TWD149503S - 多晶發光二極體封裝 - Google Patents

多晶發光二極體封裝

Info

Publication number
TWD149503S
TWD149503S TW100306724F TW100306724F TWD149503S TW D149503 S TWD149503 S TW D149503S TW 100306724 F TW100306724 F TW 100306724F TW 100306724 F TW100306724 F TW 100306724F TW D149503 S TWD149503 S TW D149503S
Authority
TW
Taiwan
Prior art keywords
creation
substrate
electrode pins
heat sink
new design
Prior art date
Application number
TW100306724F
Other languages
English (en)
Original Assignee
隆達電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 隆達電子股份有限公司 filed Critical 隆達電子股份有限公司
Priority to TW100306724F priority Critical patent/TWD149503S/zh
Publication of TWD149503S publication Critical patent/TWD149503S/zh

Links

Abstract

【物品用途】;本創作係關於一種多晶發光二極體封裝，用以作為光源。;【創作特點】;如各圖所示，本創作之多晶發光二極體封裝具有一矩形基板，該基板上設有呈矩陣排列的複數晶片，並且在該基板上設有罩蓋於晶片上方的一個半球狀透明體。;如仰視圖所示，於該基板底面的上端和下端分別設有二塊條狀電極接腳，同時在上、下兩端電極接腳中間的位置上設有一塊概呈矩形的散熱片，該等電極接腳與散熱片分別具有連接至該基板邊緣的延伸腳。;本創作尚未揭露於申請日前之公開物品，符合新穎性及創作性之新式樣專利要件，爰依法提出新式樣專利申請。
TW100306724F 2011-12-09 2011-12-09 多晶發光二極體封裝 TWD149503S (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW100306724F TWD149503S (zh) 2011-12-09 2011-12-09 多晶發光二極體封裝

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100306724F TWD149503S (zh) 2011-12-09 2011-12-09 多晶發光二極體封裝

Publications (1)

Publication Number Publication Date
TWD149503S true TWD149503S (zh) 2012-10-01

Family

ID=91477551

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100306724F TWD149503S (zh) 2011-12-09 2011-12-09 多晶發光二極體封裝

Country Status (1)

Country Link
TW (1) TWD149503S (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1036711S1 (en) 2022-02-17 2024-07-23 Creeled, Inc. Light-emitting diode package
USD1060278S1 (en) 2022-03-09 2025-02-04 Creeled, Inc. Light-emitting diode package
US12355013B2 (en) 2022-04-21 2025-07-08 Creeled, Inc. Emission height arrangements in light-emitting diode packages and related devices and methods

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1036711S1 (en) 2022-02-17 2024-07-23 Creeled, Inc. Light-emitting diode package
USD1060278S1 (en) 2022-03-09 2025-02-04 Creeled, Inc. Light-emitting diode package
US12355013B2 (en) 2022-04-21 2025-07-08 Creeled, Inc. Emission height arrangements in light-emitting diode packages and related devices and methods

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