594984 五、發明說明（l) ----- 釐斤屬之技術41^^ 本發明係有關於為一種影像感測器模組及 法，特別係指一種製造更為便利，可有效降低 者。 先Jl技術 按’一般感測器玎用來感測一訊號，該訊 光訊號，或一聲音訊號，本案之感測器係用來 號或一影像訊號。當接收該光訊號後，可透過 器將光訊號轉變成一電訊號，藉由基板傳遞至 請參閱圖1，為習用之影像感測器封模組才| 圖’其包括有一基板10，基板1〇之上、下表面 形成有訊號輸入端1 8及訊號輸出端2 4，訊號輸 以電連接於一印刷電路板1 9上，一凸緣層1 2係 上，而與基板1 0形成一凹槽1 6 ;—影像感測晶片 基板1 0與凸緣層1 2所形成之凹槽1 6内，其上形 焊墊2 0，複數條導線1 5係電連接影像感測晶片 與基板1 0之訊號輸入端1 8，一透光層2 2係黏著 層1 2上，將影像感測晶片1 4包覆住，即完成光 裝；一鏡座2 6係電連接於印刷電路板1 9上，其 感測器，其設有内螺紋2 8，一鏡筒3 0，設有外 以螺所於鏡座2 6之内螺紋2 8上，其由上而下依 孔3 4、非球面鏡片3 6及紅外線濾光鏡片3 8。 惟，上述影像感測器模組具有如下之缺點 其製造方 生產成本 號可能為一 接收一光訊 5亥影像感測 電路板上。 ^造之示意 11、1 3分別 出端24係用 設於基板1 0 放置於 成有複數個 1 4之焊墊2 0 置放於凸緣 感測器的封 罩住該影像 螺紋3 2，肖 序設有一透 ，即: 594984 五、發明說明（2) 1.該影像感測 上，再行上晶 感測晶片1 4與 便。 2 .透光層2 2在 至影像感測器 光層2 2在製造 質或降低碎裂 便。 3.該影像感測 合，其組件較 有鑑於此 神，而發明出 更為實用者。 發明内容 器在封裝時， 片及打線作業 凸緣層1 2間時 製造或運送過 内，而影響到 時，必須先行 ，如是，造成 器模組必需另 多，使其製造 ，本發明人乃 本發明影像感 係先將凸緣層1 2固定於基板10 ，此時，導線1 5欲打線於影像 ，由於距離小造成製造上之不 程中，其周緣常有雜質易掉落 影像感測器之品質，是以，透 導角處理，使其周緣不致有雜 生產成本之提高及製造上之不 以鏡座2 6作為與鏡筒3 0之結 成本提高。 本於精益求精、創新突破之精 測器模組及其製造方法，使其 本發明之主要目的，在於提供一種影像感測器模組及 其製造方法，其具有簡化零組件之功效，以達到降低生產 成本之目的。 本發明之又一目的，在於提供一種影像感測器模組及 其製造方法，其具有簡化製程之功效，以達到便於生產及 降低生產成本目的。 本發明之另一目的，在於提供一種影像感測器模組， 其具有防止透光層污染及損毀之功效，以達到便於生產之594984 V. Description of the invention (l) ----- Lijin technology 41 ^^ The present invention relates to an image sensor module and method, in particular to a method that is more convenient to manufacture and can effectively reduce . First Jl technology Press ‘general sensor’ to sense a signal, an optical signal, or an audio signal. The sensor in this case is used to signal or an image signal. After receiving the optical signal, the optical signal can be converted into an electrical signal through a device, and transmitted to the substrate via the substrate. Please refer to FIG. 1, which is a conventional image sensor package module. FIG. 'Includes a substrate 10 and a substrate 1 〇The upper and lower surfaces are formed with a signal input terminal 18 and a signal output terminal 24. The signal output is electrically connected to a printed circuit board 19, a flange layer 12 is connected to the substrate 10, and a signal Grooves 16;-In the grooves 16 formed by the image sensing wafer substrate 10 and the flange layer 12, the pads 20 are formed thereon, and a plurality of wires 15 are electrically connected to the image sensing wafer and the substrate. 1 0 signal input terminal 18, a light-transmissive layer 2 2 is an adhesive layer 12, and the image sensing chip 14 is covered to complete the light installation; a lens holder 2 6 is electrically connected to the printed circuit board 19, the sensor is provided with an internal thread 2 8 and a lens barrel 30, and is provided with an internal screw thread 2 8 on the lens holder 26 in an external screw thread, and it depends on the hole from top to bottom 3 4 , Aspherical lens 36 and infrared filter lens 38. However, the above-mentioned image sensor module has the following disadvantages. The manufacturing cost of the image sensor module may be one for receiving a light signal and the image sensor circuit board. ^ Schematic illustrations 11 and 13 are made respectively. The 24 ends are respectively placed on the substrate 1 0 and placed in a plurality of 1 4 pads 2 0. The seal placed on the flange sensor covers the image thread 3 2, Xiao Xu has a penetrating lens, which is: 594984 V. Description of the Invention (2) 1. On the image sensor, the crystal sensor chip 14 and the stool will be mounted. 2. Light-transmitting layer 2 2 to the image sensor Light layer 2 2 is in the process of manufacturing quality or reducing chipping. 3. The components of this image sensing system are more practical in view of this phenomenon. SUMMARY OF THE INVENTION When the device is packaged, the sheet and the wire-working flange layer 12 are manufactured or transported in between, and when it is affected, it must be carried out first. If so, the device module must be additional to make it. The inventor has In the present invention, the flange layer 12 is fixed to the substrate 10 at this time. At this time, the wire 15 is intended to be wired to the image. Due to the short distance, the manufacturing process is not easy. The quality of the device is based on the transmission angle treatment, so that the peripheral edge does not increase the production cost and the manufacturing cost does not increase the cost of the lens holder 26 as the junction with the lens barrel 30. The precision sensor module and its manufacturing method based on excellence, innovation and breakthrough make its main purpose of the present invention to provide an image sensor module and its manufacturing method, which have the effect of simplifying components to reduce The purpose of production costs. Another object of the present invention is to provide an image sensor module and a manufacturing method thereof, which have the effect of simplifying the manufacturing process, so as to achieve the purpose of facilitating production and reducing production costs. Another object of the present invention is to provide an image sensor module, which has the effect of preventing the light transmission layer from being contaminated and damaged, so as to achieve easy production.
第6頁 594984 五、發明說明（3) 目的。 是以，為達上述之目的’本發明之主要特徵在於包括 有；一基板，其設有一上表面及一下表面，該上表面形成 有複數個第一接點，該下表面設有複數個第二接點，用以 電連接至該印刷電路板上；一影像感測晶片，其係設置於 該基板之上表面上；複數條導線’係用以電連接該影像感 測晶片至該基板之上表面之第一接點上；一凸緣層，其為 一框型狀，係設置於該基板之上表面，將該影像感測晶片 環繞住，該凸緣層内緣由上而下形成有内螺紋及一透光 層，使該影像感測晶片可透過該透光層接收光訊號；及一 鏡筒，其中央形成有一透空之容置室，其外緣形成有一外 螺紋，用以螺鎖於該凸緣層之内螺紋上，該容置室由上而 下分別設有一透孔、非球面鏡面。 如是’該凸緣層將透光層夾持固定住，再組裝於基板 上，可達到本發明之功效及目的。 本案得藉由以下圖式及說明，得以更深入之瞭解。 實施方 么 請參閱第圖2 ’為本發明影像感測器模組的第一 = =，，其包括有一基板40、一影像感測晶片M、複數條 V線44、一凸緣層46、一透光層48及一鏡筒5〇，其中： 基板4 0設有一上表面5 2及一下矣而c J 有複數個第一接點5 6，下表面5 4形成有> t上表面5 2形成 58,用以電連接至一印刷電路板=有硬數個第二接點Page 6 594984 V. Description of Invention (3) Purpose. Therefore, in order to achieve the above-mentioned object, the main features of the present invention include: a substrate provided with an upper surface and a lower surface, the upper surface being formed with a plurality of first contacts, and the lower surface being provided with a plurality of first contacts; Two contacts are used to electrically connect to the printed circuit board; an image sensing chip is disposed on the upper surface of the substrate; and a plurality of wires are used to electrically connect the image sensing chip to the substrate. On the first contact on the upper surface; a flange layer, which is a frame shape, is arranged on the upper surface of the substrate, surrounds the image sensing chip, and the inner edge of the flange layer is formed from top to bottom An internal thread and a light-transmitting layer, so that the image sensing chip can receive light signals through the light-transmitting layer; and a lens barrel, a hollow accommodation chamber is formed in the center, and an external thread is formed on the outer edge, for A screw lock is provided on the internal thread of the flange layer, and the accommodation chamber is provided with a through hole and an aspherical mirror surface from top to bottom, respectively. If it is, the flange layer clamps and fixes the light-transmitting layer, and then assembles it on the substrate, the effect and purpose of the present invention can be achieved. This case can be understood more deeply by the following drawings and descriptions. Please refer to FIG. 2 for the implementation method. FIG. 2 is the first image sensor module of the present invention, which includes a substrate 40, an image sensor chip M, a plurality of V lines 44, a flange layer 46, A light-transmitting layer 48 and a lens barrel 50, wherein: the substrate 40 is provided with an upper surface 5 2 and a lower surface, and c J has a plurality of first contacts 5 6, and the lower surface 5 4 is formed with a> t upper surface 5 2 forms 58 for electrical connection to a printed circuit board = there are several second contacts
第7頁 5949^4 說明⑷ 影像感測晶片4 2係藉由黏膠6 2黏著設置於基板4 Ο之上 表面52上。 複數條導線4 4係用以電連接影像感測晶片4 2至基板4 0 之上表面5 2之第一接點5 6上，用以將影像感測晶片4 2之訊 夢傳遞至基板4 0上。 凸緣層4 6為一框型狀，係設置於基板4 〇之上表面5 2 上，將影像感測晶片4 2環繞住，凸緣層4 6内緣由上而下形 成有内螺紋6 4及於内螺紋6 4下方將透光層4 8固定，使影像 感測晶片4 2可透過透光層4 8接收光訊號。 在本實施例中，凸緣層4 6係以工業塑膠材料射出成 型，並形成内螺紋6 4及同時將透光層4 8固定住，而透光層 4 8為透光玻璃。 鏡筒5 0中央形成有一透空之容置室66，其外緣形成有 一外螺紋6 8，用以螺鎖於凸緣層4 6之内螺紋6 4上，容置室 6 6由上而下分別設有一透孔7 〇、非球面鏡面7 2及紅外線渡 光鏡片74。 " 請配合參閱圖3，為本發明影像感測器模組之製造方 法之第一示意圖，其包括下列步驟： 提供一基板40，其設有一上表面5 2及一下表面54，上 表面5 2設有複數個第一接點5 6，下表面設有複數個第二接 點5 8 ; 提供一影像感測晶片4 2，其係設置於基板4 0之上表面 5 2上； 提供複數條導線4 4，係用以電連接影像感測晶片4 2至Page 7 5949 ^ 4 Description ⑷ The image sensor chip 4 2 is adhered to the surface 52 on the substrate 4 0 by an adhesive 62. The plurality of wires 4 4 are used to electrically connect the image sensing chip 4 2 to the first contact 5 6 on the upper surface 5 2 of the substrate 4 0 to transmit the dream of the image sensing chip 4 2 to the substrate 4 0 on. The flange layer 4 6 is a frame shape, and is arranged on the upper surface 5 2 of the substrate 4. The image sensor wafer 4 2 is surrounded. The inner edge of the flange layer 4 6 is formed with internal threads 6 4 from top to bottom. And the light transmitting layer 4 8 is fixed under the internal thread 64, so that the image sensing chip 4 2 can receive the light signal through the light transmitting layer 4 8. In this embodiment, the flange layer 46 is formed by injection of an industrial plastic material and forms an internal thread 64 and fixes the light-transmitting layer 48 at the same time. The light-transmitting layer 48 is a light-transmitting glass. A hollow accommodating chamber 66 is formed in the center of the lens barrel 50, and an external thread 6 8 is formed on the outer edge thereof for screwing to the internal thread 6 4 of the flange layer 4 6, and the accommodating chamber 66 is from top to bottom. A through hole 70, an aspherical mirror surface 72, and an infrared crossing lens 74 are respectively provided below. " Please refer to FIG. 3 for a first schematic diagram of a method for manufacturing an image sensor module according to the present invention, which includes the following steps: A substrate 40 is provided, which is provided with an upper surface 5 2 and a lower surface 54 and an upper surface 5 2 is provided with a plurality of first contacts 5 6 and a plurality of second contacts 5 8 is provided on the lower surface; an image sensing chip 4 2 is provided, which is arranged on the upper surface 5 2 of the substrate 40; 4 wires for electrically connecting the image sensing chip 4 2 to
594984 五、發明說明（5) 基板4 0之上表面5 2之第一接點5 6上； 請配合參閱圖4，提供一凸緣層46，其為一框型狀， 係設置於基板4 0之上表面5 2上’將影像感測晶片4 2環繞 住，凸緣層4 6内緣由上而下形成有内螺紋6 4及一透光層 48 ’使影像感測晶片42可透過透光層48接收光訊號；在本 實施例中，凸緣層46係以工業塑膠材料射出成型，並形成 内螺紋64及同時將透光層48固定住，而透光層^ 光玻 璃；及 明配口參閱圖2’提供一鏡筒 空之容置室66,其外緣形 认挪 緣層46之内螺紋64上，容一外螺紋68,用以螺鎖於凸 70、非球面鏡面72及紅外績=66由上而下分別設有一透孔 如是，本發明具有如^光鏡片74。 巧斯下之優駄· 1 ·透光層4 8周緣係失設於 ” 經過導角製程，可減簡化層46上’因& ’其周緣不必 2.透光層48之周緣不致破降低=產成本。 質。 ^或 >可染，可有效提高產品之品 3 ·凸緣層4 6係於影像咸、、目,丨曰 固定於基板40上，如是，:片42打線於基板4〇上後，再行 4.在凸緣層46上形成内螺=於打線作#之進行。 罟，如吾，宵访小+ ’、、、、文64，可取代習知之鏡座之設 置，如疋，可減少零组 低生產成本。 、、牛，不但可簡化製程，且可有效降 在較佳實施例之詳細的 了易於說明本發明之技術^ =中所提出之具體實施例僅為 内各’並非將本發明狹義地限制594984 V. Description of the invention (5) On the first contact 5 6 of the upper surface 5 2 of the substrate 40; please refer to FIG. 4 to provide a flange layer 46 which is a frame shape and is provided on the substrate 4 0 上 表面 5 2 上 'encloses the image sensing chip 4 2 and the inner edge of the flange layer 4 6 is formed with internal threads 64 and a light-transmitting layer 48' from top to bottom to allow the image sensing chip 42 to pass through. The light layer 48 receives a light signal. In this embodiment, the flange layer 46 is injection molded from industrial plastic material, and forms an internal thread 64 and fixes the light transmitting layer 48 at the same time, and the light transmitting layer ^ light glass; and The matching port is shown in FIG. 2 ′. An empty accommodation chamber 66 is provided for the lens barrel. The outer edge is shaped on the internal thread 64 of the edge layer 46 and accommodates an external thread 68 for screwing on the convex 70 and the aspherical mirror 72. And infrared performance = 66 are provided with a through hole from top to bottom. If so, the present invention has a light lens 74. The advantages of Qiaosi · 1 · The peripheral edge of the light-transmitting layer 4 is not set at the edge of the light-transmissive layer. After the lead angle process, the simplification of the layer 46 can be reduced. = Production cost. Quality. ^ Or > Can be dyed, which can effectively improve product quality 3 · Flange layer 4 6 is fixed on the substrate 40, if it is fixed on the substrate 40, if so, the sheet 42 is wired on the substrate After 40, go on. 4. On the flange layer 46, the formation of the inner screw = 于 打 线 作 # is performed. 罟, such as Wu, Xiao Xiao Xiao + ',,,, Wen 64, can replace the conventional mirror seat The setting, such as 疋, can reduce the zero group and low production costs. Not only can simplify the process, but also can effectively reduce the details of the preferred embodiment. It is easy to explain the technology of the present invention. Merely internal 'does not limit the invention narrowly
594984 五、發明說明（6) 於實施例，凡依本發明之精神及以下申請專利範圍之情況 所作種種變化實施均屬本發明之範圍。 594984 圖式簡單說明 圖1為習知影像感測器模組之示意圖。 圖2為本發明影像感測器模組之剖視圖。 圖3為本發明影像感測器模組及其製造方法之第一示意 圖。 圖4為本發明影像感測器模組及其製造方法之第二示意 圖。 本發明之圖號 基 板 40 影 像 感 測 晶少 ί 42 複 數 條 導 線 44 凸 緣 層 46 透 光 層 48 鏡 筒 50 上 表 面 52 下 表 面 54 第 一 接 點 56 第 二 接點 58 印 刷 電 路 板 60 黏 膠 62 内 螺 紋 64 容 置 室 66 外 螺 紋 68 透 孔 70 非 球 面 鏡 面 72 紅 外 線 濾 光 鏡片74594984 V. Description of the invention (6) In the embodiments, all the changes and implementations according to the spirit of the present invention and the scope of the following patent applications are within the scope of the present invention. 594984 Brief description of drawings Figure 1 is a schematic diagram of a conventional image sensor module. FIG. 2 is a cross-sectional view of an image sensor module of the present invention. FIG. 3 is a first schematic diagram of an image sensor module and a manufacturing method thereof according to the present invention. FIG. 4 is a second schematic diagram of an image sensor module and a manufacturing method thereof according to the present invention. The drawing number substrate 40 of the present invention 40 image sensing crystals 42 multiple wires 44 flange layer 46 light transmitting layer 48 lens barrel 50 upper surface 52 lower surface 54 first contact 56 second contact 58 printed circuit board 60 Glue 62 internal thread 64 accommodating chamber 66 external thread 68 through hole 70 aspherical mirror 72 infrared filter lens 74
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