TWD231013S - Wafer - Google Patents

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Publication number
TWD231013S
TWD231013S TW111300506F TW111300506F TWD231013S TW D231013 S TWD231013 S TW D231013S TW 111300506 F TW111300506 F TW 111300506F TW 111300506 F TW111300506 F TW 111300506F TW D231013 S TWD231013 S TW D231013S
Authority
TW
Taiwan
Prior art keywords
design
wafer
make
produce
appearance
Prior art date
Application number
TW111300506F
Other languages
Chinese (zh)
Inventor
陳世益
顧浩民
黃靖恩
林雅雯
林壯聲
何宜珈
Original Assignee
晶成半導體股份有限公司 新竹市科學園區力行五路5號1樓 (中華民國)
晶成半導體股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 晶成半導體股份有限公司 新竹市科學園區力行五路5號1樓 (中華民國), 晶成半導體股份有限公司 filed Critical 晶成半導體股份有限公司 新竹市科學園區力行五路5號1樓 (中華民國)
Priority to TW111300506F priority Critical patent/TWD231013S/en
Publication of TWD231013S publication Critical patent/TWD231013S/en

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Abstract

【物品用途】;本設計係關於一種晶圓之外觀式樣設計。;【設計說明】;本設計係一種新穎造型之晶圓，可使本設計具有簡潔且協調之視覺意象，進而使本設計之整體產生獨特之視覺效果。[Item Usage];This design is about the appearance design of a wafer.;[Design Description];This design is a wafer with a novel shape, which can make this design have a simple and coordinated visual image, and thus make the overall design produce a unique visual effect.

Description

晶圓 Wafer

本設計係關於一種晶圓之外觀式樣設計。 This design is about the appearance design of a wafer.

本設計係一種新穎造型之晶圓，可使本設計具有簡潔且協調之視覺意象，進而使本設計之整體產生獨特之視覺效果。 This design is a novel wafer that can give this design a simple and coordinated visual image, thereby making the overall design produce a unique visual effect.

TW111300506F 2022-01-27 2022-01-27 Wafer TWD231013S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW111300506F TWD231013S (en) 2022-01-27 2022-01-27 Wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW111300506F TWD231013S (en) 2022-01-27 2022-01-27 Wafer

Publications (1)

Publication Number Publication Date
TWD231013S true TWD231013S (en) 2024-05-01

Family

ID=91333274

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111300506F TWD231013S (en) 2022-01-27 2022-01-27 Wafer

Country Status (1)

Country Link
TW (1) TWD231013S (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD171962S (en) 2014-11-13 2015-11-21 東京威力科創股份有限公司 Part of the simulated wafer (3)

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD171962S (en) 2014-11-13 2015-11-21 東京威力科創股份有限公司 Part of the simulated wafer (3)

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