TW592932B - In-die control method for manufacturing super thin housings for semiconductor memory cards - Google Patents

Abstract

An in-die control method for manufacturing super thin housings for semiconductor memory cards mainly comprises: a set of spilt molds, a vacuum pump device, a pressure detection device, and related digital control devices, in which the vacuum pump device is connected to a mold set article formation region, the pressure detection device adopts in-die control means to be connected to the inside of the mold set so that during the extrusion feeding process of a high speed injection molding machine, a vacuum pump device is synchronously activated in the formation region inside the molds for evacuating gas in the molds during compression operation for preventing the formation of back pressure, and, synchronically, the pressure detection device is used for monitoring the pressure inside the molds so that on the event of overpressure taking place, the in-die control means controls the extrusion feeding device of the injection molding machine for a timely backward movement to maintain the pressure inside the mold is constantly at a specified value, thereby providing the capability of producing thin enclosures with a thickness of only about 0.12 mm.

Description

^ 2932 I. Description of the invention (1) 背景 Background of the invention 丨 <Scope of application of the invention> The present invention relates to a kind of ultra-thin control products designed for the manufacture of semiconductor memory cards, front light boards, and pool components. Thin shell injection molding method, in particular, it is related to a method other than the application of push rod: mold, to: plastic injection when pressure is applied to the male and female molds = backup = ° vacuum pump Hanbei, pressure detection device, digital Control devices, etc., make it possible to make ultra-thin shell plates with a shell thickness of only about 0.12mm to further reduce the volume of semiconductor memory cards and further increase the industrial value of the category. ', «Overview of previous techniques> In one, the manufacturing process of traditional plastic mold injection molding is to melt plastic ^ raw materials into fluid at high temperature, and then close the mold through the mold. In the mold, it is shaped by plastic and then cooled by rapid cooling. ^ The previous application No. 8210390 No. 5 "injection molding device and mold for s injection molding device" is taken as an example, which is characterized by revealing a dagger 3 with first and second molds. When two molds When the molds are in contact with each other, a movable punch is set into the cavity position of the mold for injection molding. The traditional high-pressure injection molding as described above is suitable for making objects with a large shell thickness (about 1.5 mm or more). The general daily sand can be roughly competent with its mold injection molding technology. . Of course, for new industries

Page 4 592932! V. Description of the invention (2) 丨 The thickness of the semiconductor memory card and the thickness of the case 丨 card (such as MS CARD, pure and then use the traditional thickness of 12 mm, the remaining force caused the board丨 Ultra-thin processing technology below 3 mm can take into account the above-mentioned disadvantages of traditional semiconductor memory cards and invent the invention. Therefore, the ultra-thin casing of the memory card is made of ultra-thin (0.3 mm according to the invention The problem of residual control in the in-mold manufacturing of the secondary body makes the other in-mold control of the present invention accurate. In other words, it has strict requirements (SD CARD). The mold injection technology is easy to be damaged due to ultra-thin film cracks. For the parts, the quality of the mold injection is very huge, which is aimed at the inadequacy of the shortcomings, the general purpose, and the high-tech withered I, σ. Thin f; can not reach the molding # degree is only 0 plate thickness and rupture under high pressure, or ·, so the thickness of the shell is only technically to overcome the object shell plate produced by the non-traditional shot type Thick, shadow 'and the conventional mold injection molding again There are some shortcomings, and the way to improve it is clear. The purpose is to provide a method for controlling semiconductor memory molds, which can effectively produce the thickness of the board), which is suitable for those who apply to semiconductor memory cards. . The objective is to provide a method for a semiconductor memory card ultra-thin casing, which can prevent stress on the material of the ultra-thin casing, and the casing is not easily broken and damaged. One purpose is to provide a method for ultra-thin shell of semiconductor memory card, which can control the fine size of the ultra-thin shell plate to achieve the above-mentioned purpose. The overall device of the present invention at least includes a collapsible mold set: a Vacuum pump equipment

Page 5 592932 I. Description of the invention (3) A pressure detection device; a digital control device; detection: the pump equipment is connected to the molding area of the mold group, 丨: = in the internal molding area, cooperate with injection At the same time, the feed material is pulled out of the mold to increase the output of the injection material. Z The pressure detection device measures the pressure in the mold. When the material is prepared, the position control device is used to control the injection molding. The thickness of the machine 1 is only: to maintain the preset pressure of 5 Α ^ ^ only about 0.12DmA of the right thin shell.丨 Parameter-Bottom: The detailed structure of ir Ming 'application principle, function and function 丨 <The brief description of the diagram can be fully understood.丨 Figure 1: Using the technology of the present invention to build-on a semiconductor memory card 丨 Figure 2 is a schematic flow chart of the present invention. Section 4 5 ί The cross-sectional schematic diagram of the injection molding mechanism of the invention.丨 ί Invention Example 1 Ultra-high-speed injection molding processing, speed j, range profile analysis diagram. I. <Comparison of component numbers and names in the drawing> 1. Cards Λ Β Α ·. Large-area area depression area C. Wafer embedded area 10 .. Alignable mold group U .. Right module area In the pressure chamber, the air pump is equipped with a uniform pressure distribution of the gas, which can be effective.

592932 V. Description of the invention (4) I 12 ·· Left module 13 ·· Cabin I 20 ·· Vacuum pump equipment 30 ·· Pressure detection device 4 0 ·· Digital control deviceΐ 50 ·· Squeezing and pushing equipment I 51 ·· Push rod 52 ·· Infeed necking I <Description of the preferred embodiment> | Please refer to each attachment. The first figure shows the first embodiment of the present invention | MS CARD ) Top view. Among them, the entire card body 1 has a plurality of different thicknesses. In terms of the thickness of the standard specification depression area B, the chip embedment area C, and the card body 1 each other: an area plate portion used for storing data by the machine. The thickness is 0.8mm, and the thickness is about 0.6mm. The thickness of the semiconductor device needs to be ultra-thin and only contain a chip and be combined with a semiconductor memory card structure. The area with a large area, the concave of the sticker, the G · 14mm near the upper edge of the center, through the two halves, becomes a region C where the chip embedding part mentioned in the digital video is mentioned. + 西 外 ^ 0 · 1 4mm 'The general traditional injection processing technology can not be used for the manufacturing and processing of the object shell. 1 The implementation of the focus of the present invention as an effective addition of the ultra-thin object is to solve this problem. The basic device of the present invention shown in Fig. 3 includes a vacuum pump, a vacuum pump, a device, and a digital control device, such as a digital control device. The mold group 10 includes: The right and left modules 11 and 11 which can be automatically pressed are formed between the contact surfaces of the two left and right dies.

592932 V. Description of the invention (5) The chamber 13 and the vacuum pump equipment 20 are connected to a specific position in 13 and the type is set so that the plastic is injected by a simultaneous pressure detection device 3 into the mold. The mold group 10 has an internal cavity 13 and the device 50 has a push rod 51 and the extrusion port 52 is connected to the mold group 10. The pressure control device 40 is controlled by the digital control program to drive the injection machine. The function of pressing back and moving back to the material. In this way, 'when the injection molding machine is activated by the resin plastic by the push rod 5 1 to enter the material', it reaches an ultra-high pressure vacuum system 2 〇 when it is in the closed material to synchronously extract the gas from the chamber, The "proof cover" prevents the occurrence of stress residues and improves the uniform distribution of the injection of the plastic material. The pressure is detected when the pressure value is measured. When the overpressure is measured, it acts to control the injection molding machine to extrude. Quickly retract the material at all times, so that the mold has been carefully calculated by default, and the dual design can only have 0. 12mm without difficulty, the ultra-thin uniformity of the plate, and it should not be connected to the molding area of the mold object. The vacuum pumping place of the cavity is best to expand the thin plate into a thicker place to a thin place. The eight internal up control mode is connected to the front end of the extrusion and pushing device 50 of the high-speed injection molding machine; the force detection device 30 is connected to a number system device 40, which can be pushed through a preset pushing device 5 0, the push rod 5 i is used as an extrusion pushing device 5 0, and its melting and shrinking opening 5 2 is injected into the mold group 1 0, the impact force is injected In the mold, the chambers 1 and 3 are simultaneously opened, and cooperatively enters. The south exit speed impact pressure for the next time the advantages to leaving the housing, opposite sex. The device 3 0 is also set in the mold for internal inspection. The digital control device 4 feeds the device 5 0 the pusher 5 1 and the normal pressure inside can maintain a gap between the right and left modules. Under high pressure impact, if the shell force is to remain without brittleness,

592932 V. Description of the invention (6) When it is not easy, and the pressure value of the cavity in the mold of the present invention is controlled at a preset value, the injection molding of this ultra-thin shell plate can be achieved. In this type of processing industry, the so-called ultra-high-pressure injection processing, at a high speed of 1200 mm / sec 丨, the ejector of the injection machine's extrusion and pushing equipment actually has an effective actuation stroke of only about 5 mm in length (as shown in the fourth figure) The high pressure caused will be accumulated in the mold, so it is extremely important to control the pressure accurately in the mold. From the above, in the traditional related industrial technology, there is a pressure detection detection device installed at the extrusion feeding equipment outside the mold to control the amount of plastic injection | The ultra-thin products made by the invention of this case are controlled by pressure in the mold. After knowing the amount of injection, they can control the refill or withdrawal control, so that the ultra-thin structure is provided at a specific place. The economic and practical benefits are combined, and the disadvantages of the former are clear, and the present invention has not been used in public. In accordance with the provisions of the Patent Law, a patent application has been filed in accordance with the law.

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Claims (1)

6. Scope of patent application 1. A semiconductor memory card ultra-thin casing made of a pair of molds: a vacuum pump device; a pressure detection device; the control method in the mold includes: a digital control device consisting of: its characteristics Contains the following control steps a. Take the vacuum pump equipment connected to the mold b. Take the pressure detection device connected to the mold control method to detect the mold objects into c. Take the digital control device and combine it with the tree device; on the forming area of the group of objects; The pressure value in the internal area of the mold; the high-speed injection molding machine extrusion feed d. The high-speed injection molding extrusion feed operation is carried out to extract the gas from the mold; ... the synchronous start of the vacuum pump to measure the extrusion in the mold After pressing the pressure value of the feed, use: r to move the special fruit, or press the feed device of the former to reverse the m two times; :: is ... In-mold control method, wherein the conductor memory card ultra-thin shell can be formed on the molding area by a thin plate molding machine and connected to a mold assembly