TWD215844S - Portion of heat sink for memory module - Google Patents
Portion of heat sink for memory module Download PDFInfo
- Publication number
- TWD215844S TWD215844S TW110302904F TW110302904F TWD215844S TW D215844 S TWD215844 S TW D215844S TW 110302904 F TW110302904 F TW 110302904F TW 110302904 F TW110302904 F TW 110302904F TW D215844 S TWD215844 S TW D215844S
- Authority
- TW
- Taiwan
- Prior art keywords
- design
- heat sink
- memory module
- casing
- area
- Prior art date
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- 230000000007 visual effect Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 abstract description 2
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Abstract
【物品用途】;本設計係關於一種記憶體模組散熱片之部分,本設計所依附之物品是一種用於儲存及讀取數位數據資料之記憶體模組之散熱片。;【設計說明】;本設計之特點在於包含呈長形輪廓之一殼體,其中殼體之表面具有呈左右對稱的複數造型飾紋,並於殼體之頂部飾有複數且長度不一之溝紋。藉由上述形狀之構成,使得本設計之整體造型產生俐落細緻且對稱的視覺意象,並對消費者產生科技潮流之獨特視覺效果。;圖式所揭露之虛線部分,為本案不主張設計之部分。;「A部放大圖」係放大立體圖1內之區域A的特徵,其中區域A係指立體圖1中以一點鏈線所圈選的區域。[Use of article]; This design is about a heat sink of a memory module. The article to which this design is attached is a heat sink of a memory module used to store and read digital data. ;[Design Description];The characteristic of this design is that it contains a casing with a long outline. The surface of the casing has a plurality of left-right and symmetrical decorative patterns, and the top of the casing is decorated with a plurality of different lengths. grooves. Through the composition of the above shapes, the overall shape of this design produces a neat, detailed and symmetrical visual image, and produces a unique visual effect of technological trends on consumers. ;The dotted line parts disclosed in the diagram are the parts of this case that are not intended to be designed. ; The "enlarged view of part A" is an enlarged view of area A in the perspective view 1, where area A refers to the area circled by a one-dot chain line in the perspective view 1.
Description
本設計係關於一種記憶體模組散熱片之部分,本設計所依附之物品是一種用於儲存及讀取數位數據資料之記憶體模組之散熱片。This design is about the heat sink of a memory module. The item attached to this design is a heat sink of a memory module used to store and read digital data.
本設計之特點在於包含呈長形輪廓之一殼體,其中殼體之表面具有呈左右對稱的複數造型飾紋,並於殼體之頂部飾有複數且長度不一之溝紋。藉由上述形狀之構成,使得本設計之整體造型產生俐落細緻且對稱的視覺意象,並對消費者產生科技潮流之獨特視覺效果。The feature of this design is that it includes a shell with a long profile, wherein the surface of the shell has a plurality of symmetrical decorative patterns, and the top of the shell is decorated with a plurality of grooves of different lengths. The composition of the above-mentioned shapes makes the overall shape of the design produce a neat, detailed and symmetrical visual image, and produces a unique visual effect of the technological trend for consumers.
圖式所揭露之虛線部分,為本案不主張設計之部分。The dotted line disclosed in the diagram is a part of this case that does not advocate design.
「A部放大圖」係放大立體圖1內之區域A的特徵,其中區域A係指立體圖1中以一點鏈線所圈選的區域。"Enlarged view of part A" is an enlarged view of the features of area A in the three-
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110302904F TWD215844S (en) | 2021-06-03 | 2021-06-03 | Portion of heat sink for memory module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110302904F TWD215844S (en) | 2021-06-03 | 2021-06-03 | Portion of heat sink for memory module |
Publications (1)
Publication Number | Publication Date |
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TWD215844S true TWD215844S (en) | 2021-12-01 |
Family
ID=88973449
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW110302904F TWD215844S (en) | 2021-06-03 | 2021-06-03 | Portion of heat sink for memory module |
Country Status (1)
Country | Link |
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TW (1) | TWD215844S (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWD192884S (en) | 2017-12-18 | 2018-09-11 | 美商金士頓數位股份有限公司 | Portion of memory heat dissipation sink |
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2021
- 2021-06-03 TW TW110302904F patent/TWD215844S/en unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWD192884S (en) | 2017-12-18 | 2018-09-11 | 美商金士頓數位股份有限公司 | Portion of memory heat dissipation sink |
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