TWD204698S - Wafer processing machine for producing semiconductors - Google Patents

Abstract

[Use of article]: The article designed in this case is a wafer processing machine for semiconductor manufacturing that is used for cutting wafers and forming grooves. This product has two processing sections. The transparent part of the processing section irradiates laser light and processes the wafer placed on the mounting section. The processing part is as shown in the "reference diagram showing the usage status and the names of each part", and each holding part is movable in the up and down and left and right directions. The placement part is movable in the front-to-back direction as shown in the "Reference Picture Showing Use Status and Names of Each Part". ;[Design Description];The two processing departments have the same composition. The dotted line parts revealed in the diagram are the parts for which design is not advocated in this case. What is surrounded by a chain line in the diagram defines the scope of the claim in this case. In "Reference Figure 1 showing the application part" and "Reference Figure 2 showing the application part", the parts colored in red are the parts of the proposed design of this case. ; The solid line part disclosed in the drawing only represents the processing part, and everything other than the processing part is represented by dotted lines. The thin lines shown in "Enlarged perspective view showing the application part and surrounding object", "Enlarged perspective view 1 of the processing part" and "Enlarged perspective view 2 of the processing part" are all lines showing the three-dimensional surface shape. In the "reference picture showing transparent parts and names of each part", the parts with hatched lines are transparent. ;The design of this case is a novel and unique style. By uniquely designing the wafer processing machine for semiconductor manufacturing, it can show visual effects unprecedented in previous technologies.

Description

Wafer processing machine for semiconductor manufacturing

The article designed in this case is a wafer processing machine for semiconductor manufacturing used for wafer cutting and groove formation. This article is equipped with two processing parts, irradiates laser light from the transparent part of the processing part, and processes the wafer placed on the mounting part. The processing section is shown in the "Reference Map for Displaying the Status of Use and the Names of Each Section", and each holding section is movable in the vertical and horizontal directions. The mounting part is movable in the front-rear direction as shown in the "Reference diagram showing the use status and the names of each part".

The structure of the two processing parts is the same. The dotted line exposed in the diagram is the part that does not advocate design in this case. The circle surrounded by a dotted line in the diagram defines the scope claimed in this case. In "Reference Image 1 for Displaying the Application Part" and "Reference Image 2 for Displaying the Application Part", the part colored in red is the design part claimed in this case.

The solid line part disclosed in the drawing only shows the processed part, and all the parts except the processed part are indicated by broken lines. The thin lines shown in "Enlarged perspective view showing the application part and surroundings", "Enlarged perspective view 1 of the processing section" and "Enlarged perspective view 2 of the processing section" are lines representing the shape of the three-dimensional surface. In "Reference map showing the transparent part and the name of each part", the part with diagonal lines is transparent.

The design of this case is a novel and unique style. By uniquely designing the wafer processing machine for semiconductor manufacturing, it can show the visual effects unprecedented in the prior art.

Images