TWI220116B - The manufacturing method of golf head using the infrared rapid joining process - Google Patents
The manufacturing method of golf head using the infrared rapid joining process Download PDFInfo
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- TWI220116B TWI220116B TW92121712A TW92121712A TWI220116B TW I220116 B TWI220116 B TW I220116B TW 92121712 A TW92121712 A TW 92121712A TW 92121712 A TW92121712 A TW 92121712A TW I220116 B TWI220116 B TW I220116B
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1220116 五、發明說明(l) 【發明所屬之技術領域】 紅外線加熱是以石英燈管内之鎢 為熱源,用來快速加熱所欲接合之物;:、因斤=2外線 穿透石英保護管,並藉由適當 隹於:線可以 率高)、快速冷卻(散熱快)與接合時 極具發展潛力的製程。本發明揾屮— 疋種 合製程製作高爾夫球頭之方法,A ::二:”卜線快速接 熱源之加熱方式,加熱並溶化置;;=外線為 與南爾夫球頭打擊面之間的填充合 :含m體 t;!高爾夫球頭打擊面,以製成高爾夫球;:爾夫球頭 【先前技術】 、 高爾夫球頭是由本體與打擊面接合而成的。並 有機械嵌入式的(Mechanical Inserted彳、:〇方式 (Glued)、有銲接的(Welded)、也有硬铲^合的I )等。若高爾夫球頭本體與打擊面, 丨干$ (Brazed 口金所衣成的話,則傳統的銲接製程是不易使 因知接先天上便受限於異種金屬的接合,故目_ 方式僅剩機械嵌入式、膠合及硬銲等。 :::藓 由填充合金muer Metals)置於待接合的言干方式而猎 :=間’在爐中加熱溶化填充合金',藉由炫 合金分別^I (wettln㈠高爾 面,4融的填充合金冷卻到室溫時,將完成高爾夫球頭 C:\L0G0-5\FIVE C0NTINENTS\PK9266.ptd $ 7頁 I220116 五、發明說明(2) 的接合。 球頭之本體材料有不錄鋼、麻時效鋼、鈦合全、 效:=鎂ί金等,而打擊面之材料則有鈦合金、麻時 ^狀5己合金、塊材非晶質合金…等。中較常見 (=為不銹鋼(例如17_4PH)製之高爾夫球本體 白=2,卜4”製的打,面。此種組合之高爾夫球頭 (^口二,·若是使用傳統硬銲接合製程,因加熱速率低 (^-50 C/min),為了減少基材暴露於高溫 影[工作溫度往往設定在硬銲填料熔點溫度 上力〇〜50它的範圍内,再持溫10〜30分鐘,藉由_微 j熱之液相填料與基材間的潤溼作用,來結合兩端之二基几 由於硬鐸製程在比較咼的溫度(大於4 g 〇。〇),所以在 =3:!比較廣泛的冶金反應發生,使得部分硬銲合 j洛入基材中,或是基材中的元素由於在高溫的環境下, t由擴散作用進入填充合金中,因而改變了合金的成分,L 進而影響填充合金的流動性、潤濕性,並使接合強度 改變(稱為合金化作用,A1 loying)。此外,在填充合金與 =材的界面上,會形成具有脆性的介金屬化合物;若此本 肢/填充合金/打擊面之間所形成的界面層成長過厚,將 使接合處之機械強度降低或耐衝擊能力變差。這也是為何 目前高爾夫球頭異種金屬間之接合仍以機械嵌入式人 式為主的原因。 /口 、而如何克服上述傳統硬銲製程所衍生之缺失,使高爾夫 球頭異種金屬間之接合能有更佳之抗衝擊性能,乃是各大1220116 V. Description of the invention (l) [Technical field to which the invention belongs] Infrared heating uses tungsten in the quartz lamp tube as a heat source to quickly heat the objects to be joined ;: due to kg = 2 outside line penetrates the quartz protection tube , And by appropriately focusing on: the line can be high rate), rapid cooling (fast heat dissipation) and the process with great development potential when joining. According to the present invention, a method for manufacturing a golf head by a combined process, A :: 2 :: "Bu line is quickly connected to the heat source heating method, heated and melted; = the outer line is between the strike surface of the Nanlf ball head Filling closure: containing m body t ;! golf head hitting surface to make golf ball :: golf ball head [prior art], the golf head is formed by joining the body and the hitting surface. There is mechanical embedding (Mechanical Inserted 彳,: 0 method (Glued), welded (Welded), and hard shovel I), etc.) If the body of the golf head and the striking surface, dry $ (Brazed made of gold) , The traditional welding process is not easy to make the innate connection is limited to the joining of dissimilar metals, so the only way left is mechanical embedding, gluing and brazing, etc. ::: Moss is set by filled alloy muer Metals) Hunting on the dry and dry way to be joined: = between 'heating and melting the filler alloy in the furnace', by using dazzling alloys ^ I (wettln㈠Gaul surface, 4 melted filler alloy is cooled to room temperature, the golf ball will be completed Head C: \ L0G0-5 \ FIVE C0NTINENTS \ PK9266.ptd $ 7 pages I2 20116 V. Joining of the description of the invention (2). The body material of the ball head includes non-recording steel, aging steel, titanium alloy, efficiency: = magnesium, gold, etc., and the material of the striking surface is titanium alloy, sisal ^ Shaped 5hex alloy, block amorphous alloy, etc. More common (= stainless steel (such as 17_4PH) golf body white = 2, bu 4 "hit, surface. This combination of golf head (^ 口 二, If the traditional brazing process is used, because the heating rate is low (^ -50 C / min), in order to reduce the exposure of the substrate to high temperature shadows [The working temperature is often set at the melting point of the brazing filler. Within its range, hold the temperature for another 10 ~ 30 minutes, and use the wetting effect between the hot liquid filler and the substrate to combine the two bases at both ends due to the hard Duo process at a relatively high temperature (Greater than 4 g 〇.〇), so a wide range of metallurgical reactions occur at = 3:!, Making part of the braze welding into the substrate, or because the elements in the substrate due to the high temperature environment, t Diffusion enters the filler alloy, thus changing the composition of the alloy, and L further affects the fluidity and wetting of the filler alloy. Wet and change the joint strength (called alloying, A1 loying). In addition, at the interface between the filler alloy and the material, a brittle intermetallic compound will be formed; if this limb / filler alloy / hitting surface The interface layer formed between them grows too thick, which will reduce the mechanical strength or impact resistance of the joint. This is also the reason why the dissimilar metals of golf heads are still mechanically embedded. / Mouth, and how to overcome the defects derived from the traditional brazing process described above, so that the joint between the dissimilar metals of the golf head can have better impact resistance, is the major
1220116 五、發明說明(3) 高爾夫球具製造廠努六 咖呈時應儘可能的避免目二==標,在設計硬 若能減少硬銲製程;ί 之上,以增進接點的可靠度。 力的接合製程,即可;:間或使:其它具有快速加熱能 【發明内容】 克服傳統硬鐸製程之缺點。 、’工外、泉具有光波的反射特十生,因此 以聚焦’來增加紅外線的能量密度與提昇加口 而显),斟浐&本工/心/、拋物面形怨兩種(視工件形態 而=)對鏡面表面施以錢金處理,並以適度的冷卻水冷 =用如=具有較佳的反射效應,也適合在較高溫度 ::ί ^。紅外線穿透石英保護管,然後聚焦於工件 的加熱區上,在整個過程中能源高效率使用並避免不杂的 浪費,使紅外線加熱法具有快速升溫與快速冷卻之特: 並大幅縮短整體接合時程。相較於傳統的加熱方式(加執I: 速率僅約5-5(TC/niin),使用紅外線快速接合製程具有快 速昇降溫速率(高達SOOOt/min),故於接合製程中基材暴 露於高溫中的時間將大幅減少,而減低因高溫而造成對材 料不良影響的可能性。此外,加上以秒為計時單位的靈敏 製知控制’便得接合溫度不再受限於填料之熔點溫度以上 約0〜5 0 °c的範圍内,而改以選擇界面組織控制的觀點, 來設定較合適的工作溫度。故就生產效率及製程變數之控 制兩方面而言,使用紅外線快速接合製程均優於傳統硬^ 接合製程。 11 _ I II _ 1220116 五、發明說明(4) 问:=二疋由本體與高爾夫球頭打擊 :由;=的=體軸夫球頭:;:, 靡。此時可藉=於=程並無 與咼爾夫球頭打擊面之間,α紅外線快埶=頭本體 合金後,藉由熔融的填充人全, =力…並化填充 渔及接合高爾夫球頭的時程内,分別潤 填充合全冷卻至南爾夫球頭打擊面;當熔融的 填死口至々部至至溫時,將製成高爾夫 本體之材質可為不錄鋼、麻時效鋼、鈦合金、 鎂合金寺’而:爾夫球頭打擊面之材料則有鈦合金、麻二 效鋼、形狀§己憶合金、塊材非晶質合金…。川' 【實施方式】 Μ 玆以下列示實例’詳細說明本發明之具體實施例。笋明 中所使用的紅外線硬銲接合裝置,係採用日本 ^ SINK0-RIK0 RHL-P610C型之紅外線加熱爐體’濟内且有> 組石英燈管j 2有鎢電熱絲)與六個拋物線形之黃^聚2 反射曲面,最高工作溫度可達約丨3 〇 〇它,輸入功率 (Rating)為12·0 KW。整體接合系統是在國内自行組穿-而成。配備有一端封口之石英保護管與其他附屬之進排氣 設備二而此紅外線快速加熱裝置可在流動氬氣保護氣氛 (或高真空,<5 X 10-5 mbar )下進行紅外線快速接合製 程。該紅外線波長大致介於〇 · 7 6〜1 〇 〇 〇 # m的範圍。 第一圖為使用紅外線快速接合製程製作高爾夫球頭之分 解示意圖,該高爾夫球頭係由數個零件所組成,圖中包1220116 V. Description of the invention (3) The golf equipment manufacturer should avoid as far as possible the No. 2 = standard when it is presented. If the design is hard, it can reduce the brazing process; ί above, in order to improve the reliability of the contact . Force the joining process, you can :: occasionally make: other with rapid heating energy [Summary of the invention] To overcome the shortcomings of the traditional hard duo process. , "External work, springs have the reflection of light waves for ten years, so focus is used to increase the energy density of the infrared and enhance the mouth.), Consider two kinds of & the work / heart /, parabolic shape complaints (depending on the workpiece Morphology =) Applying gold treatment to the mirror surface and cooling with moderate cooling water = using eg = has better reflection effect, and is also suitable for higher temperatures :: ^. Infrared rays penetrate the quartz protection tube, and then focus on the heating area of the workpiece. During the entire process, the energy is used efficiently and avoids unnecessary waste. The infrared heating method has the characteristics of rapid heating and cooling: and greatly shortens the overall bonding time. Cheng. Compared with the traditional heating method (plus I: the rate is only about 5-5 (TC / niin), the infrared rapid bonding process has a rapid temperature rise and fall rate (up to SOOOt / min), so the substrate is exposed to during the bonding process The time in high temperature will be greatly reduced, and the possibility of adverse effects on the material due to high temperature will be reduced. In addition, coupled with the sensitive know-how control in seconds, the joint temperature will no longer be limited by the melting point of the filler. The above range is about 0 ~ 50 ° C, and the viewpoint of selecting the interface organization control is used to set a more appropriate working temperature. Therefore, in terms of production efficiency and control of process variables, the use of infrared rapid bonding It is better than the traditional hard ^ bonding process. 11 _ I II _ 1220116 V. Description of the invention (4) Q: = 疋 is hit by the body and the golf head: by; At this time, it can be borrowed between == Cheng Chengwu and the golf ball's striking surface, α infrared fast 埶 = after the head body alloy, by melting the filling of the human body, = force ... and filling the fishing and joining the golf ball During the head time, fill in It will be cooled to the hitting surface of Nanlf's ball head; when the melted fill mouth to the crotch to to warm, the material of the golf body can be non-recording steel, aging steel, titanium alloy, magnesium alloy temple ' And: the material of the ball head hitting surface is titanium alloy, hemp secondary effect steel, shape § memory alloy, bulk amorphous alloy ... Chuan '[Embodiment] Μ The following examples are used to explain this in detail A specific embodiment of the invention. The infrared hard soldering device used in Sun Ming adopts the Japanese ^ SINK0-RIK0 RHL-P610C type infrared heating furnace body, and has > a group of quartz lamp tubes j 2 with tungsten electric heating Wire) and six parabolic yellow ^ poly 2 reflective curved surfaces, the highest working temperature can reach about 丨 3 00 it, the input power (Rating) is 12.0 KW. The overall joint system is made in China. Equipped with a sealed quartz protection tube and other attached inlet and exhaust equipment. This infrared fast heating device can perform an infrared fast joining process under a flowing argon protective atmosphere (or high vacuum, < 5 X 10-5 mbar). . The infrared wavelength is approximately in the range of 0.76 to 1 00 #m. The first figure is an exploded schematic diagram of a golf head made by using the infrared rapid joining process. The golf head is composed of several parts.
^201i6 五、發明說明(5) ::高爾夫球頭本體!、高爾夫球頭打擊面2及填充 面ΓΛ1分。/該高爾夫球頭本體1與該高爾夫球頭V擊 該高Λ該填充合金3置於該高爾夫球頭本體1與 ^爾夫球頭打擊面2之間m外線加熱該填 =其烙融’ f該填充合金3冷卻[將該高爾夫球:本雕^ 201i6 V. Description of the invention (5) :: Golf head body! 1. The golf ball hitting surface 2 and the filling surface ΓΛ1 point. / The golf head body 1 and the golf head V hit the high Λ The filling alloy 3 is placed between the golf head body 1 and the golf ball striking surface 2 m The outer line heats the filling = its melting ' fThe filler alloy 3 is cooled [The golf ball: the engraving
爾夫球頭打擊面2結合。由於目前較常見的植人J 擊m:爾夫球頭本體,及鈦合金製的高爾夫球頭打 =。t例中,爾夫球頭本_17_4PH不鏽鋼,高爾夫丁 ,丑、丁·#面2為1'1-6八1-〇合金。17-4 PH不鏽鋼 ;lc;V195? ^ ^ ^ ^ ^ ^ ^ 度及優良的加工性、抗腐蝕性、銲接性…等。至於 合金具有優異^的比強度、抗腐蝕能力及良好的 、干·,故被選為製作高爾夫球頭材料。至於填充人金 則分別使用 100%Ag、72Ag—28CU (wt%)、95Ag—5A1(w;%) 二f銀基填料,或鎳基、銅基或鈦基。 、_ 第二圖揭示本發明之另一使用紅外線快速接合製程掣作宴 南爾夫球頭之分解示意圖,其包含一高爾夫球頭本體H、 =配重塊20及一填充合金3〇。該高爾夫球頭本體1〇之材料 較佳為鈦合金、鐵基合金、鎂合金、鋁合金、鐵錳紹合 =、形狀記憶合金、鎢合金、銅合金、鎳合金、塊材非晶 夤合金、奈米合金、複合材料、陶瓷材料等。而該配重塊 20較佳選用比重較該高爾夫球頭本體1〇大之金屬或合金, 例如鎢、鎢合金、銅合金、鉛舍金等。該填充合金3〇則可 選擇銀基、鎳基、鋼基或鈦基。當該高爾夫球頭本體1〇與 C:\LOGO-5\FIVE CONTINENTS\PK9266.ptd 第11頁 1220116 五、發明說明(6) "亥配重塊20結合前,先將該填充合金30置於該高爾夫球頭 本體1^與該配重塊20之間,利用紅外線加熱該填充合金3〇 使f炫㉞’當該填充合金3 〇冷卻後,將該高爾夫球頭本體 1 0 14該配重塊2 〇結合。為避免產生合金化作用,該紅外線 加熱之速率較佳為至少約1 °C/秒,更佳為約50 °C/秒。有 工^線接合製程中所使用的製程參數如:預熱溫度、升 級速率、真空度、製程溫度與時間,詳列於第三圖中。 f者’該加熱製程係可於空氣中進行。然而,為避免該 Iί ^填充合金在製程或冷卻後產生氧化等不良之反應, S二二,於真空中進行,或置於惰性氣體中進行,該惰性丨 乳f可為氮氣、氬氣、氦氮等。 为^:^^為了卜^丨-^/“/^ — ‘四接點經紅外線於1 0 00。0 後,接點部位橫截面之掃描式電子顯微鏡(SEM) 熱所ί的接^中可以得知,、經紅外線短時間(如30秒)加rr 被抑制。第五ΘΑΤ. 7Δ真枓/、基材間之Μ金反應將明顯的运 之接點前ί 為丁1 —6Α1—4ν/Αδ/Η-4ΡΙΙ以紅外線接合後 時間‘:。使用較低的接合溫度或較短的接合 6A1 U 的接合強度。這是由於Ag填料盥 ^ ^ ^^ ( 力強度約為91.7MPa。此外對第也銀岡填料:言,其最、高的剪 使用紅外線快速接合卜弟四圖⑷中亦可以觀察到, 第六圖為Ti-6A1-4V/79A 得到一個密實的接點。 X 120 # ^ ^ ^ ^ # ^ M8〇° 〇C 口 σ式片杈截面SEM影像及接合界Elf hit the ball with 2 hits on the face. Because of the more common J hit m: golf ball body, and titanium alloy golf head hit =. In the t example, the golf ball head _17_4PH stainless steel, golf tee, ugly, ding #face 2 is 1'1-6 eight 1-0 alloy. 17-4 PH stainless steel; lc; V195? ^ ^ ^ ^ ^ ^ ^ Degree and excellent processability, corrosion resistance, weldability ... etc. As the alloy has excellent specific strength, corrosion resistance and good dry, it was selected as the material for making golf heads. For filler gold, 100% Ag, 72Ag-28CU (wt%), 95Ag-5A1 (w;%) di-f silver-based fillers, or nickel-based, copper-based, or titanium-based fillers are used, respectively. The second figure reveals another exploded schematic diagram of the Nanlf golf ball head using the infrared fast-joining process of the present invention, which includes a golf head body H, a weight block 20, and a filler alloy 30. The material of the golf head body 10 is preferably a titanium alloy, an iron-based alloy, a magnesium alloy, an aluminum alloy, an iron-manganese alloy, a shape memory alloy, a tungsten alloy, a copper alloy, a nickel alloy, and a bulk amorphous alloy. , Nano alloys, composite materials, ceramic materials, etc. The weight block 20 is preferably selected from a metal or an alloy with a specific gravity greater than that of the golf ball body 10, such as tungsten, tungsten alloy, copper alloy, lead alloy, and the like. The filler alloy 30 can be selected from silver-based, nickel-based, steel-based or titanium-based. When the golf head body 10 and C: \ LOGO-5 \ FIVE CONTINENTS \ PK9266.ptd page 11 1220116 V. Description of the invention (6) " Hai weight block 20, the filled alloy 30 is first placed Between the golf head body 1 ^ and the weight block 20, the filling alloy 30 is heated by infrared rays to make the lens flicker. When the filling alloy 30 is cooled, the golf head body 1 0 14 the weight The weight 2 is bound. To avoid alloying, the rate of infrared heating is preferably at least about 1 ° C / second, and more preferably about 50 ° C / second. The process parameters used in the wire bonding process such as: preheating temperature, upgrade rate, vacuum degree, process temperature and time are listed in detail in the third figure. f 'The heating process can be performed in the air. However, in order to avoid adverse reactions such as oxidation of the filled alloy after the process or cooling, S22, performed in a vacuum, or placed in an inert gas, the inert milk f can be nitrogen, argon, Helium and nitrogen. For ^: ^^ For the purpose of ^ 丨-^ / "/ ^ — 'After the four contacts are exposed to infrared light at 1 00. 0, the cross section of the contact section is scanned by the scanning electron microscope (SEM) heat. It can be known that the short time (such as 30 seconds) plus rr is inhibited by the infrared. The fifth ΘΑΤ. 7Δ true 枓 /, the gold reaction between substrates will be significantly higher than the junction ί 1-6 Α1— The time after 4ν / Αδ / Η-4PiI1 bonding with infrared rays :: Use a lower bonding temperature or a shorter bonding strength of 6A1 U. This is due to the Ag filler ^ ^ ^^ (force strength is about 91.7MPa. In addition to the Diye Yingang filler: In other words, the highest and highest shears can be observed in the four pictures shown in Fig. 4 using infrared rays. The sixth picture shows a dense joint for Ti-6A1-4V / 79A. X 120 # ^ ^ ^ ^ # ^ M8〇 ° 〇C σ-shaped slice branch cross-section SEM image and joint boundary
C:\LOGO-5\five CONTINENTS\PK9266.ptd 第12頁 1220116 五、發明說明(7) 面中各位置之ΕΡΜΑ化學成分分析數據。圖中大致可分為 Ti-Cii化合物内固溶少量其他金屬區(TiCu、η,%、Tic%) 及殘留填料區。同時也可發現,因填料中的Cu原子和基4 反應,而A g原子並未參與介面反應,如此勢必造成填充合 金區Cu的濃度下降,相對Ag的濃度提升。因此第六圖中二 填充合金内可發現Ag的初晶組織。此現象可簡單地自 Ag-Cu二元合金相圖中得到合理之解釋,即是其組成線偏 肖隹原始的共晶成分而至亞共晶成分所致。 第七圖 紅外線快 像。比較 時間的升 增加。此 使得填料 處有較大 第八圖 合條件下 發生在接 強度值最 並不隨著 勢。其強 屬相的成 似,使用 佳的接合 為Π-6A卜4V/72Ag-28Cu /17-4PH接點經不同的 速加熱接合條件下,接點部位橫截面之SEM影 ,六圖及第七圖可以發現,隨著加熱溫度或持溫 南或延長,填充合金與基材之間反應層的厚度會 外,在持溫3 0秒的條件下,由於持溫時間過短, 溶融後未能完全與基材反應,因而造成接合界兩〜丨 規模的富Ag共晶組織存在。 ’產 為丁 i-6A1-4V/72Ag-2 8Cu/17-4PH於不同紅外線接 接點之剪力試驗數據。從圖中得知最大剪強度值 ^溫度8 0 0 °C持溫時間為丨2 〇秒之試片,其平均剪 高約為96· 4MPa。然而自圖中可觀察到接合強度 持/JDL日守間或溫度的增加而增加,反而有下降的趨讀 度下降之原因主要歸因於介面有連續形態之介金 長所導致。此結果與前述使用純銀填料的結果類 較低的接合溫度或較短的接合時間,將可獲得較 強度。此結果主要是由於72Ag — 28Cu填料與C: \ LOGO-5 \ five CONTINENTS \ PK9266.ptd Page 12 1220116 V. Description of the invention (7) EPMA chemical composition analysis data of each position in the surface. The figure can be roughly divided into a small amount of other metal regions (TiCu, η,%, Tic%) and residual filler regions in the Ti-Cii compound. It can also be found that the Cu atom in the filler reacts with the radical 4 and the Ag atom does not participate in the interface reaction. This will inevitably cause the Cu concentration in the filled alloy region to decrease and the relative Ag concentration to increase. Therefore, the primary crystal structure of Ag can be found in the two filled alloys in the sixth figure. This phenomenon can be reasonably explained simply from the phase diagram of the Ag-Cu binary alloy, that is, its composition line deviates from the original eutectic composition to the sub-eutectic composition. The seventh image is the infrared image. The increase in comparison time increases. This makes the filler have a larger size. Figure 8 shows that the joint strength value does not follow the potential. The strong phase is similar. SEM image of the cross section of the contact part under the condition of good speed is Π-6A, 4V / 72Ag-28Cu / 17-4PH contact under different speed heating joining conditions, six pictures and seventh It can be found in the figure that the thickness of the reaction layer between the filler alloy and the substrate will be increased with the heating temperature or holding temperature or extended. Under the condition of holding temperature of 30 seconds, because the holding temperature time is too short, the melting fails. It completely reacts with the substrate, which results in the existence of an Ag-rich eutectic structure on a two-to-one scale in the junction. ’Produced by I-6A1-4V / 72Ag-2 8Cu / 17-4PH at different infrared contact points. It is known from the figure that the maximum shear strength value ^ temperature 80 0 ° C test piece with a holding time of 20 seconds, the average shear height of about 96 · 4MPa. However, it can be observed from the figure that the joint strength / JDL increases with the increase of the day-to-day temperature or the temperature, but the trend of the decline is mainly due to the continuous growth of the interface. This result is compared with the aforementioned results using pure silver fillers. Lower bonding temperatures or shorter bonding times will result in stronger strength. This result is mainly due to the 72Ag — 28Cu filler and
12201161220116
T 4V或17-4ΡΗ不銹鋼基材之間的冶金反應,因使用 紅=線快速加熱製程而被抑制。 第=圖為Ti-6A1-4V/95Ag-5A1/1 7-4PH接點經紅外線加 f接合後,接點部位橫截面之SEM影像。由圖中可知,殘 留填料區並沒有發現介金屬相層的生成,基材與填料界面 處所士成的相層,由於小於1 # m而低於ΕΡΜΑ化學成分可解 析=轭圍,因此無法確切的將此相層之化學成分正確定量 的分=出。第十圖為Ti—6A1 一 4v/95Ag_5A1/17 — 4pH以紅外 f接a後之接點剪力试驗數據。與前述兩種剪力測試結果 類似,由於使用紅外線快速加熱製程將有利於抑制界面反 應層之生成,故使用較低的接合溫度,將可獲得較佳的接 由上述實例中可知,紅外線快速接合製程之應用,將可 抑,,口界面上具脆性化合物之生成、大幅提昇此類產品兩: 之二貝、生產效率及降低於製造過程中能源之消耗。故此ί蓋 技術將可以廣泛的應用於各式填料製作高爾夫球頭之製程 中,預期將有助於此類產品之品質提升及成本降低。 上述之具體實施例是用來詳細說明本發明之目的、特徵 ^ ^ ί,對於熟悉該項技蟄人士而言,根據上述說明對該 二脰貫施例作部分變更或修改,均不脫離本發明之精神範暹| 臂。以任何更動與潤飾在不脫離本創作之基本精, 應屬於本創作之適用範圍。 一Metallurgical reactions between T 4V or 17-4PΗ stainless steel substrates are suppressed due to the rapid heating process using the red wire. The third figure is the SEM image of the cross section of the Ti-6A1-4V / 95Ag-5A1 / 1 7-4PH contact after infrared bonding. It can be seen from the figure that the formation of intermetallic phase layer was not found in the residual filler area. The phase layer formed at the interface between the substrate and the filler is less than 1 # m and the chemical composition of EPMA is lower than the yoke envelope, so it cannot be determined accurately. The chemical composition of this phase layer was accurately and quantitatively separated out. The tenth figure is the contact shear test data of Ti-6A1-4v / 95Ag_5A1 / 17-4pH after infrared a is connected to a. Similar to the above two types of shear test results, because the use of infrared rapid heating process will be beneficial to suppress the formation of interface reaction layer, so using a lower bonding temperature will obtain a better connection. As can be seen from the above examples, infrared rapid bonding The application of the process will be suppressed. The generation of brittle compounds on the mouth interface will greatly improve these products. Two: the production efficiency and the reduction of energy consumption during the manufacturing process. Therefore, the cover technology can be widely used in the manufacturing process of various types of fillers to make golf heads, which is expected to help improve the quality and cost of such products. The specific embodiments described above are used to describe the purpose and features of the present invention in detail. For those skilled in the art, according to the above description, some changes or modifications to the two embodiments are made without departing from the present invention. The spirit of invention Fan Siam | Arm. Any modification and retouching without departing from the basic essence of this creation shall belong to the scope of application of this creation. One
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【圖式簡單說明】 第1圖為本發明第一較佳實施例之使用紅外線快速 製程製作高爾夫球頭之分解示意圖。 a ,第2圖為本發明第二較佳實施例之使用紅外線快速接合 製程製作高爾夫球頭之分解示意圖。 口 第3圖為紅外線接合製程中所使用的製程參數。 /第4圖為Ti-6A1-4V/Ag/17-4PH接點經紅外線加熱接合 後’接點部位橫截面之SEM影像:(a) 1 〇〇〇。〇 X 3〇sec, (b) 1 0 0 0 °Cx 120sec ^ (c) l〇〇〇°Cx 21〇sec ^ (d) l〇〇〇 〇Cx 300sec 〇 第5圖為Ti-6A1 -4V/Ag/17-4PH以紅外線接合後接點之 剪力試驗數據。 第 6 圖為Ti-6A1-4V/72Ag-28Cu/17-4PH 不銹鋼經8〇〇 艺 X 中 熱[Brief description of the drawings] FIG. 1 is an exploded view of the first preferred embodiment of the present invention for manufacturing a golf head using a rapid infrared manufacturing process. a, FIG. 2 is an exploded schematic view of manufacturing a golf head using an infrared fast joining process according to a second preferred embodiment of the present invention. Figure 3 shows the process parameters used in the infrared bonding process. / FIG. 4 is a SEM image of the cross section of the 'contact point portion after the Ti-6A1-4V / Ag / 17-4PH contact is joined by infrared heating: (a) 1 000. 〇X 3〇sec, (b) 100 ° Cx 120sec ^ (c) 100 ° Cx 21〇sec ^ (d) 100 ° Cx 300sec 〇 The figure 5 is Ti-6A1 -4V / Ag / 17-4PH Shear test data of contacts after infrared bonding. Figure 6 shows Ti-6A1-4V / 72Ag-28Cu / 17-4PH stainless steel after 800 ° C heat
120秒之紅外線快速接合試片(a)SEM影像,(…接合界面 各位置之ΕΡΜΑ化學成分分析數據。 第7圖為Ti-6A1-4V/72Ag-28CU/17-4PH接點經紅外線加 接合後,接點部位橫截面之SEM影像:(a) 8 5 0 °Cx 30sec,(b) 850 〇Cx 120sec,(c) 8 5 0 〇Cx 30〇sec。120 seconds infrared fast joining test piece (a) SEM image, (... EPMA chemical composition analysis data at each position of the joining interface. Figure 7 shows the Ti-6A1-4V / 72Ag-28CU / 17-4PH contact through infrared joining Later, SEM images of the cross section of the contact part: (a) 850 ° Cx 30sec, (b) 850 ° Cx 120sec, (c) 850 ° Cx 30 ° sec.
第8圖為Ti-6A1-4V/7 2Ag-2 8Cu/17-4PH以紅外線接合 接點之與力試驗數據。 第9圖為Ti-6A1-4V/95Ag-5Al/l 7-4PH接點經紅外線加 熱接合後,接點部位橫截面之SEM影像:(a) 830 °Cx 30 0sec,(b) 850 〇Cx 120sec,(c) 850 〇Cx 30 0sec,(d) 9 0 0 °C x 120sec。Figure 8 shows the test data of Ti-6A1-4V / 7 2Ag-2 8Cu / 17-4PH with infrared joints. Figure 9 is a SEM image of the cross section of the Ti-6A1-4V / 95Ag-5Al / l 7-4PH contact after infrared heating bonding: (a) 830 ° Cx 30 0sec, (b) 850 〇Cx 120sec, (c) 850 ° C x 30 0sec, (d) 90 ° C x 120sec.
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