TWD204998S - Conductive sheet of wafer electroplating fixture - Google Patents
Conductive sheet of wafer electroplating fixture Download PDFInfo
- Publication number
- TWD204998S TWD204998S TW108304468F TW108304468F TWD204998S TW D204998 S TWD204998 S TW D204998S TW 108304468 F TW108304468 F TW 108304468F TW 108304468 F TW108304468 F TW 108304468F TW D204998 S TWD204998 S TW D204998S
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive sheet
- wafer electroplating
- electroplating fixture
- views
- symmetrical
- Prior art date
Links
- 238000009713 electroplating Methods 0.000 title abstract description 3
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Abstract
【物品用途】;本設計物品係用於晶圓電鍍夾具上導通電流之導電片。;【設計說明】;本設計前視圖及後視圖為對稱之視圖,故省略後視圖;左側視圖與右側視圖為對稱之視圖,故省略右側視圖。[Use of article]; This designed article is a conductive piece used to conduct current on the wafer electroplating fixture. ;[Design Description];The front and rear views of this design are symmetrical views, so the rear view is omitted; the left and right views are symmetrical, so the right side view is omitted.
Description
本設計物品係用於晶圓電鍍夾具上導通電流之導電片。This design item is a conductive sheet used to conduct current on the wafer electroplating fixture.
本設計前視圖及後視圖為對稱之視圖,故省略後視圖;左側視圖與右側視圖為對稱之視圖,故省略右側視圖。The front and rear views of this design are symmetrical views, so the rear view is omitted; the left and right views are symmetrical views, so the right side view is omitted.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108304468F TWD204998S (en) | 2019-07-26 | 2019-07-26 | Conductive sheet of wafer electroplating fixture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108304468F TWD204998S (en) | 2019-07-26 | 2019-07-26 | Conductive sheet of wafer electroplating fixture |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD204998S true TWD204998S (en) | 2020-06-01 |
Family
ID=88981565
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108304468F TWD204998S (en) | 2019-07-26 | 2019-07-26 | Conductive sheet of wafer electroplating fixture |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWD204998S (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWD193397S (en) | 2018-03-27 | 2018-10-11 | 正崴精密工業股份有限公司 | Connector contact |
-
2019
- 2019-07-26 TW TW108304468F patent/TWD204998S/en unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWD193397S (en) | 2018-03-27 | 2018-10-11 | 正崴精密工業股份有限公司 | Connector contact |
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