TWD166713S - 用於基板托盤的封接件 - Google Patents

用於基板托盤的封接件

Info

Publication number
TWD166713S
TWD166713S TW103303485F TW103303485F TWD166713S TW D166713 S TWD166713 S TW D166713S TW 103303485 F TW103303485 F TW 103303485F TW 103303485 F TW103303485 F TW 103303485F TW D166713 S TWD166713 S TW D166713S
Authority
TW
Taiwan
Prior art keywords
design
substrate tray
item
sealing member
substrate
Prior art date
Application number
TW103303485F
Other languages
English (en)
Chinese (zh)
Inventor
Sang Gon Chung
Hyoung Won Kim
Hwang Sub Koo
Hyun Je Kim
Hee Seok Jung
Original Assignee
吉佳藍科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 吉佳藍科技股份有限公司 filed Critical 吉佳藍科技股份有限公司
Publication of TWD166713S publication Critical patent/TWD166713S/zh

Links

TW103303485F 2014-02-04 2014-06-11 用於基板托盤的封接件 TWD166713S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20140005633 2014-02-04

Publications (1)

Publication Number Publication Date
TWD166713S true TWD166713S (zh) 2015-03-21

Family

ID=53476451

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103303485F TWD166713S (zh) 2014-02-04 2014-06-11 用於基板托盤的封接件

Country Status (2)

Country Link
JP (1) JP1518502S (enrdf_load_stackoverflow)
TW (1) TWD166713S (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD821552S1 (en) 2016-11-29 2018-06-26 Nippon Valqua Industries, Ltd. Composite seal
USD822181S1 (en) 2016-11-29 2018-07-03 Nippon Valqua Industries, Ltd. Composite seal
USD864361S1 (en) 2017-07-21 2019-10-22 Valqua, Ltd. Seal
USD877865S1 (en) 2016-11-29 2020-03-10 Valqua, Ltd. Seal
USD885444S1 (en) 2017-12-19 2020-05-26 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD898171S1 (en) 2017-12-19 2020-10-06 Valqua, Ltd. Seal members for use in semiconductor production apparatuses
USD905761S1 (en) 2018-07-24 2020-12-22 Valqua, Ltd. Seal member for semiconductor production apparatus
USD909323S1 (en) 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD942596S1 (en) 2015-12-24 2022-02-01 Valqua, Ltd. Seal material

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD942596S1 (en) 2015-12-24 2022-02-01 Valqua, Ltd. Seal material
USD822181S1 (en) 2016-11-29 2018-07-03 Nippon Valqua Industries, Ltd. Composite seal
USD877865S1 (en) 2016-11-29 2020-03-10 Valqua, Ltd. Seal
USD821552S1 (en) 2016-11-29 2018-06-26 Nippon Valqua Industries, Ltd. Composite seal
USD864361S1 (en) 2017-07-21 2019-10-22 Valqua, Ltd. Seal
USD922547S1 (en) 2017-12-19 2021-06-15 Valqua, Ltd. Seal members for use in semiconductor production apparatuses
USD885444S1 (en) 2017-12-19 2020-05-26 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD898171S1 (en) 2017-12-19 2020-10-06 Valqua, Ltd. Seal members for use in semiconductor production apparatuses
USD905761S1 (en) 2018-07-24 2020-12-22 Valqua, Ltd. Seal member for semiconductor production apparatus
USD919669S1 (en) 2018-07-24 2021-05-18 Valqua, Ltd. Seal member for semiconductor production apparatus
USD919670S1 (en) 2018-07-24 2021-05-18 Valqua, Ltd. Seal member for semiconductor production apparatus
USD933033S1 (en) 2018-10-12 2021-10-12 Valqua, Ltd. Seal member for semiconductor production apparatus
USD933619S1 (en) 2018-10-12 2021-10-19 Valqua, Ltd. Seal member for semiconductor production apparatus
USD909323S1 (en) 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus

Also Published As

Publication number Publication date
JP1518502S (enrdf_load_stackoverflow) 2015-03-02

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