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屬層之材質為銅。 8. —種具金屬基板的電路保護元件之製造方法，係包含以下 步驟： 步驟A)係於一金屬板上形成複數個穿孔，以形成至 少一金屬條’該金屬條具有複數個分別位於兩兩穿孔間 的金屬基板； 步驟B)分別於該金屬條之上、下表面的置中位置形 成一保護層，使該等金屬基板之兩端裸露； 步驟C)分別於該金屬板之該等金屬基板之兩端的 上下表面形成一第一金屬層；及 步驟D)切割該金屬板以使各該金屬基板獨立，以形 成複數個晶片電阻。 9. 依據申請專利範圍第8項所述之製造方法，其中，該步驟 D)中更於各該金屬基板之兩端面及第一金屬層上形成 一鎳錫金屬膜。 10. 依據申請專利範圍第8項所述之製造方法，其中，該驟 A )中的金屬基板之電阻溫度係於1〇〜2〇〇ρριη/γ之範圍 内0 11. 依據申清專利範圍第8或10項所述之製造方法，立中， 在該步驟A)中該金屬基板之材質係選擇由錄鉻合金、錄 銅合金、鐵鎳合金及錳銅合金組成群組中的一者。 12. 依據申請專利範圍第8項所述之製造方法，更包含一於 該步驟B)之步驟E)’係先於該金屬條上、下表面中預 備形成該等保護層位置形成一用以加強該等保護層與該 1234422 金屬基板間的結合強度之勒著層β 13. 依據申請專利範圍第12項所述之製造方法，其中，該黏 著層之材質係選擇由銅、鎳、錫、銀及前述金屬合金所 組成的群組中的一者。 14. 依據申請專利範圍第8項所述之製造方法，其中，該金 屬層之材質為銅。 15. 依據申請專利範圍第8項所述之製造方法，其中，該金 屬板更具有複數個位置與該等金屬基板與該等穿孔錯開 之定位孔。 16. 依據申請專利範圍第8項所述之製造方法，其中，在步 驟Β)中’該保護層更覆蓋於各該金屬基板之置中位置的 左右壁面。 17 · —種具金屬基板的晶片電阻之製造方法，係包含以下步 驟： 步驟Α)提供一金屬板’該金屬板具有至少一金屬 條，該至少一金屬條具有沿該金屬條延伸之多數個穿孔 和複數個分別兩兩穿孔間的金屬基板； 步驟Β)分別於該金屬條之上、下表面的置中位置形 成一保護層，使該等金屬基板之兩端裸露； 步驟C)分別於該金屬板之該等金屬基板之兩端的上 下表面形成一第一金屬層；及 步驟D)切割該金屬板以使各該金屬基板獨立，以形 成複數個晶片電阻。 18.依據申請專利範圍第17項所述之製造方法，其中，該步 1234422 驟D)中更於各該金屬基板之兩端面及第一金屬層上形 成一錄錫金屬膜》 19.依據申請專利範圍第17項所述之製造方法，其中，該步 驟A)中的金屬基板之電阻溫度係於1〇〜2〇〇ppm/°c之範 圍内。 20. 依據申請專利範圍第17或19項所述之製造方法，其中， 在該步驟A)中該金屬基板之材質係選擇由鎳鉻合金、鎳 銅合金、鐵攢合金及猛銅合金組成群組中的一者。 21. 依據申請專利範圍第17項所述之製造方法，更包含一於 該步驟B)前之步驟E)，係先於該金屬條上、下表面中 預備形成該等保護層位置形成一用以加強該等保護層與 該金屬基板間的結合強度之黏著層。 22_依據申請專利範圍第21項所述之製造方法，其中，該黏 著層之材質係選擇由m銀及前述金屬合金^ 組成的群組中的一者。 23.依據申請專利範圍第17項所述之製造方法，其中，該金 屬層之材質為鋼。 24.依據巾請專利範圍第17項所述之製造方法，其中，在步 驟A )中更於該金屬板上形成複數個位置與該等金屬基 板與該等穿孔錯開之定位孔。 2 5 ·依據申請專利範圍第 驟B)中，該保護層更 左右壁面。 17項所述之製造方法，其中，在步 覆蓋於各該金屬基板之置中位置的The material of the metal layer is copper. 8. —A method for manufacturing a circuit protection element with a metal substrate, comprising the following steps: Step A) Forming a plurality of perforations on a metal plate to form at least one metal strip. Metal substrates between the two perforations; Step B) Form a protective layer at the center position of the upper and lower surfaces of the metal strip, respectively, so that both ends of the metal substrates are exposed; Step C) A first metal layer is formed on the upper and lower surfaces of the two ends of the metal substrate; and step D) cutting the metal plate to make each of the metal substrates independent to form a plurality of chip resistors. 9. The manufacturing method according to item 8 of the scope of patent application, wherein in step D), a nickel-tin metal film is formed on both end surfaces of each of the metal substrates and on the first metal layer. 10. The manufacturing method according to item 8 of the scope of patent application, wherein the resistance temperature of the metal substrate in step A) is in the range of 10 ~ 200 ρριη / γ 0 11. According to the scope of patent application In the manufacturing method according to item 8 or 10, in the step A), the material of the metal substrate is selected from the group consisting of chromium alloy, copper alloy, iron-nickel alloy, and manganese-copper alloy. . 12. According to the manufacturing method described in item 8 of the scope of the patent application, it further includes a step E) 'in step B). The protective layer is formed on the upper and lower surfaces of the metal strip to form a protective layer. Grazing layer β which strengthens the bonding strength between the protective layers and the 1234422 metal substrate 13. According to the manufacturing method described in item 12 of the scope of patent application, wherein the material of the adhesion layer is selected from copper, nickel, tin, One of the group consisting of silver and the aforementioned metal alloy. 14. The manufacturing method according to item 8 of the scope of patent application, wherein the material of the metal layer is copper. 15. The manufacturing method according to item 8 of the scope of patent application, wherein the metal plate further has a plurality of positioning holes staggered from the metal substrate and the perforations. 16. The manufacturing method according to item 8 of the scope of patent application, wherein, in step B), the protection layer further covers the left and right wall surfaces of the center position of each of the metal substrates. 17-A method for manufacturing a chip resistor with a metal substrate, comprising the following steps: Step A) Provide a metal plate 'the metal plate has at least one metal strip, and the at least one metal strip has a plurality of extending along the metal strip Perforation and a plurality of metal substrates between two perforations; step B) forming a protective layer on the center position of the upper and lower surfaces of the metal strip, so that both ends of the metal substrates are exposed; step C) respectively A first metal layer is formed on the upper and lower surfaces of the two metal substrates of the metal plate; and step D) cutting the metal plate so that each of the metal substrates is independent to form a plurality of chip resistors. 18. The manufacturing method according to item 17 of the scope of the patent application, wherein in step 1234422, step D), a tin metal film is formed on both end faces of the metal substrate and the first metal layer. 19. According to the application The manufacturing method according to item 17 of the patent scope, wherein the resistance temperature of the metal substrate in the step A) is in a range of 10 to 2000 ppm / ° C. 20. The manufacturing method according to item 17 or 19 of the scope of patent application, wherein in step A), the material of the metal substrate is selected from the group consisting of nickel-chromium alloy, nickel-copper alloy, iron hafnium alloy, and hard copper alloy. One of the group. 21. According to the manufacturing method described in item 17 of the scope of the patent application, it further includes a step E) before the step B), which is used to form the protective layer in the upper and lower surfaces of the metal strip. An adhesive layer to strengthen the bonding strength between the protective layers and the metal substrate. 22_ The manufacturing method according to item 21 of the scope of patent application, wherein the material of the adhesive layer is selected from the group consisting of m silver and the aforementioned metal alloy ^. 23. The manufacturing method according to item 17 of the scope of patent application, wherein the material of the metal layer is steel. 24. The manufacturing method according to item 17 of the patent application scope, wherein in step A), a plurality of positioning holes staggered from the metal substrate and the perforations are formed on the metal plate. 2 5 • According to step B) of the scope of patent application, the protective layer is more on the left and right wall surfaces. The manufacturing method according to item 17, wherein the step of covering the center position of each of the metal substrates in step