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發明所屬之技術領域： 本發明係關於一種有機發光二極體（Organic Ught Emitted Diode，〇UD)蒸鍍機台，尤指一種具備遮罩 (shadow mask)線上（〇n_Hne)清理裝置之 極體蒸鍍機台。 ％ ^ ^ -先前技術 在 技術； 體具有 可全彩 當 下列三 選擇性 發光元 發光元 而在上 材料圖 罩法進 上方係 之透明 眾多顯示技術中，有機發光二極體係一深受矚目之 比起，、他小尺寸之液晶顯示器產品，有機發光二極 以下之優點：自發光、無視角限制、響應速度快、 化、低耗電與低成本等。 前應用於有機發光二極體的全彩化處理技術主要有 種·（1)利用蒸著光罩法將紅綠藍各發光元件分別 成長薄膜、（2)利用噴墨印刷法分別塗佈紅綠藍各 件以及（3 )利用色變換層法（螢光變換）於藍色 件^方，塗佈色變換層分別獲得綠色和紅色發光。 $:種方法中，以蒸著光罩法之成本最為低廉。 =先罩法係利用遮罩丨搭配真空成膜之技術將有機 案=她如第一八、一β與一C圖所示，係利用蒸著光 订$ <發光層選擇性薄膜成長之示意圖；在基板2 =，離壁21支#遮罩1，以避免遮罩1直接與基板2 亟2接觸；而有機發光材料係利用蒸鍍之方式透The technical field to which the invention belongs: The present invention relates to an organic light emitting diode (Organic Ught Emitted Diode, OUD) vapor deposition machine, in particular to a polar body provided with a shadow mask (On_Hne) cleaning device Evaporation machine. % ^ ^-The previous technology in the technology; the body has full color when the following three selective light-emitting elements and light-emitting elements in the upper material pattern cover method into the transparent system of many display technologies, the organic light-emitting diode system has attracted much attention Compared with his small-sized LCD products, the advantages of organic light-emitting diodes are as follows: self-luminous, no viewing angle limitation, fast response speed, low power consumption and low cost. The full-color processing technologies previously applied to organic light-emitting diodes mainly include: (1) the red, green, and blue light-emitting elements are grown into thin films by using a vaporization photomask method, and (2) the red is coated by inkjet printing. Each piece of green and blue and (3) use the color conversion layer method (fluorescent conversion) on the blue piece, and apply the color conversion layer to obtain green and red light emission, respectively. $: Among the methods, the cost of steaming the photomask is the lowest. = The first mask method uses a mask 丨 with a vacuum film forming technology to convert the organic case = She shows the growth of the selective thin film of the light-emitting layer by steaming the light as shown in the eighteenth, one β, and one C. Schematic diagram; on the substrate 2 =, 21 branches off the wall #mask 1 to avoid the mask 1 directly contacting the substrate 2 and the substrate 2; and the organic light-emitting material is transparently evaporated by evaporation.
589920 五、發明說明（2) 過遮罩1上之開孔11沉積於透明電極22之表面·同 用步進方式調整遮罩i表面開孔丨丨與基板2之相對位置’利# 此，依序進行紅色有機鑛層3R、、綠色有機鑛層3G與藍= 機鍍層3B的瘵鍍，以分別定義該紅色、綠 鈇 有 所在位置。 孤匕思素之 在上述蒸著光罩法成膜的過程中，並沒有經 術（Lithography )等溼式製程，而是利用遮罩丨定^ ^ 發光層圖t，因此，可以避免成膜過程曝露在=有機 止因水分的吸收與粉塵的附著而造成 ”卜，防 如第二圖所示，係-傳統有機；：：：：〜“ 10。之示意圖，該機台包括：一基板載入取出室;〇^: 或：出基板2時，避免破壞蒸鑛機台其他部分之功 冋”工，一個以上之有機蒸鍍室i 〇 2，用以蒗铲 :::而且’利用有機蒸鍍室102載入有機材' = 免破壞蒸鍛機台其他部分的高真空；一個 屬丁—以避 103 ’用以蒸鑛金屬與無機鹽類材料，而且，：用屬二鍵至 鍍室103載入金屬及無機鹽類 」用金屬洛 台直他部分的高直六· 、，士 了乂避免破壞蒸鍍機 口P刀的问真工，一珂處理室1〇6，用以 W，利用電漿對基板2表面進行乾式 =進仃瘵鍍 #1] "107 5 合，以防止有機發光材料與大氣 ：）進：封 104，連接至上述各室1〇1，1〇2 ^缺心，—傳达室 械…未圖示）挟持基板2:使基二7於機 101，1 02, 1 0 3, 1 0 6, 1 〇7間移動。 、上述各至589920 V. Description of the invention (2) The holes 11 on the mask 1 are deposited on the surface of the transparent electrode 22. The holes on the surface of the mask i are adjusted in the same way by stepping. The red organic ore layer 3R, the green organic ore layer 3G, and the blue = organic plating layer 3B are sequentially plated to define the positions of the red and green ore respectively. In the process of film formation by the vaporized photomask method described above, Guzumi did not use wet processes such as Lithography, but used a mask to determine the light-emitting layer t. Therefore, film formation can be avoided. Process exposure at = organic only caused by the absorption of moisture and the adhesion of dust ", as shown in the second figure, the system is-traditional organic; :::: ~" 10. Schematic diagram, the machine includes: a substrate loading and unloading chamber; 〇 ^: or: to avoid damage to other parts of the steaming machine when the substrate 2 is out, more than one organic evaporation chamber i 〇2, Use shovel ::: and 'use organic evaporation chamber 102 to load organic materials' = high vacuum that does not damage other parts of the steam forging machine; one is Ding-to avoid 103' for steaming metal and inorganic salts Materials: In addition, use two bonds to load metal and inorganic salts into the plating chamber 103. "Go straight six with a metal block straight to the other part." A 1K processing chamber 106 is used to dry the surface of the substrate 2 by using a plasma = 仃 瘵 plating # 1] " 107 5 to prevent organic light-emitting materials and the atmosphere :) into: seal 104, Connected to each of the above-mentioned chambers 101, 102, ^ lack of heart,-conveying room machinery ... not shown) holding the substrate 2: make the base 7 on the machine 101, 1 02, 1 0 3, 1 0 6, 1 〇7 moves. Each of the above
589920 五、發明說明（3) 一 藉由上述有機發光二極體蒸鍍機台1 〇 〇進行有機發光 一極體有機蒸鑛製程’可以確保基板2不與大氣接觸，以 避免基板2受到水氣影響而獲得高品質之元件。 )透過遮罩1進行有機發光材料蒸鍍時，不可避免將產 生諸如，開孔1 1受到阻塞、遮罩i上吸附微粒等遮罩1污染 的問題；如第三圖所示，係遮罩丨因有機發光材料蒸鍍產 生開孔1 1阻塞之示意圖；由於有機材料阻塞，開孔丨丨之尺 寸由w縮小為w，；因此，透過上述開孔u蒸鍍之有機鍍層 ★將產生沉積圖案錯誤或是沉積薄膜厚度不足等問題。如 第四圖所不，係遮罩因微粒附著而導致 3產生缺陷之示意目，上述缺陷除了造成有錢層有^圖層 累錯誤，甚至會在有機發光二極體兩電極之間產生成一導 通路徑，進而造成二極體元件壞死。 為避免上述遮罩1污染之問題，習知方法係在進行數 t產品之蒸鍍後，將遮罩}自有機蒸鍍室102中抽出換新， ::對遮罩i進行離線清洗。然而’為了抽換遮幻或是對 遮罩1進行離線清洗，都必須破壞有機蒸鍍室1〇2之直空； 而將遮罩1定位後，又必須恢復有機蒸錄室丨02之真二=: 因此，將造成蒸鍍機台的停滯與時間的浪費。 ”二又’ 根據上述製程上的困難’本發明提出二種 極體蒸鍍機台100，可以對遮罩1進行線上清理。 ' 又一 發明内容589920 V. Description of the invention (3) The organic light-emitting diode organic vapor deposition process performed by the above organic light-emitting diode evaporation machine 1000 can ensure that the substrate 2 is not in contact with the atmosphere to prevent the substrate 2 from being exposed to water. High-quality components due to the influence of air. ) When the organic light-emitting material is vapor-deposited through the mask 1, problems such as contamination of the mask 1 such as blocking of the openings 1 and adsorption of particles on the mask i will inevitably occur; as shown in the third figure, the mask is a mask.丨 Schematic diagram of blockage of openings 1 1 caused by evaporation of organic light-emitting materials; due to blockage of organic materials, the size of openings 丨 丨 reduced from w to w; therefore, the organic plating layer deposited through the above-mentioned openings u will deposit Problems such as wrong pattern or insufficient thickness of deposited film. As shown in the fourth figure, it is a schematic diagram of the defect generated by the mask due to the attachment of particles. In addition to the above defects, the rich layer has a layer error, and even a conduction between the two electrodes of the organic light emitting diode is generated. Path, which in turn causes necrosis of the diode element. In order to avoid the above-mentioned problem of the contamination of the mask 1, the conventional method is to extract the mask} from the organic evaporation chamber 102 and replace it with a new one after the evaporation of several t products, and then perform offline cleaning of the mask i. However, 'in order to change the cover or perform off-line cleaning of the mask 1, the vertical space of the organic evaporation chamber 102 must be destroyed; and after the mask 1 is positioned, the organic evaporation chamber 丨 02 must be restored. Two =: Therefore, the stagnation of the evaporation machine and the waste of time will be caused. "Secondary" According to the above-mentioned process difficulties, the present invention proposes two types of polar vapor deposition machines 100, which can clean the mask 1 online.
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一目的 一遮罩 機發光 鑛機台 用之遮 送室； 室，不 可以避 明之優 到進一 清理室 二極體 中，再 罩進行 並經由 僅可以 免遮罩 點與精 步的瞭 一種有 線上清 之蒸鍍 rM tgy 叹置一 乾式清 傳送室 線上清 污染， 神，可 解0 m 理有機蒸 機台係於 遮罩清理 理；且上 進行遮罩 理遮罩， 以確保製 以藉由以 本發明之 $ ’其係藉由 本發明有 發光二極體蒸 對有機蒸鍍使 室亦連接至傳 上述遮罩清理 滯，同時，亦 關於本發 及所附圖式得 實施方式 極體蒸鍍機； 鍍之遮罩。 上述傳統有機 室以利用電裝 述之遮罩清理 的傳遞。藉由 防止機台停 程之可靠度。 下的發明詳述 如第二圖所示，係一 1心0：®，包括-基板載入取有出機—發光二極體蒸鍍機台 瘵1至1 0 2、至少—個 至1 0 1、至少一個的 -前處理室_與-傳； 進行有機發光材粗 :ί:有機發光材料之污ΐ後-Γ可避免，遮罩1表面將 :錢後，將遮罩！ 白;：法係在進行 遮罩1自有機蒸錢室内插：…、鑛至102内抽出換新， 將造停滞與時間的浪？行離線漫式清洗；因而 马解決上述問顯， 、 蒸鍍機a 1 η η 士 本發明係於值纪λα丄 機σ100中，再加入—避I ,主、傳統的有機發光二極體 如第 五圖所 遐罩清tl05 ; ^ 第7頁 589920 五、發明說明（5) 示，係本發明有機發来-n μ⑽ 之示意圖，其中一較佳實施例 山> -〇 卓，月至1 05係連接至傳送室1 04 ·闵 有機•鑛室102内進行有機材 “ 〇4，因 罩！可以利用-設置於傳送室1〇4之機械手臂（使未用圖後干之)遮 、，二傳内：室1〇4傳遞至遮罩清理室1〇5，隨後，於遮罩清理 Π用電聚對遮罩!表面進行乾式清理；清理後之遮 = 述，機械手臂’由遮罩清理室105經由傳送 至 遞至有機瘵鍍室丨0 2定位，以對下一批次之玻璃基 板2進行有機蒸鍍。 為了節省遮罩1由有機蒸鍍室102經由傳送室1〇4傳遞 至，罩清理室105所需之時間，遮罩清理室1〇5係鄰近於有 機蒸鍍室1 〇 2以利遮罩1傳遞之進行。 —"上述遮罩清理室1〇5所採用之電漿可以使用氧氣或是 氮氣作為環境氣氛（但不限於此）；而該電漿之形式可以 疋直"IL、父流或是磁控（亦不限於此）。此外，為了配合 製程需要，遮罩清理室1 〇 5之電漿功率亦可以調高，以減 少遮罩1清理所需之時間。 同時，在傳統之傳統之有機發光二極體蒸鑛機台1 〇 〇 中’通常包括一機械手臂用以傳遞玻璃基板2 ;在簡化設 計的目標下，傳遞玻璃基板2與傳遞遮罩1可以使用同一組 機械手臂；然而，若是以提高效率為目標，則可以設置兩 組機械手臂分別用以傳遞玻璃基板1與遮罩2。 除此之外，·上述用以傳遞遮罩1所採用之方法除了使 用機械手臂，亦可亦使用傳送帶、移動式載台（但不限於A purpose is a masking room for the luminous mining machine of the masking machine; the room can not avoid the best of the light to enter the diode of a cleaning room, and then the mask is carried out and only a masking point and fine steps can be avoided. On-line clearing vapor deposition rM tgy sighs a dry-cleaning transfer room to clean up the pollution on the line. God can solve the 0 m organic steamer table attached to the mask cleaning; and perform masking on the mask to ensure that According to the invention of the invention, by using the light-emitting diode vapor-to-organic vapor deposition of the present invention, the chamber is also connected to the above-mentioned mask to clean up the sludge. At the same time, the polar vapor Plating machine The above-mentioned conventional organic room is transferred by using a mask described in the electric device. By preventing machine downtime reliability. The following detailed description of the invention is shown in the second figure, which is a 1 core 0: ®, including-substrate loading and taking out-light emitting diode vapor deposition machine table 1 to 1 0 2, at least-1 to 1 0 1. At least one of the -pre-treatment chamber_and-pass; the thickening of the organic light-emitting material: ί: after the contamination of the organic light-emitting material -Γ can be avoided, the surface of the 1 mask will be: after the money, it will be masked! White ;: The legal system is in the process of masking 1. Inserting from the organic steaming room: ..., extracting and replacing within 102 to mine, will it create waves of stagnation and time? Off-line diffuse cleaning; therefore, the horse solves the above problem. The evaporation machine a 1 η η This invention is based on the value λα 丄 machine σ100, and then add-avoid I, the main and traditional organic light-emitting diodes such as The fifth picture is clear ttl05; ^ page 7 589920 5. The description of the invention (5) shows that it is a schematic diagram of -n μ⑽ organically sent by the present invention. One of the preferred embodiments is > -〇 Zhuo, month to 1 05 series is connected to the transfer room 1 04 · Min Organic • Mining room 102 is used for organic materials "〇4, because of the cover! Can be used-a robot arm installed in the transfer room 1104 (to dry it after not using the picture) Within the second pass: The room 104 is passed to the mask cleaning room 105, and then the mask is cleaned dry with an electropolymer at the mask cleaning Π; the cover after cleaning is described, and the robot arm is provided by The mask cleaning chamber 105 is transferred to the organic electroplating chamber and is positioned to carry out organic vapor deposition of the next batch of glass substrates 2. In order to save the mask 1, the organic vapor deposition chamber 102 is passed through the transfer chamber 1. 4 Pass to the time required for the hood cleaning chamber 105. The hood cleaning chamber 105 is adjacent to the organic vapor deposition chamber 105. The transfer of the mask 1 is performed. &Quot; The plasma used in the above-mentioned mask cleaning room 105 can use oxygen or nitrogen as the ambient atmosphere (but not limited to this); and the form of the plasma can be straightened " IL, parent stream or magnetic control (also not limited to this). In addition, in order to meet the needs of the process, the plasma power of the mask cleaning room 105 can also be increased to reduce the time required for mask 1 cleaning. In the traditional organic light-emitting diode steaming machine 100, it usually includes a robot arm to transfer the glass substrate 2; under the goal of simplifying the design, the transfer glass substrate 2 and the transfer mask 1 can be used. The same set of robotic arms; however, if the goal is to improve efficiency, two sets of robotic arms can be set to transfer the glass substrate 1 and the mask 2. In addition, the method used to transfer the mask 1 described above In addition to using robotic arms, you can also use conveyor belts, mobile carriers (but not limited to
此）之方式以進行遮罩1傳遞。 遮罩1的清理時機並不限 了確保遮罩〗之清潔，以 '母-人進仃有機蒸鍍後；為 ^鑛進行前亦可以進行遮製程可靠度，在有機 凑，亦可以配合製程需戈二：理’·此外，若是製程緊 用電Ϊ前述’上述遮罩清理室理之時機。 機铲二進仃乾式清理；惟，二者伤、别处理至1 0 6，均係利 機鍍層，以及基板2 —者係分別針對遮罩i上之有 免電漿清理過程中，'"在”質進行清理，·因此，為了避 2成不同材料之交二腔！内產生有不同雜質微粗， ，罩清理室105之功用觉木，珂處理室106並不可以取代 ί I i亦不可利用上述遮Λ’金屬蒸鑛室103内所採用之 、、、凊理，以避免產4 、巧理室1 0 5或前處理室1 0 6進行 制太以上所述係Ϊ當污染，而影響製程之可靠度了 而=發明之範圍，而：=貫施例詳細說明本發明，而非限 微的改變及調i1員技藝人士皆能明瞭，適當 本發明之精神$範=將不失本發明之要義所在，亦This) way to make the mask 1 pass. The cleaning timing of the mask 1 is not limited to ensure the cleanness of the mask. After the organic vapor deposition is performed by the mother-in-person; the reliability of the masking process can also be carried out before the mine is carried out. Need two: Management '· In addition, if the process is tight, the timing of cleaning the room with the above-mentioned mask. The machine shovel enters the dry cleaning; however, the two injuries, do n’t deal with it to 106, are both good machine coating, and the substrate 2-which are respectively for the plasma-free cleaning process on the mask i, "& quot The cleaning is performed in the "Quality", so in order to avoid the intersection of 20% of different materials in the two chambers! Different impurities are slightly thick inside, and the function of the cleaning room 105 is covered, and the processing room 106 cannot replace ί I i It is also not possible to use the above-mentioned processing methods used in the above-mentioned metallization steaming chamber 103 to avoid the production of the production process, the processing room 105, or the pre-processing room 106, and the above-mentioned system is not contaminated. However, it affects the reliability of the manufacturing process and = the scope of the invention, and: = the examples explain the invention in detail, but not the micro-changes and the technical personnel who can adjust the i1 can understand, appropriate spirit of the invention $ 范 = 将Without losing the essence of the invention,