉儀 20 裝置量測一待測物之表面輪廓，包括下列步驟：（A)擷取一經 過一分光干涉儀之寬頻光的干涉條紋，其中此寬頻光包括至少 一特定波長之光波，並由一寬頻光源提供；（B)偵測此寬頻光 之干涉條紋分佈的變化，並記錄於一干涉強度資料庫中；（C) 針對至少一特定波長，同時對此干涉強度資料中之資料進行一 1237685 及-相位分析演算’分別取得對應於待 ⑼結合此奸㈣錄及—錢切隨值，·以及 5 物里尺度4异，取传待測物之表面輪廓。 測僅需使用Γ^，運*用本發明之待测物表面輪廟分析方法量 具有寬頻光源及單波長光源的分光干㈣儀=不=使用同時 10 15 分r可從-筆寬—= 階數值與小數干=出=:::表面輪廓之整數干涉· 測的解析度相同。^其解析度與傳統之單波長相移量 不需找出最二;:：發明·^ 析而”L:千T 掃描位置，即可執行相移干涉分 分析方值。所以，本發明之待測物表面輪廓 外，更具二::::=::;:_的_ 點，並可運用於需要迅速精確量㈣上產品:==。 第=3^=^料峨美國專利 面輪廓分析方法可直接對^強^;本發明之待測物表 計首屮誠， 奸涉強度_進行分析，並同時 干;數二而 表面輪廊的一整數干涉階數值與一小數 切的量=像美國專利第5,471，303號的量測方法必需 與二:序進行白光垂直掃描干涉術_ 應於制物之h 種不同模式的量測，才能而得出對 ；、又輪摩的一整數干涉階數值與-小數干涉階數 20 1237685 分析方法，不僅可以 測的時間也可大幅的 值。因此，運用本發明之待測物表面麵 簡化待測物之表φ輪廓的量·構，其量 縮短。 里 一號所揭 測物表面嫩咖本發明之待 10 干涉階數值的計算同時進行，兩者：= 二 進行各自的分析，並同時得出斜"強度貝科 數干涉階數值與一小數干涉階數物之表面輪廓的一整 號之演算法中，小;^值^在美國專·. 數干沣卩比數傕祜呷管山十 干^产自數值的計算必須等到整1237685 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a method for analyzing white fringe and vertical scanning interference fringes and surface loops, especially a method for measuring and measuring the surface of _ surface wheel = analysis Advantages and can be fast and precise. [Previous technology] The industry's demand for the quality of 15 products is increasing day by day, and the method of detecting the gold ball bump ruler in the production test and flip chip manufacturing process is based on the method of surface contour of the phase. _; = Surface column size and height measurement, column size, flatness measurement, color calender measurement, etc. of the surface coarse sugar content and flatness inspection. The scope of application is almost the amount on the surface of the micro-optical element. Feng Jing, flat panel display industry; first =) Section: Industry (Semiconductor Miscellaneous Industry, Gifts, Picking, Laying Branches, etc.) It is very important to quickly improve the production efficiency of the product _, production costs and research, hoping to improve product inspection Method "Every effort has been invested in the industry." At present, the general measurement of #light to be measured is the vertical scanning interference analysis method, which is mainly used for white light (broadband characteristics, accurate measurement of __ 纟 纟 痛 光). Short homology length The measurement light on the surface of the object to be measured and reflected by this surface: and the other is :: the reference light that is reflected on the 2 ::: surface and reflected by this reference mirror, the aforementioned reflected amount = and the test light is taken by this The combination of splitting and combining optical elements is: combined light and production: = the rear shifter modifies the measurement light and the reference light = the difference between the broadband light interference fringe distribution caused by the difference. Finally, the comparison of the interference fringes on the surface through 20 1237685 The vertical position of the time shifter analyzes the profile of the object to be measured. 10 15 As shown in the figure, US Patent No. 5,471,3 () 3 discloses __ species == interferometry (VSI) and single-wavelength phase-shift interferometry __ ^ Face wheel method of property placement. This special amount of money is divided into 1 t. The integer interference order value spot obtained from the analysis of white light vertical chirping interference. 2 The fraction obtained through single-wavelength phase-shifting interferometry. The value of the interference order ^ in-uprising, while maintaining the resolution of the single-wavelength phase shift measurement, corrects the surface of the object to be measured. Prostitutes, because of the patented method, it needs to be cut sequentially on the measurement date. Only pure frequency light source 112 and single-wavelength light source can be used as the measurement light source to perform the two different measurement modes. The measurement of this patent has led to the construction of the patented measurement device. In addition, the measurement method of this patent must be completed in sequence ^ two types of 1 measurement before the green surface of the object 14 can be traced. Measurement time = extremely long. Therefore, the measurement method and setting disclosed in US Patent No. 5,471, 3G3 not only has a complicated device structure, but also cannot be applied to online product detection occasions that require rapid measurement. In addition, the US patent case No. 0,028,670 discloses another algorithm that calculates the surface profile of the object under test by combining white light vertical scanning interferometry (VSI) and single-wavelength phase-shift interferometry (psi). The algorithm of this patent uses The clothing shown in FIG. 2 includes a frequency light source 21 that provides a broadband light, and the broadband light is evenly incident on a beam splitter 22. The beam splitter 22 reflects the incident broad-band light to the splitting and combining element 26, and is divided into two beams by the splitting and combining element 26 for measuring light and reference light. The measurement light is incident on the surface of the object to be measured 24 and is reflected by the surface, and the reference light is incident on the Cangkao mirror surface 25 and is reflected by the reference mirror surface. The above-mentioned reflected measurement light and the reference light 20 1237685 ^ light are combined with the splitting light to correct the combined light, and then formed into an interference-shaped broadband = and incident on the detector 27. Finally, the displacement metering 5 ^ examines the light of the _ with the light, which causes the interference-like change of the synthesized light ^ and this change is sent to the computer 2 8 for processing. Next, the flooding algorithm of this patent (U.S. Patent No. M28,6 ") first uses the white light interference coherence function peak position debt measurement method (peak_sen, -ysis), a, ^ 10 = different pixel positions are corresponding to the test The surface of the object is not: leaves an integer interference order value. Then, based on this, the peak position of the pixel is measured and located at == average, all corresponding to the intensity-information-phase shift interference score position. Bizhigan 2. Dare '' integrate the integer interference order value and the surface profile of the fractional interference order. Under the known resolution, analyze the measured 15 —Although the algorithm of this patent is not like the aforementioned No. 5 of the U.S. patent still appears as the peak position of the function; related === 2. Several interfering intensity data near Γ5ΓΓΤΓ have a scanning interval smaller than that of white light. Therefore, this patent (U.S. Patent) Case No. 6,028,670) algorithm = 1237685 Object surface contour measurement requires extremely long scan time and calculation time, and cannot be applied to the aforementioned product line measurement. As mentioned above, the above This kind of measurement technology and algorithm of the surface profile of the object to be measured requires a long measurement time and complicated calculation steps, and cannot be applied to the online product detection occasions that require fast measurement. Therefore, the industry The world urgently needs a measurement method and analysis method that can quickly measure the surface contour of an object to be measured and has excellent resolution. [Summary of the Invention] 10 The main purpose of the present invention is to provide a method for analyzing the surface contour of an object to be measured.俾 can quickly calculate an integer interference phase order and a decimal interference phase order corresponding to the surface profile of the object to be measured without switching the hardware structure of the scanning device, and can accurately depict The surface profile of the object under test effectively simplifies the complexity of the measuring device and shortens the time required for measurement. 15 Another object of the present invention is to provide a method for analyzing the surface profile of an object under test, which can maintain a single wavelength In the case of good phase measurement resolution, the surface contour of the object to be measured can be calculated by using only pen interference intensity data, effectively reducing the calculation process required for measurement. In order to achieve the above-mentioned object, the algorithm of the present invention is used to measure a surface profile of an object to be measured with a spectroscopic interferometer 20 device, including the following steps: (A) capturing a Interference fringes of broadband light of a spectroscopic interferometer, wherein the broadband light includes at least a specific wavelength of light and is provided by a broadband light source; (B) changes in the interference fringe distribution of the broadband light are detected and recorded in an interference intensity (C) For at least one specific wavelength, perform a 1237685 and -phase analysis calculation on the data in the interference intensity data at the same time to obtain the corresponding record and the value of the money cut, And the size of the object is 4 different, and the surface profile of the object to be measured is transmitted. Only Γ ^ is used for the measurement. The analysis method of the surface of the object to be measured according to the present invention is used to measure the spectroscopic interference with a broadband light source and a single wavelength light source. Instrument = not = 10 15 points at the same time can be used from-pen width-= order value and decimal fraction = = = ::: integer contour interference of surface contour measurement resolution. ^ The resolution and the traditional single-wavelength phase shift amount do not need to find the second best; :: Invention. ^ Analysis and "L: Thousand T scan position, you can perform the phase shift interference analysis analysis square value. Therefore, the present invention In addition to the outline of the surface of the object to be measured, there are two more :::: == ::;: _ _ points, and can be applied to products that need to be measured quickly and accurately: ==. No. = 3 ^ = ^ 料 埃 patented surface The contour analysis method can directly analyze the strength of the test object meter according to the present invention, the intensity of the interference, and simultaneously perform the analysis; the number of two and an integer interference order value of the surface contour and a decimal cut Measurement = measurement method like US Patent No. 5,471,303 must be compared with two: sequential white light vertical scanning interferometry _ should be measured in h different modes of the product to get the right; An integer interference order value and -fractional interference order 20 1237685 analysis method, not only can measure the time but also a large value. Therefore, the surface of the object to be measured in the present invention is used to simplify the amount and configuration of the φ contour of the object to be measured. The quantity of the sample on the surface of Li No. 1 revealed that the tenderness of the surface of the present invention is calculated at the same time. , Both: = two perform their own analysis, and at the same time obtain the oblique " intensity Beco's number interference order value and a decimal number interference order surface contour integer algorithm algorithm, small; ^ 值 ^ 在U.S.A .: Number-to-Number-to-Number-to-Number Ratio
估"白來以後，才能經由相位分析位於平均峰 =置的干涉強度資料的方法被計算出Γ。=，I 15 L =物表面輪摩分析方法較美國專利第M2M70號之 =:=縮短量測及後續運算所需的時間’並降低所需 本毛月所運用之偵測器種類沒有限制，較佳為光二極體偵 翁，最佳為感光衫元件(咖Μ貞測器。本發明所運用之分 光干涉儀種類沒有限制，較佳為式干涉儀、 20 ^helS〇n式干涉儀或Unnik式干涉儀’最佳為論抓式干涉 【實施方式】 為了使貴審查料更瞭解本發日狀技術内容，中請 別提出本發明之一較佳每#办 寸 1土貝&例，供貴審查委員參考。 10 1237685 圖3係本發明之待測物表面輪廓分析方法所配合之分光干 涉儀示意圖，其中寬頻光源31提供一寬頻光至光束整形系統 32，而光束整形系統32將入射之光束均勾地入射於分光鏡 33。分光鏡33將入射之寬頻光反射至分合光元件34，寬頻光 5 並被分合光元件34分為兩道光束，量測光及參考光。其中， 量測光入射至待測物35之表面並被此表面反射，參考光入射 至參考鏡面36並被參考鏡面反射。前述被反射之量測光及參 考光經由分合光元件34合光形成一具有干涉條紋之寬頻合成 光，並入射於陣列式偵測器37。經由位移器38調變量測光及 10 參考光之間所具之光程差，造成合成光之干涉條紋的變化，並 由陣列式偵測器37偵測。 前述具有干涉條紋之寬頻合成光的干涉強度分佈可以表示 為下式· 7^/DC.[l + F.cosW] (1) 15 此外，由於本發明之待測物表面輪廓分析方法係運用同一 筆白光垂直掃描干涉資訊分別計算出待測物表面上不同位置對 應一基準高度的不同高度落差分佈，而此高度落差分佈可被視 為待測物表面上不同位置之干涉光程差分佈。因此，對應特定 波長λ，待測物表面之高度分佈H(x，y)可表示為： (2) 20 //(%，少）=(m + ，其中 WGZ 且 f|<l 另外，干涉相位與光程差的關係可表示為下式： ΦΛ^ = Εψ1 = τη{χ^ + ε{χ,γ) 2π λ 所以，只要分析出具有較低解析度的整數干涉階數值 11 (3) 1237685 鼻」的概念同時運算_干涉 ：= 5編’所《本發明之待_ (:==數 習知之演算或量測方半祕刀析方法可在較上述 待測物之表面輪廊 心間為短的時間内精確地演算出 直地:下::猎由位移器38調變參考鏡面的垂直位置，使立垂 直地上下移動而依序改變量測光及s使其垂 10扣陣列式摘測器37之某一像:考先之間的干涉相位差-參考鏡面垂直位置的變化圖，此像^測^干涉強度變化隨著 某-位置。由圖4a並可看出，對於:亚應於待測物表面上的 置，整體干涉強度的變化會隨著―；；^物表面上的某一位 化。但是如圖4b所示，雖 ^的波包形式變 15言，其縱向空間的波包函數分佈是^的各像素而 大干涉對比位置的縱向掃描座標並不目门但^:素發生最 大干涉對比位置的縱向座標 “目同’且各像素發生最 之表面輪扉。 、目對關係正好對應於待測物 心所不’其中圖5b係 口 Μ 涉階數值味，少）的演算流㈣，圖5e#R 中，整數干 小數干涉階數值如）的演算流程圖。系圖5a之步驟如中， 列步_T5a所示，本發明之待測物表面輪齡析方法包括下 12 1237685 步驟S51 ··擷取並偵測寬頻光之干涉條紋分佈的變化，並 記錄於一干涉強度資料庫中。 步驟S52 :對上述干涉強度資料庫中之一筆干涉強度資料 同時進行整數干涉階數值爪少）的運算（步驟S5 11至步驟 5 S512)及小數干涉階數值〆x，y)的運算（步驟S521至步驟 S523) ° 步驟S53 :結合整數干涉階數值及小數干涉階數值 ，對特定波長义進行相位一物理尺度計算，取得待測物 之表面輪廓。 10 如圖5b所示，在本發明之待測物表面輪廓分析方法中， 關於整數干涉階數值的計算包括下列步驟： 步驟S511 :將先前量測所得之干涉強度資料分別對偵測 器的每一像素位置進行計算，得出偵測器每一個像素發生最大 干涉對比位置所對應的縱向掃描座標。接著，採用「質心法」 15 的計算方式迅速地分析出待測物之初階低解析度的表面輪廓 Z(x，y)，如下式所示：After quoting, it is possible to calculate Γ by the method of phase analysis of the interference intensity data at the average peak position. =, I 15 L = The method of analyzing the surface friction of objects is compared with that of US Patent No. M2M70 =: = shortening the time required for measurement and subsequent calculations, and reducing the types of detectors used in this gross month are not limited, It is preferably a photodiode detector, and most preferably a photosensitive shirt element (CaM detector). There is no limitation on the type of the spectroscopic interferometer used in the present invention, preferably a type interferometer, a 20 ^ helSon type interferometer, or Unnik-type interferometer's best for grasping interference. [Embodiment] In order to make your materials more understand the technical content of this issue, please do not propose one of the present invention. For your reference. 10 1237685 Fig. 3 is a schematic diagram of a spectroscopic interferometer matched with the surface profile analysis method of the object under test according to the present invention, in which a broadband light source 31 provides a broadband light to a beam shaping system 32, and the beam shaping system 32 will The incident light beams are incident on the beam splitter 33. The beam splitter 33 reflects the incident broad-band light to the splitting and combining element 34, and the wide-band light 5 is divided into two beams by the splitting and combining element 34. The measurement light and the reference light . Among them, the measuring light is incident on the The surface of the object 35 is reflected by this surface, and the reference light is incident on the reference mirror 36 and is reflected by the reference mirror. The reflected measured light and the reference light are combined by the splitting and combining element 34 to form a broadband synthetic light with interference fringes. And incident on the array detector 37. The optical path difference between the variable metering and the 10 reference light is adjusted by the shifter 38, which causes the interference fringes of the synthetic light to change, and is detected by the array detector 37 The interference intensity distribution of the aforementioned broadband synthetic light with interference fringes can be expressed as the following formula: 7 ^ / DC. [L + F.cosW] (1) 15 In addition, since the surface profile analysis method of the object to be measured in the present invention uses The same white light vertical scanning interference information respectively calculates different height drop distributions corresponding to a reference height at different positions on the surface of the measured object, and this height difference distribution can be regarded as the interference optical path difference distribution at different positions on the surface of the measured object. Therefore, corresponding to a specific wavelength λ, the height distribution H (x, y) on the surface of the object to be measured can be expressed as: (2) 20 // (%, less) = (m +, where WGZ and f | < l In addition, Relationship between interference phase and optical path difference It can be expressed as the following formula: ΦΛ ^ = Εψ1 = τη {χ ^ + ε {χ, γ) 2π λ So, as long as the integer interference order value with a lower resolution is analyzed 11 (3) 1237685 Nose "is calculated simultaneously _Interference: = 5 edited by the "Invention of the present invention" (: == number of known calculation or measurement method of semi-secret knife analysis can be more accurate in a short time than the surface of the test object The ground calculation calculates the straight ground: bottom :: hunting adjusts the vertical position of the reference mirror by the shifter 38, moves the vertical position up and down to sequentially change the measurement light and s to make it a 10-button array picker 37 One image: the phase difference of the interference between the first and the reference mirrors is referred to the change of the vertical position of the mirror surface. This image is used to measure the change in interference intensity with a certain position. From Fig. 4a, it can be seen that, for the location of the sub-supplier on the surface of the object to be measured, the overall interference intensity changes with ―; However, as shown in FIG. 4b, although the wave packet form of ^ is changed to 15 words, its wave space function distribution in vertical space is each pixel of ^ and the vertical scanning coordinates of the large interference contrast position are not eye-catching, but ^: prime has the largest interference The vertical coordinate of the comparison position is "the same goal" and the most surface rotation occurs for each pixel. The relationship between the eye pairs corresponds to the object being measured, of which the calculation flow of Figure 5b is related to the numerical value of the order (less). In Fig. 5e # R, the calculation flow of integer dry decimal interference order value is as shown in Fig. 5a. The steps in Fig. 5a are shown in the middle, and the step _T5a is shown. The method for analyzing the age of the surface of the object under test of the present invention includes the following 12 1237685 steps. S51 ·· Capture and detect changes in the interference fringe distribution of wideband light and record them in an interference intensity database. Step S52: Simultaneously perform integer interference order values on one of the interference intensity data in the interference intensity database. ) Operations (steps S5 11 to step S512) and fractional interference order values 〆x, y) (steps S521 to S523) ° Step S53: combining integer interference order values and decimal interference order values to define specific wavelengths Enter The calculation of the phase and a physical scale is performed to obtain the surface contour of the object to be measured. 10 As shown in FIG. 5b, in the method for analyzing the surface contour of the object of the present invention, the calculation of the integer interference order value includes the following steps: Step S511: The previously measured interference intensity data is calculated for each pixel position of the detector to obtain the vertical scanning coordinates corresponding to the position where the maximum interference contrast of each pixel of the detector occurs. Then, the “centroid method” is used. The calculation method quickly analyzes the initial low-resolution surface profile Z (x, y) of the test object, as shown in the following formula:
, N 5>ΔΖχ (/,—/,·_】） ζ(义，少)二 - Σ^-Α-ι) /==1 其中Z(x，>；)為計算出之一位於待測物表面之對應點（x,；；)的高 度，W為垂直掃描總次數，ΔΖ為每一次掃描之間的垂直位移間 20 距，（為每次掃描紀錄之干涉強度分佈。 步驟S5 12 :以待測物表面一基準位置h，八）的高度 13 1237685 ίο 知。，怂)為準，將待測物表 相減並除以特定波長乂， 其他位置（χ，少)的高度取少)與其 階數值切(义少）。 便可計算出對應於各位置的整數干涉 品〉主思、的是，對單一枯 前述所運用之質心法，;、掃插資料的—個位置點㈣而言: 運算，所需之運算量極==包=次乘除運算與！次加減 析方法可贿料算”數干涉隨mr物細輪靡分 複數束蝴㈣光及參考光)可視為 的分佈可二下：涉的集合’所以寬頻光雙光束干辨, N 5 > ΔZχ (/, — /, · _]) ζ (meaning, less) two-Σ ^ -Α-ι) / == 1 where Z (x, >;) is one of Measure the height of the corresponding point (x, ;;) on the surface of the object, W is the total number of vertical scans, and ΔZ is the distance between the vertical displacements between each scan (20 is the interference intensity distribution recorded in each scan. Step S5 12 : Based on the height of a reference position h on the surface of the object to be measured, 8) 13 1237685 ίο know. Subtract the DUT and divide it by the specific wavelength 乂, and the height at other positions (χ, less) is less) and its order value is cut (meaning less). You can calculate the integer interfering products corresponding to each position.> The main idea is that for a single centroid method used in the foregoing; and, a position point for scanning data: calculation, the required operation Quantity pole == package = times multiplication and division operation with! The sub-addition and subtraction analysis method can calculate the number of interferences with the fine rotation of the MR object (complex light and reference light). The distribution can be regarded as two: the related set ’, so the wide-band optical two-beam dry discrimination
CO'J’。卜，' 少).[1 + 吩，X，；；) · cos(·，'少))] I DC 七 IINT άσ (5) 15 其中為波H㈣。(<T，wn為對 各單頻光的干涉相位差；續叫)=2_σχ礙為干涉儀作 垂直位移掃描《ΔΖ後的干涉相位變化。 (5)式中的第二項並可進一步整理為CO'J ’. Bu, 'less). [1 + phen, X, ;;) · cos (·,' 少))] I DC VII IINT άσ (5) 15 where is the wave H㈣. (< T, wn is the interference phase difference for each single-frequency light; continued) = 2_σχ prevents the interferometer from changing the phase of the interference after the vertical displacement scan ΔΔ. (5) The second term in the formula can be further organized as
1ΙΝΤ 〇〇 y) X oxp(-j^aZ)dc (6) 其中β(σ，χ，>〇為複數，内含exp(—从(σ，χ，少))的相位項。 因此，如圖5c所示，在本發明之待測物表面輪廓分析方 法中，關於小數干涉階數值的計算包括下列步驟： 20 步驟S521 :選擇一特定波長人，將先前量測所得之干涉尹 14 1237685 trier 度貝料針對此特定波長M波數σ)進行制葉轉換(F〇uri Transform)。 立5 2 2 ·分別對傅利葉轉換轉換後所得之實部項與虛 口P項進订反正切運算，得到對於此特定波長入(波數♦言，待 、李面之待測點（Xj)的干涉相位分佈# (σ，χ，γ)。 ^驟S523 ·以待測物表面之基準位置（χ。，八）所具有之干涉 為準，將待測物表面上其他位置所 ίο 15 20 靡的小數干涉階數值如）。 ， 整數在本發明之㈣物表祕齡析找中，對於 =白數值心)的運算（如步驟训至步驟sM2)及小 數值φ：，；；）的運算（如步驟S521至步 時進;f- ◦ 可U同 物表:二且兩者所需的運算時間皆極短’而其運算出之待測 心_邪的解析度又與單波長相位量測相同。因此，本發明 中及物表面輪廓分析方法可運用於需要㈣精確量測的場合 敕二°工廠中的線上產品檢測’並可簡化量測架構的複雜度及 疋體夏測的成本。 人久 上34貫施例僅係為了方便說明而舉例而已，本發明所 施:利範圍自應以申請專利範圍所述為準，而非僅限於上述實 【圖式簡單說明】 圖1係係習知美國專利第5,471，303號之量測裝置示意圖 15 1237685 圖2係係習知美國專利第6,028,670號之量測裝置示意圖。 係本發明—較佳實施例之分光干涉儀示意圖。 圖4a係本發明—較佳實施例之干涉強度隨著參考鏡面垂直位置 變化示意圖。 圖4b係本發明一較佳實施例之干涉最大對比發生之縱向位置對 之表面輪廓示意圖。 圖 圖 係本發明一較佳實施例之待測物表面輪廓分析方法流程1 INT 〇〇y) X oxp (-j ^ aZ) dc (6) where β (σ, χ, > 〇 is a complex number, which contains the phase term of exp (—from (σ, χ, less)). Therefore, As shown in FIG. 5c, in the method for analyzing the surface profile of the object to be measured in the present invention, the calculation of the fractional interference order value includes the following steps: Step S521: Select a person with a specific wavelength and interfer the previously measured interference Yin 12 1237685 The trier degree shell material is subjected to Fouri Transform for this specific wavelength M wave number σ).立 5 2 2 · The inverse tangent operation is performed on the real part and virtual port P terms obtained after the Fourier transform, respectively, to obtain the point to be measured (Xj) for this specific wavelength. Interference phase distribution # (σ, χ, γ). ^ Step S523 · Based on the interference of the reference position (χ., VIII) on the surface of the object to be tested, the other positions on the surface of the object to be tested are 15 20 Extravagant decimal interference order values such as). In the search of the age table of the present invention, the integer is calculated for the value of (white value center) (such as step training to step sM2) and the decimal value φ:, ;;) operation (such as step S521 to step time) ; f- ◦ U can be the same thing table: two, and both require very short calculation time ', and the resolution of the heart and evil to be measured is the same as that of single-wavelength phase measurement. Therefore, in the present invention, The transit surface profile analysis method can be applied to the occasions where precise measurement is needed. Second, the online product inspection in the factory can simplify the complexity of the measurement architecture and the cost of the summer measurement of the carcass. The examples are only for the convenience of description. The scope of the invention: the scope of the patent should be based on the scope of the patent application, not limited to the above. [Schematic description] Figure 1 is a conventional US patent No. 5,471, Schematic diagram of the measuring device No. 303 15 1237685 Figure 2 is a schematic diagram of the measuring device of the conventional US patent No. 6,028,670. It is a schematic diagram of the spectroscopic interferometer of the present invention-the preferred embodiment. Fig. 4a is the present invention-the preferred embodiment Interference intensity with reference mirror vertical position Schematic change. FIG. 4b-based embodiment of the longitudinal position of the interference maximum contrast occurs on the surface of the schematic outline of a preferred embodiment of the present invention. FIG analyte based embodiment of a process surface profile analysis preferred embodiment of the present invention
10 !*5b#、本發明—較佳實施例之計算整數干涉階數值流程圖。 回係本务明一較佳實施例之計算小數干涉階數值流程圖。 【主要元件符號說明】 112寬頻光源 14待測物 17偵測器 22分光鏡 25參考鏡面 28電腦 33分光鏡 3 6爹考鏡面 111單波長光源 13分光鏡 16參考鏡面 21寬頻光源 2 4待測物 27偵測器 32光束整形系統 3 5待測物 38位移器 12光束整形系統 15步進馬達 18電腦 23位移器 26偵測器 31寬頻光源 3 4分合光元件 37偵測器10! * 5b #, the present invention-a preferred embodiment of a numerical flowchart for calculating the integer interference order. This is a numerical flowchart for calculating the fractional interference order in a preferred embodiment of the present invention. [Key component symbol description] 112 Broadband light source 14 DUT 17 Detector 22 Beamsplitter 25 Reference mirror 28 Computer 33 Beamsplitter 3 6 Mirror test 111 Single wavelength light source 13 Beamsplitter 16 Reference mirror 21 Broadband light source 2 4 To be measured Object 27 Detector 32 Beam Shaping System 3 5 Object Under Test 38 Displacer 12 Beam Shaping System 15 Stepper Motor 18 Computer 23 Displacer 26 Detector 31 Broadband Light Source 3 4 Detector Optical Element 37 Detector
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