TW593694B - Method for producing porous metal with fine porous texture - Google Patents

Method for producing porous metal with fine porous texture Download PDF

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TW593694B
TW593694B TW91117617A TW91117617A TW593694B TW 593694 B TW593694 B TW 593694B TW 91117617 A TW91117617 A TW 91117617A TW 91117617 A TW91117617 A TW 91117617A TW 593694 B TW593694 B TW 593694B
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metal
item
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TW91117617A
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Shang-Wen Kang
Shau-Chian Tzeng
Shin-Chau Tzeng
De-Yu Yuan
Jing-Man Li
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Shau-Chian Tzeng
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Abstract

A method for producing a porous metal with a fine porous texture comprises: selecting a pure metal or an alloy powder as a base material for sintering or selecting a pure metal or an alloy material as a base material for casting; selecting a water soluble or alkaline solvent-soluble fine powder as a filler; using a sintering polymerization process in combination with a blending or powder metallurgical process, or using a high or low frequency smelting process to perform a smelting polymerization process for uniformly distributing the base material for sintering or casting in the densely stacked filler in order to obtain a prototype metal blank; using a specified solvent to remove the filler in the obtained metal blank for forming a porous metal semi-product with a fine porous texture formed of the base material for sintering or casting; and subjecting the semi-product to cleaning, drying and reducing treatments to produce a porous metal product with a fine porous texture.

Description

593694 五、發明說明(1) 〔發明之應用〕 本發明之微細通孔組織的多孔 -種可以製作出微米級(約2 5 0〜0 分佈的多孔金屬技術,係能有效掌 率,且製作簡易成本低廉,可供作 池的電極、散熱、抗磁波、抗震及 :背景說明〕 坊間所謂的多孔金屬(P 〇 r 〇 u s M e t a 1 )或發泡金屬(F 〇 般是指内部結構殘留空孔的分佈率大於 由相連通的通孔以及無 有效掌控通孔或獨立孔 佈率。 分佈係 並無法 勻的分 法有: 粉末施 金屬粉 下不斷 -am Metal) 1 0%之燒結金屬,且空孔之 法連通的獨立孔雜亂組成, 的形狀、孔徑及其單獨或均 坊間製作多孔金屬的方 1,將各種金屬或合金的 2 .用金屬纖維取代上述 3 .利用金屬在變態點上 脹縮現象的多孔質鑄鐵法。 4。發泡(海棉或多孔)鋁 的方法。 5 .海棉鐵或海棉鈦之類 金屬製法,特別是提供 Ιβ ) 之通孔組織緻密 握相通微細通孔的分佈 為催化器、過濾器、電 吸音用途的材料使用。 予燒結之粉末冶金法。 末的纖維燒結法。 重複加溫及冷卻,造成 之類在炫融金屬中添加發泡劑 係把金屬化合物還原的方法 但目前的多孔金屬材料,大都是以粉末冶金法燒結而 成的為主。且知,粉末冶金法是把金屬粉末加粘結劑,經 充分攪拌後充填於模具中,預先經擠(衝)壓製作毛胚雛593694 V. Description of the invention (1) [Application of the invention] The porous through-hole microstructure of the present invention can be made into a micron-sized (approximately 2 50 ~ 0 distribution of porous metal technology, which is effective and can be produced. Simple and low cost, can be used as a cell electrode, heat dissipation, anti-magnetic wave, anti-vibration and background description] The so-called porous metal (P 〇r 〇us M eta 1) or foamed metal (F 〇 generally refers to the internal structure residue The distribution ratio of the voids is greater than that of interconnected vias and without effective control of the distribution rate of the vias or independent holes. The distribution methods that cannot be uniformed are: Powder applied metal powder continuously -am Metal) 10% of sintered metal , And the pores are connected by independent holes. The shape, pore size, and the shape of the porous metal alone or between the square are made of various metals or alloys. 2. Use metal fibers to replace the above. 3. Use metals at abnormal points Porous cast iron method based on expansion and contraction. 4. Method for foaming (sponge or porous) aluminum. 5. Method for making metal such as sponge iron or sponge titanium, especially to provide Ⅰβ) through-hole tissues tightly connected. micro- Distribution of fine through holes Used as materials for catalytic converters, filters, and electric sound absorption. Pre-sintered powder metallurgy. Fiber sintering method. Repeated heating and cooling, such as adding a foaming agent to the dazzling molten metal, is a method of reducing metal compounds. However, most of the current porous metal materials are mainly sintered by powder metallurgy. It is also known that the powder metallurgy method is to add metal powder to a binder, stir it and fill it into a mold, and then extrude (punch) and press to make the embryo.

593694 五、發明說明(2) 型,並經加溫燒結而成。在燒結過程中,毛胚中藉由粘結 Μ 2 2聚合的金屬粉末9會由原先鬆散狀態〔如圖一 .(a 所示〕,隨著加溫作用而使部份金屬粉末9開始相聚結 〔如圖一 (b) 所示〕,然後相聚結的金屬粉末9數量逐 漸增加〔如圖一 (c) 所示〕,以至於在燒結完成時,能 使起因於加熱而產生燒縮的金屬粉末9聚結成密實狀〔如 圖 d)所示 在上述粉 形成點接觸狀 如圖二(a) 各接觸點9 1 、(b)所示〕 加大時(即金 9 2 d體積逐 增南金屬粉末 因此,坊 互燒縮聚結進 品的空孔分佈 另外,由 易因金屬粉末 、粉末形狀及 ,致使成型時 不佳等問題。 )顯示出鐵粉 末冶金的燒縮過程中,金屬粉末9 a間是先 態,使各接觸點9 1 a之間形成為空孔9 2 £ 所示〕,並跟隨著燒結溫度的升高,而使 a逐漸延展成接觸面的頸部9 1 b形態〔如圖 。且當頸部9 1 b、9 1 c、9 1 d面積逐漸 屬粉末漸密實),將使空孔9 2 b、9 2 c、 漸縮小〔如圖二(b)至(d)所示〕,藉以 間的密著性,但卻使空孔分佈率更為匱乏。 間運用的粉末冶金法,雖可使金屬粉末間相 而增高密著性,但卻不利於提升多孔金屬製 率〇 於金屬粉末加粘結劑在加壓的成型過程中, 之流動性(成型性)、粒徑大小、成型形狀 與成型模具間之摩擦力大小不一…等等因素 造成應力、應變分佈不均及成品品質緻密度 I a) — ( d _ 舉如以金屬鐵粉作說明,如圖 在不同壓力下成形為圓筒狀形體的密度分佈593694 V. Description of the invention (2), and it is made by heating and sintering. During the sintering process, the metal powder 9 polymerized by bonding M 2 2 in the hair embryo will be in the original loose state (as shown in Fig. 1 (a)), and some metal powder 9 will begin to aggregate with the heating effect. (As shown in Fig. 1 (b)), and then the amount of the agglomerated metal powder 9 is gradually increased [as shown in Fig. 1 (c)], so that when the sintering is completed, the The metal powder 9 is agglomerated into a dense shape (as shown in Figure d). When the above powder forms a point contact shape, as shown in (a) of each contact point 9 1 and (b). Therefore, the distribution of pores in the products produced by the mutual firing and condensing of the south metal powder is also caused by the susceptibility to the metal powder, the shape of the powder, and the poor molding process.) It shows that the metal powder is in the process of shrinking iron powder metallurgy. 9 a is the antecedent, so that the contact points 9 1 a are formed as voids 9 2 £], and follow the increase in sintering temperature, so that a gradually extends to the neck of the contact surface 9 1 b Morphology [as shown. And when the area of the neck 9 1 b, 9 1 c, 9 1 d is gradually powder compaction), the hollow holes 9 2 b, 9 2 c, will gradually shrink (as shown in Figures 2 (b) to (d) ], Which makes the distribution of pores more scarce. Although the powder metallurgy method is used, it can increase the interphase of the metal powder and increase the adhesion, but it is not conducive to improving the yield of the porous metal. It is the fluidity (molding ), Particle size, friction between the forming shape and the forming mold, etc. factors such as stress, uneven strain distribution and density of finished product quality I a) — (d _ For example, the use of metal iron powder as an example , As shown in the density distribution of a cylindrical body under different pressures

第6頁 593694 五、發明說明(3) t況(實驗測定,g / c m3 )極不均勻。另如圖四顯示出 鐵粉在壓胚内密度分佈不均情形。再如圖五(a) — ( c) 所示,係以壓製壓力 7 t / cm 2作用壓胚内鐵粉所顯示之壓 力分佈狀態,其中圖五(a) 之壓胚高度Η與徑向距離D的 比值為H/D=0.42,圖五(b) 壓胚之H/D = 0.79,圖五(c 之壓胚之Η/D二1.66,因此由圖五(a) — ( c)可知鐵粉 在壓胚内之壓力分佈極為不均勻。 再者,金屬粉末之顆粒形狀,係依製法的不同而有球 形、多角形、板片形、水滴形…等等差異。一般金屬粉末 要在多孔金屬上取得較佳的成形性、透氣性及空孔分佈率 係採用氣冷式喷霧法製成的球狀粒子。且知,球狀粒子 的充填法在幾何學上有立方、斜方、體心、正方及細密六 方等。依實驗得知以立方堆積方式充填金屬粉末時形成之 空孔徑(或氣孔徑)為金屬粉末粒徑的4 1. 4% ,空孔徑之 形成與大小,如圖六之(a)及(b)所示有二種代表性形 式存在,其中: _ 圖六之(a)中揭示出 Di=D〇(2 // 3 -1) = 0.156D〇 圖六之(b)中揭示出 D2 = DQ(,2 -1) = 0.414D0 D 1及D 2 :表示金屬粉末粒子間的空孔徑。 D。:表示金屬粉末粒子的粒徑。 由此可知,理論上金屬粉末粒子間的空孔徑D或D2為 金屬粉末粒徑D 〇的1 5 . 6%〜4 1. 4% ,實際上為1 6〜2 0% 。 因為金屬粉末顆粒之大小,非單一粒徑組成,而且當金屬 粉末受到氧化性及吸濕性的作用後,會在擠壓過程中產生Page 6 593694 V. Description of the invention (3) The t-state (experimental determination, g / c m3) is extremely uneven. The other figure 4 shows the uneven density distribution of iron powder in the embryo. As shown in Fig. 5 (a)-(c), the pressure distribution state of iron powder in the pressed embryo under the pressing pressure of 7 t / cm 2 is shown. The ratio of the distance D is H / D = 0.42, Fig. 5 (b) H / D of the pressed embryo = 0.79, Fig. 5 (c of the pressed embryo / D = 1.66, so from Fig. 5 (a) — (c) It can be seen that the pressure distribution of iron powder in the pressed embryo is extremely uneven. In addition, the particle shape of the metal powder varies according to the manufacturing method, such as spherical, polygonal, plate-shaped, water-drop-shaped, etc. Generally, the metal powder requires Obtaining better formability, air permeability and porosity distribution on porous metal are spherical particles made by air-cooled spraying method. It is known that the filling method of spherical particles is cubic, oblique in geometry. Square, body-centered, square, fine hexagon, etc. According to experiments, it is known that the empty pore size (or pore size) formed when the metal powder is filled by cubic accumulation is 4 1.4% of the particle size of the metal powder, and the formation and size of the empty pore size As shown in Figure 6 (a) and (b), there are two representative forms, of which: _ Figure 6 (a) reveals Di = D〇 (2 // 3 -1) = 0.156D〇 Figure 6 (b) reveals D2 = DQ (, 2 -1) = 0.414D0 D 1 and D 2: indicates the pore diameter between metal powder particles D .: indicates the particle diameter of the metal powder particles. It can be seen that theoretically, the pore diameter D or D2 between the metal powder particles is 15.6% to 41.4% of the particle diameter D0 of the metal powder. Actually, 16 ~ 20%. Because of the size of the metal powder particles, not a single particle size composition, and when the metal powder is subjected to oxidative and hygroscopic effects, it will be produced during the extrusion process.

第7頁 593694 五、發明說明(4) 應力及應變分佈不均的現象,是造成變形及破裂的原因。 因此,透過最大粒徑以或然率估算取得該空孔徑是球狀金 屬粉末粒徑的1 8% 。由上可知,坊間應用粉末冶金法將金 屬粉末燒結成多孔金屬的空孔分佈率僅在5 0%以下,但燒 結金屬纖維時則可能達到9 0%以上。通常欲增加空孔分佈 率可摻金屬纖維、架橋介質或發泡劑作為充填物,然後用 加熱燒除。但空孔徑及空孔分佈率還是極難管控。同時, 在採用燒除架橋(撐)介質作為充填物時,會產生有毒氣體 及氧化現象,進而產生黑煙(碳化物)沉積在空孔中,因不 易清除,故造成多孔金屬材料成品在應用上的困擾,若應 用作為催化器、過濾器或電池的電極…等等用途的材料使 用時,將嚴重影響功能品質甚鉅。 是以,多孔金屬是由粉末顆粒、纖維或(及)其他基 本結構物之間構成之空孔,大部分呈現不規則的空孔形狀 與分佈,且存在有不相連通的獨立孔(盲孔)分佈於相連的 通孔間,因此空孔的分佈率極為不均且不良。 除此之外,坊間另公諸有一可有效取得孔形、孔徑及 其組織結構緻密度的海棉金屬(S ρ ο n g y M e t a 1 )製造技術, 該技術包括揭露於本國專利公告第4 3 4 3 2 3號可製得獨立孔 組織的海棉狀金屬製造技術,以及本國專利公告第4 9 1 9 0 3 號可製得通孔組織的海棉狀金屬製造技術。且知,該兩款 先前技術是選用所需大小、形狀與粒徑的有機胚料作為充 填物,並進行沾漿(耐火泥漿)與積層(堆疊)的製模作 業,來取得獨立孔或通孔的孔形及孔徑組織密度。惟當選Page 7 593694 V. Description of the invention (4) The uneven distribution of stress and strain is the cause of deformation and cracking. Therefore, the pore diameter obtained by the probability estimation based on the maximum particle diameter is 18% of the particle diameter of the spherical metal powder. It can be known from the above that the powder metallurgy method is used to sinter metal powders into porous metals with a porosity distribution rate of less than 50%, but it may reach more than 90% when the metal fibers are sintered. Generally, if you want to increase the pore distribution, you can add metal fiber, bridging medium or foaming agent as a filler, and then burn it with heat. However, the pore size and pore distribution rate are still extremely difficult to control. At the same time, when the bridging (branching) medium is used as the filling material, toxic gases and oxidation phenomena will be generated, and then black smoke (carbide) will be deposited in the pores, which is not easy to remove, so the finished porous metal material is used in the application If it is used as a catalyst, filter or battery electrode, etc., it will seriously affect the functional quality. Therefore, porous metals are pores formed between powder particles, fibers, and / or other basic structures. Most of them have irregular pore shapes and distribution, and there are independent pores (blind pores) that are not connected. ) Are distributed between connected vias, so the distribution of voids is extremely uneven and poor. In addition, a sponge metal (S ρ ο ngy M eta 1) manufacturing technology that can effectively obtain the density of the hole shape, pore size, and its structure is disclosed. This technology includes the technology disclosed in the National Patent Bulletin No. 4 3 No. 4 3 2 No. 3 sponge-like metal manufacturing technology capable of obtaining independent hole structure, and National Patent Bulletin No. 4 9 1 9 0 3 capable of manufacturing sponge-like metal manufacturing technology without hole structure. It is also known that the two previous technologies use organic blanks of the required size, shape and particle size as the filling material, and carry out the molding operations of dipping (refractory mud) and stacking (stacking) to obtain independent holes or holes Pore shape and pore tissue density. Only elected

593694 五、發明說明(5) 用的有機胚料粒徑過小(如微米級),在其沾漿及積層的 製模作業時,將使粒徑過小的有機胚料,在沾附黏漿後難 於掌控其積層製模時的組織密度,故不利於被應用在大量 生產微細通孔或獨立孔組織的作業上。 因此如果能夠穩健且有效的掌握微細通孔或獨立孔的 空孔徑與分佈率特性,即可以巧妙地應用在一些諸如催化 器用、過濾器用、電池電極用、散熱用、抗磁波用、抗震 用或吸音用的材料上,將可大幅提升其使用效益,但坊間 截至目前為此,仍欠缺製造微細通孔或獨立孔組織的多孔 金屬技術。此困擾正是本發明之研創動機所在。 〔發明之簡要說明〕 本發明主要係提供製造具有微細通孔組織的多孔金屬 技術,包括改善傳統粉末冶金法製造多孔金屬的技術。 本發明也包括提供另一種熔煉法,亦能製造具有微細 通孔組織的多孔金屬。 在實施上述二種方法前,本發明必須先進行配料作業 ,包括選用一種純金屬或合金粉末作為執行粉末冶金法所 需的燒結用基料,本發明亦可選用另一種純金屬或合金材 料作為執行煉法所需的炫鑄用基料,除此之外,本發明必 須同時選用一種可溶於水或鹼性溶劑的微細粉末作為執行 粉末冶金法或熔煉法中所需的充填物。在選擇上述配料時 ,粉末的形狀及粒子大小,應選擇安息角愈小者愈好,因 為安息角愈小的粉末流動性愈佳,且粉末與粉末間的摩擦 力也愈小;同時該充填物的熔點必須高於燒結用基料及熔593694 V. Description of the invention (5) The particle size of the organic blank used is too small (such as micron level). When it is used in the molding and laminating molding operations, the organic blank with a too small particle size will be adhered to the slurry. It is difficult to control the tissue density of the laminated mold, so it is not suitable for the application of mass production of fine through-hole or independent hole organization. Therefore, if the pore diameter and distribution rate characteristics of micro through holes or independent holes can be grasped robustly and effectively, it can be skillfully applied to some applications such as catalysts, filters, battery electrodes, heat dissipation, anti-magnetic waves, anti-vibration or The materials used for sound absorption will greatly improve its use efficiency, but so far, there is still a lack of porous metal technology for manufacturing fine through holes or independent pore structures. This dilemma is exactly the motivation of the invention. [Brief Description of the Invention] The present invention mainly provides a technique for manufacturing a porous metal having a fine through-hole structure, including a technique for improving a porous metal by a conventional powder metallurgy method. The present invention also includes providing another smelting method which can also produce porous metals having a fine through-hole structure. Before implementing the above two methods, the present invention must first perform batching operations, including selecting a pure metal or alloy powder as the base material for sintering required for performing powder metallurgy. The present invention can also use another pure metal or alloy material as the base material. In addition to the base material for flash casting required to perform the smelting method, the present invention must simultaneously select a fine powder soluble in water or an alkaline solvent as a filler required for performing the powder metallurgy method or smelting method. When selecting the above ingredients, the shape and particle size of the powder should be selected as the smaller the repose angle, the smaller the repose angle is, the better the fluidity of the powder is, and the smaller the friction between the powder and the powder is; The melting point must be higher than the sintering base and melting point

第9頁 593694 五、發明說明(6) 鑄用基料,且必須依所需製成的通孔徑與製 擇最為適當的充填物。 為了有效執行粉末冶金技術,本發明上 與充填物必須進行燒結聚合製程,包括必須 增塑劑混拌均勻,讓燒結用基料均勻填塞在 為所動的充填物堆疊空隙間緻密聚合,並以 Cold Isostatic Pressure)成型或熱均壓 -ostatic Pressure) 的粉末燒結方式,製 且已具雛型的金屬胚件。且燒結時的溫度, 料之主成份純金屬或合金粉末溶點的1 / 2以 點以下的範圍内,但若燒結用基料為選用合 燒結溫度會較純純金屬或合金粉末低。在適 末冶金法係適合用來製作5 0 0 g (克)以下較 型k複雜之高熔點金屬或合金的胚件使用。 在上述引用粉末冶金法進行燒結時,為 金屬或合金胚件受到氧化影響,通常可依所 的純金屬或合金之活化性能,而在還原性氣 ,以維持燒成胚件的品質。 另,為了有效執行熔煉技術,本發明上 與充填物必須進行熔煉聚合製程,此製程並 南週波爐或另 低週波爐的區別。該南週波 溶點金屬或合金的炼煉爐。該低週波爐適合 屬或合金作的熔煉爐。該充填物的熔點溫度 鑄用基料的熔點r並藉助高或低週波爐内均 程效益而去選 述燒結 添加黏 熔點較 冷均壓 (HIP, 成緻密 係在燒 上至充 金粉末 用領域 輕、較 了防止 選燒結 體中進 用基料 結劑與 南且不 (CIP, Hot Is 度較好 結用基 填物熔 時,其 上,粉 小且造 製成的 用基料 行燒結 述熔鑄用基料 晝分出使用一 爐適合作為南 作為低熔點金 皆必須高於熔 能產生磁力循 _Page 9 593694 V. Description of the invention (6) The base material for casting must be made according to the required aperture and the most appropriate filler. In order to effectively implement powder metallurgy technology, the present invention must be subjected to a sintering polymerization process with the filler, including the need to mix the plasticizer uniformly, so that the sintering base is uniformly packed in the densely polymerized space between the stacked stacks of the moving filler, and Cold Isostatic Pressure) or sintering powder-ostatic pressure) method. And the temperature during sintering is within the range of 1/2 of the melting point of the main component of pure metal or alloy powder, but if the base material for sintering is selected, the sintering temperature will be lower than that of pure pure metal or alloy powder. In the appropriate metallurgical system, it is suitable for making embryos of complex high-melting metals or alloys of less than 500 g (grams). In the above-mentioned sintering by powder metallurgy, the metal or alloy preform is affected by oxidation. Generally, the reducing gas can be used to maintain the quality of the fired preform according to the activation performance of the pure metal or alloy. In addition, in order to effectively execute the melting technology, the present invention and the filler must be subjected to a melting polymerization process, and this process is different from a southern frequency furnace or another low frequency furnace. This smelting furnace for melting metals or alloys at the south frequency. This low frequency furnace is suitable for metal or alloy melting furnaces. The melting point of the filler is the melting point r of the base material for casting. With the help of the high- or low-frequency furnace average range efficiency, the sintering is added. The viscosity and the melting point are colder and equalized (HIP). The field is lighter, and it is better to prevent the use of binders and sintered bodies (CIP, Hot Is) in the sintered body. When the base filler is melted, the powder is small and the base material is made. The sintering base material for melting and casting is used in a day furnace. It is suitable for use as a low melting point gold. It must be higher than the melting energy to generate magnetic force. _

第10頁 593694 五、發明說明 環的攪拌 已熔融的 被炼煉物 可以在 即可使溶 洗注至模 或合金胚 且幾何造 件使用。 本發 括一卸除 或驗性溶 用基料或 藉超音 上述金屬 藉以製 上述 洗,把殘 完成製作 上述 須清洗及 孔組織間 採用 1.作 ⑺ 作用, 熔鑄用 (包括 高或低 煉物之 具中冷 件。在 型簡單 明除了 充填物 劑的化 炼鑄用 波產生 胚件中 成多孔 製成之 留的溶 具有微 充填物 烘乾外 的氧化 本發明 為燒結 故能使爐 基料(純 充填物及 週波爐前 間被熔煉 卻定型, 適用領域 的板或片 應用上述 作業的技 學屬性, 基料的溶 的渦凹效 的充填物 金屬半成 多孔金屬 劑或雜垢 細通孔組 若為氧化 ,尚必須 層(膜) 之技術, 用基料的 内的充填物均勾且緻密的分佈在 金屬或合金)聚液中。其間如果 熔鑄用基料)之間比重懸殊大時 設置保溫爐,同時照射超音波, 的更加緻密均勻。隨後實施真空 製成已具雛型的高或低熔點金屬 上,熔煉法係適合用來製作較大 型的高或低熔點金屬或其合金胚 製程技術取得金屬胚件外,尚包 術,主要係依據充填物可溶於水 加以選配可以相溶但不傷及燒結 劑,並在設有超音波的清洗槽中 應(Cavitation effect) ,將 溶解於水或鹼性溶劑中加以清除 品。 半成品’必須再經超音波徹底清 徹底清除後再進行烘乾處理,以 織之多孔金屬成品的方法。 物時,該多孔金屬半成品除了必 經過一道還原處理,以利除去通 〇 將具有下列優點: 純金屬或合金粉末或作為熔鑄用Page 10 593694 V. Description of the invention Stirring of the ring The molten material to be refined can be washed and cast into molds or alloy embryos and used in geometrical parts. This article includes a method of removing or verifying the dissolution of the base material or the use of the above-mentioned metal to make the above-mentioned washing, and the completion of the residues. The above-mentioned must be cleaned and used between the pore structure. Medium and cold parts. The type is simple and clear. In addition to the oxidization of the micro-filler, which is made of porous materials, it is made of porous materials in the wave-producing embryos for chemical refining and casting. Base material (pure filler and frontal furnace are smelted but shaped, the applicable fields of the board or sheet apply the technical properties of the above operations, the base material melts the vortex concave effect of the filler metal semi-porous metal agent or dirt If the fine through hole group is oxidized, the layer (film) technology must be used. The filling material in the base material is evenly and densely distributed in the metal or alloy). The specific gravity between the base materials is used for melting. When the disparity is large, a heat-retaining furnace is set, and at the same time, the ultrasonic wave is irradiated to make it denser and more uniform. Subsequent vacuum is used to make prototype high or low melting point metals. The smelting method is suitable for making larger high or low melting point metals or their alloy embryos. Process technology is used to obtain metal embryos. According to the filling material is soluble in water, it can be selected to be compatible but does not hurt the sintering agent, and it should be dissolved in water or alkaline solvents to remove the product in a cleaning tank with ultrasonic waves (Cavitation effect). The semi-finished product 'must be thoroughly cleaned by ultrasonic waves, and then dried, and then the porous metal product is woven. In addition, the semi-finished product of porous metal must undergo a reduction treatment in order to facilitate the removal. It will have the following advantages: Pure metal or alloy powder or used for melting and casting

593694 五、發明說明(8) 基料的純金屬或合金材料,以及作為充填物的可溶性微細 粉末,在坊間均易取得,價格合理,且種類繁多,依製程 經濟性及方便性之考量,可製成多孔金屬成品之材質具選 擇性,且微細通孔的分佈率易從選擇配料作業開始獲得有 效掌控。 - 2. 粉末冶金法中採用冷均壓成型或熱均壓進行燒結, 係可使燒結用基料與充填物間獲得絕佳的緻密混合較果, 或是熔煉法中採用高或低週波進行熔煉的技術應用,亦可 使充填物能在既定配比的熔鑄用基料熔漿中均勻混合,因 此均利於在大量生產時有效掌握多孔金屬成品上相通的微 g 細通孔分佈,並提升多孔金屬成品上微細通孔組織的緻密 度及穩定性高。 3. 在卸除金屬胚件上緻密分佈的充填物時,係在超音 波照射清洗中使用溶劑將充填物溶解清除,技術穩定性高 ,且可降低生產成本及不良率。 4. 可在真空爐内注入還原氣體或採用溶劑溶解方式, 去除多孔金屬上的氧化層(膜),故成品美觀且利於作為 催化器、過濾器、電池的電極、散熱、抗磁波、抗震及吸 音等用途的特殊材料使用。 〔發明之詳細說明〕 $ 本發明製造具有微細通孔組織的多孔金屬技術,係可 區分成一粉末冶金法及另一熔煉法二種實施方式。 該粉末冶金法必須實施包括配料1 、燒結聚合製程2 ' 、卸除充填物3 、清洗4、烘乾5及還原6等作業。其中 ~593694 V. Description of the invention (8) The pure metal or alloy material of the base material and the soluble fine powder as the filling material are easily available in the workshop, the price is reasonable, and there are many types. According to the economic and convenience considerations of the manufacturing process, The material of the porous metal product is selective, and the distribution rate of the fine through holes is easy to be effectively controlled from the selection of the batching operation. -2. In the powder metallurgy method, cold equalizing or hot equalizing is used for sintering, which can achieve excellent and dense mixing between the sintering base and the filling, or the high or low frequency is used in the smelting method. The application of smelting technology can also make the filler uniformly mixed in a predetermined proportion of the base material for melting and casting. Therefore, it is beneficial to effectively grasp the micro-g fine hole distribution on the porous metal product during mass production and improve The dense through-hole structure of the porous metal product has high density and stability. 3. When removing the densely packed fillings on the metal blank, the solvent is used in ultrasonic irradiation cleaning to dissolve the fillings, which has high technical stability, and can reduce production costs and defective rates. 4. The reducing gas can be injected into the vacuum furnace or the solvent dissolution method can be used to remove the oxide layer (film) on the porous metal, so the finished product is beautiful and good for use as a catalyst, filter, battery electrode, heat dissipation, anti-magnetic wave, anti-shock and Use of special materials for sound absorption and other purposes. [Detailed description of the invention] The technology of producing porous metal with fine through-hole structure of the present invention can be divided into two embodiments, one powder metallurgy method and another melting method. The powder metallurgy method must perform operations including batching 1, sintering polymerization process 2 ', removing filling 3, cleaning 4, drying 5, and reduction 6. Where ~

第12頁 593694 五、發明說明 該燒結聚 熱2 6及 該熔 卸除充填 ,其中該 週波爐7 (如圖八 實施 料1及1 在施 金屬或合 水或鹼性 2的熔點 行燒結2 不會被燒 在施 屬或合金 或鹼性溶 的熔點溫 高或低週 動,亦即 上述 熔鑄用基 Zn之合金 (9) 合製程 燒結2 煉法必物3 0 溶煉聚 2兩種 所示) 本發明 0作業 行粉末 金粉末 溶劑的 溫度必 7作業 結用基 行熔煉 材料作 劑的微 度必須 波爐進 不會被 粉末冶料1 3 ),或 2係包括有混拌2 7等程序(如圖七 須實施包括配料1 、清洗4 0、烘乾 合製程7係區分成 途徑,然後再進行 1 、乾燥定型2 5 、預 所示)。 〇 、炫煉聚合製程7、 50及還原60等作業 使用高週波爐7 1或低 澆注成型7 4程序者。 上述兩種方法所須進行的首次程序皆為配 冶金法 作為燒 微細粉 須高於 時,較 料1 1 法的配 為熔鑄 細粉末 高於熔 行熔煉 熔解。 金法中 ,均可 可選擇 的配料1作 結用基料1 末作為充填 燒結用基料 南溫的充填 的燒結溫度 料1 0作業 用基料1 3 作為充填物 鑄用基料1 時9較局溫 的燒結用基 選擇A1金屬 Cu金屬(或 業上,必須選用一種純 1 ,以及另一種可溶於 物1 2 ,且該充填物1 1 1的熔點,以利於進 物1 2不為所動,亦即 所燒結。 上,必須選用一種純金 ,以及另一種可溶於水 1 2 ,且該充填物1 2 3的熔點。以利於置入 的充填物1 2不為所 料1 1或是熔煉法中的 (或 A 1與 S i、Mg、Cu或 C u與 Ζ η 、S η、A 1 或 P之 _Page 12 593694 V. Description of the invention The sintering heat collection 2 6 and the melting removal and filling, in which the furnace 7 (as shown in Figure 8 implementation materials 1 and 1 sintered at the melting point of metal or hydration or alkaline 2) 2 It will not be burned at the melting point of alloys or alloys or alkaline solvents with high or low melting point, that is, the above-mentioned Zn-based alloy (9) for fusion casting. Sintering process 2 Refining process 3 0 Melting polymerization 2 (Shown) The temperature of the powder gold powder solvent in the 0 operation line of the present invention must be 7 and the degree of smelting of the base line smelting material must be used in the furnace. The powder will not be powdered. 7 and other procedures (as shown in Figure 7 must be implemented including ingredients 1, cleaning 40, drying and combining process 7 is divided into routes, and then 1, drying and setting 2 5, as shown). 〇, the smelting polymerization process 7, 50 and reduction 60 and other operations using high-frequency furnace 7 1 or low casting 7 4 procedures. The first procedure required for the above two methods is to use metallurgical method as the fine powder for firing. When the method is used, it is better to melt the fine powder than the melting method. In the gold method, optional ingredients 1 can be used as the binding base material 1 and finally used as the filling and sintering base material. The filling sintering temperature material 1 0 is used as the working material 1 3 as the filling material and is used as the casting base material. The sintering base for local temperature selection is A1 metal Cu metal (or in the industry, one pure 1 and another soluble 1 2 must be selected, and the melting point of the filler 1 1 1 is in favor of feeding 12 2 It is necessary to use one kind of pure gold and another kind which is soluble in water 1 2 and the melting point of the filling material 1 2 3. The filling material 1 2 which is convenient for insertion is not as expected 1 1 or Is in the smelting method (or A 1 and S i, Mg, Cu or Cu and Z η, S η, A 1 or P _

第13頁 593694 五、發明說明(ίο) 合金),或可選擇Fe金屬,或可選擇Pb金屬(或Pb與Sn或 Zn之合金),或可選擇Mg金屬(或Mg與Li、A1或Cu之合金 ),或可選擇Μ η金屬(或Μ η與F e或Ni之合金),或可選擇 Μ〇金屬(或Μ 〇與F e、N i、C 〇或C r之合金),或可選擇Ni金 屬(或Ni與Fe、Cr、Μ 〇或C 〇之合金),或可選擇A g金屬( 或A g與C u之合金),或可選擇S η金屬(或Sn與Pb、Cu或Bi 之合金),或可選擇W金屬(或W與N i、Cu或Ag之合金), 或可選擇V金屬(或V與Mo、Ni、Co或Ti之合金),或可選 擇Ti金屬(或Ti與A卜Ni或Co之合金)等金屬或合金的微 細粉末(如表一所示)。Page 13 593694 V. Description of the Invention ((ο) alloy, or Fe metal, or Pb metal (or Pb and Sn or Zn alloy), or Mg metal (or Mg and Li, A1 or Cu) Alloy), or Mn metal (or an alloy of Mn with Fe or Ni), or Mn metal (or an alloy of Mo with Fe, Ni, Co, or Cr), or Ni metal (or an alloy of Ni and Fe, Cr, M 0 or C 0) can be selected, or A g metal (or an alloy of Ag and Cu) can be selected, or S η metal (or Sn and Pb, Cu or Bi alloy), or W metal (or W and Ni, Cu or Ag alloy), or V metal (or V and Mo, Ni, Co or Ti alloy), or Ti Fine powders of metals or alloys such as metals (or alloys of Ti and Al or Ni or Co) (as shown in Table 1).

第14頁 593694 五、發明說明(π) 燒結或 熔鑄用 的基料 名稱 燒結或 熔鑄用 的基料 比重 熔點 °C 沸點 V 可溶件溶劑 不溶性溶劑 冷水 熱水 其他溶劑 溶劑 鋁及 $呂合金 ΑΙ, AI-Si,Mg,Cu,Zn 2.7 ^2.7 660(低) < 660(働 2056 <2056 不溶 不溶 溶於HCI, H2S〇4 NaOH, KOH CH3CH2OH(乙醇,酒 精),甘油 銅及 銅合金 Cu, Cu-Zn,Sn,AI,P 8.92 二 8.92 1083(高) <1083(高) 2300 <2300 不溶 不溶 溶於HN〇3, 熱h2s〇4 NH4CI, NaOH, KOH, NH40H 鐵及 鐵合金 Fe 7.86 7.6-7.8 1535(高) 1575(高) 3000 <3000 不溶 不溶 溶於h2s〇4, _3, HCI NH4CI, NaOH, KOH, NH40H 鉛及 給合金 Pb Pb-Sn,Zn 11.34 <11.34 327.5(低) < 327(低) 1620 <1620 不溶 不溶 溶於hno3 ch3ch2〇h(乙醇,酒 精),甘油 鎂及 鎂合金 Mg Mg-Li.Al.Cu 1.74 二 174 651 (低) <651(低) 1110 <1110 不溶 微 分解 溶於h2s〇4, _3,稀 HCI CH3CH2OH(乙醇,酒 精),NH4CI,甘油, NaOH, KOH 錳及 ί孟合金 Mn Mn-Fe,Ni 7.2 ^ 7.2 1260(高) <1260(高) 1900 <1900 解離 不溶 溶於稀h2s〇4, 稀 HN03 ^HCI NH4CI, NaOH, KOH, NH40H 鉬及 鉬合金 Mo Mo-Fe,Ni,Co,Cr 10.2 >10.2 2620(®) <2620(高) 3700 <3700 不溶 不溶 溶於熱濃h2s〇4 nh4oh, nh4ci 鎳及 鎳合金 Ni Ni-Fe.Cr.Mo.Co 8.90 >8.90 1452(高) <1452(高) 2900 <2900 不溶 不溶 溶於稀hno3 NH4CI, NaOH, KOH, NH4OH 銀及 銀合金 Ag Ag-Cu 10.5 >10.5 960.5(低) =960.5(低 1950 <1950 不溶 不溶 溶於hno3, 熱h2s〇4 NaOH, KOH, NH40H, NH4CI 錫及 錫合金 Sn Sn-Pb,Cu,Bi 7.31 二 7.31 232(低) ^232(低) 2260 <2260 不溶 不溶 mn hci, H2S〇4 稀— ch3ch2〇h(乙醇,酒 精),甘油 錫及 鎢合金 W W-Ni,Cu,Ag 19.3 <19.3 3370(高) <3370(高) 5900 <5900 不溶 不溶 溶於熱濃KOH NH4CI,NaOH, K〇H, nh4oh, nh4oh 註:製作w及罗 溶劑的充塡物。ί c合金時丨 旦充塡物 濩加入Ni粉末,可; 7的熔點要高於160( 涛燒結溫度 )°c,如有ι\ 降至1500°C以下 /InO, Ti02l V203l ; ,即可選用溶於鹼性 Zn〇,Mg〇, Zr〇2等。 釩及 釩合金 V V-Mo,Ni,Co,Ti 5.96 >5.96 1710(高) 21710(高) 3000 <3000 不溶 不溶 溶於_3, h2so4 NaOH, KOH, NH40H, NH4CI 欽及 鈦合金 Ti Ti-AI,Ni,Co 4.5 >4.5 1800(高) 之1800(高) >3000 >3000 不溶 解離 溶於HCI, _3 h2so4 NaOH, KOH, nh4oh, nh4ci 表=_:係本發所選用燒結用基料或熔鑄甲甚料兄Μ忡皙〕 593694 五、發明說明(12) 該充填物1 2係可選擇CaCl2,MnO,NaCM,Ti02,W0 ,V 20 3,ZnO或MgO等可溶於水或鹼性溶劑的微細粉末 (如表二所示)。 充塡物 名稱 化學式 比重 熔點 °C 沸點 °C 可溶性溶劑 適合與之搭配的 燒結用基料或熔鑄用 基料 冷水 熱水 其他溶劑 氯化鈣 CaCI2 2.15 772 >1600 部分 部分 溶於ch3ch2oh(乙醇, 酒精) 適用於Al,Pb, Mg, Sn及其合金 一氧化猛 Mn〇 5.18 1650 >1600 不溶 不溶 溶於nh4ci 適用於Cu, Fe,Mg, Mn,Ni及其合金 氯化鈉 (食鹽) NaCI 2.163 801 1413 可溶 可溶 溶於甘油 適用於Al,Pb, Mg, Sn及其合金 二氧化鈦 Ti02 4.26 1640 <3000 不溶 不溶 溶於 NaOH,KOH 適用於Cu, Fe, Μη, Ni,Mg及其合金 三氧化鎢 W03 7.16 2130 <3000 不溶 不溶 溶於 NaOH,KOH 適用於Cu,Fe, Mn, Ni,Ag,V,Ti及其合金 三氧化 二釩 V2〇3 4.87 1970 <3000 微溶 可溶 溶於 NaOH,KOH 適用於Cu,Fe,Mn, Ni,Ag,V,Ti及其合金 氧化鋅 ZnO 5.61 1800 <3000 極 微溶 不溶 溶於 NaOH,KOH 適用於Cu, Fe, Μη, Ni, Ag, V,Ti及其合金 氧化鎂 MgO 3.65 2800 3600 極 微溶 不溶 溶於 nh4oh,NH4CI 適用於Cu, Fe, Mn, Ni,Ag,V,Ti,Mo 及其 合金 〔表二:係本發明所選用的充填物性質〕Page 14 593694 V. Description of the invention (π) Name of base material for sintering or melting. Specific gravity of base material for sintering or melting. Melting point ° C Boiling point V Soluble part solvent Insoluble solvent Cold water and hot water Other solvents Solvents Aluminium and aluminum alloys ΙΙ , AI-Si, Mg, Cu, Zn 2.7 ^ 2.7 660 (low) < 660 (働 2056 < 2056 Insoluble and insoluble soluble in HCI, H2S〇4 NaOH, KOH CH3CH2OH (ethanol, alcohol), copper glycerol and copper alloy Cu, Cu-Zn, Sn, AI, P 8.92 2.8.92 1083 (high) < 1083 (high) 2300 < 2300 Insoluble and insoluble soluble in HN〇3, hot h2s〇4 NH4CI, NaOH, KOH, NH40H iron and iron alloy Fe 7.86 7.6-7.8 1535 (high) 1575 (high) 3000 < 3000 Insoluble and insoluble soluble in h2s〇4, _3, HCI NH4CI, NaOH, KOH, NH40H Lead and alloy Pb Pb-Sn, Zn 11.34 < 11.34 327.5 (Low) < 327 (Low) 1620 < 1620 Insoluble and insoluble soluble in hno3 ch3ch20h (ethanol, alcohol), magnesium glycerol and magnesium alloy Mg Mg-Li.Al.Cu 1.74 two 174 651 (low) < 651 (Low) 1110 < 1110 Insoluble slightly decomposed and soluble in h2s〇4, _3, dilute HCI CH3CH2OH (ethanol, alcohol), NH4CI, glycerol, NaOH, KOH manganese and ί Alloy Mn Mn-Fe, Ni 7.2 ^ 7.2 1260 (high) < 1260 (high) 1900 < 1900 Dissociated insoluble in dilute h2s〇4, dilute HN03 ^ HCI NH4CI, NaOH, KOH, NH40H Molybdenum and molybdenum alloy Mo Mo -Fe, Ni, Co, Cr 10.2 > 10.2 2620 (®) < 2620 (high) 3700 < 3700 Insoluble and insoluble soluble in hot concentrated h2s〇4 nh4oh, nh4ci Nickel and nickel alloy Ni Ni-Fe.Cr.Mo .Co 8.90 > 8.90 1452 (high) < 1452 (high) 2900 < 2900 Insoluble and insoluble in dilute hno3 NH4CI, NaOH, KOH, NH4OH silver and silver alloy Ag Ag-Cu 10.5 > 10.5 960.5 (low) = 960.5 (low 1950 < 1950 insoluble and insoluble in hno3, hot h2s〇4 NaOH, KOH, NH40H, NH4CI tin and tin alloy Sn Sn-Pb, Cu, Bi 7.31 two 7.31 232 (low) ^ 232 (low) 2260 < 2260 insoluble and insoluble mn hci, H2S〇4 dilute — ch3ch20h (ethanol, alcohol), tin glycerin and tungsten alloy W W-Ni, Cu, Ag 19.3 < 19.3 3370 (high) < 3370 (high) 5900 < 5900 Insoluble Insoluble Insoluble in hot concentrated KOH NH4CI, NaOH, KOH, nh4oh, nh4oh Note: Make fillings of W and Ro solvents. ί When alloy c is filled with Ni powder, the melting point of 7 should be higher than 160 (Tao sintering temperature) ° c, if ι \ drops below 1500 ° C / InO, Ti02l V203l, you can Choose basic ZnO, Mg〇, ZrO2 and so on. Vanadium and vanadium alloy V V-Mo, Ni, Co, Ti 5.96 > 5.96 1710 (high) 21710 (high) 3000 < 3000 Insoluble and insoluble soluble in _3, h2so4 NaOH, KOH, NH40H, NH4CI and titanium alloy Ti Ti-AI, Ni, Co 4.5 > 4.5 1800 (H) to 1800 (H) > 3000 > 3000 Insoluble and soluble in HCI, _3 h2so4 NaOH, KOH, nh4oh, nh4ci Base material for sintering or smelting of forged armor] 593694 V. Description of the invention (12) The filler 12 can be selected from CaCl2, MnO, NaCM, Ti02, W0, V 20 3, ZnO or MgO, etc. Fine powder in water or alkaline solvent (as shown in Table 2). Filler name Chemical formula Specific gravity Melting point ° C Boiling point ° C Soluble solvent Suitable for sintering base or melting base Cold and hot water Other solvents Calcium chloride CaCI2 2.15 772 > 1600 Partially soluble in ch3ch2oh (ethanol, Alcohol) Applicable to Al, Pb, Mg, Sn and its alloys Mn Mn 〇5.18 1650 > 1600 Insoluble and insoluble soluble in nh4ci Applicable to Cu, Fe, Mg, Mn, Ni and their alloys Sodium chloride (table salt) NaCI 2.163 801 1413 Soluble soluble soluble glycerin suitable for Al, Pb, Mg, Sn and its titanium dioxide Ti02 4.26 1640 < 3000 Insoluble insoluble soluble in NaOH, KOH suitable for Cu, Fe, Mn, Ni, Mg and its alloys Tungsten oxide W03 7.16 2130 < 3000 Insoluble and insoluble in NaOH, KOH is suitable for Cu, Fe, Mn, Ni, Ag, V, Ti and its alloys vanadium trioxide V203 3.87 1970 < 3000 slightly soluble soluble NaOH, KOH is suitable for Cu, Fe, Mn, Ni, Ag, V, Ti and its alloy zinc oxide ZnO 5.61 1800 < 3000 Very slightly soluble insoluble in NaOH, KOH is suitable for Cu, Fe, Mn, Ni, Ag, V , Ti and its alloy MgO 3.65 28 00 3600 Very slightly soluble Insoluble Soluble in nh4oh, NH4CI Suitable for Cu, Fe, Mn, Ni, Ag, V, Ti, Mo and their alloys [Table 2: Properties of the filler used in the present invention]

第16頁 593694 五、發明說明(13) 、^本發明兹將引用上述燒結用基料1 1與充填物1 2 , 並實施說明粉末冶金法之製程(如圖七所示)如下: ^ 在配料1 (如圖七所示)作業中,燒結用基料1 1為 i^用A1金屬(或A1與Si、Mg、Cu或Zn之合金)粉末時,因 其溶點$ 6 6 (TC ’所以應選擇熔點較高於6 6 〇〇c的可溶性微 細粉末作為充填物1 2 ,在表二中可選用的充填物1 2計 有· CaCl2,MnO’ NaCl,Ti〇2,w〇3,v2〇3,ZnO或 MgO 等微 細粉末。 換言之’當燒結用基料1 1為選用Cu金屬(或⑸與Z S η、A 1或P之合金)的粉末時,因其熔點$ J 〇 8扣,因 此在表一中可選用較佳的充填物丄2為.0,T丨〇 2,w〇 3, V 20 3,ZnO或MgO等微細粉末。 依上述配料原則予以類推,表一中其餘的燒結用基料 1亦可和表一的充填物進行下列配料組合: 選用F e金屬粉末作為悻έ士田|伞土, 卜马&結用基枓1 1時,可以選用熔 點車父咼之 MnO,T1 〇 2,w〇 ,v η 7 η斗、ι, > 3 ν2〇 3’ ZnO或MgO等微細粉末作 充填物1 2。 v A rD興Sn或Zn之 選用卩1)金> 用基料η時,可以選用^二=P.16 5933694 5. Description of the invention (13) The present invention will quote the above-mentioned sintering base 11 and filler 12, and implement the powder metallurgy process (as shown in Figure 7) as follows: ^ In In batch 1 (as shown in Figure 7), when the sintering base 11 is i ^ A1 metal (or an alloy of A1 and Si, Mg, Cu or Zn) powder, its melting point is $ 6 6 (TC 'So you should choose soluble fine powders with a melting point higher than 6 6oc as the filler 12. The fillers that can be selected in Table 2 include: CaCl2, MnO' NaCl, Ti〇2, w〇3 , V2〇3, ZnO or MgO and other fine powders. In other words, when the sintering base material 11 is a powder of Cu metal (or an alloy of rhenium and ZS η, A 1 or P), its melting point is $ J 〇8 Therefore, in Table 1, a better filling material can be selected. 丄 2 is .0, T 丨 〇2, WO3, V 20 3, ZnO or MgO, and other fine powders. Analogize according to the above ingredients principle, Table 1 The remaining base material 1 for sintering can also be combined with the fillings in Table 1 as follows: Use Fe metal powder as the base material for sintering | Umbrella soil, Buma & In this case, MnO, T1 〇2, w0, v η 7 η bucket, ι, > 3 ν2〇3 'ZnO or MgO, which are melting points, can be used as the filler 12. v A rD and Sn The choice of Zn or 卩 1) Gold > When using the base material η, you can choose ^ 二 =

Ti〇2, w〇3, ν2ο3’ Ζη0或 Mg〇等微細 選用Mg金屬(或_Ll、mcu之合充金真)物:粉末 燒結用基料1 1時,可選用熔點較高之CaCi2, Mn〇, ,Ti〇2’ wo3,v2o3’ Zn0或Mg0等微細粉末作充填 選用Μη金屬(或_F^Nl之合金)的粉末作為燒。矣 593694 五、發明說明(14) wo3, ν,ο 用基料1 1時,可以選用饺 _ 7 k用4點較鬲MnO, Tio ,^〇或Mg0,等微細粉末作充填物丄2。 選用Mo金屬(或M〇與Fe、Ni、r—、r人、 作為繞結用基料1 i時,可以 上°或s金)的粉末 粉末作充填物i 2。 k用熔點較尚之MgO等微細 域用Ni金屬(或Ni愈Fe、rr、M十r 人 作為繞結用A斜1 1 A主/、 Mo或Co之合金)的粉末 ,W〇3, v Q 7' 、,可以選用熔點較高之MnO,Ti02 二2〇3 Zn〇或Mg〇等微細粉末作充填物丄2。 1 ΐ用_CU之合金)的粉末作燒結用基料 等微細中、\作Λ較高之Mn0, Tl〇2,w〇3, V2〇3’zn〇 /彳成、、、田杨末作充填物;[2 。 結用:m (或s—pb、⑸或…之合金)的粉末作燒 Ti〇2,w〇時,可以選用熔點較高之CaCl2,Mno, NaCl 選2用W金3’/2〇3’、以〇或Mg〇等微細粉末作充填物1 2。 結用基料/ ] 士(或稱Ni、⑸或Ag之合金)的粉末作為燒 配料1時加 時,因其熔點溫度高達3 3 7 Ot,因此必須在 至1 5 〇 〇。(:以下N丨粉末’可將W金屬或其合金的燒結溫度降 1 6 0 〇QC以上的’如此一來’將可以選用在燒結時熔點高於 微細粉末作☆从110 ’ T i 0 2,3’ V 2〇 3,ZnO或MgO等可溶性 、& 兄填物1 2。 建用V金屬丄z 為繞結用基料〈或V與Mo、N i、Co或T i之合金)的粉末作 或Mg〇箄可^ 1 1時,可選用嫁點較高之W〇3,v2〇3,Zn〇 選用T ^倣細粉末作充填物1 2 。Ti〇2, w〇3, ν2ο3 'Znη0 or Mg〇 and other fine selection of Mg metal (or _Ll, mcu mixture filled with gold): powder sintering base 11, can choose the higher melting point of CaCi2, Mn〇,, Ti〇2 'wo3, v2o3' Zn0 or Mg0 and other fine powders are used for filling. The powder of Mn metal (or _F ^ Nl alloy) is used as the firing.矣 593694 V. Description of the invention (14) wo3, ν, ο When using the base material 11, you can choose dumplings _ 7 k with 4 points compared to 鬲 MnO, Tio, ^ 〇 or Mg0, and other fine powders as filling 丄 2. The powder of Mo metal (or Mo and Fe, Ni, r—, r, or as the binding base material 1 i can be made into ° or s gold) is used as the filler i 2. k Use powders with higher melting points such as MgO and Ni metal (or Ni, Fe, rr, and Mr as the sintering A oblique 1 1 A main / Mo or Co alloy) powder, W3, v For Q 7 ', fine powders such as MnO, Ti02 2203 Zn〇 or Mg〇 with high melting point can be used as the filler 丄 2. 1 (Using _CU alloy) powder as the sintering base material, etc., as the Λ higher Mn0, Tl02, w〇3, V2〇3'zn〇 / 彳 成 ,,, Tian Yangmo For filling; [2. Use: m (or s-pb, yttrium or ... alloy) powder for firing Ti〇2, when w0, you can choose the higher melting point of CaCl2, Mno, NaCl choose 2 W gold 3 '/ 2〇3 ', Using 0 or Mg0 fine powder as a filler 12. The powder of the binder /] (or alloy of Ni, rhenium or Ag) is used as the baking ingredient for 1 hour, because its melting temperature is as high as 3 37 Ot, so it must be up to 15 00. (: The following N 丨 powders 'can reduce the sintering temperature of W metals or their alloys by more than 160 ° C.' This way 'will allow the melting point to be higher than that of fine powders when sintered ☆ from 110' T i 0 2 , 3 'V 2 0 3, ZnO or MgO soluble, & brother filler 1 2. V metal 丄 z is used as the binder for binding (or V and Mo, Ni, Co or T i alloy) When powder is used or MgO 箄 can be ^ 1 1, W03, v203, which has a higher grafting point can be selected, and Zn〇 is used as the filling material 12 for imitation of fine powder.

4屬(或Ti與Al、Ni或Co之合金)的粉末作為 第18頁 593694 五、發明說明(15) 燒結用基料1 1時,可以選用熔點較高 或MgO等可溶性微細粉末作充填物1 2 c 在選用上述配料時,燒結用基料1 粉末,以及充填物1 2的微細粉末,皆 在2 5 0〜0 . 1 // 的微米級粉末材料,且價 末粒徑達到微米(//)級時,其實早已 疊(積層)的球粒狀。 再者,在選用上述配料時,除了上 以外,在粉粒形狀上,應選用安息角愈 息角愈小的粉末在混拌時的流動性愈佳 的摩擦力也愈小。 更甚者,在選用上述配料時,充填 比應高於5 0 % ,亦即充填物/燒結用基 > 1 ,然後進行混拌2 1作業,以利後 %的多孔金屬成品。 在混拌2 1作業時(如圖七所示) 合與既定配比的燒結用基料1 1與充填 器内,同時並須添加黏結劑2 2與增塑 基料1 1與充填物1 2經充份混拌,達 堆疊混合之效(如圖九所示)。 該黏結劑2 2 ,能使燒結用基料1 粉末能與充填物1 2在乾燥定型2 5過 及可塑性,且在後面的燒結2 7過程中 用而隨煙氣燃燒排出。可選用的黏結劑 之W〇 v2oPowder of genus 4 (or an alloy of Ti and Al, Ni, or Co) as page 18 593694 V. Description of the invention (15) Sintering base material 11 When using a soluble fine powder with a high melting point or MgO as a filler 1 2 c When the above ingredients are selected, the powder for sintering base 1 and the fine powder of filler 12 are all in the micron level powder material of 250 ~ 0. 1 //, and the final particle size reaches micron ( //) level, in fact, has been stacked (layered) pellets. In addition, when selecting the above ingredients, in addition to the above, in the shape of the powder particles, the powder with a smaller rest angle should be selected. The powder with better fluidity during mixing and the smaller the frictional force are. What's more, when selecting the above ingredients, the filling ratio should be higher than 50%, that is, the filling / sintering base > 1, and then the mixing 21 operation is performed to facilitate the subsequent% porous metal product. When mixing 2 1 (as shown in Figure 7), mix the sintering base material 1 1 with the predetermined proportion and the filler, and add the binder 2 2 and the plasticized base material 1 1 and the filling material 1 2 After full mixing, achieve the effect of stack mixing (as shown in Figure 9). The bonding agent 2 2 enables the powder 1 for the sintering base 1 and the filler 12 to pass through the drying setting 25 and be malleable, and is used in the subsequent sintering 2 7 process to be discharged with the combustion of the flue gas. Optional adhesive W〇 v2o

Zn〇 1的純金屬或合金 可在坊間購取粒徑 格合理。當這些粉 趨近成利於緻密推 述粉粒大小的考量 小者愈好,因為安 ,且粉末與粉末間 物1 2所佔的體積 料的體積配比必須 續製得通孔率> 5 0 ,係以上述選用組 物1 2置入混拌容 劑2 3 ,使燒結用 到均勻分佈、敏密 1的純金屬或合金 程中具有黏合能力 ,可藉高溫氧化作 2 2種類計有:聚 _Pure metal or alloy of Zn〇 1 can be purchased in the workshop with reasonable particle size. When these powders approach to facilitate the compactness of the powder, it is better to consider the smaller particle size, because it is safe, and the volume ratio of the volume occupied by the powder and the powder intermediate 12 must be continued to obtain the porosity> 5 0, based on the above-mentioned selected composition 12 placed in the mixing container 2 3, so that evenly distributed and dense pure metal or alloy used in sintering has the adhesion ability, can be oxidized at high temperature to make 2 2 types. : Poly _

第19頁 593694 五、發明說明(16) 乙烯醇、蠟、纖維素、糊精、熱塑塑脂、熱固樹脂、氯化 碳氫化合物、藻類膠質、木質素、橡膠、樹膠、澱粉、麵 粉、乾絡素、動物膠、蛋白質、蛋白素、遞青、壓克力、 聚苯乙烯、聚醋酸乙烯酯、石蠟及蜜蠟等。 舉例使用聚乙稀醇(Polyvinyl Alcohol,PVA)作為 黏結劑2 2 ,其分子式為〔-C H 2_ C Η -〕η ,η為其聚合度 ,使用在η = 1 5 0 0〜1 7 0 0為宜。但聚乙烯醇不適於鹼性氧化 物(如MgO、CaO、BaO、Ζη 0和硼酸鹽、石粦酸鹽等),因聚 乙稀醇會與驗性氧化物結合成不溶性或近乎脆性或彈性的 圑塊,特別不利於成型。 換言之,若使用聚醋酸乙烯酯(Polyvinyl Acetate )作為黏結劑2 2 ,其分子式為:Page 195993 V. Description of the invention (16) Vinyl alcohol, wax, cellulose, dextrin, thermoplastic resin, thermosetting resin, chlorinated hydrocarbons, algae gum, lignin, rubber, gum, starch, flour , Dry complex, animal glue, protein, proteoglycan, green, acrylic, polystyrene, polyvinyl acetate, paraffin and beeswax. For example, Polyvinyl Alcohol (PVA) is used as the binding agent 2 2. Its molecular formula is [-CH 2_ C Η-] η and η is its polymerization degree. It is used at η = 1 5 0 0 ~ 1 7 0 0 Better. However, polyvinyl alcohol is not suitable for basic oxides (such as MgO, CaO, BaO, Zη 0, and borate, stone salt, etc.), because polyvinyl alcohol will combine with test oxides to become insoluble or nearly brittle or elastic. The stern block is particularly difficult to shape. In other words, if Polyvinyl Acetate is used as the bonding agent 2 2, its molecular formula is:

?武合度η通常在4 Ο 0〜6 Ο 0間,適合用於鹼性氧化物中,正可 彌補聚乙烯醇的不足。但聚醋酸乙烯酯只溶於酒精、苯、 甲苯等有機溶劑中,使用時應加注意。 上述黏結劑2 2亦可使用石蠟或蜜蠟,在加熱的情況 下具有很好的流動性,對燒結用基料1 1的純金屬或合金 粉末亦有很好的潤濕力,但加溫不宜超過1 3 0°C , 否則將 會迅速氧化而減少黏性,迫使性能變劣,亦應加注意。? Wuhe degree η is usually between 4 0 0 ~ 6 0 0, suitable for alkaline oxides, it can make up for the deficiency of polyvinyl alcohol. But polyvinyl acetate is only soluble in organic solvents such as alcohol, benzene, toluene, etc., please pay attention when using. The above-mentioned bonding agent 2 2 can also use paraffin or beeswax, which has good fluidity under heating, and also has good wetting power on the pure metal or alloy powder of the sintering base 1 1, but it is heated It should not exceed 130 ° C, otherwise it will oxidize quickly and reduce the viscosity, forcing the performance to deteriorate, and attention should be paid.

第20頁 593694 五、發明說明(17) 該增塑劑2 3 ,具使燒結用基料1 1的純金屬或合金 粉末與充填物1 2之間增加流動、潤滑與增塑的作用,可 解決黏結劑黏性過大的問題,對促進混拌2 1作業時之均 勻度極有助益。可選用的增塑劑2 3種類計有:乙二醇、 丙二醇、丙三醇(甘油)、硫酸、硬脂酸、油酸、桐油及 其他植物油等。 舉例使用上述丙三醇(甘油)作為增塑劑2 3 ,除了Page 205993694 V. Description of the invention (17) The plasticizer 2 3 can increase the flow, lubrication and plasticity between the pure metal or alloy powder of the sintering base 11 and the filler 12. Solving the problem of excessive viscosity of the adhesive is extremely helpful to promote the uniformity of the mixing operation. Available plasticizers include 3 types: ethylene glycol, propylene glycol, glycerol (glycerol), sulfuric acid, stearic acid, oleic acid, tung oil, and other vegetable oils. Glycerol (glycerin) is used as plasticizer 2 3 as an example, except

具有潤滑作用外,還具有強的吸濕性;若使用油酸,則兼 具有潤滑及活化粉末粒子表面的作用;若使用桐油及其他 植物油,則兼具有潤滑、乳化及黏合粉末粒子的作用。 上述混拌2 1作業後,接續必須進行乾燥定型2 5作 業(如圖七所示),主要係施予2 5 0°C 以下的乾燥溫度, 使燒結用基料1 1與充填物1 2間充份乾燥,並被黏結劑 2 2黏固,維持原有均勻分佈並緻密堆疊的粉粒組織結構 。該充填物1 2係作燒結用基料1 1間的架橋介質使用。 上述配料完成乾燥定型2 5作業後,須以5 0 0〜7 0 0 °C 的溫度對已定型的充填物1 2進行預熱2 6處理,藉以去· 除充填物1 2的水份,利於進行後續的燒結2 7作業(如 圖七所示)。In addition to its lubricating effect, it also has strong hygroscopicity; if oleic acid is used, it also has the function of lubricating and activating the surface of powder particles; if tung oil and other vegetable oils are used, it has both lubricating, emulsifying, and adhering powder particles. effect. After the above-mentioned mixing operation 21, the drying and setting operation 25 (shown in Figure 7) must be continued, which is mainly applied to a drying temperature below 250 ° C, so that the sintering base 1 1 and the filling material 1 2 The mesenchyme is dry, and is fixed by the adhesive 22, maintaining the original uniformly distributed and densely stacked powder structure. The filler 12 is used as a bridging medium between the sintering base materials 11. After the above ingredients are dried and shaped 25, the shaped filling 12 must be pre-heated 2 5 at a temperature of 5000 ~ 700 ° C, so as to remove and remove the moisture of the filling 12 Conducive to the subsequent sintering 2 7 operations (as shown in Figure 7).

燒結2 7時,係以冷均壓(C I P, C ο 1 d I s 〇 s t a t i c P r -essure)成型或熱均壓(HIP, Hot Isostatic Pressure )的粉末燒結方式,製成緻密度較好且已具雛型的金屬胚 件2 8。燒結時的溫度,係在選用燒結用基料1 1主要純 金屬熔點的1 / 2以上至充填物1 2熔點以下的範圍内。但When sintering 27, the powder is sintered by cold equal pressure (CIP, C ο 1 d I s static P-essure) molding or hot equal pressure (HIP, Hot Isostatic Pressure). Already have a prototype metal embryo 2 8. The temperature at the time of sintering is within the range of the melting point of the main pure metal used for the sintering base 11 or more to the melting point of the filler 12 or less. but

第21頁 593694 五、發明說明(18) 若燒結用基料1 1為選用合金粉末時,其燒結溫度會較純 金屬或合金粉末低。 在燒結時,為了防止製成的金屬或合金胚件受到氧化 或氮化影響,通常可依所選燒結用基料的金屬或合金之活 化性能,而在還原性氣體中進行燒結,以維持燒成金屬胚 、 件2 8的品質。 _ 藉由上述的燒結條件,將使原以點接觸形態均勻堆疊 的充填物1 2與燒結用基料1 1 (如圖九所示),被燒結 成燒結用基料1 1 a飽實填滿並密實包覆於周圍的充填物 1 2 a間的聚合形態(如圖十所示)。其中,較高溫的充 φ 填物1 2 a與充填物1 2 a之間,以及充填物1 2 a與燒 結用基料1 1 a之間,也被燒擠成具有面接觸形態的頸部 1 2 0生成。待冷卻後成型為已具燒結聚合之微粒組織雛 型的金屬胚件2 8 (如圖十一所示),並完成本發明粉末 冶金之燒結聚合製程2 (如圖七所示)。在適用領域上, 粉末冶金法係適合用來製作5 0 0 g (克)以下較輕、較小且 造型較複雜之高熔點金屬或合金的胚件使用。 上述頸部1 2 0的形成,係可作為後續卸除充填物1 2 a (容後詳述)之後各通孔間的通道使用。該通孔分佈 率係可經由X / D取得(如圖十二所示);D為充填物1 2 w 的粉末粒徑,可在選擇配料時取得;X為充填物燒結後形 成的頸部直徑,可藉燒結溫度、時間及配料組合等條件控 制取得;因此在燒結時,即可掌控後續製成多孔金屬成品 ’ 的通孔分佈率。 „Page 21 593694 V. Description of the invention (18) If the base material 11 for sintering is selected from alloy powder, the sintering temperature will be lower than that of pure metal or alloy powder. During sintering, in order to prevent the produced metal or alloy blank from being affected by oxidation or nitridation, sintering in a reducing gas is usually performed according to the activation performance of the metal or alloy of the selected sintering base material to maintain the sintering. Into metal embryos, pieces 2 to 8 quality. _ Under the above-mentioned sintering conditions, the filler 12 and the sintering base 1 1 (as shown in Figure 9), which originally uniformly stacked in the point contact form, are sintered into the sintering base 1 1 a and filled. Full and densely polymerized morphology covering the surrounding fillings 1 2 a (as shown in Figure 10). Among them, the relatively high-temperature filling φ filler 1 2 a and filler 1 2 a, and the filler 12 a and sintering base 1 1 a are also burned to form a neck with a surface contact shape. 1 2 0 generated. After cooling, it is formed into a metal embryo 2 8 (shown in Fig. 11) with a sintered polymerized microstructure prototype, and completes the powder metallurgy sintered polymerization process 2 (shown in Fig. 7) of the present invention. In the applicable field, the powder metallurgy method is suitable for making lighter, smaller and more complex high-melting metal or alloy preforms below 500 g (grams). The formation of the neck 1 2 0 described above can be used as a channel between the through holes after the filling 12 1 a is removed in detail (described later). The through-hole distribution rate can be obtained through X / D (as shown in Figure 12); D is the powder particle size of the filler 12 w, which can be obtained when selecting the ingredients; X is the neck formed after the filler is sintered The diameter can be obtained by controlling conditions such as sintering temperature, time, and combination of ingredients; therefore, during sintering, you can control the through-hole distribution rate of subsequent porous metal products. „

第22頁 593694 五、發明說明(19) 另外,本發明玆將引用上述表一中的熔鑄用基料1 3 以及表二中的充填物1 2 ,並實施說明熔煉法之製程(如 圖八所示)如下: 在熔煉製程的配料1 0作業上,必須先區分出熔鑄用 基料1 3 (純金屬或合金材料)的炼點溫度後’才能執行 接下來的溶煉聚合製程7。Page 22 593694 V. Description of the invention (19) In addition, the present invention will quote the base material for melting 1 3 in Table 1 and the filler 12 in Table 2 and implement the process of explaining the melting method (see Figure 8). (Shown) is as follows: In the batch 10 operation of the melting process, the melting point temperature of the melting base 13 (pure metal or alloy material) must be distinguished before the subsequent melting polymerization process 7 can be performed.

該熔鑄用基料1 3必須被區分成高熔點與低熔點的純 金屬或其合金材料。如表一所示炫鑄用基料1 3中,炫點 溫度高於1 0 0 0°C者,即屬高熔點金屬或其合金材料,包括 有: C u金屬(或C u與Z η 、S η、A 1或P之合金); F e金屬; Μη金屬(或Μη與Fe或Ni之合金); Μ〇金屬(或Μ 〇與F e、N i、C 〇或C r之合金);The base material 13 for melting and casting must be distinguished into high-melting and low-melting pure metals or alloy materials thereof. As shown in Table 1, in the base material 13 for casting, if the temperature of the flash point is higher than 1000 ° C, it is a high melting point metal or its alloy material, including: Cu metal (or Cu and Z η , S η, A 1 or P alloy); Fe metal; Mn metal (or alloy of Mn and Fe or Ni); Μ metal (or alloy of Μ0 and F e, Ni, C 0 or C r );

Ni金屬(或Ni與Fe、Cr、Mo或Co之合金);Ni metal (or an alloy of Ni and Fe, Cr, Mo or Co);

Ag金屬(或Ag與Cu之合金); W金屬(或W與Ni、Cu或Ag之合金); V金屬(或V與Mo、Ni、Co或Ti之合金);Ag metal (or an alloy of Ag and Cu); W metal (or an alloy of W and Ni, Cu, or Ag); V metal (or an alloy of V and Mo, Ni, Co, or Ti);

Ti金屬(或Ti與A卜Ni或Co之合金)。 表一中熔點溫度低於1 0 0 o°c者,即屬低熔點金屬或其 合金材料,包括有: A1金屬(或A1與Si、Mg、Cu或Zn之合金);Ti metal (or an alloy of Ti and Al or Ni or Co). Those with a melting point below 100 ° C in Table 1 are low melting metals or their alloy materials, including: A1 metal (or an alloy of A1 and Si, Mg, Cu or Zn);

Pb金屬(或Pb與Sn或Zn之合金);Pb metal (or alloy of Pb with Sn or Zn);

第23頁 593694 五、發明說明(20) M g金屬(或M g與L i、A 1或C u之合金);Page 23 593694 V. Description of the invention (20) M g metal (or M g and L i, A 1 or Cu alloy);

Sn金屬(或Sn與Pb、Cu或Bi之合金)。 上述以高或低熔點純金屬或其合金作為熔鑄用基料1 3時,在配料1 0作業上,該充填物1 2的選用,仍與上 述粉末冶金法相同(前已述明,在此不加敷述),亦即: 充填物1 2的熔點必須高於熔鑄用基料1 3 ,利於進 行熔煉聚合製程7時,較高溫的充填物1 2不被熔鑄用基 料1 3的熔煉溫度所熔融;同時, 為了有效執行熔煉技術,本發明將熔煉聚合製程7區 分成使用一高週波爐7 1或另一低週波爐7 2兩種作業途 徑(如圖八所示)。上述熔鑄用基料1 3為屬高熔點純金 屬或合金者,必須選用高週波爐7 1作業途徑。上述熔鑄 用基料1 3為屬低熔點純金屬或合金者,必須選用低週波 爐7 2作業途徑。Sn metal (or an alloy of Sn and Pb, Cu or Bi). When a high or low melting pure metal or its alloy is used as the base material 13 for melting and casting, the selection of the filler 12 in the operation of batching 10 is still the same as that of the above powder metallurgy method (as previously described, here (No description), that is, the melting point of the filler 12 must be higher than that of the melting base 13, which is beneficial to the melting polymerization process 7, and the higher temperature filler 12 is not melted by the melting base 13 At the same time, in order to effectively execute the smelting technology, the present invention divides the smelting polymerization process 7 into two operation paths using a high frequency furnace 71 or another low frequency furnace 7 2 (as shown in FIG. 8). The above-mentioned base material 13 for melting casting is a pure metal or alloy with a high melting point, and a high frequency furnace 71 must be selected for the operation. The above-mentioned base material 13 for melting casting is a pure metal or alloy with a low melting point, and a low-frequency furnace 72 must be used for the operation.

在採用高週波爐7 1或低週波爐7 2進行熔煉時,因 二款週波爐皆具有週波感應能力,因此能產生磁力循環的 攪拌作用,可分別針對高熔點或低熔點的熔鑄用基料1 3 及其充填物1 2間產生均勻攪拌效果。 但為了取得更佳的攪拌效果,可以在高週波爐7 1及 低週波爐7 2的爐前,分別設置保溫爐7 1 0及7 2 0 , 並照射超音波,促使經過上述高或低週波感應熔煉後的充 填物1 2 ,得以更加均勻且緻密的分佈在已熔融的熔鑄用When using high frequency furnace 7 1 or low frequency furnace 7 2 for smelting, both types of frequency furnaces have the frequency induction ability, so they can generate the stirring effect of magnetic circulation. They can be used for high melting point or low melting point base materials for melting. 1 and its fillings 1 and 2 produce a uniform stirring effect. However, in order to obtain a better stirring effect, heat-retaining furnaces 7 1 0 and 7 2 0 can be set in front of the high-frequency furnace 7 1 and the low-frequency furnace 7 2 respectively, and the ultrasonic waves can be irradiated to promote the passage of the high- or low-frequency waves. The filler 1 2 after induction melting can be more evenly and densely distributed in the molten casting

第24頁 593694 五、發明說明(21) 基料1 3 (指高 進行快速的真空 物1 2能在熔融 密堆疊,待冷卻 金屬胚件7 8 。 上述熔煉法 煉溫度作用,胚 熔固後的熔鑄用 1 2 0的形態相 也可以被掌控。 且幾何造型簡單 使用。 上述包括引 件2 8或7 8 , 卸除充填物 要係依據金屬胚 性溶劑的化學屬 1 3的溶劑3 1 所能產生的渦凹 屬胚件2 8或7 解清除,藉以展 編構形成微細通 當充填物1 (乙醇,酒精)作 或低熔點純金屬或合金)的漿液中,隨後 澆注成型7 4作業,使固體微粒狀的充填 狀熔鑄用基料1 3間,迅速均勻分佈、緻 後形成為已具微粒組織雛型的高或低熔點 製成的高或低熔點金屬胚件7 8 ,因受熔 件中的充填物與充填物間,以及充填物與 基料間,均會與上述燒結製程後形成頸部 同(參考圖十及圖十一所示),且通孔率 在適用領域上,熔煉法適合用來製作較大 之板或片型的高或低熔點金屬或合金胚件 用粉末冶金法或是熔煉法所製成 皆必須再進行以下之共同製程: 3或3 0作業(如圖七及圖八所 件2 8或7 8中充填物1 2可溶 性,加以選配可相溶但不傷及熔 ’並在設有超音波的清洗槽内’ 效應(Cavitation effect) , 8中的充填物12 a (如圖十一 現由燒結用基料1 1 a或熔鑄用 孔組織的多孔半成品3 2 。 2為CaCl 2時,係選用可相溶的 成的溶劑3 1 (如表二所示), 的金屬胚 示),主 於水或驗 鑄用基料 精超音波 把上述金 所示)溶 基料1 3 C H 3C Η 20 Η 且此溶劑 _Page 24 593694 V. Description of the invention (21) Base material 1 3 (refers to high-speed vacuum materials 12 can be densely stacked in the melt, waiting to cool the metal blanks 7 8. The above smelting method has the effect of smelting temperature. After the embryos are solidified The morphology and phase of 1 2 0 for melting casting can also be controlled. And the geometric modeling is simple to use. The above includes the lead 2 8 or 7 8. The removal of the filler should be based on the metal germ solvent 1 3 solvent 3 1 The vortex-concave embryos that can be produced can be removed by removing 8 or 7 to spread the structure to form a fine paste (filler 1 (ethanol, alcohol) or low-melting pure metal or alloy), and then cast 7 4 The operation can quickly and uniformly dispose 1 to 3 solid particulate filling base materials for melting and casting, and then form high or low melting metal blanks 7 8 made of high or low melting points that have already had a microstructure. The filler and the filler, and the filler and the base material in the molten part will be the same as the neck formed after the above sintering process (see Figure 10 and Figure 11), and the through-hole ratio is in the applicable field. In addition, the smelting method is suitable for making larger plates or High- or low-melting metal or alloy blanks made by powder metallurgy or smelting must be subjected to the following common processes: 3 or 30 operations (as shown in Figure 7 and Figure 8) 2 8 or 7 8 The filling material 12 is soluble, and it can be selected to be compatible but does not hurt the melt, and in a cleaning tank with an ultrasonic wave, the Cavitation effect, the filling material 12 a in 8 (as shown in Figure 11) Base material 1 1 a for sintering or porous semi-finished product 3 2 for pore structure for melting casting. When 2 is CaCl 2, a compatible solvent 3 1 (as shown in Table 2) is selected. In the water or the base material for the casting, the ultrasonic is shown in the above gold) dissolve the base material 1 3 CH 3C Η 20 Η and this solvent _

第25頁 593694 五、發明說明(22) 3 1是合適以Al、Pb、M g或S η等純金屬或其合金作為溶鎮 用基料1 3時使用,該乙醇溶劑3 1將不會對上述熔鑄用 基料1 3造成傷害(如表一所示)。 當充填物1 2為ΜηΟ時,係選用可相溶的NH4C1作為溶 劑3 1 (如表二所示),且這些溶劑3 1是合適以Cu、Fe 、Mg、Μη或Νι等純金屬或其合金作為熔鑄用基料1 3時使 用,這些溶劑3 1將不會對熔鑄用基料1 3造成傷害(如 表一所示)。 當充填物1 2為NaC 1時,係選用可相溶的冷水或熱水 作為溶劑3 1 (如表二所示),且這些溶劑3 1是合適於 以A卜Pb、Mg、Sη等純金屬或其合金作為熔鑄用基料1 3 時使用,這些溶劑3 1將不會對熔鑄用基料1 3造成傷害 (如表一所示)。 當充填物1 2為Ti02時,係選用可相溶的NaOH或Κ0Η 作為溶劑3 1 (如表二所示),且這些溶劑3 1是合適以 Cu、Fe、Mg、Μη或Ni等純金屬或其合金作為熔鑄用基料1 3時使用,這些溶劑3 1將不會對溶鑄用基料1 3造成傷 害(如表一所示)。 當充填物1 2為W03時,係選用可相溶的NaOH或K0Η 作為溶劑3 1 (如表二所示),且這些溶劑3 1是合適於 以Cu、Fe、Mn、Ni、Ag、V或Ti等純金屬或其合金作為熔 鑄用基料1 3時使用,這些溶劑3 1將不會對熔鑄用基料 1 3造成傷害(如表一所示)。Page 25593694 V. Description of the invention (22) 31 is suitable for use when pure metals such as Al, Pb, Mg, or S η or their alloys are used as the base material for ballasting 13. The ethanol solvent 3 1 will not Injury to the above-mentioned base material for melting 13 (as shown in Table 1). When the filling material 12 is MηO, miscible NH4C1 is used as the solvent 3 1 (as shown in Table 2), and these solvents 31 are suitable for pure metals such as Cu, Fe, Mg, Mη or Ni or the like. When the alloy is used as the base material for melting 1 3, these solvents 31 will not cause damage to the base material 1 for melting (as shown in Table 1). When the filling material 12 is NaC 1, compatible cold or hot water is used as the solvent 3 1 (as shown in Table 2), and these solvents 3 1 are suitable for pure solvents such as Pb, Mg, and Sη. When the metal or its alloy is used as the base material 1 3 for melting and casting, these solvents 31 will not cause damage to the base material 1 for melting (as shown in Table 1). When the filler 12 is Ti02, miscible NaOH or K0Η is selected as the solvent 3 1 (as shown in Table 2), and these solvents 31 are suitable for pure metals such as Cu, Fe, Mg, Mn or Ni. When the alloy or its alloy is used as the base material for melting 1 3, these solvents 31 will not cause damage to the base material 1 for melting (as shown in Table 1). When the filler 12 is W03, miscible NaOH or K0Η is selected as the solvent 3 1 (as shown in Table 2), and these solvents 31 are suitable for Cu, Fe, Mn, Ni, Ag, V When pure metals such as Ti or their alloys are used as the base material for melting 1 3, these solvents 31 will not cause damage to the base material 1 for melting (as shown in Table 1).

當充填物1 2為V 20 3時,係選用可相溶的NaOH或K0HWhen the filling material 12 is V 20 3, it is compatible with NaOH or K0H.

593694 五、發明說明(23) 作為溶劑3 1 (如表二所示),且這些溶劑3 1是合適以 Cu、Fe、Mn、Ni、Ag、V或T i等純金屬或其合金作為容鑄 用基料1 3時使用,這些溶劑3 1將不會對熔鑄用基料1 3造成傷害(如表一所示)。 當充填物1 2為ZnO時,係選用可相溶的 NaOH或KOH 作為溶劑3 1 (如表二所示),且這些溶劑3 1是合適以 Cu、Fe、Mn、Ni、Ag、V或Ti等純金屬或其合金作為炼鑄 用基料1 3時使用,這些溶劑3 1將不會對熔鑄用基料1 3造成傷害(如表一所示)。593694 V. Description of the invention (23) As solvents 31 (as shown in Table 2), and these solvents 31 are suitable for pure metals such as Cu, Fe, Mn, Ni, Ag, V or T i or their alloys as the capacitor These solvents 31 will not cause any damage to the casting base 1 3 (as shown in Table 1). When the filler 12 is ZnO, miscible NaOH or KOH is selected as the solvent 3 1 (as shown in Table 2), and these solvents 31 are suitable for Cu, Fe, Mn, Ni, Ag, V or When pure metals such as Ti or their alloys are used as the base material 1 for refining and casting, these solvents 31 will not cause damage to the base material 13 for melt casting (as shown in Table 1).

當充填物1 2為MgO時,係選用可相溶的 NH4〇H或 N H 4C1作為溶劑3 1 (如表二所示),且這些溶劑3 1是 合適以Cu、Fe、Mn、Ni、Ag、V、Ti或Mo等純金屬或其合 金作為熔鑄用基料1 3時使用,這些溶劑3 1將不會對熔 鑄用基料1 3造成傷害(如表一所示)。 以上述卸除充填物3或3 0之方法製成之多孔半成品 3 2 ,接續必需進行使用清水清洗4或4 0的作業,且因 在卸除充填物3或3 0時,使用了諸多鹼性溶劑3 1 ,所When the filler 12 is MgO, miscible NH4OH or NH 4C1 is selected as the solvent 3 1 (as shown in Table 2), and these solvents 31 are suitable for Cu, Fe, Mn, Ni, and Ag. Pure metals such as, V, Ti, or Mo or their alloys are used as the base material for melting 1 3, these solvents 31 will not cause damage to the base material 1 for melting (as shown in Table 1). The porous semi-finished product 3 2 made by the above-mentioned method for removing the filling 3 or 30 must be washed with water 4 or 40, and because many alkalis are used when removing the filling 3 or 30 Solvent 3 1

以在清洗4或4 0時,最好是在附加有超音波的清洗槽内 進行,使附著於多孔半成品3 2之通孔孔壁間的殘留溶劑 3 1 ,均可被清水沖洗至潔淨。 經過清洗後的多孔半成品3 2 ,必須進行烘乾5或5 0作業。烘乾時,可使用設有紅外線爐或微波爐進行烘乾 。其中若採用微波烘乾時,其微波頻率為100〜140GHz,波 長為1 mm〜1 m間可得較佳烘乾效果。使上述清洗過程中附著When cleaning 4 or 40, it is best to perform it in a cleaning tank with an ultrasonic wave, so that the residual solvent 3 1 attached to the walls of the through holes of the porous semi-finished product 32 can be washed with water to be clean. After cleaning, the porous semi-finished product 3 2 must be dried 5 or 50. When drying, you can use the infrared oven or microwave oven for drying. When microwave drying is used, the microwave frequency is 100 to 140 GHz and the wavelength is 1 mm to 1 m to obtain a better drying effect. Allows attachment during the above cleaning process

第27頁 593694 五、發明說明 於多孔半 除,如此 多孔金屬 再者 業時,是 述烘乾5 作業。 還原 品8置入 原氧化物 (膜), 還原 膜)的溶 將其注入 層(膜) 綜上 法,係可 可掌握相 原料取得 散熱、 應備具獲 至為感 (24) 成品3 2 之通孔 來,即可製得 如圖十 程中, 氧化物 業後, 成品8 ( ,上述製 選用隸屬 或5 0作 處理6或 一真空爐 的反應, 而取付盡 處理6或 劑,該溶 超音波清 溶解清除 所述,本 穩定製成 通微細通 容易,故 抗磁波、 准發明專 禱0 6 0的 内,並 精以去 善盡美 6 0的 劑可為 洗槽内 〇 發明提 微米級 孔間的 可供作 抗震及 利之要 孔壁間的殘留水份得以被快速烘 本發明具有微細通孔8 0組織的 三示)。 若是在最先前的配料1或1 〇作 的充填物1 2者,必須在完成上 穿插進行一道還原處理6或6 0 作法,是將烘乾後之多孔金屬成 注入還原性氣體(如H 2 ),作還 除微細通孔8 0組織間的氧化層 的多孔金屬成品8 。 作法,另可採用可溶解氧化層( NaOH、KOH、NH4C1 或 NH40H, ,將微細通孔8 0組織間的氧化 供之微細通孔組織的多孔金屬製 通孔組織的的多孔金屬材料,且 分佈率,在製作上並不艱困,且 為催化器、過滤器、電池的電極 吸音用途的材料使用,是以,理 件,爰依法提出申請,懇請賜准Page 27 593694 V. Description of the invention For porous and semi-removable, so porous metal is also described in the drying operation. The reduction product 8 is placed in the original oxide (film), and the reduction film is dissolved and injected into the layer (film). In summary, the cocoa masters the phase raw materials to obtain heat dissipation, and it should be equipped with the best feeling (24) The finished product 3 2 Through the through-hole, you can obtain the finished product 8 (as shown in the tenth process, after the oxide industry, the above system uses the affiliate or 50 for the treatment 6 or a vacuum furnace reaction, and takes out the treatment 6 or agent, the solvent The sonic wave dissolves and removes the above. This stable preparation is easy to pass through, and it is easy to pass. Therefore, anti-magnetic wave, quasi-invention special prayer within 0 60, and the perfect 60 agent can be used to wash the bath. Residual moisture between the walls of the pores, which can be used for earthquake resistance and benefit, can be quickly dried. The third aspect of the invention has a fine through-hole 80 structure). If it is the filling material 12 made in the previous ingredients 1 or 10, it must be interspersed with a reduction treatment 6 or 60. The method is to inject the dried porous metal into a reducing gas (such as H 2 ), A porous metal product 8 that also removes the interlayer microstructure oxidation layer 8. As a method, a porous metal material made of a porous metal through-hole structure, which can dissolve the oxidation layer (NaOH, KOH, NH4C1 or NH40H), and provide the fine through-hole structure with the oxidation between the fine through-hole 80 structures, can be used. The production rate is not difficult, and the materials used for the sound absorption of the electrodes of catalysts, filters, and batteries are applied in accordance with the law.

第28頁 593694 圖式簡單說明 〔圖式簡單說明〕 圖一 (a):係揭示習知粉末冶金前,毛胚中金屬粉 末藉由粘結劑聚合的鬆散分佈狀態示意圖。 圖一 (b):係揭示習知粉末冶金初期,毛胚中金屬 粉末已有部份開始聚結的狀態示意圖。 圖一 (c):係揭示習知粉末冶金中期,相聚結的金 屬粉末數量已逐漸增加的狀態示意圖。 圖"^ ( d) •係揭不習知粉末冶金完成時’金屬粉末 燒縮成密實狀的示意圖。Page 28 593694 Schematic description [Schematic illustration] Figure 1 (a): It is a schematic diagram showing the loose distribution state of the metal powder in the hair embryo polymerized by the binder before the conventional powder metallurgy. Figure 1 (b): It is a schematic diagram showing the state of the metal powder in the hair embryo that has started to agglomerate at the beginning of the conventional powder metallurgy. Figure 1 (c): It is a schematic diagram showing the state of gradually increasing the amount of agglomerated metal powders in the conventional powder metallurgy. Figure " ^ (d) • It is a schematic diagram showing that the metal powder is shrunk into a dense shape when the powder metallurgy is completed.

圖二(a):係揭示習知燒結初期,金屬粉末間具接 觸點及空孔分佈的示意圖。 圖二(b):係揭示圖二(a)中,接觸點逐漸延展成 接觸面的頸部形態示意圖。 圖二(c):係揭示圖二(b)中,頸部面積逐漸增加 且空孔體積逐漸減小的示意圖。 圖二(d):係揭示圖二(c)中,頸部面積已增加至 極大且空孔體積已縮減至極小的示意圖。 圖三(a):係揭示坊間以鐵粉在1 01 (噸)壓力下呈 現圓筒成形體的密度分佈不均狀態圖。 圖三(b):係揭示坊間以鐵粉在1 51 (噸)壓力下呈 現圓筒成形體的密度分佈不均狀態圖。 圖三(c) ··係揭示坊間以鐵粉在2 01 (噸)壓力下呈 現圓筒成形體的密度分佈不均狀態圖。 圖三(d):係揭示坊間以鐵粉在2 51 (噸)壓力下呈Figure 2 (a): It is a schematic diagram showing the distribution of contacts and voids between metal powders in the early stage of conventional sintering. Figure 2 (b): The schematic diagram of the neck shape of the contact surface in Figure 2 (a) is gradually revealed. Figure 2 (c): It is a schematic diagram showing that in Figure 2 (b), the neck area gradually increases and the void volume gradually decreases. Figure 2 (d): In Figure 2 (c), the neck area has been increased to a maximum and the void volume has been reduced to a minimum. Figure 3 (a): It shows the state of uneven density distribution of cylindrical shaped bodies with iron powder under a pressure of 1 01 (tons). Figure 3 (b): It is revealed that the density distribution of cylindrical shaped bodies in iron powder at a pressure of 1 51 (tons) is uneven. Figure 3 (c) reveals the state of uneven density distribution of cylindrical shaped bodies with iron powder at a pressure of 2 01 (tons). Figure 3 (d): It is revealed that the iron powder in the workshop is presented under the pressure of 2 51 (ton).

第29頁 593694 圖式簡單說明 現圓筒成形體的密度分佈不均狀態圖。 圖四:係揭示坊間將鐵粉置於壓胚内量測取得之密度 分佈不均的狀態圖。 圖五(a):係揭示坊間將鐵粉置於H / D = 0 · 4 2的壓胚 内施加壓力7 t / c m 2所測得之壓力分佈不均狀態圖。 圖五(b):係揭示坊間將鐵粉置於H/D = 0. 79的壓胚 内施加壓力7 t / c m 2所測得之壓力分佈不均狀態圖。 圖五(c):係揭示坊間將鐵粉置於H / D = 1 · 6 6的壓胚 内施加壓力7 t / c m 2所測得之壓力分佈不均狀態圖。 圖六(a):係揭示習知以斜方堆積金屬粉末與充填 物之球狀粒子的示意圖。 圖六(b):係揭示習知以立方堆積金屬粉末與充填 物之球狀粒子的示意圖。 圖七:係本發明揭示實施粉末冶金法的流程圖。 圖八:係本發明揭示實施熔煉法的流程圖。 圖九:係本發明揭示出燒結用基料均勻填塞在充填物 間的局部組織放大示意圖。 圖十:係本發明揭示金屬胚件局部組織的放大示意圖 〇 圖十一:係本發明揭示金屬胚件局部組織的立體放大 示意圖。 圖十二:係本發明揭示充填物粒徑D與頸部直徑X之間 的關係示意圖。 圖十三:係本發明揭示多孔金屬成品局部組織的立體P.29 593694 The figure is a brief illustration of the density distribution of the cylindrical shaped body. Figure 4: It is a diagram showing the state of uneven density distribution obtained by measuring iron powder in the embryo. Figure 5 (a): It is a diagram showing the pressure distribution unevenness measured when iron powder is placed in a compact with H / D = 0 · 4 2 and pressure is applied at 7 t / cm 2. Figure 5 (b): It is a diagram showing the state of uneven pressure distribution measured when iron powder is placed in a compact with H / D = 0.79 and pressure is applied at 7 t / cm 2. Figure 5 (c): It is a diagram showing the pressure distribution unevenness measured when iron powder is placed in a compact with H / D = 1 · 6 6 and pressure is applied at 7 t / cm 2. Figure 6 (a): A schematic diagram showing spherical particles in which metal powders and fillers are conventionally stacked in an oblique manner. Figure 6 (b): It is a schematic diagram showing the spherical particles of metal powders and fillers that are conventionally stacked in cubic. FIG. 7 is a flow chart of the powder metallurgy method disclosed in the present invention. FIG. 8 is a flow chart of the smelting method disclosed in the present invention. Fig. 9: The present invention reveals an enlarged schematic view of the local structure of the sintering base material evenly packed between the filling materials. Fig. 10: An enlarged schematic diagram of the partial tissue of the metal embryo according to the present invention. Fig. 11: An enlarged schematic diagram of the partial tissue of the metal embryo according to the present invention. Fig. 12 is a schematic diagram showing the relationship between the filler particle diameter D and the neck diameter X disclosed in the present invention. Figure 13: The three-dimensional perspective of the local structure of the finished porous metal product disclosed by the present invention

593694 圖式簡單說明 放大示意圖。 〔編號說明〕 配料1、1 Ο 充填物1 2、1 2 a 空隙1 4 混拌2 1 增塑劑2 3 預熱2 6 燒結2 7 卸除充填物3、3 0 清洗4、4 0 還原6、6 0 高週波爐7 1 低週波爐7 2 成品8 金屬粉末9、9a、9b 接觸點9 1 a 頸部 9 lb、9 lc、9 空孔 92a、92b、9 1—- 00 IX IX 程 料料製2 基基合2 用用聚劑 結鑄結結 燒熔燒黏 a 8 7 Λ 5 8 2 2 型 件^~_ 定 胚3 燥 屬劑 乾 金溶 ο 2 7 7 、 ο 程ο 4 5 製 τ—- Τ 、合7型 5聚爐成 乾煉溫注 烘熔保洗 通孔8 Ο、9 c 、9 d d c 2593694 Brief description of the drawing Enlarge the schematic. [Nomenclature] ingredients 1, 1 〇 filling 1 2, 1 2 a void 1 4 mixing 2 1 plasticizer 2 3 preheating 2 6 sintering 2 7 removing filling 3, 3 0 cleaning 4, 4 0 reduction 6, 6 0 High frequency furnace 7 1 Low frequency furnace 7 2 Finished product 8 Metal powder 9, 9a, 9b Contact point 9 1 a Neck 9 lb, 9 lc, 9 Hole 92a, 92b, 9 1-- 00 IX IX Process material system 2 base-based combination 2 using agglomerate casting and sintering sintering agglutination a 8 7 Λ 5 8 2 2 type parts ^ ~ _ fixed embryo 3 drying agent dry gold solution ο 2 7 7 、 程ο 4 5 making τ—- T, He 7 type 5 polymer furnace into dry smelting temperature injection baking cleaning and washing through hole 8 〇, 9 c, 9 ddc 2

ο d 2 2 τ—Iο d 2 2 τ—I

第31頁Page 31

Claims (1)

593694 f 告 表___ 一六·Ί會專利l&S 1 * 一種微細通孔組織的多孔金屬製法,係為粉末冶 金法,包括執行下列作業程序: 一配料作業;選用純金屬或其合金之粉末作為燒結用 基料,並選用可溶於水或鹼性溶劑的微細粉末作為充填物 ,該充填物的熔點必須高於燒結用基料的熔點; 一燒結聚合製程;將上述燒結用基料與充填物一起混 拌,並在混拌時添加黏結劑與增塑劑,使燒結用基料與充 填物均勻分佈並緻密堆疊,然後乾燥定型並預熱,以去除 充填物的水份,再以燒結溫度進行燒結,以製成緻密度較 好且已具微粒組織雛型的金屬胚件; 一卸除充填物作業;依上述金屬胚件中充填物可溶於 水或驗性溶劑的化學屬性,選配可相溶的溶劑,並在設有 超音波的清洗槽中,藉超音波的渦凹效應,把金屬胚件中 的充填物溶解清除,取得由燒結用基料編構形成微細通孔 組織的多孔半成品, 一清洗作業;係以清水沖洗上述多孔半成品之通孔孔 壁間的殘留溶劑;及, 另一烘乾作業;係烘乾上述清洗作業時殘留於多孔半 成品之通孔孔壁間的水份; 藉由上述作業程序,以產製出具有微細通孔組織的多 孔金屬成品。 2 ·如申請專利範圍第1項所述微細通孔組織的多孔 金屬製法,其中當燒結用基料選擇A1金屬或A1與Si、Mg、 C u或Ζ η合金的粉末時,充填物為選用CaCl2、MnO、NaCl、593694 f Report ___ 六 · Ί patent l & S 1 * A method of making porous metal with a fine through-hole structure, which is a powder metallurgy method, which includes the following procedures: a batching operation; the use of pure metals or their alloys The powder is used as a sintering base material, and a fine powder soluble in water or an alkaline solvent is selected as a filler. The melting point of the filling material must be higher than the melting point of the sintering base material; a sintering polymerization process; the sintering base material is used Mix with the filler, and add binders and plasticizers during the mixing, so that the sintering base and the filler are evenly distributed and densely stacked, then dried and shaped and preheated to remove the moisture of the filler, and then Sintering at the sintering temperature to make metal embryos with good density and micro-structures; one to remove the filler; the filler in the metal embryo can be dissolved in water or a test solvent. Properties, optional miscible solvents, and in the ultrasonic cleaning tank, using the ultrasonic vortex effect, the filler in the metal blank is dissolved and removed to obtain the sintering base material structure The porous semi-finished product forming a fine through-hole structure is a cleaning operation; the residual solvent between the walls of the through-holes of the porous semi-finished product is rinsed with water; and another drying operation is performed when the porous semi-finished product remaining during the cleaning operation is dried. Water content between the walls of the through-holes; through the above-mentioned operation procedure, a porous metal finished product with a fine through-hole structure is produced. 2 · The method for making a porous metal with a fine through-hole structure as described in item 1 of the scope of the patent application, wherein when the powder for the sintering base is A1 metal or A1 and Si, Mg, Cu or Z η alloy powder, the filler is selected CaCl2, MnO, NaCl, 第32頁 593694 六 申請專利範圍 ^~~ ^ -- Ti02、W03、V 20 3、ZnO或 Mg0 的微細粉末。 金 V 3 ·如申請專利範圍第丄項所述微細通孔組 屬製法,其中當燒結用基料選擇Cu金屬或Cu與z A1或P合金的粉末時,充填物為選用Mn〇、Ti〇、 20 3、ZnO或MgO的微細粉末。 2 3、 4 ·如申請專利範圍第χ項所述微細通孔 金屬製法,其中當燒結用基料選擇Fe金屬 := 物為,用TlG2、WG3、从、㈤或心⑽微^末充填 金屬製法,0其;項所述微細通孔組織的多孔 金的f東日4,右# A π用基料選擇Pb金屬或?1}與Sl^ 211合 、v Q刀 7、^ M 真物為選用 CaCl2、MnO、NaCb Ti〇2、W〇3 、V 20 3、ZnO或Mg〇的微細粉末。 6 ·如申請專 金屬製法,其中者j =圍第1項所述微細通孔組織的多孔 Cu合金的粉末時:::Λ用基料選擇仏金屬或仏與Li、A1或 、W(V ν〇 充真物為選用 CaCl2、MnO、NaCb Ti02 V · 1、 或Mg〇的微細粉末。 ( 如申言青專刹々Λτ 卜 金屬製法,其中合掉$圍第1項所述微細通孔組織的多孔 合金的粉末眸二乂、、、"用基料為選擇^111金屬或^111與?6或1^ _ WO, ν20, ΖΠΟ 8 ·如申請專利r η Μ 金屬製法,其中去掉=w弟1項所述微細通孔組織的多孔 、Co或Cr合金的二用基料為選擇Mo金屬或Mo與Fe、Ni 9 ·如申& : 日寸’充填物為選用MgO的微細粉末。 。月專利範圍第1項所述微細通孔組織的多孔Page 32 593694 VI Scope of Patent Application ^ ~~ ^-Fine powder of Ti02, W03, V 20 3, ZnO or Mg0. Gold V 3 · The fine through-hole assembly method as described in item 范围 of the scope of the patent application, in which when Cu metal or Cu and z A1 or P alloy powder is selected as the base material for sintering, the filler is selected from Mn0 and Ti. , 20 3, Fine powder of ZnO or MgO. 2 3, 4 · The method for making a fine through-hole metal as described in item χ of the scope of the patent application, where Fe metal is selected as the sintering base material: = T1G2, WG3, Cong, Ping, or Plein Production method, 0; the fine through-hole structure of the porous gold described in the item of Dongdong 4, right # A π Pb metal or? 1} combined with Sl ^ 211, vQ knife 7, ^ M The real thing is a fine powder selected from CaCl2, MnO, NaCb Ti02, W03, V203, ZnO, or Mg〇. 6 · If you apply for a special metal production method, where j = powder of a porous Cu alloy with a fine through-hole structure as described in item 1: ::: Use a base material to select 料 metal or 仏 with Li, A1, or W (V The ν〇 charge is a fine powder selected from CaCl2, MnO, NaCb Ti02 V · 1, or Mg〇. (For example, the method of making metal for the Qing Dynasty special brake τ ττ, where the fine through-hole structure described in item 1 above is omitted. The powder of porous alloys is made of ^ 111 metal or ^ 111 and? 6 or 1 ^ _ WO, ν20, ZnΠ 8. For example, if the patent application method of r η Μ is used, remove = w The porous, Co or Cr alloy base material of the fine through-hole structure described in item 1 is selected from Mo metal or Mo and Fe, Ni 9 · Rushen &: Ricci 'filling is a fine powder of MgO. Porosity of the fine through-hole structure described in the first item of the monthly patent scope 第33頁 593694 六、申請專利範圍 金屬製法,其中當燒結用基料選擇N i金屬或N i與F e、C r、 Mo或Co合金的粉末時,充填物為選用 MnO、Ti02、W〇3、 V 2〇3、ZnO或MgO的微細粉末。 1 0 ·如申請專利範圍第1項所述微細通孔組織的多 孔金屬製法,其中當燒結用基料選擇Ag金屬或Ag與Cu合金 的粉末時,充填物為選用MnO 、Ti〇2、W〇3、V 20 3、ZnO或 MgO的微細粉末。 1 1 ·如申請專利範圍第1項所述微細通孔組織的多 孔金屬製法,其中當燒結用基料選擇Sn金屬或Sn與Pb、Cu 或Bi合金的粉末時,充填物為選用 CaCl2、MnO> NaCl> T i 0 2、W0 3、V 20 3、ZnO或 MgO的微細粉末。 1 2 ·如申請專利範圍第1項所述微細通孔組織的多 孔金屬製法,其中當燒結用基料選擇W金屬或W與N i、Cu或 A g合金的粉末時,必須在配料時加入N i的粉末,並選用充 填物為MnO、T i 0 2、W0 3、V 20 3、ZnO或MgO的微細粉末。 1 3 ·如申請專利範圍第1項所述微細通孔組織的多 孔金屬製法,其中當燒結用基料選擇V金屬或V與Mo、N i、 Co或Ti合金的粉末時,充填物為選用W03、V 20 3、ZnO或MgO 的微細粉末。 1 4 ·如申請專利範圍第1項所述微細通孔組織的多 孔金屬製法,其中當燒結用基料選擇T i金屬或T i與A卜N i 或Co合金的粉末時,充填物為選用W0 3、V 20 3、ZnO或MgO的 微細粉末。 1 5 *如申請專利範圍第1項所述微細通孔組織的多Page 33, 593694 VI. Patent application metal production method, in which when the base material for sintering is selected from Ni metal or powder of Ni and Fe, Cr, Mo or Co alloy, the filling material is MnO, Ti02, W. 3. Fine powder of V203, ZnO or MgO. 10 · The method for producing a porous metal with a fine through-hole structure as described in item 1 of the scope of the patent application, wherein when Ag metal or Ag and Cu alloy powder is selected as the sintering base material, the filling material is MnO, Ti〇2, W 〇3, V 20 3, ZnO or MgO fine powder. 1 1 · The method for making porous metal with a fine through-hole structure as described in item 1 of the scope of patent application, wherein when the sintering base is selected from Sn metal or powders of Sn and Pb, Cu, or Bi alloy, the filler is selected from CaCl2, MnO & gt NaCl > Fine powder of T i 0 2, W0 3, V 20 3, ZnO or MgO. 1 2 · The method for producing a porous metal with a fine through-hole structure as described in item 1 of the scope of the patent application, wherein when the sintering base is selected from the powder of W metal or W and Ni, Cu or Ag alloy, it must be added during the batching The powder of Ni is a fine powder with MnO, Ti 0, W0 3, V 20 3, ZnO or MgO as the filler. 1 3 · The method for producing a porous metal with a fine through-hole structure as described in item 1 of the scope of the patent application, wherein when V metal or a powder of V and Mo, Ni, Co, or Ti alloy is selected as the sintering base material, the filling material is selected W03, V 20 3, fine powder of ZnO or MgO. 1 4 · The method for producing a porous metal with a fine through-hole structure as described in item 1 of the scope of patent application, wherein when the base material for sintering is selected from Ti metal or Ti and Ab Ni or Co alloy powder, the filler is selected W0 3, V 20 3, fine powder of ZnO or MgO. 1 5 * As described in item 1 of the patent application, 第34頁 593694 六、申請專利範圍 孔金屬製法,其中充填物/燒結用基料的體積配比是> 1 〇 1 6 ·如申請專利範圍第1項所述微細通孔組織的多 孔金屬製法,其中當充填物為CaC 1 2時,係選用可相溶的 CH3CH2OH (乙醇,酒精)作為溶劑。 1 7 ·如申請專利範圍第1 6項所述微細通孔組織的 多孔金屬製法,其中該溶劑是合適以A 1、Pb、Mg或Sη等純 金屬或其合金作為燒結用基料時使用。 1 8 ·如申請專利範圍第1項所述微細通孔組織的多 孔金屬製法,其中當充填物為 ΜηΟ時,係選用可相溶的 NH4C1作為溶劑。 1 9 ·如申請專利範圍第1 8項所述微細通孔組織的 多孔金屬製法,其中該溶劑是合適以C u、F e、M g、Μ η或N i 等純金屬或其合金作為燒結用基料時使用。 2 0 ·如申請專利範圍第1項所述微細通孔組織的多 孔金屬製法,其中當充填物為NaC 1時,係選用可相溶的冷 水或熱水作為溶劑。 2 1 ·如申請專利範圍第2 0項所述微細通孔組織的 多孔金屬製法,其中該溶劑是合適以A卜Pb、Mg或Sη等純 金屬或其合金作為燒結用基料時使用。 2 2 ·如申請專利範圍第1項所述微細通孔組織的多 孔金屬製法,其中當充填物為T i 0 2時,係選用可相溶的 NaOH或 K0H作為溶劑。 2 3 ·如申請專利範圍第2 2項所述微細通孔組織的Page 34 593694 VI. Patented porous metal production method, in which the volume ratio of the filler / sintering base is > 1 〇 1 6 · Porous metal production method as described in item 1 of the patented application Among them, when the filling material is CaC 1 2, compatible CH3CH2OH (ethanol, alcohol) is used as the solvent. 17 · The porous metal production method according to item 16 of the scope of patent application, wherein the solvent is suitable for use when pure metals such as A 1, Pb, Mg, or Sη or their alloys are used as the base material for sintering. 1 8 · The method for making a porous metal with a fine through-hole structure as described in item 1 of the scope of patent application, wherein when the filling material is Mn0, compatible NH4C1 is used as the solvent. 19 · A method for producing a porous metal with a fine through-hole structure as described in item 18 of the scope of the patent application, wherein the solvent is suitable for sintering pure metals such as Cu, Fe, Mg, Mη, or Ni, or alloys thereof Use when using binder. 2 0. The method for making a porous metal with a fine through-hole structure as described in item 1 of the scope of the patent application, wherein when the filling material is NaC 1, compatible cold or hot water is used as the solvent. 2 1 · The method for producing a porous metal with a fine through-hole structure as described in item 20 of the scope of the patent application, wherein the solvent is suitable for use as a base material for sintering when a pure metal such as Alb, Pb, Mg, or Sη is used. 2 2 · The method for making a porous metal with a fine through-hole structure as described in item 1 of the scope of the patent application, wherein when the filling material is Ti 02, compatible NaOH or KOH is used as the solvent. 2 3 · The fine through-hole structure as described in item 22 of the scope of patent application 第35頁 593694 六、申請專利範圍 多孔金屬製法,其中該溶劑是合適以Cu、Fe、Mn、Ni或Mg 等純金屬或其合金作為燒結用基料時使用。 2 4 ·如申請專利範圍第1項所述微細通孔組織的多 孔金屬製法,其中當充填物為 W0 3時,係選用可相溶的 NaOH或 KOH作為溶劑。 2 5 *如申請專利範圍第2 4項所述微細通孔組織的 多孔金屬製法,其中該溶劑是合適以C u、F e、Μ η、N i、A g 、乂或T i等純金屬或其合金作為燒結用基料時使用。 2 6 ·如申請專利範圍第1項所述微細通孔組織的多 _ 孔金屬製法,其中當充填物為 V 20 3時,係選用可相溶的 NaOH或 K0H作為溶劑。 2 7 ·如申請專利範圍第2 6項所述微細通孔組織的 多孔金屬製法,其中該溶劑是合適以C u、F e、Μ η、N i、A g 、又或T i等純金屬或其合金作為燒結用基料時使用。 2 8 ·如申請專利範圍第1項所述微細通孔組織的多 孔金屬製法,其中當充填物為 ZnO時,係選用可相溶的 NaOH或 K0H作為溶劑。 2 9 ·如申請專利範圍第2 8項所述微細通孔組織的 多孔金屬製法,其中該溶劑是合適以C u、F e、Μ η ' N i、A g 、又或T i等純金屬或其合金作為燒結用基料時使用。 3〇·如申請專利範圍第1項所述微細通孔組織的多 孔金屬製法,其中當充填物為 MgO時,係選用可相溶的 NH4〇H或 NH4C1作為溶劑。 3 1 ·如申請專利範圍第3 0項所述微細通孔組織的Page 35 593694 VI. Scope of patent application Porous metal production method, in which the solvent is suitable for the use of pure metals such as Cu, Fe, Mn, Ni, or Mg or their alloys as the base material for sintering. 2 4 · The method for making a porous metal with a fine through-hole structure as described in item 1 of the scope of patent application, wherein when the filling material is W0 3, compatible NaOH or KOH is used as the solvent. 2 5 * A method for preparing a porous metal with a fine through-hole structure as described in item 24 of the scope of the patent application, wherein the solvent is a pure metal suitable for Cu, Fe, Mn, Ni, Ag, 乂, or Ti It is used when it is used as a sintering base. 2 6 · The method of making porous metal with a fine through-hole structure as described in item 1 of the scope of patent application, wherein when the filler is V 20 3, compatible NaOH or K0H is used as the solvent. 2 7 · A method for preparing a porous metal with a fine through-hole structure as described in item 26 of the scope of patent application, wherein the solvent is a pure metal suitable for Cu, Fe, Mn, Ni, Ag, or Ti It is used when it is used as a sintering base. 2 8 · The method for making a porous metal with a fine through-hole structure as described in item 1 of the scope of patent application, wherein when the filler is ZnO, compatible NaOH or KOH is used as the solvent. 2 9 · The method for preparing a porous metal with a fine through-hole structure as described in item 28 of the scope of the patent application, wherein the solvent is a pure metal suitable for Cu, Fe, Mn'Ni, Ag, or Ti It is used when it is used as a sintering base. 30. The method for making a porous metal with a fine through-hole structure as described in item 1 of the scope of the patent application, wherein when the filling material is MgO, NH4OH or NH4C1, which are miscible, are used as the solvent. 3 1 · The fine through-hole structure as described in item 30 of the scope of patent application 第36頁 六、申請專利範圍 夕孔金屬製法,其中該溶劑是合適 、y、了!或Mo等純金屬或其合金作為焯、Fe、.、…、Ag 3 2 ·如申請專利範圍第丄項所^ %用基料時使用。 孔金屬製法,其中該去除充填物水份=微細通孔組織的多 〜700 °C。 的預熱溫度係在500 3 3 ·如申請專利範圍第丄項 孔金屬製法,其中該燒結溫度係在^ (細通孔組織的多 上至充填物熔點以下的範圍内。 σ用基料熔點1 / 2以 3 4 .如申請專利範圍第丄項 孔金屬製法,其中該清洗作業係古L ^細通孔組織的多 進行。 〃 °又有超音波的清洗槽内 3 5 ·如申請專利範圍第丄 孔金屬製法’其中該洪乾作業係在以組織的多 孔全】2::::;圍第1項所織的多 率為100〜140 GHz ,波長為。爐内進仃,镟波頻 3 7 ·如申請專利範圍第丄 孔金屬製法中該充填物 」^細通孔組織的多 作業後進行一還原處理,以除 日^,必須在完成烘乾 38 .如申請專利範圍1 =化層(膜)。 多孔金屬製法,其中該還々 a,所达微細通孔組織的 品置入-真空爐内,並=理”:共乾後,多:L金屬成 反應,藉以去除微細通孔%巧2 1 ;:亂體作還原乳化物的 39 .如申請專利㈡=氧化層⑷。 軛N弟3 7項所述微細通孔組織的 第37頁 593694 4 料’並 且該充 煉聚合 低週波 煉後植 得均勻 使固體 用基料 的金屬 除充填 溶劑的 清洗槽 溶解清 孔半成 洗作業 留溶劑 六、申請專利範圍 多孔金屬製法, )的溶劑,將微 4 0 ·如申 多孔金屬製法, ΝΗ40Η。 種 法,包括執行下 一配料作業 炫禱用基 充填物, 一熔 置入高或 、溶煉,熔 照射,取 型作業, 融狀熔鑄 組織雛型 一卸 水或鹼性 超音波的 的充填物 組織的多 一清 壁間的殘 其中該還原處 細通孔組織間 請專利範圍第 其中該溶劑係 微細通 列作業 ;選用 選用可 填物的 製程; 爐内, 入南或 的混择 微粒狀 間’待 胚件; 物作業 化學屬 中,藉 除,取 口 · 口口 , :係以 :及, 孔組織 程序: 高或低 溶於水 熔點必 將上述 以週波 低週波 作用, 的充填 冷卻後 :依上 性,選 超音波 得由燒 清水沖洗上述多孔半成品之通孔孔 理是採用可溶解氧化層(膜 的氧化層(膜)溶解清除。 3 9項所述微細通孔組織的 為 NaOH、 KOH、 NH4C1 或 的多孔金屬製法,係為炫煉 熔點純金屬或合金材料作為 或鹼性溶劑的微細粉末作為 須高於熔鑄用基料的熔點; 熔鑄用基料以及上述充填物 感應產生磁力循環攪拌進行 爐前的保溫爐内配設超音波 隨後進行快速的真空澆注成 物均勻分佈並緻密堆疊在熔 形成為已具熔煉聚合之微粒 述金屬胚件中充填物可溶於 配可相溶的溶劑,並在設有 的渦凹效應,把金屬胚件中 結用基料編構形成微細通孔Page 36 6. Scope of patent application Xikong metal production method, where the solvent is suitable Or pure metals such as Mo or alloys thereof as rhenium, Fe, ..., Ag 3 2 · Used as the base material for ^% of the scope of the patent application. Porous metal method, in which the moisture content of the filler is removed ~ 700 ° C more than the fine through-hole structure. The preheating temperature is 500 3 3 · As in the patent application for item 丄 of the porous metal production method, the sintering temperature is in the range of ^ (the number of fine through-hole structures is up to the melting point of the filler. Σ is the melting point of the base material 1/2 to 34. For example, the method of making hole metal in item 制 of the patent application scope, in which the cleaning operation is performed by the ancient L ^ fine through-hole organization. 〃 ° Ultrasonic cleaning tank 3 5 · If applying for a patent The scope of the 丄 hole metal production method 'where the Honggan operation is based on the porous structure of the organization] 2 ::::; The multi-rate weaving around the 1st item is 100 ~ 140 GHz, the wavelength is. Wave frequency 3 7 · If the filling material in the patented metal method of the scope of patent application "^ through the multi-hole structure of the through-hole operation, a reduction treatment is performed to remove the day ^, and drying must be completed. 38 = Chemical layer (film). The method of making porous metal, in which the microstructure of the obtained through-hole structure is placed in a vacuum furnace, and the reason is: after co-drying, more: L metal reacts to remove Fine through-holes% 2 2 1 :: 39 as a reduced emulsified substance. For example, the patent application ㈡ = oxygen Layer yoke. The fine through-hole structure described in item 7 on page 37 of 5973694. The material is planted uniformly after low-frequency refining, so that the metal of the solid base is removed from the cleaning tank filled with the solvent. Porous semi-washing operation retains the solvent. 6. The patent application scope of the porous metal production method, the solvent) will be micro 40. Rushen porous metal production method, ΝΗ40Η. This method includes performing the next batching operation to show the basic filling material. Melting into high or low temperature, melting, melting irradiation, taking out operations, melting smelting casts, prototypes, unloading water or alkaline ultrasonic fillings, more than one residue between the clear walls, and a fine through hole at the reduction point For the organization, please refer to the scope of the patent, where the solvent is a fine-grained operation; choose the process that can be filled; use the furnace, enter the south or mix the particulates between the embryos; the material operation is in the chemical genus, borrow, remove Mouth · Mouth mouth: Department of: and, Pore organization program: High or low solubility in water Melting point will effect the above-mentioned cycle with low frequency. After cooling and filling: Dependency, choose ultrasonic The porous pores of the porous semi-finished product can be washed with boiling water by dissolving and dissolving the soluble oxide layer (film oxide layer (film)). 3 The fine through-hole structure described in item 9 is a porous metal such as NaOH, KOH, NH4C1 or porous metal. The manufacturing method is to smelt the fine powder of pure metal or alloy material as melting point or alkaline solvent as the melting point of the base material for melting and casting. Equipped with ultrasonic waves and then quickly vacuum cast the uniformly distributed products and densely stack them in the metal blanks that are melted to form particles that have been melted and polymerized. The fillers are soluble in miscible solvents, and Concavity effect, forming fine through-holes by structuring the base material of the metal blank 第38頁 593694 六、申請專利範圍 另一烘乾作業;係烘乾上述清洗作業時殘留於多孔半 成品之通孔孔壁間的水份; 藉由上述作業程序,以產製出具有微細通孔組織的多 孔金屬或合金成品。 4 2 ·如申請專利範圍第4 1項所述微細通孔組織的 多孔金屬製法,其中當以高熔點純金屬或合金材料作為熔 鑄用基料時,必須使用高週波爐進行熔煉。 _ 4 3 ·如申請專利範圍第4 1項所述微細通孔組織的 多孔金屬製法,其中該高熔點熔鑄用基料為使用Cu金屬或 Cu與Zn 、Sn、A1或P合金的材料時,充填物為選用MnO、 Ti02、W03、V 20 3、ZnO或 MgO的微細粉末。 4 4 ·如申請專利範圍第4 1項所述微細通孔組織的 多孔金屬製法,其中該高熔點熔鑄用基料為使用F e金屬的 材料時,充填物為選用Mn〇、Ti02、W03、V 20 3、ZnO或MgO 的微細粉i 〇 _〜一 _ ’ 4 5 ·如申請專利範圍第4 1項所述微細通孔組織的 多孔金屬製法,其中該高熔點熔鑄用基料為使用Μη金屬或 Μη與Fe或Ni合金的材料時,充填物為選用MnO、Ti02、W03 、V 20 3、Ζ η 0或 M g 0的微細粉末。 4 6 ·如申請專利範圍第4 1項所述微細通孔組織的 多孔金屬製法,其中該高熔點熔鑄用基料為使用Mo金屬或 Μ◦與Fe、Ni、C◦或Cr合金的材料時,充填物為選用MgO的 微細粉末。 4 7 ·如申請專利範圍第4 1項所述微細通孔組織的P.38 593694 VI. Another drying operation in the scope of patent application; drying the water remaining between the walls of the through holes of the porous semi-finished product during the above cleaning operation; through the above operating procedures, micro-holes with fine through holes are produced. Finished porous metal or alloy structure. 4 2 · The method for producing a porous metal with a fine through-hole structure as described in item 41 of the scope of patent application, wherein when a high-melting pure metal or alloy material is used as the base material for melting and casting, a high frequency furnace must be used for melting. _ 4 3 · The method for making a porous metal with a fine through-hole structure as described in item 41 of the scope of patent application, wherein the base material for high-melting melting casting is a material using Cu metal or Cu and Zn, Sn, A1, or P alloy, The filler is a fine powder selected from MnO, Ti02, W03, V 20 3, ZnO or MgO. 4 4 · The method for producing a porous metal with a fine through-hole structure as described in item 41 of the scope of patent application, wherein when the base material for high melting point melting is a material using Fe metal, the filling material is selected from Mn0, Ti02, W03, V 20 3. Fine powder of ZnO or MgO i 〇_〜 一 _ '4 5 · The porous metal manufacturing method of the fine through-hole structure as described in item 41 of the patent application scope, wherein the base material for the high melting point casting uses Μη For metal or Mη and Fe or Ni alloy materials, the filler is fine powder selected from MnO, Ti02, W03, V 20 3, Z η 0 or M g 0. 4 6 · The method for producing a porous metal with a fine through-hole structure as described in item 41 of the scope of patent application, wherein the base material for the high-melting melting casting is a material using Mo metal or M◦ and Fe, Ni, C◦, or Cr alloy The filling is a fine powder of MgO. 4 7 · The fine through-hole structure as described in item 41 of the scope of patent application 第39頁 593694 六、申請專利範圍 多孔金屬製法,其中該高熔點熔鑄用基料為使用N i金屬或 N i與F e、C r、Μ 〇或C 〇合金的材料聘,充填物為選用 Μ η 0、 T i 0 2、WO 3、V 20 3、Ζη0或 Mg0的微細粉末。 4 8 ·如申請專利範圍第4 1項所述微細通孔組織的 多孔金屬製法,其中該高熔點熔鑄用基料為使用Ag金屬或 Ag與Cu合金的材料時,充填物為選用MnO、Ti02、W03、 V 2〇3、Ζ η 0或M g 0的微細粉末。 _ 4 9 。如申請專利範圍第4 1項所述微細通孔組織的 多孔金屬製法,其中該高熔點熔鑄用基料為使用W金屬或W 與N i、Cu或Ag合金的材料時,必須在配料時加入N i的粉末 ,並選用充填物為MnO、T i 0 2、W0 3、V 2〇3、ZnO或MgO的微 細粉末。 5 0 ·如申請專利範圍第4 1項所述微細通孔組織的 多孔金屬製法,其中該高熔點熔鑄用基料為使用V金屬或V 與Mo、Ni、Co或Ti合金的材料時,充填物為選用W03、V203 、ZnO或MgO的微細粉末。 5 1 ·如申請專利範圍第4 1項所述微細通孔組織的 m 多孔金屬製法,其中該高熔點熔鑄用基料為使用T i金屬或 Ti與A卜Ni或Co合金的材料時,充填物為選用 W03、 V 20 3 、ZnO或MgO的微細粉末。 5 2 ·如申請專利範圍第4 1項所述微細通孔組織的 多孔金屬製法,其中當充填物為CaC 1 2時,係選用可相溶 的CH3CH20H (乙醇,酒精)作為溶劑。 5 3 ·如申請專利範圍第5 2項所述微細通孔組織的Page 39593694 6. Patent application scope Porous metal production method, in which the base material for high-melting melting casting is made of Ni metal or Ni and Fe, Cr, M0 or C0 alloy, and the filler is optional Fine powder of M η 0, T i 0 2, WO 3, V 20 3, Zη0 or Mg0. 4 8 · The porous metal manufacturing method according to item 41 of the scope of patent application, wherein when the base material for high-melting melting casting is made of Ag metal or Ag and Cu alloy, the filling material is MnO, Ti02 , W03, V203, Zη0 or Mg0. _ 4 9. The method for making a porous metal with a fine through-hole structure as described in item 41 of the scope of patent application, wherein when the base material for high melting point melting is a material using W metal or W and Ni, Cu or Ag alloy, it must be added during the batching Ni powder, and fine powder with fillers of MnO, Ti 0, W0 3, V203, ZnO or MgO is selected. 50. The method for producing a porous metal with a fine through-hole structure as described in item 41 of the scope of the patent application, wherein the base material for the high-melting melting casting is a material using V metal or V and Mo, Ni, Co, or Ti alloy, and filling The material is a fine powder selected from W03, V203, ZnO or MgO. 5 1 · The method for making m porous metal with a fine through-hole structure as described in item 41 of the scope of patent application, wherein the base material for high-melting melting casting is made of Ti metal or Ti and Al or Ni alloy or Co alloy The material is a fine powder selected from W03, V 20 3, ZnO or MgO. 5 2 · The method for making porous metal with a fine through-hole structure as described in item 41 of the scope of patent application, wherein when the filling is CaC 1 2, compatible CH3CH20H (ethanol, alcohol) is used as the solvent. 5 3 · The fine through-hole structure as described in Item 52 of the scope of patent application 第40頁 593694 六、申請專利範圍 多孔金屬製法,其中該 金屬或其合金作為燒結 5 4 ·如申請專利 多孔金屬製法,其中當 NH4C1作為溶劑。 5 5 ·如申請專利 多孔金屬製法,其中該 等純金屬或其合金作為 5 6 ·如申請專利 多孔金屬製法,其中當 冷水或熱水作為溶劑。 5 7 ·如申請專利 多孔金屬製法,其中該 純金屬或其合金作為燒 5 8 ·如申請專利 多孔金屬製法,其中當 的NaOH或KOH作為溶劑< 5 9 ·如申請專利 多孔金屬製法,其中該 等純金屬或其合金作為 6 0 ·如申請專利 多孔金屬製法,其中當 NaOH或K0H作為溶劑。 6 1 ·如申請專利 溶劑是合適以A卜Pb、Mg或Sn等純 用基料時使用。 範圍第4 1項所述微細通孔組織的 充填物為MnO時,係選用可相溶的 範圍第5 4項所述微細通孔組織的 溶劑是合適以C u、F e、M g、Μ η或N i 燒結用基料時使用。 範圍第4 1項所述微細通孔組織的 充填物為NaCl時,係選用可相溶的 範圍第5 6項所述微細通孔組織的 溶劑是合適以A 1、P b、M g或 S η等 結用基料時使用。 範圍第4 1項所述微細通孔組織的 充填物為 T i 0 2時,係選用可相溶 範圍第5 8項所述微細通孔組織的 溶劑是合適以C u、F e、Μ η、N i或M g 燒結用基料時使用。 範圍第4 1項所述微細通孔組織的 充填物為W 0 3時,係選用可相溶的 範圍第6 0項所述微細通孔組織的Page 40 593694 VI. Application scope of patent The method of making porous metal, in which the metal or its alloy is used for sintering. 5 4. For example, the method of making porous metal, in which NH4C1 is used as the solvent. 5 5 · Patented porous metal production method, where these pure metals or their alloys are used as 5 6 · Patented porous metal production method, where cold or hot water is used as the solvent. 5 7 · As a patented porous metal manufacturing method, wherein the pure metal or its alloy is used as a fire 5 8 · As a patented porous metal manufacturing method, where the current NaOH or KOH is used as a solvent < 5 9 · As a patented porous metal manufacturing method, where These pure metals or their alloys are used as 60. For example, the patented porous metal manufacturing method uses NaOH or KOH as a solvent. 6 1 · If applying for a patent, the solvent is suitable for pure base materials such as Ab, Pb, Mg or Sn. When the filling material of the fine through-hole structure described in item 41 of the range is MnO, a solvent compatible with the fine through-hole structure described in item 54 of the range is suitable. Cu, Fe, Mg, M η or Ni is used for sintering. When the filling material of the fine through-hole structure described in the item 41 of the range is NaCl, a solvent compatible with the fine through-hole structure described in the item 56 of the range is suitable as A 1, P b, M g, or S. η, etc. are used when forming binders. When the filling material of the fine through-hole structure described in the item 41 of the range is T i 02, the solvent for the fine through-hole structure described in the compatible item of the item 58 is suitable to be Cu, F e, M η , Ni or M g are used for sintering. When the filling material of the fine through-hole structure described in item 41 of the range is W 0 3, it is compatible with the fine through-hole structure described in the item 60 of range. 第41頁 593694 六、申請專利範圍 多孔金屬製法,其中該溶劑是合適以C u、F e、Μ η、N i、A g 、又或T i等純金屬或其合金作為燒結用基料時使用。 6 2 *如申請專利範圍第4 1項所述微細通孔組織的 多孔金屬製法,其中當充填物為 V 20 3時,係選用可相溶 的N a Ο Η或Κ Ο Η作為溶劑。 6 3 ·如申請專利範圍第6 2項所述微細通孔組織的 多孔金屬製法,其中該溶劑是合適以C u、F e、Μ η、N i、A g 、乂或T i等純金屬或其合金作為燒結用基料時使用。Page 41 593694 VI. Patent application method for porous metal production, in which the solvent is suitable to use pure metals such as Cu, Fe, Mn, Ni, Ag, or Ti as the base material for sintering use. 6 2 * The porous metal production method according to item 41 of the scope of the patent application, wherein when the filling material is V 20 3, compatible N a Η Κ or Κ Ο 选用 is used as the solvent. 6 3 · The method for producing a porous metal with a fine through-hole structure as described in item 62 of the scope of the patent application, wherein the solvent is a pure metal suitable for Cu, Fe, Mn, Ni, Ag, 乂, or Ti It is used when it is used as a sintering base. 6 4 *如申請專利範圍第4 1項所述微細通孔組織的 多孔金屬製法,其中當充填物為ZnO時,係選用可相溶的 NaOH或K0H作為溶劑。 6 5 ·如申請專利範圍第6 4項所述微細通孔組織的 多孔金屬製法,其中該溶劑是合適以C u、F e、Μ η、N i、A g 、乂或T i等純金屬或其合金作為燒結用基料時使用。 6 6 ·如申請專利範圍第4 1項所述微細通孔組織的 多孔金屬製法,其中當充填物為MgO時,係選用可相溶的 ΝΗ40Η或NH4C1作為溶劑。6 4 * The porous metal production method according to item 41 of the scope of patent application, wherein when the filling material is ZnO, compatible NaOH or KOH is used as the solvent. 6 5 · The method for preparing a porous metal with a fine through-hole structure as described in item 64 of the scope of the patent application, wherein the solvent is a pure metal suitable for Cu, Fe, Mn, Ni, Ag, 乂, or Ti It is used when it is used as a sintering base. 6 6 · The porous metal production method according to item 41 of the scope of patent application, wherein when the filling material is MgO, compatible NHΗ40Η or NH4C1 is used as the solvent. 6 7 ·如申請專利範圍第6 6項所述微細通孔組織的 多孔金屬製法,其中該溶劑是合適以Cu、Fe、Mn、N i、Ag 、V、T i或Mo等純金屬或其合金作為燒結用基料時使用。 6 8 ·如申請專利範圍第4 1項所述微細通孔組織的 多孔金屬製法,其中該充填物/高或低熔點熔鑄用基料的 體積配比是> 1。 6 9 ·如申請專利範圍第4 1項所述微細通孔組織的 593694 六、申請專利範圍 多孔金屬製法,其中 基料的熔點但低於充 7 0 ·如申請專 多孔金屬製法,其中 内進行。 7 1 ·如申請專 多孔金屬製法,其中 7 2 ·如申請專 多孔金屬製法,其中 頻率為100〜140GHz, 7 3 ·如申請專 多孔金屬製法,其中 乾作業後進行一還原 7 4 ·如申請專 多孔金屬製法,其中 品置入一真空爐内, 應,猎以去除微細通 7 5 ·如申請專 多孔金屬製法,其中 )的溶劑,將微細通 7 6 ·如申請專 多孔金屬製法,其中 NH4OH。 7 7 ·如申請專6 7 · The method for preparing a porous metal with a fine through-hole structure as described in item 6 of the scope of the patent application, wherein the solvent is a pure metal such as Cu, Fe, Mn, Ni, Ag, V, Ti, or Mo, or the like The alloy is used as a base material for sintering. 6 8 · The method for producing a porous metal with a fine through-hole structure as described in item 41 of the scope of the patent application, wherein the volume ratio of the filler / base material for high or low melting point casting is > 1. 6 9 · As for the fine through-hole structure as described in item 41 of the patent application 593694 6. Method of patent application for porous metal production, where the melting point of the base material is less than 70%. · For application of special porous metal production method, which is carried out within . 7 1 · If applying for the special porous metal method, of which 7 2 · If applying for the special porous metal method, where the frequency is 100 ~ 140GHz, 7 3 · If applying for the special porous metal method, where a reduction is performed after the dry operation 7 4 · If applying Special porous metal production method, where the product is placed in a vacuum furnace, should be hunted to remove the fine pass 7 5 · If applying for the special porous metal production method, where) the solvent, the fine pass 7 6 · If applying for the special porous metal production method, where NH4OH. 7 7 · If applying for 該熔煉溫度係高於高或低熔點熔鑄用 填物的熔點。 利範圍第4 1項所述微細通孔組織的 該清洗作業係在設有超音波的清洗槽 利範圍第4 1項所述微細通孔組織的 該烘乾作業係在紅外線爐内進行。 利範圍第4 1項所述微細通孔組織的 該烘乾作業係在微波爐内進行,微波 波長為1 m m〜1 m。 利範圍第4 1項所述微細通孔組織的 該充填物為氧化物時,必須在完成烘 處理,以除去氧化層(膜)。 利範圍第7 3項所述微細通孔組織的 該還原處理是將烘乾後之多孔金屬成 並注入Η還原氣體作還原氧化物的反 孔組織間的氧化層(膜)。 利範圍第7 3項所述微細通孔組織的 該還原處理是採用可溶解氧化層(膜 孔組織間的氧化層(膜)溶解清除。 利範圍第7 5項所述微細通孔組織的 該溶劑係為 NaOH、 KOH、 NH4C1或 利範圍第4 1項所述微細通孔組織的This smelting temperature is higher than the melting point of the filler for high or low melting point casting. The cleaning operation of the fine through-hole structure according to item 41 of the scope of interest is performed in a washing tank provided with an ultrasonic wave. The drying operation of the fine through-hole structure according to the scope of item 41 of this scope is performed in an infrared oven. The drying operation of the fine through-hole structure described in item 41 of the scope of interest is performed in a microwave oven with a microwave wavelength of 1 m to 1 m. When the filling material of the fine through-hole structure described in item 41 of the scope of interest is an oxide, it is necessary to complete the baking treatment to remove the oxide layer (film). The reduction process of the fine through-hole structure described in Item 73 of this invention is to form an oxide layer (film) between the anti-porous structures of the porous metal after drying and injecting a tritium reducing gas as a reducing oxide. The reduction treatment of the fine through-hole tissues described in Item 73 is performed by dissolving and dissolving the soluble oxide layer (the oxide layer (film) between the membrane pore tissues.) The solvent is NaOH, KOH, NH4C1 or the fine through-hole structure described in item 41 of the range. 第43頁 593694 、申請專利範圍 多 =:^法’其中當以低溶點純金屬或合 鸲用基料時,必須使用低週波爐進行熔煉。 了十作為熔 7 8 .如申請專利範圍第4 i項 多孔金屬製法,其中該低炼點炫_料為 A1與Si、Mg、Cu或Zn合金的材料時,充填物 二屬或 、MnO、NaCl、Ti02、W03、ν?〇、7η(Η Μ η 用 CaC1 2 7 9 .如申請專利範圍第4丄項所、μ末。 多孔金屬製法’其中該低熔點炫鑄用基料為:二:織的 Pb與Sn或Ζη合金的材料時,充填物為選用’、、=Pb金屬或 MaC1、Tl〇2、W〇3、V2〇3、Zn(^Mg⑽微細粉末 Mn〇、 8 0 ·如申請專利範圍第4 i項 多孔金屬製法,其中該低熔點炼鑄用二二ι孔組織的 Μ—、A域Cu合金的材料時,使用心金屬或 、NaH、Tl〇2、W〇3、V2〇3、為遠用 CaCl2、MnO 3 V 2u3 Zn〇或Mg〇的微細 8 1 ·如申請專利範圍第4 i項所 多孔金屬製法,其中該低熔點熔鑄用基=f、、、田通孔組織的 Ag與Cu合金的材料時,充填物為選用土Mn〇=屬或 V 20 3、ZnO或 MgO的微細粉末。 ΐιϋ2、W03、 8 2 ·如申請專利範圍第4 1 多孔金屬製法’其中該低熔點熔鑄用c通孔組織的 Sn與Pb、Cii或Bi合金的材料時,奋搶=二為使用Sn金屬或 、NaCl、TiO、WO、V0 ί 、為遠用 CaCl2、ΜηΟ NaC1 Tl〇2 W〇3 V2〇3、Zn〇或 Mg〇的微細粉末。Page 43 593694, the scope of patent application is many =: ^ method ′ Where the pure metal with low melting point or the base material for the compound must be smelted using a low frequency furnace. For example, if the melting point is 7 8. For example, the method for making porous metal according to item 4 i of the patent application scope, wherein the low-melting point material is A1 and Si, Mg, Cu or Zn alloy material, the filler is two or, MnO, NaCl, Ti02, W03, ν? 〇, 7η (Η Μ η CaC1 2 7 9. As in the patent application No. 4 丄, the end of μ. Porous metal production method 'wherein the low melting point casting base is: 2 : For woven Pb and Sn or Zη alloy materials, the filling material is selected from the group consisting of Pb metal or MaC1, T102, W03, V203, Zn (^ Mg⑽fine powder Mn〇, 8 0 · For example, the method for making a porous metal according to item 4i of the patent application, wherein in the low melting point smelting, the material of the M-, A-domain Cu alloy with a two-two-pore structure is made of a core metal or NaH, T102, W03. , V2〇3, finely used CaCl2, MnO 3 V 2u3 Zn〇 or Mg〇 8 1 · As in the porous metal production method of the patent application No. 4 i, wherein the low melting point casting base = f ,,, When the material of the Ag and Cu alloy of the through-hole structure is used, the filling material is a fine powder selected from the group consisting of Mn0 = or V 20 3, ZnO, or MgO. 如 ιϋ2, W03, 8 2 · such as Patent scope No. 4 1 Method for making porous metal 'where Sn and Pb, Cii, or Bi alloy materials of the c-hole structure of the low-melting-point melting are used. Struggle = Second is the use of Sn metal or NaCl, TiO, WO, V0 It is a fine powder of CaCl2, MnO NaCl, T02, W03, V203, Zn or Mg.
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100402199C (en) * 2005-09-22 2008-07-16 远东技术学院 Method for producing permeability type die steel
CN111112600A (en) * 2018-11-01 2020-05-08 苏州铜宝锐新材料有限公司 Composite powder and preparation method thereof
CN112296339A (en) * 2019-07-25 2021-02-02 林道法 Metal powder injection molding process
CN112536436A (en) * 2020-11-20 2021-03-23 昌河飞机工业(集团)有限责任公司 Preparation method of self-lubricating copper-based powder metallurgy structural part for helicopter

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100402199C (en) * 2005-09-22 2008-07-16 远东技术学院 Method for producing permeability type die steel
CN111112600A (en) * 2018-11-01 2020-05-08 苏州铜宝锐新材料有限公司 Composite powder and preparation method thereof
CN112296339A (en) * 2019-07-25 2021-02-02 林道法 Metal powder injection molding process
CN112536436A (en) * 2020-11-20 2021-03-23 昌河飞机工业(集团)有限责任公司 Preparation method of self-lubricating copper-based powder metallurgy structural part for helicopter

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