TWI232529B - Measuring method of shear bonding force between packaging material and mold surface - Google Patents

Abstract

The present invention is related to a kind of measuring method of shear bonding force between packaging material and mold surface, a method available for measuring shear bonding force between the mold surface and the product. The data generated from the mentioned method of bonding force between the material and the material surface is for the related industrial engineers' design or fabrication references. This measuring method of shear bonding force of packaging material is suitable for use in the measurement of bonding force for either metal material (such as steel, iron, copper, aluminum, magnesium, titanium, lead, and tin), non-metal material (such as ceramic, polymer, fiber, plastic, and electronic material), or semiconductor material (element semiconductor, and compound semiconductor).

Description

1232529 Amendment No. 92134000 V. Description of the invention (1) [Technical field to which the invention belongs] 2 Ming is a kind of shear adhesive force between the sealing compound and the surface of the mold =, two, refers to a type that can easily detect the interface adhesion of the material The strength of the force is used to measure the adhesive force data generated by the surface interface of each material, and to provide manufacturers with a good reference index data in design and manufacturing [the previous booming "light, continuous push function There are many births. The example of the current situation has resulted in the increasing demand for 1C products, which has promoted the electronic packaging industry, and the continuous development and evolution of electronic manufacturing technology, in the IC chip, thin, short "Small, small, high-function" requirements have also made the packaging technology new, in order to meet the needs of electronic products and then give full play to it. In the electronic packaging process, the interface between materials will produce adhesion phenomena, and adhesion The magnitude of the force may cause many problems. 4 Production such as the sealant material will stick to the mold surface during the curing process. This phenomenon will affect the stripping process. There may be results such as glue failure, reduced production yield, and poor reliability. There are three ways of testing the shear adhesive strength in the previous standard: (1) Shear force test method ( S hear M eth 〇d) 2) Puli Method 3) Three-point bending test method (Three_P〇int: Bending

Method) but out of the cavity

Page 5 Because the measurement methods of these three experiments are to take the finished product and test it again, the measurement interface has been affected, and the experimental data obtained is yet to be discussed. I232529

1 SUMMARY OF THE INVENTION In view of this, the present invention relates to the shear adhesive force of contact between the testers of shear adhesive force on the surface of a needle, and the tester. To solve this shortcoming, the method of encapsulating compound and mold is used to measure materials and materials in real time. The present invention can respond to various material adhesion wheels: the measured shear level is formed into wedges and forces. A sealing method that provides consistent adhesion for measurement; 'Completely divides the finished product into a finished product and a mold, which reacts to a unit of force data to allow the manufacturing material to be selected. The industrial circle measures its characteristics as filling and separation, and then it has adhesion, and the winner can use the method of installing materials and materials on the material, so that after this, first use the detection of the damage of the mold surface. The clear thrust force then knows the data of the shear direction and the shear adhesion force between the material interface with the shear adhesion force on the surface is used to measure the mold early element and the detection module's delamination when the materials are in contact with each other. The upper group applies a shear to the finished product, and the load cell (Lab VI EW) focuses on the size of the force to provide a consideration when designing and manufacturing.

The main purpose of the present invention is to provide a method for detecting the shear adhesion of the encapsulating compound from the two surfaces, so as to facilitate the detection of the shear adhesion data generated by the material ## , And then provide data materials so that producers can prevent or solve problems through data speculation as the main purpose of the month, thereby improving the smoothness of the processing process.

1232529

Case No. 92134000 V. Description of the invention (3) [Embodiment] First, please refer to the first and the second ^ The shear direction of the rubber material and the mold surface is not the seal view of the present invention and the sectional view of the mold. : Provide a mold method, mold three-dimensional outer group 2; Among them: ',, /, early die 1 and a detection mold The mold unit 1 includes an upper mold ii, a three-plate mold design and demolding 4 Xiao i 4 ·, 2. Lower hole 1 3 feed hole ..., while the middle mold i2: ,, 1 1 has eccentricity.丄 2 There are branches 1 2 1 and runners i 2 2 The detection module 2 is designed to make the measurement | qy 〇, flat state, as the lower mold i 3 is placed on the lower mold " the water side is appropriate height. Move, the detection rod 2 2 is set on the mold. Please continue to cooperate with the first surface shear mold and the melted raw material 1 2 1 'after molding is ready to be formed in the pressurized glue dispenser (such as the servo motor is moved upward for a short period of time. Mold (such as the upper surface of the fourth release pin 1 4) (such as the detection of the force of the three to seven pictures of the release pin 1, starting from the feed hole 1 product a after the pudding is cured, the hydraulic cylinder or the distance ' Make the figure shown); Displace downwards as shown in Figure 5 and Figure 4 after positioning. It is the detection steps 1 to 5 of the encapsulation compound and mold method of the present invention, when the potting molding operation is performed; σ 1 1 via The runner 1 2 2 enters the cavity design (as shown in the third figure); the first stage of demolding starts. The upper surface of the demolding pin 丄 4 a and the demolding pin are driven by actuating the gasoline booster cylinder. i 4 first α a small distance, until the finished product a

Segment demolding begins. Sincerely

V. Description of the invention (4) A device (such as a servo motor, hydraulic cylinder or gasoline booster cylinder) drives the upper die 12 to move upward a certain distance, at this time the demolding pin i 4 is still $ 2 above the top surface of the product a, so that The adhesive surface between the finished product a and the test piece 2 i is not damaged (as shown in the sixth figure); the surface does not break the ejector pin 14 and is shifted up a short distance to make it completely a. The actuator of the detection module 2 (such as a servo motor, '^ or a gasoline booster cylinder) 卩 drives the detection rod 2 at a very slow speed. 2 The pushing cylinder pushes the measurement product a in the shear direction, and performs an adhesive force measurement. However, the adhesion interface was damaged by thrust in the range of 0.001 ~ second (as shown in the seventh figure). Heart_ At the moment when the adhesive surface of the finished product a and the detection module 2 is broken, the force gauge (Load Cel 1) in the inspection group 2 will be subjected to a pressure, which is derived from the detection module 2 and the finished product a The demolding resistance between them is also the shear adhesive force between the mold surface and the finished product a, and the signal output by the force gauge is the voltage value, which is converted into force by an analog digital converter and analysis software (LabvIEW) ' Unit, and then divide the measured force by the measured area to obtain the force per unit area. From this, the magnitude of the shear adhesive force can be calculated during the measurement. The speed of the detection rod 2 must be controlled at 2mm / mi η ~ 10mm / min, and the test rod 22 must be close to the adhesive interface in parallel when pushing the test piece. Therefore, the distance between the push position of the test rod 22 and the adhesive interface must be less than 1 mm. 1232529 _ Case No. 92l34〇nn V. Description of the invention (5) As mentioned above, we're divided into the following descriptions: 1. The packaging method of the present invention can be precise and small, so that the manufacturer can be sure. 2 The packaging of the present invention The method 'can ensure the production process by using the obtained shear adhesion between the interfaces. Correction It can be known that the present invention has the advantages described below. Inspection of shear adhesive force between the rubber and the mold surface: f. Properties of the extraction grip material with large shear adhesive force at the material-material interface. ::: Die: Detecting the shear adhesion of the surface: The data of the adhesive force can be used to learn the material and the size of the material to prevent or solve problems in the manufacturing process. The characteristics of the invention can indeed provide a kind of effective test object that can effectively reduce the inferiority, with its overall combination: special surface = mandatory requirements, soil: public, since it has been in line with the law of the Friends of the Patent Law. Invention patent application. c This is only a preferred embodiment of the present invention, and should not be covered by the patent. The white decoration should still belong to the present invention. 1232529 Case No. 92134000 Revised diagrams Briefly explain the technical means and other effects adopted by the present invention to achieve the above g. The following are the preferred and feasible embodiments and the diagrams. To make it easier for the reviewers to understand the production of the present invention. • Brief description of the drawings. The first diagram is the three-dimensional appearance of the mold for the method of detecting the shear adhesion between the sealing compound and the mold surface of the invention. The second diagram is the package of the invention. Sectional view of the mold for the method of detecting the shear adhesive force between the rubber material and the mold surface. The second image is the detection step of the method for detecting the shear adhesive force of the packaging rubber material and the mold surface of the present invention. The fourth image is the packaging adhesive of the present invention. Detection step of the method for detecting the shear adhesion between the material and the mold surface The fifth diagram is the detection step of the method for detecting the shear adhesion of the sealing compound and the mold surface of the present invention. The sixth diagram is the detection step of the method for detecting the shear adhesion of the sealing compound and the mold surface of the present invention. The seventh diagram is the detection step of the method for detecting the shear adhesion between the sealing compound and the mold surface of the present invention. 50. Simple description of the drawing number. 1 Mold unit 1 1 Upper mold 1 1 1 Feed hole 1 2 Middle mold 1 2 1 Mold cavity 1 2 2 runner

Page ίο 1232529 Case No. 92134000 Modification of the drawing simple description 1 3 Lower mold 2 Detection module 2 2 Detection rod Demolding pin Test piece Finished product

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Claims (1)

1232529 Case No. 92134000 6. Scope of patent application1. A kind of encapsulation method 'provided by hunting > ^ mold The mold unit includes and release pin; the design of the upper mold on the road; the detection module is the lower mold And move; after the filling is completed, the inspection is completely separated, and then by setting shear thrust, the force gauge in the finished product and the module (Load is derived from measuring the shear adhesion between the test piece and the finished product ' Then, by analogy, the unit of force is converted into the unit of force, and then the measured force is subjected to the force. From this, the material (steel, iron, copper, material (ceramic, polymer, material, etc.) Elemental Semiconductor, Chemical 3 · If the patent application side has a shear adhesion inspection speed of 2mm / material, the mold surface shear adhesion detection unit and a detection module, of which: there are upper mold, The middle mold and the lower mold are three-plate molds with eccentric feed holes, while the middle mold has mold cavities and wash test pieces placed on the lower mold in a horizontal state, and the rod is set at an appropriate height on the side of the mold; First, the upper mold is made into a segmented release. The detection module completed on the side of the mold applies a pressure to the finished product when the adhesive surface of the test piece is broken, and the cell is subjected to a pressure, and the release resistance between the pressure products is also the surface of the mold. The signal output by the force gauge is the voltage value converter and analysis software (LabVIEW) converted into the measured force divided by the measured area to be the unit surface, which can be used to calculate the shear adhesive force. The range is described in item 1 The method of measuring the encapsulation compound and mold, where: the test piece can be metal aluminum, magnesium, titanium, lead, tin, etc.), non-metallic fiber, plastic, electronic materials, etc., semiconductor materials, semiconductors, etc.) One of them. The method for measuring the encapsulating compound and the mold described in the first item of the scope, wherein: during the measurement, the detection rod is between m i η to 100 m m / m i η, and the detection rod is pushed. Page 12 1232529 Case No. 92134000 Amendment 6. Scope of patent application The moving test piece must be close to the adhesive interface in parallel, so the distance between the pushing position of the test rod and the adhesive interface must be less than 1 mm. limi