TWD204998S - Conductive sheet of wafer electroplating fixture - Google Patents

Conductive sheet of wafer electroplating fixture Download PDF

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Publication number
TWD204998S
TWD204998S TW108304468F TW108304468F TWD204998S TW D204998 S TWD204998 S TW D204998S TW 108304468 F TW108304468 F TW 108304468F TW 108304468 F TW108304468 F TW 108304468F TW D204998 S TWD204998 S TW D204998S
Authority
TW
Taiwan
Prior art keywords
conductive sheet
wafer electroplating
electroplating fixture
views
symmetrical
Prior art date
Application number
TW108304468F
Other languages
Chinese (zh)
Inventor
邱曉明
Original Assignee
邱曉明
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 邱曉明 filed Critical 邱曉明
Priority to TW108304468F priority Critical patent/TWD204998S/en
Publication of TWD204998S publication Critical patent/TWD204998S/en

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Abstract

【物品用途】;本設計物品係用於晶圓電鍍夾具上導通電流之導電片。;【設計說明】;本設計前視圖及後視圖為對稱之視圖,故省略後視圖;左側視圖與右側視圖為對稱之視圖,故省略右側視圖。[Use of article]; This designed article is a conductive piece used to conduct current on the wafer electroplating fixture. ;[Design Description];The front and rear views of this design are symmetrical views, so the rear view is omitted; the left and right views are symmetrical, so the right side view is omitted.

Description

晶圓電鍍夾具之導電片Conductive sheet of wafer electroplating fixture

本設計物品係用於晶圓電鍍夾具上導通電流之導電片。This design item is a conductive sheet used to conduct current on the wafer electroplating fixture.

本設計前視圖及後視圖為對稱之視圖,故省略後視圖;左側視圖與右側視圖為對稱之視圖,故省略右側視圖。The front and rear views of this design are symmetrical views, so the rear view is omitted; the left and right views are symmetrical views, so the right side view is omitted.

TW108304468F 2019-07-26 2019-07-26 Conductive sheet of wafer electroplating fixture TWD204998S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW108304468F TWD204998S (en) 2019-07-26 2019-07-26 Conductive sheet of wafer electroplating fixture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW108304468F TWD204998S (en) 2019-07-26 2019-07-26 Conductive sheet of wafer electroplating fixture

Publications (1)

Publication Number Publication Date
TWD204998S true TWD204998S (en) 2020-06-01

Family

ID=88981565

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108304468F TWD204998S (en) 2019-07-26 2019-07-26 Conductive sheet of wafer electroplating fixture

Country Status (1)

Country Link
TW (1) TWD204998S (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD193397S (en) 2018-03-27 2018-10-11 正崴精密工業股份有限公司 Connector contact

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD193397S (en) 2018-03-27 2018-10-11 正崴精密工業股份有限公司 Connector contact

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