TWD155115S - 發光二極體封裝 - Google Patents

發光二極體封裝

Info

Publication number
TWD155115S
TWD155115S TW101307818F TW101307818F TWD155115S TW D155115 S TWD155115 S TW D155115S TW 101307818 F TW101307818 F TW 101307818F TW 101307818 F TW101307818 F TW 101307818F TW D155115 S TWD155115 S TW D155115S
Authority
TW
Taiwan
Prior art keywords
metal brackets
creation
carrier body
vehicle body
new patent
Prior art date
Application number
TW101307818F
Other languages
English (en)
Inventor
pei song Cai
Original Assignee
隆達電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 隆達電子股份有限公司 filed Critical 隆達電子股份有限公司
Priority to TW101307818F priority Critical patent/TWD155115S/zh
Priority to US29/456,957 priority patent/USD709042S1/en
Publication of TWD155115S publication Critical patent/TWD155115S/zh

Links

Abstract

【物品用途】;本創作係為一種可應用於一般照明及背光裝置，用於封裝發光二極體並提供光源效果之發光二極體封裝。;【創作特點】;如各附圖所示，本創作之發光二極體封裝包含有概呈矩形的一載具本體以及結合於載具本體下方之兩金屬支架；該載具本體具有上窄下寬且帶有圓弧邊角的梯形上半部，以及厚度較上半部薄的矩形下半部。此外，如立體圖及俯視圖所示，該載具本體頂面上嵌置一圓形窗片，且於一角落上設有一圓形凹槽。;如立體圖2及仰視圖所示，前述的兩金屬支架具有相同輪廓外型，兩金屬支架分別嵌置在該載具本體的底部上下兩側並且被隔開，兩金屬支架的左右兩端分別具有對稱之階級狀形狀設計且兩端緣凸出於該載具本體下半部外側；此外，在兩金屬支架的左右側分別設計有兩個孔且和載具本體底部分別延伸出的底柱相互嵌合。;本創作尚未揭露於申請日前之公開物品，符合新穎性及創作性之新式樣專利要件，爰依法提出新式樣專利申請。
TW101307818F 2012-12-27 2012-12-27 發光二極體封裝 TWD155115S (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW101307818F TWD155115S (zh) 2012-12-27 2012-12-27 發光二極體封裝
US29/456,957 USD709042S1 (en) 2012-12-27 2013-06-05 Light emitting diode package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101307818F TWD155115S (zh) 2012-12-27 2012-12-27 發光二極體封裝

Publications (1)

Publication Number Publication Date
TWD155115S true TWD155115S (zh) 2013-08-01

Family

ID=51136063

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101307818F TWD155115S (zh) 2012-12-27 2012-12-27 發光二極體封裝

Country Status (2)

Country Link
US (1) USD709042S1 (zh)
TW (1) TWD155115S (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD729751S1 (en) * 2012-03-29 2015-05-19 Nichia Corporation Light emitting diode
USD727273S1 (en) 2012-09-27 2015-04-21 Nichia Corporation Light emitting diode
USD728491S1 (en) * 2012-12-12 2015-05-05 Nichia Corporation Light emitting diode
USD731987S1 (en) * 2012-12-28 2015-06-16 Nichia Corporation Light emitting diode
TWD167977S (zh) * 2014-06-27 2015-05-21 隆達電子股份有限公司 發光二極體用導線架
JP1563810S (zh) * 2016-03-24 2016-11-21
TWD193225S (zh) * 2016-06-17 2018-10-01 億光電子工業股份有限公司 發光二極體
USD899384S1 (en) 2019-11-04 2020-10-20 Putco, Inc. Surface-mount device
USD1080931S1 (en) * 2022-06-01 2025-06-24 Ligitek Electronics Co., Ltd. Light emitting diode package
JP1740013S (ja) * 2022-10-19 2023-03-27 半導体発光モジュール

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD517025S1 (en) * 2003-03-17 2006-03-14 Nichia Corporation Light emitting diode
USD505397S1 (en) * 2003-09-15 2005-05-24 Nichia Corporation Light emitting diode
USD573113S1 (en) * 2005-12-09 2008-07-15 Nichia Corporation Light emitting diode
USD568261S1 (en) * 2006-10-12 2008-05-06 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
USD576573S1 (en) * 2007-07-17 2008-09-09 Rohm Co., Ltd. Light emitting diode module
USD633631S1 (en) * 2007-12-14 2011-03-01 Cree Hong Kong Limited Light source of light emitting diode
USD593967S1 (en) * 2008-02-01 2009-06-09 C. I. Kasei Company, Limited Light emitting device
US10431567B2 (en) * 2010-11-03 2019-10-01 Cree, Inc. White ceramic LED package
USD664103S1 (en) * 2009-11-13 2012-07-24 Nichia Corporation Light emitting diode
USD619110S1 (en) * 2009-11-20 2010-07-06 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD624885S1 (en) * 2010-01-27 2010-10-05 Silitek Electronic (Guangzhou) Co., Ltd. LED package structure
USD674361S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
TWD154427S (zh) * 2012-07-12 2013-07-01 隆達電子股份有限公司 發光二極體封裝
USD698742S1 (en) * 2012-09-27 2014-02-04 Kabushiki Kaisha Toshiba Light-emitting diode
USD693780S1 (en) * 2012-09-27 2013-11-19 Lextar Electronics Corporation Light emitting diode package

Also Published As

Publication number Publication date
USD709042S1 (en) 2014-07-15

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