TWD164556S - LED package - Google Patents
LED packageInfo
- Publication number
- TWD164556S TWD164556S TW103303057F TW103303057F TWD164556S TW D164556 S TWD164556 S TW D164556S TW 103303057 F TW103303057 F TW 103303057F TW 103303057 F TW103303057 F TW 103303057F TW D164556 S TWD164556 S TW D164556S
- Authority
- TW
- Taiwan
- Prior art keywords
- insulating material
- led package
- item
- design
- metal blocks
- Prior art date
Links
- 239000011810 insulating material Substances 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 2
- 239000003292 glue Substances 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
Abstract
【物品用途】;本設計物品,係一種用於照明設備之LED封裝體。;【設計說明】;本設計物品具有一絕緣材、二分別鑲嵌於該絕緣材的金屬塊,以及一結合於該絕緣材與該等金屬塊上方的封裝膠,本設計物品係用於封裝LED芯片(圖未示出)。[Item Usage]; This design item is an LED package for lighting equipment. ; [Design Description]; This design item has an insulating material, two metal blocks respectively embedded in the insulating material, and a packaging glue combined with the insulating material and the metal blocks. This design item is used to package LED chips (not shown).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201430031953 | 2014-02-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD164556S true TWD164556S (en) | 2014-12-01 |
Family
ID=90412900
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103303057F TWD164556S (en) | 2014-02-21 | 2014-05-21 | LED package |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWD164556S (en) |
-
2014
- 2014-05-21 TW TW103303057F patent/TWD164556S/en unknown
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