TWD215844S - Portion of heat sink for memory module - Google Patents

Portion of heat sink for memory module Download PDF

Info

Publication number
TWD215844S
TWD215844S TW110302904F TW110302904F TWD215844S TW D215844 S TWD215844 S TW D215844S TW 110302904 F TW110302904 F TW 110302904F TW 110302904 F TW110302904 F TW 110302904F TW D215844 S TWD215844 S TW D215844S
Authority
TW
Taiwan
Prior art keywords
design
heat sink
memory module
casing
area
Prior art date
Application number
TW110302904F
Other languages
Chinese (zh)
Inventor
林怡婷
卓蔚昕
Original Assignee
美商金士頓數位股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商金士頓數位股份有限公司 filed Critical 美商金士頓數位股份有限公司
Priority to TW110302904F priority Critical patent/TWD215844S/en
Publication of TWD215844S publication Critical patent/TWD215844S/en

Links

Images

Abstract

【物品用途】;本設計係關於一種記憶體模組散熱片之部分,本設計所依附之物品是一種用於儲存及讀取數位數據資料之記憶體模組之散熱片。;【設計說明】;本設計之特點在於包含呈長形輪廓之一殼體,其中殼體之表面具有呈左右對稱的複數造型飾紋,並於殼體之頂部飾有複數且長度不一之溝紋。藉由上述形狀之構成,使得本設計之整體造型產生俐落細緻且對稱的視覺意象,並對消費者產生科技潮流之獨特視覺效果。;圖式所揭露之虛線部分,為本案不主張設計之部分。;「A部放大圖」係放大立體圖1內之區域A的特徵,其中區域A係指立體圖1中以一點鏈線所圈選的區域。[Use of article]; This design is about a heat sink of a memory module. The article to which this design is attached is a heat sink of a memory module used to store and read digital data. ;[Design Description];The characteristic of this design is that it contains a casing with a long outline. The surface of the casing has a plurality of left-right and symmetrical decorative patterns, and the top of the casing is decorated with a plurality of different lengths. grooves. Through the composition of the above shapes, the overall shape of this design produces a neat, detailed and symmetrical visual image, and produces a unique visual effect of technological trends on consumers. ;The dotted line parts disclosed in the diagram are the parts of this case that are not intended to be designed. ; The "enlarged view of part A" is an enlarged view of area A in the perspective view 1, where area A refers to the area circled by a one-dot chain line in the perspective view 1.

Description

記憶體模組散熱片之部分The part of the memory module heat sink

本設計係關於一種記憶體模組散熱片之部分,本設計所依附之物品是一種用於儲存及讀取數位數據資料之記憶體模組之散熱片。This design is about the heat sink of a memory module. The item attached to this design is a heat sink of a memory module used to store and read digital data.

本設計之特點在於包含呈長形輪廓之一殼體,其中殼體之表面具有呈左右對稱的複數造型飾紋,並於殼體之頂部飾有複數且長度不一之溝紋。藉由上述形狀之構成,使得本設計之整體造型產生俐落細緻且對稱的視覺意象,並對消費者產生科技潮流之獨特視覺效果。The feature of this design is that it includes a shell with a long profile, wherein the surface of the shell has a plurality of symmetrical decorative patterns, and the top of the shell is decorated with a plurality of grooves of different lengths. The composition of the above-mentioned shapes makes the overall shape of the design produce a neat, detailed and symmetrical visual image, and produces a unique visual effect of the technological trend for consumers.

圖式所揭露之虛線部分,為本案不主張設計之部分。The dotted line disclosed in the diagram is a part of this case that does not advocate design.

「A部放大圖」係放大立體圖1內之區域A的特徵,其中區域A係指立體圖1中以一點鏈線所圈選的區域。"Enlarged view of part A" is an enlarged view of the features of area A in the three-dimensional view 1, where area A refers to the area encircled by a dotted chain line in the three-dimensional view 1.

TW110302904F 2021-06-03 2021-06-03 Portion of heat sink for memory module TWD215844S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW110302904F TWD215844S (en) 2021-06-03 2021-06-03 Portion of heat sink for memory module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110302904F TWD215844S (en) 2021-06-03 2021-06-03 Portion of heat sink for memory module

Publications (1)

Publication Number Publication Date
TWD215844S true TWD215844S (en) 2021-12-01

Family

ID=88973449

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110302904F TWD215844S (en) 2021-06-03 2021-06-03 Portion of heat sink for memory module

Country Status (1)

Country Link
TW (1) TWD215844S (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD192884S (en) 2017-12-18 2018-09-11 美商金士頓數位股份有限公司 Portion of memory heat dissipation sink

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD192884S (en) 2017-12-18 2018-09-11 美商金士頓數位股份有限公司 Portion of memory heat dissipation sink

Similar Documents

Publication Publication Date Title
TWD203453S (en) Part of stylus
USD970503S1 (en) Mouse
TWD205998S (en) Part of the memory module
TWD221367S (en) Storage Box
TWD215844S (en) Portion of heat sink for memory module
USD906332S1 (en) Computer case
TWD225439S (en) Portion of heat sink for memory module
USD960002S1 (en) Wireless thermometer
TWD225345S (en) Portion of heat sink for memory module
TWD207891S (en) Portion of laptop
TWD192884S (en) Portion of memory heat dissipation sink
TWD218080S (en) Portion of heat sink for memory module
TWD228711S (en) Part of the memory module
TWD203523S (en) Spotlight
TWD209785S (en) Portion of a data accessing device
TWD228712S (en) Part of the memory module
TWD225444S (en) Portion of heat sink for memory module
TWD212164S (en) Memory radiator
TWD231139S (en) Lipstick Case
USD906269S1 (en) Flexible heat sink
TWD218059S (en) Portion of a data accessing device
TWD230082S (en) Portion of heat sink for memory module
TWD220612S (en) Portion of heat sink for memory module
TWD218854S (en) heat sink
TWD223155S (en) memory cooling case