TWD100417S1

TWD100417S1 - Photosensitive integrated circuit components

Info

Publication number: TWD100417S1
Application number: TW092304844F
Authority: TW
Inventors: 堀之內昇吾; 大山英樹
Original assignee: 松下電器產業股份有限公司
Priority date: 2003-07-09
Filing date: 2003-08-08
Publication date: 2004-09-21
Also published as: USD510915S1

Abstract

【物品用途】;本創作係有關一種受光積體電路組件之新式樣設計，其主要是用於保持、固定光電轉換的受光部以及構成電流電壓轉換電路的IC晶片的IC組件。;【創作特點】;如第1圖所示，本創作是在一個積體電路的封裝體上下表面的中心部位，各設置一個長矩形的漏斗狀凹槽，該凹槽底即設有一個受光感光元件；從第2圖的A-A即第8圖中可以看出，封裝體上下面皆有凹槽直通到積體電路上，而使得在積體電路上的受光體得以向外擴大，而形成大的開口使其能有效受光；本創作之特徵即在於使一個方正的積體電路封裝體，因為欲增加板狀受光元件的受光面積，故選擇以長矩型漏斗凹槽之設計，來滿足其機能同時增益其美觀與價值感，其在造形上呈現簡潔富科技美感性的獨特造型，確為一理想之優良設計。[Use of the item] This creation is about a new style design of a light-receiving integrated circuit component, which is mainly used to hold and fix the light-receiving part of the photoelectric conversion and the IC chip that constitutes the current-voltage conversion circuit. ;【Features of the creation】;As shown in Figure 1, this creation is to set a long rectangular funnel-shaped groove at the center of the upper and lower surfaces of an integrated circuit package, and a light-receiving photosensitive element is set at the bottom of the groove; it can be seen from A-A in Figure 2, that is, Figure 8, that there are grooves on the upper and lower sides of the package that directly connect to the integrated circuit, so that the photosensitive element on the integrated circuit can expand outward to form a large opening so that it can effectively receive light; the characteristic of this creation is to make a square integrated circuit package, because it is desired to increase the light-receiving area of the plate-shaped photosensitive element, so the design of a long rectangular funnel groove is chosen to meet its function while enhancing its beauty and value. Its shape presents a unique shape that is simple and rich in technological aesthetics, which is indeed an ideal and excellent design.