TWD204853S - 電子元件保持器 - Google Patents

電子元件保持器 Download PDF

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Publication number
TWD204853S
TWD204853S TW108304432F TW108304432F TWD204853S TW D204853 S TWD204853 S TW D204853S TW 108304432 F TW108304432 F TW 108304432F TW 108304432 F TW108304432 F TW 108304432F TW D204853 S TWD204853 S TW D204853S
Authority
TW
Taiwan
Prior art keywords
holder
electronic devices
item
design
hold electronic
Prior art date
Application number
TW108304432F
Other languages
English (en)
Chinese (zh)
Inventor
藤原直己
徳山秀樹
石橋幹司
渡辺創
高橋和宏
Original Assignee
日商Ｔｏｗａ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｔｏｗａ股份有限公司 filed Critical 日商Ｔｏｗａ股份有限公司
Publication of TWD204853S publication Critical patent/TWD204853S/zh

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TW108304432F 2019-01-25 2019-07-25 電子元件保持器 TWD204853S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
XHDM201814 2019-01-25
WO970010803 2019-01-25

Publications (1)

Publication Number Publication Date
TWD204853S true TWD204853S (zh) 2020-05-21

Family

ID=72047368

Family Applications (2)

Application Number Title Priority Date Filing Date
TW108304432F TWD204853S (zh) 2019-01-25 2019-07-25 電子元件保持器
TW108304440F TWD203976S (zh) 2019-01-25 2019-07-25 電子元件保持器

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW108304440F TWD203976S (zh) 2019-01-25 2019-07-25 電子元件保持器

Country Status (2)

Country Link
JP (2) JP1666045S (2)
TW (2) TWD204853S (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD212158S (zh) 2020-12-02 2021-06-11 日商三社電機製作所股份有限公司 半導體元件

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200730828A (en) 2005-10-05 2007-08-16 Renesas Tech Corp Probe sheet adhesion holder, probe card, semiconductor inspection apparatus, and method for manufacturing semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200730828A (en) 2005-10-05 2007-08-16 Renesas Tech Corp Probe sheet adhesion holder, probe card, semiconductor inspection apparatus, and method for manufacturing semiconductor device
TWI313752B (2) 2005-10-05 2009-08-21 Renesas Tech Corp

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD212158S (zh) 2020-12-02 2021-06-11 日商三社電機製作所股份有限公司 半導體元件

Also Published As

Publication number Publication date
JP1666046S (2) 2020-08-17
TWD203976S (zh) 2020-04-11
JP1666045S (2) 2020-08-17

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