TWD237600S

TWD237600S - IC test probe

Info

Publication number: TWD237600S
Application number: TW113303708F
Authority: TW
Inventors: 黃東源; 黃裁白; 裁白黃; 黃路建載; 路建載黃
Original assignee: 韓商惠康有限公司 (南韓); 韓商惠康有限公司; 黃東源 (南韓); 黃東源; 黃裁白 (美國); 裁白黃
Priority date: 2024-01-18
Filing date: 2024-07-18
Publication date: 2025-04-11

Abstract

【物品用途】;本設計係關於一種IC測試用探針，特別是有關於一種用於檢查電子元件之IC測試用探針。;【設計說明】;本設計係與待檢查物體的電極、端子或焊盤接觸的探針，例如半導體裝置、半導體封裝、積體電路、印刷電路板等。在檢查過程中，電訊號從基板和IC與接觸的上探針經過下探針流向下方。本設計在最大壓縮下，上探針和下探針可同時直接接觸IC和基板以流動電流。[Article Use];This design relates to an IC test probe, and in particular to an IC test probe for inspecting electronic components.;[Design Description];This design is a probe that contacts an electrode, terminal or pad of an object to be inspected, such as a semiconductor device, semiconductor package, integrated circuit, printed circuit board, etc. During the inspection process, the electrical signal flows downward from the upper probe that contacts the substrate and IC through the lower probe. Under maximum compression, the upper and lower probes of this design can directly contact the IC and substrate at the same time to flow current.

Description

Probes for IC testing

本設計係關於一種IC測試用探針，特別是有關於一種用於檢查電子元件之IC測試用探針。 This design is about an IC test probe, and in particular, about an IC test probe for inspecting electronic components.

本設計係與待檢查物體的電極、端子或焊盤接觸的探針，例如半導體裝置、半導體封裝、積體電路、印刷電路板等。在檢查過程中，電訊號從基板和IC與接觸的上探針經過下探針流向下方。本設計在最大壓縮下，上探針和下探針可同時直接接觸IC和基板以流動電流。 This design is a probe that contacts the electrode, terminal or pad of the object to be inspected, such as a semiconductor device, semiconductor package, integrated circuit, printed circuit board, etc. During the inspection process, the electrical signal flows from the upper probe that contacts the substrate and IC to the lower probe. Under maximum compression, the upper and lower probes of this design can directly contact the IC and substrate at the same time to flow current.