TWD147245S - A radiator for an electronic device - Google Patents
A radiator for an electronic deviceInfo
- Publication number
- TWD147245S TWD147245S TW100304313F TW100304313F TWD147245S TW D147245 S TWD147245 S TW D147245S TW 100304313 F TW100304313 F TW 100304313F TW 100304313 F TW100304313 F TW 100304313F TW D147245 S TWD147245 S TW D147245S
- Authority
- TW
- Taiwan
- Prior art keywords
- heat sink
- electronic devices
- electronic device
- creation
- fin assembly
- Prior art date
Links
- 238000010586 diagram Methods 0.000 abstract 1
Abstract
【物品用途】;本創作之電子裝置用的散熱器裝設於電子裝置上,此電子裝置如裝設於電腦之主機板上的中央處理單元,電子裝置用的散熱器用於冷卻電子裝置所產生的熱。;【創作特點】;本創作之外觀特點在於電子裝置用的散熱器的形狀及型態的組合。以代表圖及前視圖或後視圖觀之,電子裝置用的散熱器的鰭片組大致呈膠囊狀,且鰭片組的鰭片平行排列,且鰭片組的中央有一個凹入空間,而風扇設置於此凹入空間中。此電子裝置用的散熱器具有獨特且新穎的造形。[Use of the article]; The heat sink for electronic devices of this creation is installed on an electronic device, such as a central processing unit installed on a computer motherboard, and the heat sink for electronic devices is used to cool the heat generated by the electronic device. ; [Features of the creation]; The appearance feature of this creation lies in the shape and type combination of the heat sink for electronic devices. From the representative diagram and the front view or the rear view, the fin assembly of the heat sink for electronic devices is roughly capsule-shaped, and the fins of the fin assembly are arranged in parallel, and there is a concave space in the center of the fin assembly, and the fan is arranged in this concave space. This heat sink for electronic devices has a unique and novel shape.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20110007722 | 2011-02-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD147245S true TWD147245S (en) | 2012-05-21 |
Family
ID=46061681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100304313F TWD147245S (en) | 2011-02-25 | 2011-08-23 | A radiator for an electronic device |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD660256S1 (en) |
| TW (1) | TWD147245S (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1643634S (en) * | 2018-12-28 | 2020-10-12 | ||
| JP1662414S (en) | 2019-09-12 | 2020-06-29 | ||
| USD964605S1 (en) * | 2020-03-25 | 2022-09-20 | Guangzhou Chengguang Electronic Technology Co., Ltd. | Headlight |
| US12207443B2 (en) * | 2022-07-15 | 2025-01-21 | Dell Products L.P. | Low-noise heat exchanger |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW575154U (en) * | 2003-04-23 | 2004-02-01 | Hon Hai Prec Ind Co Ltd | Radiator having heat pipe |
| US7059388B2 (en) * | 2003-12-19 | 2006-06-13 | Kuo Ta Chang | Heat dissipating device |
| CN2727964Y (en) * | 2004-09-17 | 2005-09-21 | 鸿富锦精密工业(深圳)有限公司 | Radiator |
| WO2006109929A1 (en) * | 2005-04-11 | 2006-10-19 | Zalman Tech Co., Ltd. | Apparatus for cooling computer parts and method of manufacturing the same |
| USD541232S1 (en) * | 2005-12-19 | 2007-04-24 | Zalman Tech Co., Ltd. | Radiator for electronic parts |
| TWD116597S1 (en) * | 2006-05-02 | 2007-04-21 | 華信精密股份有限公司 | Heat dissipating assmbly |
| TWD119775S1 (en) * | 2006-12-08 | 2007-11-01 | 曜越科技股份有限公司 | Radiator (VII) |
| USD573109S1 (en) * | 2007-07-10 | 2008-07-15 | Fujikura Ltd. | Heat sink |
| USD604704S1 (en) * | 2008-08-21 | 2009-11-24 | Zalman Tech Co., Ltd. | Radiator for an electronic device |
-
2011
- 2011-08-23 TW TW100304313F patent/TWD147245S/en unknown
- 2011-08-23 US US29/400,049 patent/USD660256S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD660256S1 (en) | 2012-05-22 |
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