玖、發明說明 【發明所屬之技術領域】 本發明爲一免焊式發光二極體定位結構（二），係屬 於電子元件之固定結構。 【先前技術】 由於發光二極體具有低溫、低耗電量之特性，故廣爲 應用於照明燈具，或者電子產品之顯示燈，而發光二極體 之型式是在透明的封膠體內部包覆有晶粒，以及向下延伸 之接腳，藉由接腳插置於電路板之穿孔，再以焊錫方式將 接腳固定於電路板上，然而，如此之組裝方式卻會發生晶 粒燒毀而導致不堪使用之情形。 另一種結合發光二極體之方式則是將發光二極體之兩 接腳彎折成九十度，再以點焊方式分別固結於兩金屬板上 ，透過金屬板插置於電路板上，如此之組裝方式，其點焊 時之高溫多少還是會損及晶粒。 是以，現有發光二極體與電路板之間的結合方式實有 加以改良之必要。 【發明內容】 爲了改善現有發光二極體與電路板之間由於結合方式 不當所導致容易產生不良品之缺失，本發明之主要目的在 於提供一種發光二極體不需要經過焊接即可以結合於電路 板之發光二極體定位結構。 基於上述目的，本發明之主要技術在於提供一種免焊 式發光二極體定位結構，包括：一電路板；一發光二極體 ，其具有接腳，接腳自中段反向彎折而使自由端形成彎折 段；一組金屬板組，由複數個不相連之金屬板所組成，相 鄰之金屬板係分別插置於電路板而具有不同極性，於兩相 鄰之金屬板異於電路板該側分別沖壓成型一可供同一只發 光二極體之接腳彎折段插置，再將發光二極體固定住之結 合部。 藉由上述之技術手段，本發明可使發光二極體在不經 焊接作業之下直接插置於金屬板，進而結合於電路板上， 由於其不需經過高溫焊接，故晶粒不致燒毀而接腳亦無熔 斷之虞。 【實施方式】 請參閱第一圖所示，本發明所提供之免焊式發光二極 體定位結構係包括一電路板（1 0 )、一插接固定於電路 板（1 0 )之金屬板組（2 0 )、以及插置於金屬板組（ 2 0 )之發光二極體（3 0 );其中，所述之發光二極體 (3 0 )係爲現有產品，其具有兩支由封膠體（3 0 0 ) 底部延伸而出之接腳（3 1 )，兩接腳（3 1 )自中段向 外反向彎折九十度，使其自由端形成彎折段； 而所述之金屬板組（2 0 )係由數個不相連之金屬板 (2 1 )所組成，各金屬板（2 1 )分別設有一彎折之接 腳（2 1 0 )，藉以插置焊固於電路板（1 〇 )上’相鄰 之金屬板（2 1 )的極性不同’又於兩相鄰之金屬板（2 1 )上，分別沖壓成型一朝向異於電路板（1 0 )突出之 結合部（2 2 )，於本較佳實施例當中，所述之結合部（ 6 2 2 )係爲L形，其以一縱側板（2 2 Ο )連接金屬板（ 2 1 )，再彎折一橫側板（2 2 1 )，該橫側板（2 2 1 )與金屬板（2 1 )表面之間距係略大於發光二極體（3 0 )之接腳（3 1 )厚度，以供接腳（3 1 )插置，而後 再如第二圖所示沖壓橫側板（2 2 1 )之自由端，使其彎 折包覆發光二極體（3 0 )之接腳（3 1 )，即將發光二 極體（3 0 )固定於金屬板（2 1 )上。 又如第三圖所示係本發明之另一種實施型態，其亦是 預先於兩相鄰之金屬板（2 1 ’）上相應沖壓成型有朝外突 起之結合部（2 3 )，該結合部（2 3 )之型態則是形成 有兩個間隔設置之突部（2 3 0 )，以於兩突部（2 3 0 )之間容置發光二極體（3 0 )之接腳（3 1 )彎折段， 突部（2 3 0 )之高度並且大於接腳（3 1 )之厚度，以 供結合時再度沖壓成型使兩突部（2 3 0 )之頂部如第四 圖所示相向彎製而壓制於接腳（3 1 )之頂面，即使得發 光二極體（3 0 )在不經焊接的情形下固定於不同極性之 金屬板（2 1 ’）上，以形成通路。 而由於本發明之設計使發光二極體（3 0 )未經高溫 之點焊或焊錫作業，故發光二極體（3 0 )之晶粒無燒毀 之情形，其接腳（3 1 )亦無熔斷之虞，可以確保發光二 極體（3 0 )之品質，極具產業利用性。 又，上述所述圖式當中係以具有兩接腳之發光二極體 爲例說明，此外，其亦可適用於具有四接腳之發光二極體 ，其係以同側設置之兩接腳爲一組，插置於同一金屬板上 7 591812 【圖式簡單說明】 (一）圖式部分 第一圖係本發明之立體分解示意圖。 第一圖係本發明之平面組合剖面示意圖。 第三圖係本發明第二種實施型態未固定發光二極體接腳之 側視示意圖。 第四圖係本發明第二種實施型態已固定發光二極體接腳之 側視示意圖。 (2 1 ) ( 2 1 ’）金屬板 (二）元件代表符號 (10)電路板 (2 2 )結合部 (2 2 1 )橫側板 (2 3 0 )突部 (3 〇 )發光二極體 (31)接腳 (2 0 )金屬板組 (2 1 〇 )接腳 (2 2 0 )縱側板 (2 3 )結合部 (3 0 〇 )封膠體发明 Description of the invention [Technical field to which the invention belongs] The present invention is a solderless light-emitting diode positioning structure (2), which belongs to a fixed structure of an electronic component. [Previous technology] Because the light emitting diode has the characteristics of low temperature and low power consumption, it is widely used in lighting lamps or display lamps of electronic products, and the type of light emitting diode is covered inside a transparent sealing gel. There are grains and pins that extend downward. The pins are inserted into the through holes of the circuit board, and then the pins are fixed to the circuit board by soldering. However, such an assembly method will cause chip burnout and Causes unacceptable conditions. Another way to combine light-emitting diodes is to bend the two pins of the light-emitting diodes to 90 degrees, and then fix them to two metal plates by spot welding, and insert them on the circuit board through the metal plates. In this way of assembly, the high temperature during spot welding will still damage the grains to some extent. Therefore, it is necessary to improve the existing bonding method between the light-emitting diode and the circuit board. [Summary] In order to improve the lack of defective products due to improper bonding between the existing light-emitting diode and the circuit board, the main object of the present invention is to provide a light-emitting diode that can be combined with a circuit without soldering. Light emitting diode positioning structure of the board. Based on the above purpose, the main technology of the present invention is to provide a solderless light-emitting diode positioning structure, including: a circuit board; a light-emitting diode having pins, the pins are bent in the reverse direction from the middle section to be free A bent section is formed at the end; a group of metal plates is composed of a plurality of non-connected metal plates. Adjacent metal plates are respectively inserted into the circuit board and have different polarities. Two adjacent metal plates are different from the circuit. The side of the board is respectively stamped and formed into a joint portion that can be inserted into the bent section of the same light emitting diode, and then the light emitting diode is fixed. By means of the above-mentioned technical means, the present invention can directly insert a light-emitting diode into a metal plate without soldering, and then combine it with a circuit board. Since it does not need to be soldered at high temperature, the crystal grains will not be burned. There is no risk of the pins being blown. [Embodiment] Please refer to the first figure. The solderless light-emitting diode positioning structure provided by the present invention includes a circuit board (1 0) and a metal plate inserted and fixed on the circuit board (1 0). Group (2 0), and a light emitting diode (3 0) inserted into a metal plate group (20); wherein the light emitting diode (3 0) is an existing product, which has two branches The pins (3 1) extending from the bottom of the sealing gel (3 0 0), and the two pins (3 1) are bent outwardly from the middle section by ninety degrees, so that the free end forms a bent section; and The metal plate group (2 0) is composed of several unconnected metal plates (2 1), and each metal plate (2 1) is provided with a bent pin (2 1 0) for inserting and welding. On the circuit board (10), 'the adjacent metal plates (2 1) have different polarities', and on the two adjacent metal plates (2 1), respectively, they are stamped and formed to protrude in different directions from the circuit board (1 0). The joint portion (2 2), in the preferred embodiment, the joint portion (6 2 2) is L-shaped, which is connected to the metal plate (2 1) by a longitudinal side plate (2 2 Ο), and then Bend a transverse side plate 2 2 1), the distance between the lateral side plate (2 2 1) and the surface of the metal plate (2 1) is slightly larger than the thickness of the pins (3 1) of the light-emitting diode (30), for the pins (3 1 ), And then press the free end of the lateral side plate (2 2 1) as shown in the second figure, so that it bends to cover the pins (3 1) of the light-emitting diode (3 0), that is, the light-emitting diode The body (30) is fixed on the metal plate (21). As shown in the third figure, it is another embodiment of the present invention. It is also formed by pressing two adjacent metal plates (2 1 ′) with a protruding portion (2 3) protruding outward. The joint portion (2 3) is formed by two protruding portions (2 3 0) disposed at intervals to accommodate the connection of the light emitting diode (3 0) between the two protruding portions (2 3 0). The bending section of the foot (3 1), the height of the protrusion (2 3 0) is greater than the thickness of the pin (3 1), so that the top of the two protrusions (2 3 0) is like a fourth when combined. As shown in the figure, they are bent opposite to each other and pressed on the top surface of the pin (3 1), so that the light-emitting diode (30) is fixed to a metal plate (2 1 ′) of different polarity without welding. To form a pathway. And because the design of the present invention makes the light-emitting diode (30) not subjected to high temperature spot welding or soldering operation, the crystal grains of the light-emitting diode (30) are not burned, and its pins (3 1) are also There is no risk of fusing, which can ensure the quality of the light-emitting diode (30), which is extremely industrially applicable. Moreover, in the above-mentioned drawings, a light-emitting diode with two pins is used as an example. In addition, it can also be applied to a light-emitting diode with four pins, which uses two pins provided on the same side. As a group, inserted on the same metal plate 7 591812 [Simplified illustration of the drawings] (A) The first drawing of the drawing part is a three-dimensional exploded view of the present invention. The first figure is a schematic plan sectional view of the present invention. The third diagram is a schematic side view of an unfixed light emitting diode pin of the second embodiment of the present invention. The fourth diagram is a schematic side view of the fixed light emitting diode pin of the second embodiment of the present invention. (2 1) (2 1 ′) Metal plate (two) Element representative symbol (10) Circuit board (2 2) Joint (2 2 1) Lateral side plate (2 3 0) Projection (3 〇) Light emitting diode (31) Pin (2 0) Metal plate group (2 1 0) Pin (2 2 0) Vertical side plate (2 3) Bonding portion (3 0 0) Sealing gel
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