TWD181977S - Part of non-contact type data carrier - Google Patents

Part of non-contact type data carrier

Info

Publication number
TWD181977S
TWD181977S TW103305479D01F TW103305479D01F TWD181977S TW D181977 S TWD181977 S TW D181977S TW 103305479D01 F TW103305479D01 F TW 103305479D01F TW 103305479D01 F TW103305479D01 F TW 103305479D01F TW D181977 S TWD181977 S TW D181977S
Authority
TW
Taiwan
Prior art keywords
layer
view
wiring
design
diameter coil
Prior art date
Application number
TW103305479D01F
Other languages
Chinese (zh)
Inventor
Takuto ISHIKAWA
Original Assignee
新力股份有限公司
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新力股份有限公司, Sony Corp filed Critical 新力股份有限公司
Publication of TWD181977S publication Critical patent/TWD181977S/en

Links

Abstract

【物品用途】;如「顯示各部名稱之參考前視圖」所示,本物品係一種於配設有由大徑線圈與小徑線圈等所構成之非接觸通信用之天線的基板搭載有IC晶片而形成之非接觸式資料載具。;【設計說明】;本案為103305479號專利申請案之衍生設計。;如立體圖、前視圖、後視圖、左側視圖、右側視圖、俯視圖、及仰視圖等所示,如是構成整體外觀具新穎性及特異視覺效果之設計。;本設計物品屬於多層基板,如「顯示第一層之配線的參考圖」至「顯示第六層之配線的參考圖」所示般使複數片基板相重疊而構成。各層之基板包含配置有取接近基板的外周緣端部之路徑而成之大徑線圈者、及配置有取比該大徑線圈更內側且更小之路徑而成之小徑線圈者。「顯示第一層之配線的參考圖」至「顯示第六層之配線的參考圖」係顯示從前面側所見之各層的配線,並非表示構成本物品之基板依每一層分離。;「參考前視圖」、「參考後視圖」、「參考左側視圖」、「參考右側視圖」、「參考俯視圖」、「參考仰視圖」、及「顯示第一層之配線的參考圖」至「顯示第六層之配線的參考圖」的各圖式係藉由電腦圖形作成之圖式,「參考後視圖」所示之基板的顏色與「顯示第四層之配線的參考圖」至「顯示第六層之配線的參考圖」所示之基板的顏色之彩度不同,係表示每一層基板之透光性程度與重疊複數片基板之狀態之透光性程度不同。於「顯示透光性程度之參考照片」顯示重疊複數片基板之狀態的透光性程度。參照「後視圖」、「參考後視圖」所示,第五層及第四層之配線除了與上層(相對於第五層之第六層、相對於第四層之第五層及第六層)之配線重疊的部分之外,係穿透上層基板而顯現於表面。穿透背面而顯現之配線亦為欲主張權利者。「顯示第一層之具有透光性之部分的前視圖」至「顯示第六層之具有透光性之部分的前視圖」中施以淺黑色之部分係具有透光性。「參考前視圖」、「參考後視圖」、「參考左側視圖」、「參考右側視圖」、「參考俯視圖」、「參考仰視圖」、及「顯示第一層之配線的參考圖」至「顯示第六層之配線的參考圖」中,黃色之著色部分以外的部分(亦即,顯示有大徑線圈與小徑線圈之大致L字形的配線之後面的右側面側、及第四層至第六層之右側面側的部分)係對應於欲主張設計之部分。;圖式所揭露之實線係界定本案欲主張設計之部分,圖式所揭露之虛線係本案不主張設計之部分。圖式所揭露之一點鏈線係用以界定本案欲主張之部分與不主張設計之部分之分界線,該一點鏈線本身為本案不主張設計之部分。;圖式所揭露之色彩為本案不主張設計之部分。[Use of the article]; As shown in the "reference front view showing the names of each part", this article is a substrate equipped with an antenna for non-contact communication composed of a large-diameter coil and a small-diameter coil, and an IC chip is mounted on it A non-contact data carrier is formed. ;[Design Description];This case is a derivative design of patent application No. 103305479. ;As shown in the three-dimensional view, front view, rear view, left view, right view, top view, and bottom view, etc., this constitutes a design with novelty and unique visual effects in the overall appearance. ;This design item is a multi-layer substrate, and is constructed by overlapping multiple substrates as shown in "Reference drawing showing the wiring of the first layer" to "Reference drawing showing the wiring of the sixth layer". The substrates of each layer include those in which a large-diameter coil is arranged to take a path close to the outer peripheral end of the substrate, and a small-diameter coil in which a small-diameter coil is arranged in a path that is further inside and smaller than the large-diameter coil. "Reference drawing showing the wiring of the first layer" to "Reference drawing showing the wiring of the sixth layer" show the wiring of each layer as seen from the front side, and do not mean that the substrate constituting this article is separated by each layer. ;"Reference front view", "Reference rear view", "Reference left view", "Reference right view", "Reference top view", "Reference bottom view", and "Reference drawing showing the wiring of the first layer" to " The drawings in "Reference Drawing Showing the Wiring on the Sixth Layer" are drawings made by computer graphics. The colors of the substrate shown in "Reference Rear View" and "Reference Drawing Showing the Wiring on the Fourth Layer" to "Display The different saturations of the colors of the substrates shown in the "Reference Picture of the Sixth Layer Wiring" indicate that the degree of light transmittance of each layer of substrate is different from that of the state of stacking multiple substrates. The "reference photo showing the degree of light transmittance" shows the degree of light transmittance in a state where multiple substrates are stacked. Refer to the "Rear View" and "Reference Rear View", the wiring of the fifth and fourth layers are different from those of the upper layer (the sixth layer relative to the fifth layer, the fifth layer and the sixth layer relative to the fourth layer). ), they penetrate the upper substrate and appear on the surface. The wiring that penetrates the back and appears is also for those who want to claim rights. From "Front view showing the translucent part of the first layer" to "Front view showing the translucent part of the sixth layer", the parts colored light black are translucent. "Reference front view", "Reference rear view", "Reference left view", "Reference right view", "Reference top view", "Reference bottom view", and "Reference drawing showing the wiring of the first layer" to "Display In the "Reference Picture of the Sixth Layer Wiring", the parts other than the yellow colored parts (that is, the right side behind the roughly L-shaped wiring showing the large-diameter coil and the small-diameter coil, and the fourth layer to the The part on the right side of the sixth floor) corresponds to the part to be designed. ;The solid lines disclosed in the drawings define the parts of the case where the design is intended to be claimed, and the dotted lines disclosed in the drawings define the parts of the case where the design is not claimed. The dotted chain line disclosed in the drawing is used to define the dividing line between the part to be claimed in this case and the part not claimed for design. The dotted chain line itself is the part of this case that is not claimed to be designed. ;The colors revealed in the drawings are not part of the design of this case.

TW103305479D01F 2014-03-18 2014-09-18 Part of non-contact type data carrier TWD181977S (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2014-5730F JP1548256S (en) 2014-03-18 2014-03-18

Publications (1)

Publication Number Publication Date
TWD181977S true TWD181977S (en) 2017-03-21

Family

ID=55743964

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103305479D01F TWD181977S (en) 2014-03-18 2014-09-18 Part of non-contact type data carrier

Country Status (2)

Country Link
JP (1) JP1548256S (en)
TW (1) TWD181977S (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD776070S1 (en) 2014-03-18 2017-01-10 Sony Corporation Non-contact type data carrier

Also Published As

Publication number Publication date
JP1548256S (en) 2016-04-18

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