TWI233322B - Solder pot and solder manufacturing process - Google Patents

Abstract

The present invention discloses a solder pot and a solder manufacturing process, in which the solder pot includes: a solder bath tank; and a robotic arm located on one side of the solder bath tank, the end thereof having a substrate support device, in which when one substrate is supported and fastened thereon, the to-be-soldered part of the substrate is exposed. The extension range of the robotic arm includes the inside and the outside of the solder bath tank, and has stepless variation in the extension range of the location of the substrate support device and is able to control the included angle between the substrate and the horizontal plane.

Description

1233322 V. Description of the invention (1) The technical field to which the invention belongs The present invention relates to a soldering device and a method of using the same, and particularly to a soldering furnace used for printed circuit board assembly (PCBA) and the above. Tin soldering process. Please refer to FIG. 1 for the first prior art. Pin-Through-Hole (PTH) elements 110 are respectively mounted on the first surface 101 of the substrate, and j 丨 pin 111 of the pTH element 110 are respectively The first surface 101 penetrates the substrate 10 (), protrudes from the second surface 102, and is fixed and electrically connected to the substrate 100 by a solder U5. In addition, the second surface 102 of the substrate 100 may be provided with a surface adhesion type (surface m0unt technolgym) element 1 2 ′ and spaced apart from the protruding pin 111. < 1 In the process of electrically connecting the PTQ element 110 and the substrate 100, the ρτΗ element 110 and a soldering flux (not shown) are installed in the through hole in a plug-in manner, and the substrate 100 is then mounted. The surface 102 is immersed in the molten soft solder material liquid, so that the molten soft fresh material is filled in the through-hole 116, and then the substrate 100 is removed from the molten solder material liquid, and the molten soft solder in the through-hole 16 The material is cooled and solidified into a soldering material 115, and the PTH element 110 is electrically connected to the substrate 100. The manufacturing process is currently completed using a continuous automatic tin furnace. The condolences will place the substrate 100 with the completed inserts in the carousel in order. One delivery ▼ Guide the substrate 100 to the above-mentioned automatic tin furnace's tin bath, so that the surface 102 of the substrate 100 Immersion in the fresh and bathy solder material 〇755-A3 〇424TWF (Nl); dwwang.ptd Page 5 1233322 V. Description of the invention (2), then f is removed from the silo tank to complete The above-mentioned electrical connection process has the advantages of continuous and mass production. However, with the market demand for lighter, thinner, shorter, and smaller electronic products, the distance between each PTH element no and the SMT element 120 on the substrate 100 is increasing. In the above-mentioned continuous-type automatic tin furnace manufacturing process, especially in the case of SMT element 120 = near PTH element 110, it is particularly easy for SMT element 120 to block the entry or discharge of molten soft-to-liquid liquid, and the influence of excessive solder joints. This makes the formed soldering material 115 prone to defects such as empty welding, short circuit, and tin bridges (bridges between adjacent soldering materials 1 j 5). However, due to the use of a conveyor belt, the above-mentioned continuous automatic tin furnace manufacturing process, when the substrate 1000 enters and exits the tin bath, the angle between the substrate and the liquid level of the soft soldering liquid in the tank is usually fixed; There are not many adjustment parameters, usually only the speed of the conveyor belt (which can adjust the time when the surface is immersed in the molten soft solder liquid), etc., which makes it difficult to solve the above problems by using a continuous automatic tin furnace process. problem. Although in addition to the automatic tin furnace process, the aforementioned process of electrically connecting the PTH element 11 and the substrate 丨 00 can be performed manually, it can be manually adjusted when the substrate 100 enters and exits the tin bath, the liquid with the solder material in the tank The liquid = the fire angle, 'the speed of the substrate can enter and exit the tin bath 1000 in 5 weeks, and the immersion time, etc.' and defects can be repaired in time. However, the reproducibility of manual operation is poor and the variability of product quality is high; and the temperature of the soft solder liquid in the tin bath is usually above 250 ° C. A little careless operation may easily cause personal injury. 1233322 V. Description of the invention (3) In view of this, the soldering potential of the above-mentioned tin furnace of the present invention is the most beautiful (1 type of tin furnace and two U electrical components and substrates using components on the substrate) , Movable and continuous production, ^: The process parameters can be adjusted steplessly, and the rate of change can be reduced, and the quality of the product can be reduced; the current performance is good, so the cost of the product is improved. The invention is 2 degrees, and the production process is reduced. Cost: Including: -Tin baths; and L The present invention provides-a tin furnace with a side with an arm at the end, when it is located on one of the above-mentioned tin baths, a carrying device to carry and fix a beautiful trick; the scope includes the above-mentioned tin In the bath:, ::: 'The extension of the upper arm of the robot arm describes the position of the substrate bearing device, and the second: the upper angle of the section without any change in the dry wall. The above-mentioned substrate between the substrate and the horizontal plane is further improved. A plug is provided by a furnace, and a M process is provided. The method includes: providing the above-mentioned tin wind and / or I plate, which is fixed to a lead pin A Th which is to be welded on the upper side of the upper part of the upper part of the upper part of the upper part of the upper part of the upper part of the upper part of the upper part. A surface to be welded is inserted, and the above-mentioned soil And the protruding surface of the substrate from Wu Lu · π from L 寺 寺 # is for the above-mentioned substrate to carry through the body / Tugong Road, dumb as the liquid surface of the above-mentioned mechanical soil lower 5 suit- A corner plate and a first phase of the liquid material of the soldering material are equal to one hectare, and the substrate is compared with the liquid material of the soldering material to make a predetermined 8 π. The surface to be welded is immersed in the soft substrate and soft. ; Η :: and operating the above-mentioned robotic arm, so that the liquid level of the dry material liquid of the above-mentioned workman I is a second relative ball relative to the above-mentioned soft solder liquid-'a second opposing ball; The above-mentioned soft soldering material liquid, and again, the above-mentioned to-be-welded 0755-A3〇424TlF (Nl); dww; ang.ptd page 7 1233322 ~ --- 5. Description of the invention (4) Features of the present invention First, a robotic arm is used, which can move the position, control the speed of movement, and reproduce the distribution of the components of the element. There is no change in steps and adjustments. Related Embodiments First Example 1J. Please refer to Figure 2 ,for

The figure is a simplified diagram, which is only for illustration: Formula 2 is a structural unit of the body, and the above-mentioned structural unit is not necessarily drawn by the number, shape, and size ratio of the eight-body κ%. The tin furnace according to the first embodiment of the present invention includes two main masters 240 and a robot arm 22o. Jin—Knife tin cold support 0 tin content 241, which can hold soft solder liquid tin blowing 22 is a tin-based alloy, and has a liquid level 251 parallel to the horizontal plane ~ the tank 240 usually also has heating and heat preservation Device (not shown) to keep Feng " material liquid 250 in a liquid state, which can also be added if necessary

:) 'Make disturbance waves, plane waves, etc. on the liquid surface to help; ^ Process 0 Robot arm 2 2 0, which is located on one side of the tin bath 2 4 0, and its end 2 2 5 has: a substrate carrying device 213 for carrying When the substrate 100 is fixed thereon, the to-be-welded portion (surface 102) of the substrate 100 may be exposed, and the extension of the robot arm 100 may include the inside and outside of the tin bath 24, and may receive the substrate 100. Rear,

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It is immersed in the solder material liquid 25 in the tin bath 240 to produce a solder material liquid 25. In order to form the soft soldering in the figure], connect the PTH7L part 110 and the substrate 100 to complete the soldering process. The maple arm 220 must change the position of the substrate bearing 2 waves at 213 within its extension, and can control the clamping between the substrate 100 and the liquid surface 251

求 In order to achieve the above, therefore, in this embodiment, the robot arm 2 2 0 has a main body base 201, an arm body base 202, an arm body 211, 212, and a finger clothing 221, 222. , 223, 224. The selection of the robot arm 220 is not limited to those shown in Fig. 2. Those skilled in the art can also choose other known robot arms according to their needs. The main body base 201 is used to fix the position of the entire robotic arm 22; the transmission device 221 on the main body base 201 mainly controls the position of the substrate bearing device 2'13 in the X direction in the figure; and the arm base 202 separates the transmission Devices 221 and 222, and the arm body 211 and 212 supported and stabilized when operating the transmission device 221; the transmission devices 2 22, 223 and the arm bodies 2n, 222 can jointly control and change the substrate bearing device 213 in the figure γ and Z position. Therefore, the position of the substrate carrying device 213 can be changed steplessly within the extension range of the arm bodies 211 and 212. In addition, the transmission device 224 is connected to a base

The anti-bearing device 213 and the end 225 of the robot arm 220 can change steplessly and control the substrate 100 and the horizontal surface when the substrate bearing device 2 ^ 13 carries the substrate 100, which is the liquid level of the solder material liquid 250. The angle of 251. The transmission device 224 can also be based on the process requirements, plus the function of controlling the substrate carrier 2 1 3 to swing slightly in the horizontal direction (X, γ directions in the figure), or even the vertical direction (z direction in the figure).

1233322 V. Description of the invention (6) In addition, the tin tin of the first embodiment of the present invention may also need to be added with the substrate input / output (10ad / unioad) and the fan belt 260 in the figure, The substrate 100 can be the tin furnace of the first embodiment of the second embodiment; and the completed manufacturing process can be invented to the next manufacturing process. The ash-stabilized substrate 100 is transported in the tin furnace of the first embodiment of the present invention. The following second embodiment is considered. At first glance, eyes-and-brothers, consistent examples = Please refer to Figures 3 to 12 for a series of front and left figures, f, ', and the soldering process of the second embodiment of the present invention. The following system uses the tin furnace of the present invention in the automatic way. = = Semi-automatic, automatic operation-step-by-step operation, its reproduction H is used

The handle "soldering" is the general name of this industry, and does not represent the selection of Xin ^ ^ I. It is tin. Those who are familiar with this skill can 'first place Λ on all public 213, refer to the 3K, fix pure 100 to the substrate * loading device, and close the two arms 220 to move the substrate carrying device 213 to the output ^ ^ The substrate 100 receiving the completed plug-in is inserted, and the insert 1: the PZ element 1 1 α is exposed by the substrate carrying device 213. Defective, plate 100 is followed by reference to Figs. 4 and 5, the robot arm 22 is operated, and the base material 25Q in the bath 24G is moved. At this point, the substrate 224 can be tilted by a predetermined angle of 0 ° as shown in the front view.

0755-A30424TW (Nl); dwwang.ptd Page 10 1233322 V. Description of the invention (7) Figure 4 can also be tilted a predetermined angle 0 2 As shown in Figure 5 on the left side view, you can also tilt at the same time The predetermined angle θ 1 as shown in the fourth view of the front view and the predetermined angle 0 2 as shown in the fifth view of the left view. 0 1. 0 and Θ 2 are the substrate 1 and the liquid surface 2 5 1 (horizontal plane). The angle of the normal vector is determined according to the distribution relationship between the PTH element 110 and the SMT element 120 on the substrate 1000, using a trial and error method, or a known experimental method such as the Taguchi experiment planning method. In order to reduce the negative effect of the shadow effect described in the conventional technology on the process yield. Those skilled in the art can also tilt the substrate 100 (for example, the positions shown in the subsequent figures 6 and 7) when the substrate 100 approaches the liquid surface 251. among them

In FIG. 5 and subsequent left views, in order to simplify the drawings, the arm body 21, the transmission devices 221, 222, 223, the arm base 202, and the main body base 201 are omitted and not shown. In addition, those skilled in the art can also decide whether to generate disturbances such as disturbance waves and / or plane waves on the liquid surface 251 according to their process requirements. At this point, another substrate 100 that has completed the previous process can be sent to the conveyor 26.

Next, please refer to FIG. 6 and FIG. 7, which are a front view and a left side view, respectively. ′ Show the moment when the substrate 100 is about to be immersed in the solder material liquid 250. At this time, the angle between the substrate 100 and the liquid surface 251 of the solder material liquid 250 is 01 and / or 0 2 ′, and the surface 10 of the substrate 〇〇〇 is immersed in the solder material liquid 2 5 0 at a predetermined vertical relative speed of VI. in. The vertical relative speed ^ is determined based on the distribution relationship between the PTH element 110 and the SMT element 120 on the substrate 100. It is determined by trial and error method, or a known experimental method, such as the Taguchi experiment plan method, to reduce the conventional The negative effect of the shadow effect described in the technology on the process yield rate. Next, refer to Figures 8 and 9, which are a front view and a left view, respectively.

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FIG. 'Shows a substrate immersed in a solder material liquid 250. At this time, those skilled in the art can determine the angle between the substrate 100 and the liquid surface 251 at this time. In this embodiment, the substrate 100 is parallel to the liquid surface 251. At this time, the solder material liquid 250 enters the through-hole 116 (refer to FIG. 1) and / or between the contact of the SMT element 120 and the base and 100 (not shown). At this time, those who are familiar with this technique can also see that the process needs to make the substrate carrier 213 drive the substrate 100 to swing in the direction of the double arrows in Fig. 8 and / or Fig. 9, which can further reduce the shadow described in the conventional technology. The adverse effect of the effect on the process yield. The above-mentioned function of swinging the substrate can be designed on the transmission device 224, or an additional component can be added for control. Next, please refer to FIG. 10 and FIG. 11, which are a front view and a left side view, respectively. ′ Are the moments when the display substrate 1 00 is released from the solder material liquid 2 5 0. After immersing the substrate 100 in the solder material liquid 25 0, after a predetermined period of time, the transmission device 2 2 4 can be used to tilt the substrate 100 by a predetermined angle φ 1 as shown in the figure, or it can be inclined by a predetermined angle. φ 2 is as shown in FIG. 11, and can also be tilted at the same time as the predetermined angle φ 1 shown in FIG. 10 and the predetermined angle Φ 2 as shown in FIG. 丨 丨 (Φ1, Φ2 are the substrate 100 and 〇 The angle of the normal vector of the liquid surface 251 (horizontal plane)) makes the substrate 100 out of the solder material liquid 250 at a predetermined vertical relative speed of V2. The above-mentioned predetermined time, φ1, φ2, and V2 are based on the distribution relationship between the PTT element 1 1 0 and the SMT element 120 on the substrate 1000, and the trial-and-error method, or a known experimental day method, such as Taguchi It is determined by the experiment of calligraphy to reduce the negative influence of the shadow effect described in the conventional technology on the process yield. After the substrate 100 is separated from the solder material liquid 250, it enters the through hole 116 (refer to FIG. 1) and / or between the contact of the SMT element 120 and the substrate 100.

0755-A30424TWF (N1); dwwang.ptd Page 12 1233322 V. Description of the invention (9) (not shown) the solder material liquid 2 5 0 When solidified in the cold, it will form solder materials 11 5 (please refer to a reference (Fig. 1) and a joint (not shown) between the SMT element 120 and the substrate 100, so that the PTH element 110 and the SMT element κο are electrically connected to the US board 100, respectively, to complete the soldering of the present invention. Process. Finally, please refer to FIG. 12 and send the soldered substrate 100 which has completed the present invention to the next process station, such as a trimming process. As mentioned above, the tin furnace of the present invention and the soldering process using the above-mentioned tin furnace use a mechanical arm 22 0 1 which can be moved in a three-degree space === and the production of the substrate 100 can be based on The PTZ Λ / shape on the substrate 100, without step changes, and adjusting related process parameters achieves the above-mentioned object of the present invention. = The present invention has been disclosed as above with a preferred embodiment, but it is not limited to this book. Anyone who is familiar with this technique will not be allowed to depart from the spiritual sacrifice of the present invention within the scope of the second sum. Attachment, please be bounded by the scope of patents ^ quasi-guarantee 5 Man page 13755-A30424TWF (N1); dwwang.ptd 1233322

Brief Description of Drawings Figure 1 is a cross-sectional view showing a substrate on which a PTH element is assembled. Fig. 2 is a front view showing the structure of tin according to the first embodiment of the present invention. Fig. 3 is a front view showing the starting steps of a soldering process for manufacturing a second embodiment of the present invention. Figures 4 and 5 are a front view and a left side view, respectively. Following the steps shown in Figure 3, showing the soldering process of the second embodiment, Niu Cong is-front view and left 4 and 5 respectively. The steps do not show the process steps of the soldering process of the second embodiment. Figures 8 and 9 are a front view and a left view, respectively, following the steps shown, showing the process steps of the soldering process of the second embodiment. Figures 10 and 11 are a front view and a left side view, respectively. Following the steps shown in the figure, showing the second and nine processes of the soldering process of the second embodiment. Figure 12 is a front view, showing the The substrate that has completed this process is sent to the next process station. Yuxi

Symbol description I 0 0 ~ substrate; 102 ~ second surface 111 ~ pin; II 6 ~ through hole; I 0 1 ~ first surface; 110 ~ PTH element; II 5 ~ soft solder; 120 ~ SMT element; 2 (Π ~ main body base; 211, 212 ~ arm body 2 2 0 ~ robot arm; 213 ~ substrate bearing device · 221, 222 ~ transmission device

0755- A30424TWF (Ν1); dwwang.pt d Page 14 1233322 The diagram briefly explains 223, 224 ~ transmission device; 240 ~ tin bath; 241 ~ content; 2 50 ~ soft solder liquid; 251 ~ liquid level; 260 ~ Conveyor belt.

Page 15 0755-A30424TWF (Nl); dwwang.ptd

Claims (1)

1233322 VI. Scope of patent application 1. A tin furnace including a tin bath; and a robot arm, a plate bearing device, which holds the tin bath of the tin bath, and has a base to be welded at the end, the robot hand; :; ==, the target 5 that exposes the outline and is within its extension ranges the inside and outside of the tin bath to make the substrate and the horizontal plane ^. The substrate carries the position of the substrate, and controls the arm f 2 spoons: the tin furnace described in item 1 of the patent scope, Fu Zhongjin car only includes a transmission mechanism, and the robot makes it. Between the angled end of the substrate and the horizontal plane and the substrate bearing device, the control arm-3 scoops of the tin furnace described in the first patent application scope, in which the Xifeng Zhufeng arm further includes a swinging cry in Gan Shi, ,, t Ingenious machine: The robot arm swings the substrate bearing & set 1, between ^ and the substrate bearing device, there is no section 4 like the tin furnace described in item i of the patent application scope, and it also includes a transport device in the tin bath. Next, control the substrate into and out of the substrate carrying soil mounting plate 5 · A soldering process, including: η car: for a tin furnace 'has a tin bath, a soft solder liquid, and-machine: the soft solder liquid Mounted in the tin bath, the robot arm is located on one side of the tin bath, and its end has a substrate carrying device ^ The extension range of the robot arm includes the inside and outside of the tin bath; and a substrate is fixed to the substrate bearing Device with a one-pin plug-in type gh-Hole; ρτΗ) component, the element has a pin that penetrates the substrate and protrudes from the substrate to be soldered 0755-A30424TWF (N1); dwwang.ptd Page 16 1233322 Application scope __ Surface 'And the to-be-recorded book, Office ## The surface is the substrate carrying the jealousy of the different + + surface for the robotic arm 5 war Ling Zhisuo violent road,-the first, and ϋ 乂 该 The substrate and the soft solder The liquid level of the material liquid is relatively obsessed with: "? Ϊ ϊ !!" in the soft Tuo liquid-the first-between; and, 々 曲 'father into " the saddler welding liquid -Article ί: The machine makes the substrate pair with the liquid surface of the soft solder material liquid; 2: ;;; The second surface of the cup to be removed from the soft with the second phase relative to the soft fresh material liquid Welding material liquid. The fresh tin manufacturing process described in item 5 of the application patent scope is adopted, wherein the surface of the raft to be kneaded with the solder material liquid further includes swinging the substrate. 7. The soldering process as described in item 5 of the scope of patent application, wherein the mechanical arm further includes a transmission device between its end and the substrate carrying device 'to control the angle between the substrate and the horizontal plane. 8. The soldering process as described in item 5 of the scope of patent application, wherein the robot arm further includes a pendulum between its end and the substrate bearing device, swinging the substrate bearing device in steps. 9 The soldering process described in the above item further includes a substrate transfer device next to the tin bath tank, which controls the substrate to enter and exit the substrate carrying device.