TWD202850S - Circuit board - Google Patents
Circuit board Download PDFInfo
- Publication number
- TWD202850S TWD202850S TW108301968F TW108301968F TWD202850S TW D202850 S TWD202850 S TW D202850S TW 108301968 F TW108301968 F TW 108301968F TW 108301968 F TW108301968 F TW 108301968F TW D202850 S TWD202850 S TW D202850S
- Authority
- TW
- Taiwan
- Prior art keywords
- design
- circuit board
- item
- meandering
- roughly
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract description 2
- 230000000007 visual effect Effects 0.000 abstract description 2
- 238000004804 winding Methods 0.000 description 2
- 230000003796 beauty Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Images
Abstract
【物品用途】;本設計物品,係置於RJ45插頭連接器內部,用來傳輸差分信號。;【設計說明】;本設計之設計特點在於:該電路板大致呈長方形體,其由多層基板組成,並且在該電路板的上下表面暴露出兩條呈蜿蜒型路徑的線路,且一部分蜿蜒型路徑由多個大致呈“n”形的折線構成;在該電路板的兩端上還形成有多排導電貫孔,用來與對應的線路連接。藉此,本設計之電路板整體設計呈現出一種優美、時尚之美感,有別於市面上一般電路板之獨特視覺造形風格。[Use of item]; This design item is placed inside the RJ45 plug connector and is used to transmit differential signals. ;[Design Description];The design features of this design are: the circuit board is roughly rectangular in shape, which is composed of multi-layer substrates, and two meandering paths are exposed on the upper and lower surfaces of the circuit board, and some of them are meandering. The serpentine path is composed of a plurality of roughly "n"-shaped folded lines; multiple rows of conductive through holes are also formed on both ends of the circuit board for connecting to corresponding lines. In this way, the overall design of the circuit board of this design presents a graceful and fashionable aesthetic, which is different from the unique visual styling style of ordinary circuit boards on the market.
Description
本設計物品,係置於RJ45插頭連接器內部,用來傳輸差分信號。 This design item is placed inside the RJ45 plug connector and is used to transmit differential signals.
本設計之設計特點在於:該電路板大致呈長方形體,其由多層基板組成,並且在該電路板的上下表面暴露出兩條呈蜿蜒型路徑的線路,且一部分蜿蜒型路徑由多個大致呈“n”形的折線構成;在該電路板的兩端上還形成有多排導電貫孔,用來與對應的線路連接。藉此,本設計之電路板整體設計呈現出一種優美、時尚之美感,有別於市面上一般電路板之獨特視覺造形風格。 The design feature of this design is that the circuit board is generally rectangular, which is composed of multiple layers of substrates, and two winding paths are exposed on the upper and lower surfaces of the circuit board, and part of the winding path is composed of multiple It is composed of an approximately "n"-shaped fold line; multiple rows of conductive through holes are also formed on both ends of the circuit board for connection with corresponding lines. In this way, the overall design of the circuit board of this design presents a beautiful and fashionable beauty, which is different from the unique visual shaping style of general circuit boards on the market.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201830578236.2 | 2018-10-17 | ||
CN201830578236 | 2018-10-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD202850S true TWD202850S (en) | 2020-02-21 |
Family
ID=71092992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108301968F TWD202850S (en) | 2018-10-17 | 2019-04-08 | Circuit board |
Country Status (2)
Country | Link |
---|---|
US (1) | USD887999S1 (en) |
TW (1) | TWD202850S (en) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD894018S1 (en) | 2017-05-31 | 2020-08-25 | D6 Inc. | Container |
USD920937S1 (en) * | 2019-03-29 | 2021-06-01 | Shindengen Electric Manufacturing Co., Ltd. | Power module device containing semiconductor elements |
USD1012050S1 (en) * | 2019-06-21 | 2024-01-23 | Raspberry Pi (Trading) Limited | Computer |
JP1659716S (en) * | 2019-08-29 | 2020-05-18 | ||
JP1659677S (en) * | 2019-08-29 | 2020-05-18 | ||
JP1659678S (en) | 2019-08-29 | 2020-05-18 | ||
JP1659674S (en) * | 2019-08-29 | 2020-05-18 | ||
JP1659676S (en) | 2019-08-29 | 2020-05-18 | ||
JP1659675S (en) | 2019-08-29 | 2020-05-18 | ||
JP1659673S (en) * | 2019-08-29 | 2020-05-18 | ||
JP1654981S (en) * | 2019-08-30 | 2020-03-16 | ||
USD934820S1 (en) * | 2019-10-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD938925S1 (en) * | 2019-10-24 | 2021-12-21 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD941788S1 (en) * | 2020-03-06 | 2022-01-25 | Norman R. Byrne | Circuit board |
USD909319S1 (en) * | 2020-07-08 | 2021-02-02 | Impact Ip, Llc | Circuit board |
CA202670S (en) * | 2021-04-09 | 2024-05-15 | 9493662 Canada Inc | Microfluidic slab with 4 well arrangements |
CA202671S (en) * | 2021-04-09 | 2024-05-15 | 9493662 Canada Inc | Microfluidic slab with 2 well arrangements |
USD999748S1 (en) * | 2021-12-02 | 2023-09-26 | Ace Technologies Corporation | Printed circuit board |
USD1030688S1 (en) * | 2022-05-31 | 2024-06-11 | Faraidoon Pundole | Circuit board for an electrical connector |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD474773S1 (en) * | 2001-07-10 | 2003-05-20 | Sony Corporation | Information recording element |
USD485536S1 (en) * | 2003-03-10 | 2004-01-20 | Pulse Engineering, Inc. | Electronics component assembly |
US7107944B1 (en) * | 2005-05-05 | 2006-09-19 | Illinois Tool Works, Inc. | Beam system membrane suspension for a motor mount |
US20130286603A1 (en) * | 2012-04-30 | 2013-10-31 | Takashi Okada | Memory card and sd card |
US10299400B2 (en) * | 2013-02-27 | 2019-05-21 | Innovelis, Inc. | Mounting systems for digital media players |
US9513666B2 (en) * | 2014-07-25 | 2016-12-06 | VivaLnk, Inc. | Highly compliant wearable wireless patch having stress-relief capability |
USD826190S1 (en) * | 2017-05-26 | 2018-08-21 | TinyPCB, Inc. | Modular circuit board |
USD826189S1 (en) * | 2017-05-26 | 2018-08-21 | TinyPCB, Inc. | Modular circuit board |
USD826192S1 (en) * | 2017-05-26 | 2018-08-21 | TinyPCB, Inc. | Modular circuit board |
USD832229S1 (en) * | 2017-05-26 | 2018-10-30 | TinyPCB, Inc. | Modular circuit board |
USD834546S1 (en) * | 2017-05-30 | 2018-11-27 | TinyPCB, Inc. | Modular circuit board |
USD830320S1 (en) * | 2017-05-30 | 2018-10-09 | TinyPCB, Inc. | Modular circuit board |
USD830319S1 (en) * | 2017-05-30 | 2018-10-09 | TinyPCB, Inc. | Modular circuit board |
USD833990S1 (en) * | 2017-05-30 | 2018-11-20 | TinyPCB, Inc. | Modular circuit board |
USD841606S1 (en) * | 2017-05-30 | 2019-02-26 | TinyPCB, Inc. | Modular circuit board |
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2019
- 2019-04-08 TW TW108301968F patent/TWD202850S/en unknown
- 2019-04-11 US US29/687,155 patent/USD887999S1/en active Active
Also Published As
Publication number | Publication date |
---|---|
USD887999S1 (en) | 2020-06-23 |
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