TW586120B - Management system for defective memory - Google Patents

Management system for defective memory Download PDF

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Publication number
TW586120B
TW586120B TW92102611A TW92102611A TW586120B TW 586120 B TW586120 B TW 586120B TW 92102611 A TW92102611 A TW 92102611A TW 92102611 A TW92102611 A TW 92102611A TW 586120 B TW586120 B TW 586120B
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Taiwan
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memory
defect
management system
data
defect management
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TW92102611A
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TW200415654A (en
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Ting-Jin Wu
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Ting-Jin Wu
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  • For Increasing The Reliability Of Semiconductor Memories (AREA)

Abstract

A defect management system allows the usage of memory devices with a plurality of defective memory cells to be used for data storage. The system is especially suitable for the storage of streaming media data. The defect management system provides significant manufacturing costs benefits to products that store significant quantities of data in solid state memory, such as MP3 players or MPEG-4 video players. A non-volatile memory stores a map of defective areas within the memory devices that is generated using in built in self test (BIST) procedure. The system employed are low overhead and can be realise in software code or a hardware implementation. The technique can be applied to a very wide range memory technologies include DRAM, Flash, FeRAM and MRAM.

Description

586120586120

五、發明說明(i) 【發明所屬之技術領域】 本發明之發明領域係有關 缺陷管理系統相關,該缺陷管 缺陷的記憶晶胞之記憶趙裝置 尤其是適於儲存串列媒趙數據 【先前技術】 於記憶體管理,尤其是與一 理系統允許使用包含多個具 ’係用於儲存數據。該系統V. Description of the invention (i) [Technical field to which the invention belongs] The field of invention of the present invention relates to a defect management system. The memory device of the memory cell of the defect tube defect is particularly suitable for storing serial media Zhao data. [Previous Technology] For memory management, especially with a management system allows the use of a system containing multiple devices for storing data. The system

六W的半導體§己惚體裝置包含數百萬個各別的數揭 儲存記憶晶胞。製造程序之一目的為製造該裝置,使得每 一記憶晶胞均可使用,且可以應用可靠的方式儲存數據。 由於製造技術的限制,某一比率的記憶體具有一或多個具 缺陷的記憶晶胞,而無法可靠地儲存數據。此使構 體裝置無法以標準的製品销售。 在大部份的這種’’部份可用”(P a r t i a 1 )或"低品質 ”(downgrade)的記憶體中,大部份的記憶晶胞均^以可 靠的方式動作。這些記憶體裝置的售價遠低於各記憶晶 均良好的記憶體裝置。其折扣率遠高於無法使用的記憶晶 胞。所以在需要數據儲存的終端應用中使用這些組件可: 節省下相當的成本。已發展出多種不同的技術,以在某1 特定的應用中使用。 多種不同的技術已在相當多的應用中可以使用這種$ 份記憶體組件。這些技術也應用到D R A Μ及快閃記# ^ 裝置中。尤其是由於廣泛地應用在pc中。再者,DRa Μ的製造為高度競爭性的產業,且在進入高密度的製造| 置期間,當在製造技術達到最適化之前,將產生大4 % _Six-Watt Semiconductor § Capsule devices contain millions of individual memory cells. One of the manufacturing procedures is to make the device so that every memory cell can be used and the data can be stored in a reliable way. Due to manufacturing technology limitations, a certain percentage of memory has one or more defective memory cells and cannot reliably store data. This prevents the structural device from being sold as a standard product. In most of this 'partially available' (P a r t i a 1) or " low quality " (downgrade) memory, most of the memory cells operate in a reliable manner. These memory devices are priced much lower than those with good memory crystals. The discount rate is much higher than that of unusable memory cells. So using these components in end applications that require data storage can: Save considerable costs. A number of different technologies have been developed for use in a particular application. A number of different technologies have been used in a considerable number of applications for this memory component. These techniques are also applied to DR A M and flash # ^ devices. Especially because it is widely used in pc. Furthermore, the manufacturing of DRa Μ is a highly competitive industry, and when entering the high-density manufacturing | setting, it will generate 4% larger before the manufacturing technology is optimized _

第5頁 586120 五、發明說明(2) 份可用記憶體裝置 D R A Μ及某 術。這些額外的列 在測試的數個步驟 列及行以電子方式 不可抹除式的儲存 陷的位置時,便可 是,即使當使用此 維修。之所以如此 限制冗餘的資源的 的,即無法對映到 佈局(LAYOUT)限制 修作業,此係因為 程度。其次,在分 些資源"重建"的組 的冗餘列或行,則 裝置比率的優點的 s己憶體組件無法使 在銷售時,所提供 少。因此必需由往 許多具有缺陷 用在某些類型的低 陷數的部份可用記 使用在數位電話答 些其他的 及行的製 中,必需 對應到該 或融絲(: 適當地對 技術時, ,主要有 使用。一 該晶片中 其彈性。 這些圖樣 配予冗餘 件的比率 冗餘對於 重要性。 用在一般 之缺陷的 後的測試 之低位準 階銷費裝 憶體裝置 錄機中。 使用内 計的一 的缺陷 區域。 許一當 記憶體 的記憶 首先, 及行並 。定時 陷圖樣 中某些 區域及 協。如 影響超 在相當 但是一 方面的 訊0 記憶體 。例如 記憶體 不壓縮 記憶體位在 造為晶片設 找出各裝置 晶片的缺陷 f u s e )允 映這些冗餘 仍有相當多 兩個原因。 般冗餘的列 的任何部份 因此某些缺 超過該區域 資源的晶粒 之間必需妥 晶粒尺寸的 因此,仍存 的應用中。 特性及品質 建立這些資 的部份可用 置及玩具中 (稱為聲訊 這些裝置以 部冗餘技 部份。如果 以將冗餘的 在該晶粒子 知道任何缺 的區域。但 體裝置必需 在該晶粒中 非是全域性 (TIMING)及 無法進行維 區域的冗餘 可能使用這 果存在太多 過可重建之 比率之部份 般這些組件 資訊仍很 可以直接使 ,具有低缺 )已成功地 的格式儲存Page 5 586120 V. Description of the invention (2) Available memory devices DRAM and a certain technique. These additional columns are located in several steps of the test when the rows and rows are stored electronically in an erasable storage location, even when this repair is used. The reason why the redundant resources are limited in this way is that it cannot be mapped to the LAYOUT to limit the repair work, because of the degree. Secondly, in the case of redundant columns or rows of a group of resources " reconstruction ", the advantages of the device ratio of the memory module cannot be provided at the time of sale. Therefore, it is necessary to use many parts that have defects that are used in some types of low traps. They can be used in digital telephone answering and other systems, which must correspond to this or fusion (: when properly technology, It is mainly used. First, its flexibility in the chip. The ratio of these patterns to redundant parts is important to the redundancy. It is used in the low-level cost-of-order retrofit tester for general defect testing. Use the defect area of the internal calculation. Xu Yidang memory first and parallel. Some areas and co-ordination in the timing trap pattern. Such as the impact of the super 0 but one aspect of the memory. For example, the memory is not Compressed memory is located in the chip and is designed to find the defects of each device chip. There are still two reasons for allowing these redundancy. Any part of a generally redundant column is therefore required to have a grain size between the grains that exceeds the resource of the region. Therefore, the grain size is still in use. Characteristics and quality The part of building these assets can be used in toys (referred to as audio equipment, these devices are redundant technology parts. If you want to be redundant in the chip know any missing areas. But the body device must be in the The non-dimensional (TIMING) in the die and the inability to perform dimensional area redundancy may use this part because there are too many over-reconstructable ratios (these component information can still be used directly, with a shortage). Format

第6頁 586120 五、發明說明(3) ------ 數位聲訊在5己馇、體内的缺陷只有對聲音的品質產生暫態 的衝擊,雖然這拖 哲卜I ^ ^ 士衝擊本質上"·、法辨識,但是不會對該裝 置,功能產生重要的影響。但是,此簡單的技術無法使用 在高畫質j裝置中,或者是數據已麼縮的轉換下:、麼縮的 可避免的衝擊 其缺陷數遠高h被接受的範®存在在答錄機的應 用中 應更進步加強單一位元缺陷的衝擊,使得產生更多不 而且’存在許多可用之部份記憶髏組件Page 6 586120 V. Description of the invention (3) ------ The defects of the digital audio in the body are only a temporary impact on the quality of the sound, although this is the essence of shock On " ·, method identification, but will not have an important impact on the device, function. However, this simple technique cannot be used in high-definition devices, or the conversion of data has been reduced: the avoidable impact of shrinking, the number of defects is much higher, and accepted Fans exist in the answering machine. The application should be further improved to strengthen the impact of single-bit defects, so that there are more and 'there are many available parts of the memory skull assembly

一種用於在P c中回復部份可用DRAM裝置的技術 稱為位元平面分類。圖1中設計此技術之一例子。標示 1 0中顯示4個分開的記憶體裝置。各記憶體裝置可同時 讀取或寫入4個位元。大部份的共用記憶體類型其寬度至 少為8位元且通常為χ 6或3 2位元。各位元的數據儲存 在記憶體1 0 2内的獨立方塊中。一般,用於不同輸出位 元的數據可實質上更接近,但是其邏輯位址空間仍分開。A technique for recovering part of the available DRAM devices in PC is called bit plane classification. An example of this technique is shown in Figure 1. 4 separate memory devices are shown in the label 10. Each memory device can read or write 4 bits simultaneously. Most types of shared memory have a width of at least 8 bits and usually x 6 or 32 bits. Each element's data is stored in a separate block in memory 102. In general, the data for different output bits can be substantially closer, but their logical address space is still separated.

陷0 個缺 此單一的缺陷影響大量的個別記憶晶胞。標示1 Q 4 顯示一位元平面排,其包含記憶體中的一缺陷行。標示 1 0 5為一包含一缺陷列的位元平面排。如果包含缺陷的 話,則位元平面技術簡單地棄除一整個平面。標示1 〇 6 顯示一缺陷數據平面的數據腳位沒有連接到一外部系統。 係由記憶體提供的數據位元標示為1 0 7。如圖所示,實 際上只有使用連接到數據記憶體之全好的記憶晶胞平面上Trap 0 defects This single defect affects a large number of individual memory cells. The designation 1 Q 4 shows a one-bit flat row containing a defective row in the memory. The label 105 is a bit plane row including a defect row. If defects are included, the bit plane technique simply discards an entire plane. Mark 1 06 indicates that the data pins of a defective data plane are not connected to an external system. The data bits provided by the memory are labeled 107. As shown in the figure, in fact, only a good memory cell plane connected to the data memory is used.

586120586120

五、發明說明(4) 之位元。因此必須使用額外的記憶體裝置以提供所需要的 數據存取寬度。此項技術的優點為操作簡單,但是存在某 些缺點’首先即使該數據冗餘僅包含少數缺陷記憶晶胞 時’整個數據冗餘均無法使用。其次,必需適配其他的記 憶體裝置’以達到所需要的數據寬度。因此佔據P C B上 更多的區域且耗損更多的電力。如果位元組的寫入能力為 記憶體系統中所要求者,則需要更多的組件,此係因為單 一的組件無法將含數據字元的兩位元組分開處理。第三, 當缺陷的平均數上升到某一數量時,將便侍适些記憶邀裝 置無法使用此技術處理。但是,實際上有可能在該記愧趙 裝置中缺陷記憶晶胞的實際數相當的少。 一種更複雜的技術顯示在圖2中。其中多個具缺陷的 記憶體裝置以標示2 〇 1表示。各裝置連接到一特殊對映 的AS I C202中。此裝置的内部包含某些控制邏輯單 元2 0 3及一記憶體陣列2 〇 4。此記憶體形成外部冗 餘,其使得各別記憶體裝置中的缺陷與外部匯流排2 〇 上的記憶體系統的外部傳送的數據隔離。在各別記 有缺陷的對映關係儲存在不可抹除記憶逋裝置 2 0 5中。只要控制邏輯單元偵測到欲存取一缺 動作時,此將該操作切換到冗餘記憶體陣適、 依據此方式,只有具缺陷的記憶晶胞必 j 。 可以適度的使用該記憶體裝置。但是,進灯几餘儲存, 項缺點。第:點,AS IC 2〇2必需在二術艘也及存該在多 統之其餘部份之間的數據路徑中。對於^ … I系 丁於馬速的系統,此技V. Description of invention (4). Therefore, additional memory devices must be used to provide the required data access width. The advantage of this technology is that it is simple to operate, but there are some disadvantages. First, even if the data redundancy contains only a few defective memory cells, the entire data redundancy cannot be used. Secondly, other memory devices' must be adapted to achieve the required data width. Therefore occupying more area on PCB and consuming more power. If the write capacity of a byte is required in a memory system, more components are needed, because a single component cannot process the two-byte component containing data characters. Third, when the average number of defects rises to a certain number, some memory-inviting devices cannot be processed using this technique. However, it is actually possible that the actual number of defective memory cells in the shame Zhao device is quite small. A more complex technique is shown in Figure 2. Many of the defective memory devices are indicated by the designation 201. Each device is connected to a special mapping AS I C202. The device contains certain control logic units 203 and a memory array 204. This memory forms external redundancy, which isolates defects in the individual memory devices from data transmitted externally of the memory system on the external bus 20. Defective mappings are stored in the non-erasable memory device 205. As long as the control logic unit detects an action to be accessed, this operation switches the operation to a redundant memory array. According to this method, only a defective memory cell must be j. The memory device can be used moderately. However, it is a disadvantage to store in a few lights. Point: AS IC 202 must be in the data path between Ershu and the rest of the system. For the ^… I series Ding Ma Su system, this technique

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五、發明說明(5) 術可以達到一 當複雜。必需 的對映關係以 所以在整個製 件且得到完全 為一項極為複 本而不影響原 下’此技術更 【發明内容】 〔所欲解決之 本發明的 聲訊及視訊的 /或視訊數據 其適於使用在 設計這些 些數據包封將 壞。但是,包 破壞後仍可正 包含關鍵性的 效。此格式的 (Μ Ρ 3 )及 〔解決問題之 本發明提 記憶體裝置, 相當的定時 測試各個部 在往後記錄 品程序中必 且準確的缺 雜的挑戰。 先使用部份 不具效率。 技術問題〕 缺陷管理系 儲存。這些 。此類型的 此類型的環 數據檔案以 會耗損掉, 含適當之内 常地連續播 資訊,將不 性能之衝擊。第二, 份可用記憶體裝置, 在一缺陷對映記憶體 需追蹤個別的組件。 陷對映關係至一記愧 尤其是當要求必需維 可用記憶體裝置的優 統可以串列媒體格式 數據播案一般包含愚 數據具有多個重要的 境中。 跨耗損 而導致 部同步 放。因 會致使 例子如Μ P E G — MPEG-2視訊 性網路媒體傳 播放品質產生 的數據格式將 此,如果所有 播放數據的其 3 , Layer3的 信號。 技術手段〕 出一種缺陷管理系統,該系統包 此裝置包含多個缺陷儲存記憶晶5. Description of the invention (5) The technique can be complicated. The necessary mapping relationship is so that the entire product is completely a copy without affecting the original 'this technology is more [inventive content] [the audio and video and / or video data of the invention to be solved is suitable These packets will be broken for use in the design. However, critical effects can still be included after a package is destroyed. (MP 3) in this format and [solution to the problem of the present invention provide a memory device, the timing of testing the various parts must be accurate and accurate in the future record of the missing challenges. It is not efficient to use the part first. Technical issues] Defect Management Department Store. These ones . This type of this type of ring data file will be lost and contain continuous broadcast information as appropriate, which will not impact performance. Second, the available memory devices are required to track individual components in a defect-mapped memory. It ’s a shame to fall into the mapping relationship, especially when it is necessary to maintain the available memory device. The system can serialize the media format. Data broadcasts generally contain stupid data in many important situations. Cross-consumption leads to simultaneous synchronization. As a result, for example, MPG — MPEG-2 video network media transmission, the quality of the data format will be the same, if all the playback data is 3, the signal of Layer3. Technical means] A defect management system is provided. The system includes a plurality of defect storage memory crystals.

製造程序相 且儲存缺陷 2 0 5 中。 測試這些組 晶胞的程度 持低測試成 點的情況 作業以進行 縮的聲訊及 特性,而使 送。因此某 暫時性的破 允許在遭到 的包封均不 餘部位無 聲訊信號 含:至少一 胞;一不可The manufacturing process is related to storage defects in 2005. Test the degree of unit cell in these groups. Keep the test point at a low level. Perform operations to reduce the sound and characteristics of the cells. Therefore, a temporary break is allowed without sound signals in the remaining parts of the encapsulation. Including: at least one cell;

第9頁 586120Page 9 586120

抹除記憶體,此記憶體具有多個記憶體方塊,以將上述缺 陷的位置儲存在記憶體方塊内;其中該缺陷管理系統測試 1缺陷記憶體裝置,且配置該不可抹除記憶體的形態,以 指示在各記憶體裝置中缺陷區域的位置,且在系統使用期 間’偵測新的缺陷,而將所偵測的新缺陷加入不可抹除記 愧體中的缺陷對映關係。由下文的說明可更進一步瞭解本 發明的特徵及其優點,閲讀時並請參考附圖。 【實施方式】Erase memory, this memory has multiple memory blocks to store the locations of the above defects in the memory blocks; wherein the defect management system tests 1 defect memory device and configures the form of the non-erasable memory To indicate the position of the defect area in each memory device, and 'detect new defects during system use, and add the detected new defects to the defect mapping relationship in the non-erasable shame body. The features and advantages of the present invention can be further understood from the following description, and please refer to the accompanying drawings when reading. [Embodiment]

圏3中顯示本發明之實施例。其中數據串列區以標示 fO 1顯示。該數據串列區包含各別的數據框302。在 這些數據框3 〇 2中,依據所使用的格式,而使得每一數 據框具有相同的長度或不同的長度。 每一數據框以一格樞同步3 〇 3開始。此允許甚至在 數據傳輸時當包封耗損或破壞發生時,仍可以決定各數據 框的開始處。一數據框的表頭3 〇 4提供與數據框内容相 關的資訊。最後需要說明數據框3 〇 5的數據酬載中包含 媒艘的内容。 具有此特性的檔案尤其是適於使用此類型之缺陷管理 系統的儲存體。雖然進行開始時測試作業以找出記憶體中Example 3 shows an embodiment of the present invention. The data series area is displayed with the symbol fO 1. The data series area includes respective data frames 302. In these data frames 302, each data frame has the same length or a different length depending on the format used. Each data frame starts with a grid synchronization of 303. This allows the beginning of each data frame to be determined even when data loss or destruction occurs during data transmission. A data frame header 304 provides information related to the content of the data frame. Finally, it needs to be explained that the data payload of data frame 305 contains the contents of the media ship. Files with this feature are especially suitable storage for this type of defect management system. While doing the initial test job to find the memory

的缺陷位置,但是在該記憶體的使用期間,仍可能存在少 量的缺陷三需要這些缺陷對於該裝置的性能不會有致命性 ?衝擊值ΐ使用數據串列媒體檔時,一缺陷的衝擊相當的 ί i使ί 2有對於播放的品質產生暫時的效應。在許多例 子中’使用者根本無法辨識此缺陷。Location of the defect, but during the use of the memory, there may still be a small number of defects. Three. These defects are not expected to be fatal to the performance of the device. Ί i makes til 2 have a temporary effect on the quality of playback. In many cases, the user cannot recognize the defect at all.

586120 五、發明說明(7) 缺陷管理技術尤其是適於使用某些裝置中’其中這些 裝置的數據儲存在快取記憶體中,以隨後在一裝置中播 放。此儲存的數據將不會從該裝置傳送到另一儲存媒艘 中。此製品之一例子為可攜式的MP 3聲訊或MPEG — 4視訊播放器。從一個人電腦中下載媒體檔以儲存在該裝 置中,然後在播放出來。 必需瞭解,本發明的缺陷管理技術尤其是適於串列媒 體格式數據的儲存,但是也可以儲存其他格式的數據。如 果在内建之自行測試期間測試所涵蓋的範圍比標示為良妤 的對映方塊的結果還要好很多的話,則該媒體可以視為任 _ 何型式之數據之可靠的儲存媒體。 圖4中顯示使用此缺陷管理系統之一系統的實際架構。該 系統具有多個記憶體裝置40 1 。圖中所使用之記憶體裝 置的數目並不用於需要本發明的系統,圖中所顯示者為所 需要記憶體數目中最少的數目。任何數目的記憶體裝置均 適於本發明。這些記憶體可能包含多個具缺陷的記憶晶 胞。雖然需要限制缺陷的數目以確保整個製品具有某些記 憶體容量,但是在一給定的裝置中缺陷的數目基本上並沒 有限制。 由位址及控制信號4 0 2控制兄憶體裝置。依據記憶 _ 體的架構,該位址及控制信號可以是指向各個記憶體裝置 之位址不相關的信號,或者是可以是共用的共同控制及位 址信號,除了各個裝置的選擇。 使用數據匯流排4 0 3寫入數據到這些記憶體中,或586120 V. Description of the invention (7) Defect management technology is particularly suitable for use in certain devices' where the data of these devices are stored in cache memory for subsequent playback in a device. This stored data will not be transferred from the device to another storage vehicle. An example of this product is a portable MP 3 audio or MPEG-4 video player. Download media files from a personal computer to store in the device and play them back. It must be understood that the defect management technology of the present invention is particularly suitable for storage of serial media format data, but can also store data in other formats. If the range covered by the built-in self-test during the test is much better than the result of the mapping box marked as good, then the media can be regarded as a reliable storage medium for any type of data. The actual architecture of a system using one of these defect management systems is shown in Figure 4. The system has a plurality of memory devices 40 1. The number of memory devices used in the figure is not used in a system requiring the present invention, and the number shown in the figure is the smallest of the required number of memories. Any number of memory devices are suitable for the present invention. These memories may contain multiple defective memory cells. Although the number of defects needs to be limited to ensure that the entire article has some memory capacity, there is essentially no limit to the number of defects in a given device. The memory device is controlled by the address and the control signal 4 2. According to the architecture of the memory, the address and control signals can be signals that are not related to the addresses of the various memory devices, or can be shared common control and address signals, except for the selection of each device. Write data to these memories using data bus 4 0 3, or

586120 五、發明說明(8) 者是從記憶體中讀取數據。 於各記憶體而古,铉此二厌疋明 ,士也t W些“號可以是分 使用的信號。基本上該記 記憶體裝置,以摇柢μμ化 果構中 货许β以提供比任何各別的記 Ϊ度。仁疋,此對於記憶體寬度不重 用一共用數據匯流排架構,以減 之插腳數。 記憶體控制器404。基本上該 器、’而且可以控制記憶體系統的存取 器連接到一缺陷對映記憶體4 0 5。 體,其容量比主記憶體陣列小报多, 陣列内具缺陷區域的對映關係。當需 避免具缺陷的記憶晶胞時,該記憶體 表中相關的區域。在使用期間當偵測 憶體控制器也吁以更新缺陷對映關係 圖5中顯示整個系統的架構。用 體數據的數據串列以標示5 〇 1表示 位準格式不會受到缺陷管理系統操作 製品設計中可从視為一黑盒子系統。 5 0 2決定主紀憶體中的位址。其中 寫入輸入數據處。例如,有可能輸入 介面’其寫入Μρ 3聲訊數據以儲存 整個控制器5 0 3決定缺陷管理 點處儲存或讀取數據者。此方塊也存 依據記憶體架構,對 開的信號,或是共同 使用多個平行排列的 憶體更寬的數據存取 要的系統中,可以使 記憶體控制器中實際 控制器為一微處理 動作。該記憶體控制 此為一不可抹除記憶 且用於儲存在記憶體 要存取記憶體陣列以 控制器存取缺陷對映 到新的缺陷時,該記 〇 於儲存在系統中之媒 。此數據中實際的低 方式的影審,因此在 數據寫入控制器 該主記憶體為儲存且 數據501來自pc 在製品中。 系統是否在任何空間 在與製品之其餘部份586120 V. Description of the invention (8) The reader reads data from the memory. In the memory of the ancient times, the two are obscure, and the "number" can be a signal for sub-use. Basically, the memory device is used to shake the μμ in the fruit structure to provide a ratio of β. Any individual memory. Ren Ye, this does not reuse a common data bus architecture for memory width to reduce the number of pins. Memory controller 404. Basically, it can control the memory system's The accessor is connected to a defective anti-memory memory 405. Its capacity is larger than that of the main memory array, and there is a mapping relationship of defective areas in the array. When it is necessary to avoid defective memory cells, the memory Relevant areas in the body surface. During detection, the memory controller also calls for updating the defect mapping relationship. The overall system architecture is shown in Figure 5. The data series of the volume data is marked with 501 to indicate the level format. It will not be affected by the defect management system. The design of the operating product can be regarded as a black box system. 502 determines the address in the subject memory. It is where the input data is written. For example, it is possible to enter the interface 'its write Μρ 3 audio data to Store the entire controller 503 to determine who stores or reads data at the defect management point. This block is also stored according to the memory architecture, the signals that are open, or the use of multiple parallel arrays of memory for wider data access requirements. In the system, the actual controller in the memory controller can be a micro-processing action. The memory control is a non-erasable memory and is used for storing in the memory to access the memory array for the controller to access the defect. When a new defect is reflected, it should be recorded in the media stored in the system. The actual low-level audit in this data, so when the data is written to the controller, the main memory is stored and the data 501 comes from the PC in process Whether the system is in any space with the rest of the product

586120 五、發明說明(9) ^接的介面,因此整個應用可以指令缺陷管理系統的行 為0 二目錄寫入控制器5 0 4與寫入控制器緊密耦合。該 、工制器所儲存的資訊如在特定媒體檔或檔案區塊2記 憶體中的開始及結束位址。此允許隨即可取得數據。該目 錄資訊寫入主記憶體中預定的區域。586120 V. Description of the invention (9) ^ interface, so the entire application can instruct the behavior of the defect management system. 0 The directory write controller 504 is tightly coupled with the write controller. The information stored by the tool is such as the start and end addresses in the memory of a specific media file or file block 2. This allows data to be obtained immediately. The directory information is written in a predetermined area in the main memory.

一 其中顯示記憶體陣列位在圖中心處,以標示5 0 5顯 不此可包含數個各別之部份可用記憶體裝置。使用一標準 的位址解碼方式以依據所呈現的位址選擇個別的裝置。記 憶艘控制器從數據寫入及目錄寫入控制器中接收數據及位 址。由數據讀取及目錄讀取控制器可以存取記憶體中的項 目。因為所使用的記憶體裝置為部份可用者,所以在記憶 想陣列中任何空間的記憶晶胞可能具有缺陷,且因此無法 可靠地儲存在一數據位元中。 … 在缺陷對映記憶體中維持記憶體陣列中缺陷的對映關 係506。此為一不可抹除記憶體,且該記憶體的容量基本 上為主s己憶艘陣列中的某一比例。該記愧體儲存在主記憶 體陣列内缺陷方塊的位置的對映關係。 ” ^One The display memory array is located at the center of the figure, which is marked with 50.5. This may include several separate parts of available memory devices. A standard address decoding method is used to select individual devices based on the presented address. Remember that the controller receives data and addresses from the data write and directory write controllers. Data read and directory read controllers can access items in memory. Because the memory device used is partially available, the memory cell in any space in the memory array may be defective and therefore cannot be reliably stored in a data bit. … Maintaining the mapping of defects in the memory array 506 in the defect mapping memory. This is a non-erasable memory, and the capacity of the memory is basically a certain proportion in the main memory array. The antiquated body is stored in the mapping of the position of the defective block in the main memory array. "^

目錄讀取控制器5 0 7可以由目錄寫入控制器取得儲 存在記憶體中的開始及結束資訊。因此可以決定特定媒艘 檔中數據的開始及結束數據的位址。 ' 數據讀取控制5 0 8讀取來自記憶艘之數據,且傳 送這些數據到輸出頻道5 0 9中。如果需要的話,該控制 器玎以連接到該系統的其餘位置以提供所需要的功^。例The directory read controller 507 can obtain the start and end information stored in the memory by the directory write controller. Therefore, the address of the start and end data of the data in a specific media file can be determined. '' The data read control 508 reads the data from the memory ship and sends these data to the output channel 509. If necessary, the controller is connected to the rest of the system to provide the required power ^. example

586120586120

=丄可以連接到一Mp 3解碼器系統,以從一 PC介面播 放先前儲存在一裝置中的數據。 处 2陷快取記憶體控制器以5 1 〇標示。該控制器的功 月匕當寫入檔案時,儲存與特定之媒體檔案相關的缺陷對 映,係的快取版本。此快取缺陷對映關係本身可以儲存在 主記愧艘中,該快取的型式表示在寫入媒體缺陷時該缺陷 的狀態。 圖中顯示一新缺陷控制器模組511。在使用該製品 期間’該模組將已偵測到新缺陷加入該缺陷記憶體中。 最後有一内建自行測試(Β ϊ st)單元5 12,此單元 的功能為在記憶體陣列上執行一連串的測試作業,且補捉 缺陷組以寫入缺陷對映記憶體5 〇 6中。一般只有在該製 品起動或當製造程序期間使用一指定的測試夾(test jig:) 時起動該製品時,才執行此一連串的測試程序。其中信號 5 1 3標示何時執行b I s T測試。 在記憶體裝置内的記憶晶胞再次分為多個對映的方 塊。各對映方塊包含在記憶體裝置内的多個記憶晶胞。各 對映方塊表示可以為缺陷管理系統標示為良好或不良的最 小可執行區域。如果一對映方塊包含任何的缺陷記憶晶胞 時,則該對映方塊被標示為不良的對映方塊。如果一對映 方塊被標示為良好的對映方塊時,則在該方塊内所有的記 憶晶胞在其記憶晶胞執行記憶艘測試時,必需均可以可靠 地儲存數據。必需瞭解在往後的使用中,在某些環境下, 這些記憶晶胞有可能無法可靠地儲存數據,在此情況下,= 丄 Can be connected to an Mp 3 decoder system to play back data previously stored in a device from a PC interface. The 2 trap cache memory controller is labeled 5 10. The function of the controller, when writing to a file, stores a cached map of the defects associated with a particular media file. This cache defect mapping can itself be stored in the master shame boat, and the cached pattern indicates the state of the defect when the defect is written to the media. The figure shows a new defect controller module 511. During the use of the article 'the module adds a detected new defect to the defective memory. Finally, there is a built-in self-test (B ϊ st) unit 5 12. The function of this unit is to perform a series of test operations on the memory array, and to catch the defect group to write into the defect mapping memory 506. This series of test procedures is generally performed only when the product is started or when the product is started when a specified test jig () is used during the manufacturing process. The signal 5 1 3 indicates when the b I s T test is performed. The memory cell within the memory device is again divided into a plurality of antipodal blocks. Each antipodal block contains a plurality of memory cells within a memory device. Each checkbox indicates the smallest executable area that can be marked as good or bad for the defect management system. If a pair of antipodes contains any defective memory cell, the antipod is marked as a bad antipod. If a pair of map blocks is marked as a good map block, all memory cells in the block must be able to reliably store data when performing a memory boat test on their memory cells. It is necessary to understand that in future use, under certain circumstances, these memory cells may not be able to reliably store data. In this case,

586120 五、發明說明(11) 此對映方塊將標示轉為不良狀態,反之,不良對映方塊不 可能被轉為標示良好之對映方塊。586120 V. Description of the invention (11) The mapping box will be marked as bad, otherwise, the bad mapping box cannot be turned into a well-marked mapping box.

在對映方塊内記憶晶胞的數目決定主記憶體陣列及所 需要之缺陷對映記憶體的大小之間的關係。在一缺陷對映 記憶艘内只需要單一位元即可表示一對映方塊。此簡單地 顯示一對映方塊為良好或不良者。例如,如果各個對映方 塊包含1 0 2 4個記憶晶胞,則該記憶體陣列的大小為 6 4 Μ B,則該缺陷對映記憶體必需為6 4 K B。該缺陷 管理系統允許可以調整對映方塊的大小以符合實際應用上 的需要。較大的對映方塊使得缺陷對映記憶體的需要達到 最小,但是其缺點為在記憶體陣列中浪費較多良好的記憶 晶胞,甚至當記憶體陣列中只包含少數不良的記憶晶胞, 則整個對映方塊必需被標示成不良的記憶晶胞,且在該對 映方塊内的記憶晶胞均不使用。The number of memory cells in the antipodal block determines the relationship between the main memory array and the size of the defective antipodal memory required. Only a single bit is required to represent a pair of mapping blocks in a defective mapping memory vessel. This simply shows that a pair of mapping squares is good or bad. For example, if each antipodal block contains 102 memory cells, and the size of the memory array is 64 MB, the defective antipodal memory must be 64 KB. The defect management system allows the size of the mapping block to be adjusted to meet the needs of practical applications. The larger antipodes minimize the need for defective antipodal memory, but the disadvantage is that more good memory cells are wasted in the memory array, even when the memory array contains only a few bad memory cells, Then the entire antipodal block must be marked as a bad memory cell, and no memory cell in the antipodal block is used.

圖6中顯示包含多個缺陷記憶晶胞的記憶體陣列,以 標示6 0 1表示。該記憶體包含各別的對映方塊6 0 2。 該記憶體陣列包含大量的缺陷6 0 3 ,其影響大量的相鄰 之記憶晶胞。包含任何具缺陷之記憶晶胞的對映方塊必需 被標示為不良的記憶晶胞。在圖中這些記憶晶胞以陰影線 遮住。標示6 〇 4標示由缺陷6 0 3所導致之不良對映方 塊的區域。 記憶艚陣列也包含行缺陷6 0 5。在記憶體令由於下 層之實際架構而使得行及列缺陷很常見,在整個記憶體陣 列中(包含字元線及位元線)記憶體陣列實際上為連接個A memory array containing multiple defective memory cells is shown in FIG. The memory contains a separate mapping block 602. The memory array contains a large number of defects 603, which affect a large number of adjacent memory cells. The antipodal box containing any defective memory cell must be marked as a bad memory cell. These memory cells are shaded in the figure. Marking 604 indicates the area of the bad enantiomeric block caused by defect 603. The memory array also contains row defects 6 0 5. In memory, row and column defects are very common due to the actual structure of the underlying layer. In the entire memory array (including word lines and bit lines), the memory array is actually connected to

第15頁 586120 、發明說明(12) 別記憶晶胞水平及 路或破壞這些連結 而標示為不良的記 垂直交錯的軌道。如 ,則將產生一具缺陷 憶晶胞在圖中以6 0 果以某些方式而短 的行或列。行缺陷 6標示。 記憶體陣列也包含一行缺陷6 0 7。由於缺陷而標示 成缺陷管理系統者在圖中以6 〇 8標示出來。 一般’在一對映方塊内行記憶晶胞的數目及列記憶晶 的數目為2的次方。此允許在缺陷對映記憶體中的不良 標的正確位址可以直接從主記憶體位址中得到。可以使 用簡單的移位及加法運算以計算該位址,這對使用低效能Page 15 586120, description of the invention (12) Don't memorize the level and path of the unit cell or break these connections and mark them as bad notes. Vertically staggered tracks. If, it will produce a defective row or column of the memory cell in the figure with some 60 results in some way. Line defect 6 is marked. The memory array also contains a row of defects 6 0 7. Those who are marked as a defect management system due to a defect are indicated as 608 in the figure. Generally, the number of rows of memory cells and the number of rows of memory cells in a pair of squares is a power of two. This allows the correct address of the bad object in the defective mapping memory to be obtained directly from the main memory address. You can use a simple shift and addition operation to calculate the address, which is inefficient for using

之微處理器,以軟體方式處理此管理系統,尤其重要。 圖7中顯示在主記憶體陣列缺陷及對應之缺陷對映記 $想之間的關係。具有缺陷之記憶體陣列標示為7 0 1 。 陷對映記憶體為標示7 0 2。在記憶體中的單一位元 士到β己憶艘陣列中的對映方塊。在本該對 映方坡兔τ & & 馬不良者’則將缺陷對映的内容標示成1,如果該 顯示在,良好者’則標示為〇,反之亦然。標示70 3 ;I Μs己憶體中的對映方塊及在缺陷對映記憶體中的位 70之間的關係。It is especially important for the microprocessor to handle this management system in software. Figure 7 shows the relationship between the defect of the main memory array and the corresponding defect map. Defective memory arrays are labeled 7 0 1. The trapped mapped memory is labeled 702. A single bit in memory to an antipodal block in a beta-cathode array. In the case of the counterpart Fangpo Rabbit τ & & Horse Defective, the content of the defect mapping is marked as 1, if it is displayed, the goodness is marked as 0, and vice versa. Denotes the relationship between the 70 3; 1 Ms enantiomeric block in memory and bit 70 in the defective antipodal memory.

陷餅:從該記憶艘陣列中寫入或讀取數據時’則檢查缺 數據。、$係。從在一特定之對映方塊中的同等位置t存取 下一良達到一對映方塊的終點時,該位址增加,且指向 入之對映方塊開始點。依據此方式’在記憶艘中寫 示數據期間’將跳過具缺陷的對映方塊。圖中以標 _不在各個良好對映方塊中的對映方塊的數目。Trap cake: When writing or reading data from the memory boat array ', it checks for missing data. , $ Department. When accessing from the same position t in a specific antipodal block, the next address reaches the end of a pair of antipodal blocks, the address increases and points to the starting point of the antipodal block. In this way, 'during the writing of data in the memory vessel', defective maps will be skipped. The figure is labeled with the number of mapping blocks that are not in each good mapping block.

586120586120

五、發明說明(13) 這些數目表示可存取之記憶體陣列中有4 7個良好的 方塊。對映方塊的形狀對於對映方塊的數目有直接的影、 響,依據其缺陷的實際架構將該對映方塊標示成不良^ 映方塊。 % 圖8顯 是,在此例 移。即,在 瞭解在各對 總數相同, 同。區域8 有8個對映 個。因此兩 於行缺陷的 塊。總共有 6中有4個 下,水平向 中,一對映 高度中只有 缺陷的關係 6中係為4 塊,處理列 囷9中 唯在本例子 體陣列中, 示圖6相同 子中,在形 記憶體陣列 映方塊中記 且因此必需 0 1顯示具 方塊被標示 者之間的差 關係,這些 8個對映方 。所以在行 偏移對映方 方塊可以包 單一的一列 ’這些對映 個,所以, 缺陷較有效 顯示與圓6 中’在形狀 這些對映方 的記憶體陣 狀中已將對 中其列分段 憶晶胞的總 使用之缺陷 有圓形缺陷 成不良的對 別不大。這 對映方塊被 塊被標示成 對映中,與 塊較沒有效 含記憶體陣 。標不8 0 方塊總共係 在列對映中 率。 相同的記憶 上對映方塊 塊的行區段 列及缺陷的 映方塊在水 比行分段來 數與圖6中 對映記憶體 的對映方塊 映方塊,而 些區域8 0 標不為不良 不良的對映 方形的對映 率。在一極 列中所有的 3的區域, 有2個視為 ’水平向偏 體陣列及缺 呈垂直偏移 比列區段長 配置。但 平向上偏 得長。必需 對映方塊的 的大小也相 。在本圖中 圖6中有9 2中顯示由 的對映方 方塊,而圖 方塊比較 端的例子 行,但是在 顯示由於列 不良,而圖 移對映之方 陷的配置。 。即從記憶 。必需瞭解5. Description of the invention (13) These numbers indicate that there are 47 good blocks in the accessible memory array. The shape of the antipodal block has a direct effect on the number of antipodal blocks. According to the actual structure of the defect, the antipodal block is marked as a bad antipodal block. % Figure 8 shows yes, in this example shift. That is, the total number in each pair is the same and the same. Region 8 has 8 maps. So it's more than a defective block. There are 4 out of 6 in total. In the horizontal direction, there is only a defect in the pair of mapping heights. The relationship 6 is 4 blocks. The processing column 囷 9 is only in the example array of the example. The shape memory array maps the squares and therefore must be 0 1 to show the difference relationship between those marked with the squares, these 8 enantiomers. So in the row offset antipodal squares can contain a single column 'these antipodes, so the defect is more effectively displayed with the circle 6' in the shape of the memory array of these antipodes has been aligned in its columns The defects of Duan Yi's unit cell are round defects which are not good. This antipodal block is marked as antipodal by the block, which is less effective than the block containing the memory array. The total number of squares that are not 80 is in the column mapping. In the same memory, the rows and columns of the mapped blocks and the defective mapped blocks are numbered in the water ratio to the number of mapped blocks in the mapped memory in FIG. 6, and the areas 80 are not marked as bad. Poorly contrasting squares. Of all 3 areas in a pole column, two are regarded as 'horizontal deflection arrays' and lack vertical offset than the column sections. However, it is too long flat. The size of the required antipodes is also similar. In this figure, Figure 9 shows the antipodal square block shown by 9 in the figure, and the example of the square block is relatively the same as the row, but the figure shows the configuration of the antipodal squared column due to the bad column. . Ie from memory. Must understand

586120 五、發明說明(14) 在各對映方塊内記憶晶胞的總數同於圖6者,因此所需要 之缺陷對映記憶體的大小也相同。區域9 〇 1顯示在圓形 缺陷中標示為具缺陷之對映方塊。總共有8個對映方塊被 標示為不良的對映方塊,而圖6中則為9個。因此,兩者 之間的差異不大。區域9 0 良的對映方塊。只有兩個被 個。與方形的對映方塊比較 效率。區域903顯示由於 塊。該區域中總共有8個對 6中則有4個。在處理列缺 沒有效率。在極端的例子中 列中所有的列,但是各列的 記憶體中得到一新列的存取 行之數據還要長很多時,則 不經濟。存取各別列所麵措 行的功率還要多。 2顯示由於行缺陷而標示為不 標不為不良者,而圖6中有4 下,垂直偏移對映方塊比較有 列缺陷而標示為不良的對映方 映方塊被標示為不良者,而圖 陷時,垂直偏移的對映方塊較 ,對映方塊可以包含記憶體陣 寬度只有一行。但是,當從一 時間比在同一列中得到一不同 此方法在效率及性能上則顯得 的功率也比在同一列中的不同 因此一般配置的訝映方塊的大小及形狀以符合主 體及可使用之缺陷對眯勺义狀从付口主δ己憶 發現之缺陷的-般分佈5己尺寸及在記憶艘裝置中所 移,則使用水平偏移:對:=列在強烈的偏 烈的偏移,則使用垂直::::映=在行缺陷上存在強 内建自行測試(Β Τ ς 憶艘裝置,以產生-_ #=目的為測試部份可用記 的缺陷涵蓋範圍,則可、,、圖❶如果可以得到充足 則了以找出在該裝置内大部份的缺陷位586120 V. Description of the invention (14) The total number of memory cells in each antipodal block is the same as that in Fig. 6, so the size of the required antipodal memory is also the same. The area 901 shows the opposite square marked as defective among the circular defects. A total of 8 antipodes are marked as bad antipodes, compared to 9 in Figure 6. Therefore, there is not much difference between the two. Area 9 0 good antipodal squares. Only two were. Efficient compared to square counterparts. The area 903 is displayed due to the block. There are a total of 8 pairs in this area and 4 out of 6. There is no efficiency in dealing with column gaps. In the extreme example, all the columns are in the column, but it is not economical to obtain a new column in the memory of each column for a long time. More power is required to access the individual columns. 2 shows those marked as not marked or not due to row defects, while in Figure 6 there are 4 times where the vertically offset mapper has column defects and the mapper marked as bad is marked as bad, and When the image is trapped, the vertically offset antipodal blocks are compared. The antipodal blocks can contain only one line of memory array width. However, when a difference is obtained from a time ratio in the same column, the power and efficiency of this method appear to be different than that in the same column. Therefore, the size and shape of the general configuration surprise box are consistent with the subject and can be used If the defects are in the same shape as the defects found from the owner δ Ji Yi, the general distribution is 5 and the size is shifted in the memory boat device, then the horizontal offset is used: right: = listed in a strong bias. Shift, then use vertical :::: ying = there is a strong built-in self-test on the line defect (Β Τ ς memory device, to generate -_ # = purpose to test the coverage of the defect that can be recorded, then, If you can get enough, figure 找出 to find most of the defects in the device

586120 五、發明說明(15) 置,則存入缺 用記憶體的缺 只有少量的額 BIST 試該記憶體, 般。因此,幾 執行B I s T 知技術比較下 t成本。因為 =上進行此項 之實際裝置 $巢置插座上 ‘最後製品所 用記憶體裝置 通常,在 B I S T。另 ί δ 1 8 Τ 程 二因為測試 Μ Β 1 S τ 測 φ 在 Β I S 提要而與正常 少翁挪試所涵 額外缺陷數 當開始Β 陷對映記憶 陷區域中儲 外缺陷被發 使用相同的 如同該缺陷 乎不會導致 之故。無論 ,此更進一 一當記憶體 測試,在整 相關的缺陷 由於不良的 使用的環境 〇 製品程序期 外,可以由 序,而不會 的程序不需 試可以延長 Τ進行期間 的情況不同 蓋的範圍, 體内。 存數據 微控制 管理系 其他額 如何必 步降低 裝置被 個製造 對映。 導電率 對極相 然後可以避免在此部份可 。在該製品的使用期間, 器或其 統的正 外的製 需包含 使用部 整合到 程序t 而且, ,所產 同的環 他的硬 常操作 品成本 此功能 份可用 製品中 ,不會 可以避 生的衍 境下測 體機構以測 期間使用一 ,此係因為 。與某些習 記憶體裝置 在最後的製 再追蹤與特 免在測試器 生缺陷。在 試此部份可 間,當製品第一次賦能時,進行 一組由外部輸入系統的信號開始 在製品的正常使用期間進行該程 要昂貴記憶逋測試器的資源,所 時間。 ’電壓或溫度等的環境條件可適 。此允許在Β I S T期間,可以 而且因此在製品使用期間可以減 I ST處理時,先清理缺陷對映記憶體 以586120 Fifth, the invention description (15), then the lack of memory is stored in the memory, only a small amount of BIST try the memory, generally. Therefore, several implementations of B I s T know the technology to compare the cost. Because = the actual device on which this is done $ Nested socket on the ‘memory device used for the final product Normally, at B I S T. In addition, δ 1 8 Τ is the same as the number of additional defects included in the normal IS test when testing Μ Β 1 S τ and φ in the BS IS feed. As if the defect was hardly the cause. Regardless, this step by step when the memory test, the entire related defects due to the poor use of the environment, the product program period, the process can be started, and the program will not be tested without the need to extend the situation during the T cover The scope of the body. Stored data Micro-control Management Department Others How to reduce the device is necessary to be mirrored by the manufacturing. Conductivity counter phase can then be avoided in this part. During the use of the product, the manufacturing of the device or the system must include the use of the integration of the use part into the program t. Moreover, the cost of the same common operating products produced by this product can be used in the product. It will not be avoided. This is because of the use of one during the testing period in the health environment. With some custom memory devices in the final system, tracking and avoiding defects in the tester. In this part of the test, when the product is first energized, a set of signals from an external input system is performed to perform the process during the normal use of the product, which requires expensive memory and tester resources and time. Environmental conditions such as voltage and temperature are suitable. This allows the defect-mapped memory to be cleared first during the B I S T and can and therefore can be reduced during the use of the product.

586120 五、發明說明(16) 使得在部份記憶艘中所有的 試期間偵測到期間缺陷時, 者。實際上,BIST對應 域,此操作更像磁數據儲存 BIST可以包含任何 包含多個匹配的測試圖樣, 減少位址的方向,而定址記 憶體中確定的錯誤(即—記 成1或0),且耦合在該記 的錯誤。對於DRAM而言 所以在某些測試中將超過最 漏失率的弱記憶晶胞,且因 當完成所有的測試作業 定記憶體中所留下的良好容 不是,則視該裝置已失效。 (iterative test ),該項 到不再偵測到任何新的缺陷 或不穩定的裝置必需以某種 的測試。 在製品中使用部份可用 接向一篩選程序。因此可以 足敷使用,且不會違反參數 超過最大備用電流。通常部 良好裝置而言,其具有較差 區域均為良好的區域。當在測 則將該對映方塊標示為不良 格式化操作以決定不良的區 媒體的格式化。 測試配置組。但是一般來說, 其沿著數據改變圖樣,增加或 憶體。設計這些測試以找出記 憶晶胞只可用可靠的方式儲存 憶體陣列中相鄰記憶晶胞之間 ’必需周期性地更新其内容, 大的更新時間,以偵測具有高 此無法可靠地儲存數據。 後’必需進行檢核作業,以確 量大於一預定的最小值。如果 該B I S 丁也包含迭代測試 測試為持續測試該記憶體,直 為止。此允許對於缺陷數目多 方式在該裝置上必需進行更多 記憶體裝置時,這些裝置必需 確定在製品中記憶晶胞的數目 最大化的原則。例如,不可以 份可用記憶體裝置對於所有的 的參數性能。 '586120 V. Description of the invention (16) When the period defect is detected in all the trial periods in some memory ships, In fact, the BIST corresponds to the field. This operation is more like magnetic data storage. The BIST can contain any test pattern that contains multiple matches, reducing the direction of the address, and the error identified in the addressing memory (ie, recorded as 1 or 0) And coupled in the mistake of the note. For DRAM, in some tests, the weak memory cell with the highest leakage rate will be exceeded, and since all the test tasks are completed, the good capacity left in the memory is not, it is considered that the device has failed. (iterative test). This item does not detect any new defects or unstable devices and must be tested in some way. The part used in the product is available to a screening process. Therefore, it can be used fully without violating the parameters and exceeding the maximum standby current. Generally speaking, a good device has a poor area and a good area. When under test, mark the map box as a bad format operation to determine bad areas. Format the media. Test configuration group. But in general, it changes the pattern along the data, adds or recalls. Design these tests to find out that the memory cell can only be stored in a reliable way between adjacent memory cells in the memory array. 'It is necessary to periodically update its content. Large update time to detect the high data. The latter 'must be checked to ensure that it is greater than a predetermined minimum. If the B I S D also contains iterative tests, the test is to continuously test the memory until then. This allows the principle of maximizing the number of memory cells in the product when more memory devices have to be made on the device for a large number of defects. For example, it is not possible to share the performance of available memory devices for all parameters. '

586120 五、發明說明(17) 圖1 0為本發明篩選程序的流程圖。在步驟1 0 〇 1 中以未分類的部份可用記憶體裝置開始進行該糕序。在步 驟1 0 0 2中進行篩選程序。在此程序中進行多種不同的 測試作業。其中包含功能記憶體測試及參數測試。這些測 試並沒有徹底的進行,而是簡單地提供在一特定裝置中缺 陷記憶晶胞數目’指示。一種可能性為使用具有適當之包 封處理器的商用記憶體測試器。但是,這些測試器一般設 計上係針對測試所有的良好之記憶體裝置,而且一般無法 計算一記憶體裝置中缺陷記憶晶胞的數目,而立這些測試 使用一通過/失敗(P a s s / i a i !)的測試準則。 對於DRAMit件而言,另—項選擇為使用(個 人電腦)為基礎的測試器。將記憶體裝置載入零插拔力插 座的載體,且插人—t a u ^ 好記憶體模組插"m己憶體模組中良 一* 落第一模組插槽用以執行作業系統及應 I程^ ^ f隐體測試程式對於測試下的模組進行核對作 肉。L二鍤可、’且指示那些部件在最大缺陷記憶晶胞計數 ^ # ^ +二,擇的方式為在最後製品的環境下測試這4b 組件。可對於這此却掩躲 - 品。然後可以進;標:=使用具有零插入力插座的製 製品中產生回授;:準:::::,“筛選這些組件。從 些組件沒有通過^。顯_些元件已通過測試’且那 性。ί:選以r:r變環境參數以改進測試的有致 以組件上進對於這些元件所需要的存取 V21 ΐ 1 ^ 586120586120 V. Description of the invention (17) Figure 10 is a flowchart of the screening procedure of the present invention. The sequence is started in step 1001 with an unclassified portion of the available memory device. The screening procedure is performed in step 1002. A number of different test jobs are performed in this program. It includes functional memory test and parameter test. These tests were not performed thoroughly, but simply provided an indication of the number of defective memory cells in a particular device. One possibility is to use a commercial memory tester with a suitable encapsulated processor. However, these testers are generally designed to test all good memory devices, and generally cannot calculate the number of defective memory cells in a memory device, and these tests use a pass / fail (P ass / iai!) Test criteria. For DRAMit, the other option is to use a (personal computer) -based tester. Load the memory device into the carrier of the zero-plug force socket, and insert it—tau ^ Good memory module plug " mjiyi body module Liangyi * dropped the first module slot to run the operating system and The procedure I should use ^ ^ f stealth test program to check the modules under test as flesh. L 锸, ’, and indicates which parts have the largest defect memory cell count ^ # ^ + 2, the choice is to test the 4b component in the environment of the final product. But I can hide from this. Then you can enter; mark: = use the product with zero insertion force socket to produce feedback ;: quasi :::::, "screen these components. From these components failed ^. Some components have passed the test ' And that: ί: Choose r: r to change the environmental parameters to improve the test so that the components are advanced for the access required for these components V21 ΐ 1 ^ 586120

五、發明說明(18) 最後的應用所還嚴袼。一般對於所有 帶以減少組件誤通過缔選準則的機率。、試參數設定保護 標示1 0 0 3為篩選的決定點。作 小於一最大可允許數的組件(或者是、、,記憶晶胞數 試機構的話,缺陷之對映方塊數), 測試B I S 丁測 要求。無效組件的流程以1 〇 〇 4標示通過,參數缔選的 棄除,或者是使用在某些低階的情況 將這些無效組件 以標示1 0 0 5表示。然後使用缺陷營^過組件的流程 的組件用於組裝製品。 理系統將這些通過V. Description of the invention (18) The final application is strict. Generally for all belts to reduce the chance of components passing the selection criteria by mistake. 1. Test parameter setting protection Mark 1 0 0 3 is the decision point for screening. Make less than a maximum allowable number of components (or ,,, memory cell number test organization, the number of defect mapping squares), test the BIS test requirements. The flow of invalid components is marked with 2004, and the parameter selection is discarded, or it is used in some low-level cases. These invalid components are marked with 105. The components of the defect-passing assembly process are then used to assemble the article. Management system will pass these

程序1 0 0 6表示由該製品執行的 該製品完全與部份可用記憶體裝置組 S τ。此係當 況。該缺陷對映關係寫入不可抹除缺^第一次賦能的情 以只要該裝置隨後被賦能的條件下均可^映記憶體中,所 在完成BIST測試後,在樑示 ^ 在該製品上執行一通過的核查。此測試:所不者, ST程序期間,發現缺陷方塊後,在、、基於在BI 一最小記憶體容量。在進行篩選之二=可以使用的某 間將具有-相當的保護帶。▲此階段;將測試期Program 1 0 6 indicates that the product is completely and partially available memory device group S τ executed by the product. This is the case. The defect mapping relationship is written in the erasure condition. The first time it is energized, as long as the device is subsequently energized, it can be reflected in memory. After completing the BIST test, Perform a pass check on the product. This test: Nothing, during the ST program, after finding a defective block, based on a minimum memory capacity in BI. There will be-equivalent protective bands in the second screening = somewhere available. ▲ At this stage; test period

的少。標示1 0 0 8表示無效製敗的數目將相當 备丨昤,且脓曰+敗 1 ^ 的流程。這些製品將被 1009顯有最的記憶體組件替換掉。在標示 最後的情況將留下適於裝载的良好製品。 除::體數據的儲存内’目錄資訊也必需 ΐΠΠ如媒;=維持在相同的部份可用記憶體· 量總儲存谷量,一般與媒體數據的大小比較Less. The label 1 0 0 8 indicates that the number of invalid defeats will be quite ready, and the process of pus + + 1 ^. These products will be replaced by the most memory components of the 1009. At the end of the labeling, good products suitable for loading will be left. In addition to: the directory information in the volume data storage must also be ΐΠΠsuch as media; = maintained in the same part of the available memory · the total amount of storage, generally compared with the size of media data

586120 五、發明說明(19) 下’目錄資訊相當的少。該目錄數據維 媒體檔案的開始及結束位置,或者是其 些目錄數據必需以高度可靠的方式儲存 錄數據被破壞的話’將導致無法存取該 〔習式之問題點〕 雖然已使用B I S T測試部份記憶 製品的使用期間產生其他額外的缺陷。 的可能性相當的大,而足以使得目錄資 主記憶體陣列中。必需提供一額外的冗 資訊均可以可靠的方式重建。使用一冗 (majority voting)的方式以達到此一 圖1 1顯示此方法,在記憶體裝置 資訊的一區域儲存三次。該副本儲存在 體裝置中,以防止產生共同模式失敗的 記憶艘裝置。但是,在某些環境下,不 一記憶體裝置的不同區域中。 從一目錄資訊之各別的位元組以1 示已從正確值遭受破壞的位元組,以標 一般,被破壞之位元組的比例相當少。 只要從目錄中讀取數據,則從各副 組。該多數議決,控制器從標示1 i 〇 該目錄中讀取該數據的不同副本,且對 確的數值。所以,如果該數據的兩個位 數值被回復。因此,相卑一個位元組被 持資訊 他相關 ,因此 媒體檔案 ,如特定之 的屬性。這 如果這些目 艘,但 一般, 訊無法 餘不良 餘及多 -目的 110 實際上 情況而 同的副 10 2 示1 1 本中讀 4表示 於一位 元組均 破壞時 是仍可能在 發生此情況 直接儲存在 以確定目錄 數決 1中將目錄 不同的記憶 影蜜到整個 本儲存在同 標示。X標 〇 3表示。 取各個位元 。有必要從 元組決定正 相同,則該 ’不會影響586120 V. Description of the invention (19) The catalogue information is quite small. The directory data maintains the start and end positions of the media files, or some of the directory data must be stored in a highly reliable manner. If the recorded data is destroyed, it will result in inaccessibility. [Problems of the practice] Although the BIST test department has been used Additional memory defects arise during the use of one memory article. The probability is quite large enough to make the directory capital memory array. It is necessary to provide additional redundant information that can be reconstructed in a reliable manner. A majority voting method is used to achieve this. Figure 11 shows this method, which is stored three times in an area of memory device information. This copy is stored in the body device to prevent the memory ship device from generating a common mode failure. However, in some environments, different areas of different memory devices. From the individual bytes of a directory information, 1 is used to indicate the bytes that have been damaged from the correct value. In general, the proportion of corrupted bytes is relatively small. As long as the data is read from the directory, it is from each subgroup. The majority resolves, and the controller reads different copies of the data from the directory labeled 1 i 〇 and the correct value. So if the two digits of the data are returned. Therefore, a humble group of bytes is held by information that is relevant to it, and therefore media files, such as specific attributes. This is the case for these ships, but in general, the information can not be more than bad and multi-purpose 110. Actually the same situation as the deputy 10 2 Show 1 1 Reading 4 in this book indicates that this may still happen when a byte is destroyed. The situation is directly stored in determining the number of directories. The memory of different directories in the directory is stored in the same label. X mark 〇3. Take each bit. It ’s necessary to decide exactly the same from the tuple, then ’will not affect

586120 五、發明說明(20) 到儲存數據的 破壞的能力。 標示1 1 錄數據的不同 組以字母"〇" 議決控制器可 回正確的” 0 " 熟習本技 以應用可靠的 正碼(E c C 存額外的錯誤 在原始數據中 數據。但是, 如果配置在相 費相當長的處 設計在B 裝置中得到大 成測試出所有 境條件對該測 期間’偵測到 播放的品質產 不會有太大的 只要在該 用,且標示不 整體。目錄的副本數可增加,以改進防止被 0 5顯 位元組 表示。 從兩個 值,其 術者須 方式儲 )方法 復位元 出現多 此技術 當簡單 理時間 1ST 部份的 的缺陷 試提供 額外的 生小小 影箏。 製品的 良缺陷 示讀取的例 中的數據位 但是,第二 其餘的正確 中以標示1 瞭解在本技 存目錄數據 以進行目錄 以允許原始 個位元錯誤 的缺點為數 之微控制器 〇 期間執行的 缺陷。但是 ,正如沒有 保護帶。因 缺陷。在播 的衝擊,但 子。這 元組。 位元組 位元組 10 6 術中可 。例如 數據的 的目錄 的情況 學上的 的處理 些讀取作 該正確的 已被破壞 中得到該 表 。 以使用其 ,可以使 儲存。這 數據重製 下仍可以 計算相當 軟艘上時 業係從目 數據位7G 。此多數 數據而送 他的機構 用錯誤更 些方法儲 ,甚至當 回復這些 複雜,且 ,必需耗 測試以在部份可用記憶體 ’程序測試無法保證已完 任何機構可以以時間或環 此有可能在該製品的使用 放該媒體檔案時,將對該 是在大部份的情況下可能 使用期間發生任何缺陷的話,必需使 記憶晶胞之對映方塊。因此在未來進586120 V. Invention Description (20) The ability to destroy the stored data. Mark the different groups of 1 1 recorded data with the letters "quote." The controller can return the correct "0". Familiar with this technique to apply a reliable positive code (E c C stores additional errors in the original data. But If the configuration is designed at a relatively long cost, the device can be tested in the B device and all the environmental conditions will be detected during the test. The quality of the playback will not be too large as long as it is used, and the label is not overall. The number of copies of the directory can be increased to improve the prevention of being represented by 0 to 5 bytes. From two values, the surgeon must store it in a way.) The reset element appears more. This technique is provided as a simple treatment of the defects of the 1ST time. The extra production of a small shadow kite. Good product defects show the data bits in the read example. However, the second remaining correct is marked with 1. Learn about the disadvantages of storing the catalog data in this technology for cataloging to allow the original bit error. Counts of defects implemented during microcontroller 0. But, just as there is no guard band. Due to defects. Shock in play, but sub. This tuple. Byte 10 6 Intraoperative. For example, the catalogue of the data is processed scientifically. Some readings are done to get the table from the correct one that has been destroyed. To use it, it can be stored. This data can still be calculated to be a relatively soft ship after the data is reproduced. The last time was 7G from the target data. Most of the data was sent to his organization to store it by mistake, even when replying to these complex, and it is necessary to consume the test to test in some available memory. The program test cannot guarantee the completion Any institution can place the media file in time or around the time it is possible to use the product, and if there are any defects that may occur during most of the use, it is necessary to make the memory cell an antithetical block. So in the future

586120 五、發明說明(21) 行數據儲存時不使用該對映方塊。此機構允許在該製品的 使用期間,設定學習與新缺陷允許的資訊。 使用一總和檢查(checksum)的方法以允許在該装置 使用期間偵測所產生的新缺陷。圖1 2中顯示此一情沉。 其中標示1 2 0 1顯示在記憶體陣列内個別的對映方塊。 其以8x 8的記憶晶胞方塊表示。此方塊可以在該裝置的 多個數據平面上進行跨平面的複製,例如8個位元。因 此’在圖中兩位元的十六進位值與各記憶晶胞相關 1 2 0 2。與各記憶晶胞相關的位元數視使用的記憶體架 構而定。而且,在實際的系統各個對映方塊最好具有一較 大的尺寸。如箭號標示1 2 0 3中所示者,在一對映方塊 中相鄰的位置中。 , 在各對映方塊中儲存一總和檢查值。在該方塊中以最 後值顯不,且標示為i 2 〇 4。該總合檢查值表示在對映 方塊中所有其他儲存之數值的總合。如果在對映方塊中數 據遭到破壞,則將使用該總合檢查值進行偵測。當讀取數 據時,則隨時計算該總合檢查值。然後與所儲存的總合檢 查值進行比較。如果兩者不同,則在對映方塊内由於缺陷 記憶晶胞的關係,該對映方塊已被破壞。然後對映方塊被 標不成在缺陷對映記憶體中為受破壞者。有可能如果一連 串的位元組遭到破壞,則有可能產生相同的總合檢查值, 且因此無法偵測到錯誤。但是,產生此情況的機率相當 小。必需瞭解本發明的缺陷管理系統不需在曉得數據位元 組之内含意義的情況下才成立,以使用該機構。586120 V. Description of the invention (21) This map box is not used for data storage. This organization allows the learning and new defects to be permitted during the use of the product. A checksum method is used to allow new defects to be detected during the use of the device. This feeling is shown in Figure 12. Among them, the number 1 2 0 1 is displayed in the individual map box in the memory array. It is represented as an 8x8 memory cell square. This block can be copied across multiple planes of the device, such as 8 bits. Therefore, the two-digit hexadecimal value in the figure is associated with each memory cell 1 2 0 2. The number of bits associated with each memory cell depends on the memory architecture used. Moreover, it is preferable that each antipodal block in the actual system has a relatively large size. As shown by the arrow 1 2 0 3, it is in an adjacent position in a pair of mapped squares. , Store a check sum in each map box. The last value is shown in this box, and it is marked as i 2 04. The sum check value represents the sum of all other stored values in the map box. If the data is corrupted in the map box, the combined check value will be used for detection. When reading data, the total check value is calculated at any time. It is then compared with the stored total check value. If the two are different, the antipodal block has been destroyed due to a defective memory cell in the antipodal block. The antipodal block is then marked as corrupted in the defective antipodal memory. It is possible that if a series of bytes are corrupted, it is possible to produce the same total check value and therefore no errors can be detected. However, the chances of this happening are quite small. It is necessary to understand that the defect management system of the present invention does not need to be established without knowing the meaning of the data bytes to use the mechanism.

586120 五、發明說明(22) 使用總合檢查無法決定那一個特定的記憶晶胞或記憶 晶胞群具有缺陷。但是,並不見得需要此條件,此係因為 包含在總合檢查值中所有的項目均落在相同的對映方塊 中’且因此整個對映方塊必需標示成不良的對映方塊。 標示1 2 〇 5顯示具缺陷的記憶晶胞,且因此無法以 可靠的方式儲存數據。當讀取該對映方塊的數據時,將該 相關的總合檢查值1 2 0 6加以偵測。在計算及儲存之總 合檢查之間的差異將導致該對映方塊被標示成不良的對映 方塊’因此在以後以對映方塊將不用於儲存數據。 熟習本技術者必需瞭解可以使用其他簡單之總合檢查 的機構。例如,可以使用循環冗餘碼(CRC)以在一對 映方塊内更可靠地偵測出數據破壞的情況。但是其缺點為 必需耗费更多的時間。當在低成本的微控制器内配置缺陷 管理系統時,此為具有重要的考量。 使用某些限制以防止在一媒體檔案的單一次讀取期間 有太多的對映方塊被標示成具缺陷的對映方塊。此係因為 每-人將新的對映方塊標示成缺陷對映方塊時,將使得 該製=的容量減少。此總合檢查機構無法辨識由記憶 陷所^致^總合檢查之無效或由於在系統内數 致的其他成因。如果由於某些原因(例如由於斷電 壞記憶體的話’媒艘播案的播放必需不標示所有的對映方 塊’因此調整像由製品之無法使用所導致的不良情況一 Γ 該製:將新的不良對映方塊的最大數設定 為一固疋的翏數。一當該限Φ1Ρ相 限制匕超過讀取一特定之媒體檔 第26頁 586120 五、發明說明(23) 案者,則可能知道任何所遭遇到該其他總合檢查的無效情 況〇586120 V. Description of the invention (22) It is not possible to determine which particular memory cell or group of memory cells is defective using the total inspection. However, this condition is not necessarily required because all the items included in the total check value fall in the same antipodal box 'and therefore the entire antipodal box must be marked as a bad antipodal box. The designation 1205 indicates a defective memory cell and therefore cannot store data in a reliable manner. When reading the data of the mapping block, the relevant total check value 1 2 0 6 is detected. The difference between the total check of calculation and storage will result in the map box being marked as a bad map box 'and therefore the map box will not be used to store data in the future. Those skilled in the art must be aware of mechanisms that can use other simple collective inspections. For example, a cyclic redundancy code (CRC) can be used to more reliably detect data corruption in a pair of mapping blocks. The disadvantage is that more time must be spent. This is an important consideration when deploying a defect management system in a low-cost microcontroller. Certain restrictions are used to prevent too many antipodes from being marked as defective antipods during a single read of a media file. This is because when each person marks a new mapping block as a defective mapping block, the capacity of the system will be reduced. The aggregate inspection agency cannot identify the invalidity of the aggregate inspection due to memory traps ^ or other causes that are counted in the system. If for some reason (for example, the memory is broken due to power failure, the media player broadcast must not be marked with all of the mapping boxes, so adjust the image to the bad situation caused by the unavailability of the product. The maximum number of bad mapping blocks is set to a fixed number. Once the limit Φ1P phase limit exceeds the reading of a specific media file, page 26, 586120 5. Inventor (23) The case may know Any invalidity encountered in that other combined inspection.

此方法的另一項配置方式為在各對映方塊中使用一錯 誤更正碼,而非僅使用一簡單的總合檢查值。此必需佔據 整個儲存裝置中更大比率的容量,但是其優點為可以更正 多種不同類型的錯誤。在此方法中,更正這些錯誤,如讀 取程序中的一部份,因此在讀取的品質上至少下降。但是 對映方塊仍標示成缺陷方塊,此係因為下次當將數據寫入 該方塊時,缺陷可能超過可以為E c C所可更正的數量。 該裝置以無法偵測的方式處理此程序,增加不會對品質產 生任何的衝擊。使用此程序需要整合高位準的數據使用部 份可用記憶體裝置加以儲存。 當 記憶體 憶體以 題。如 讀取, 大量數 低0 — 所 存在快 映資訊 當將新 快取記 誤用對 中將對 決定跳 果在第 則將跳 據將漏 般將情 以在媒 取記憶 ,以在 的數據 憶體。 映方塊而 映方塊標 過那一對 一次已债 過整個對 失掉,而 況比原來 體檔案第 體中。使 讀取該檔 寫入該記 此缺陷對 偵測到新的缺 不成不良者, 映方塊以讀取 測到該缺陷, 映方塊因此在 使得該媒體播 缺陷本身所產 一次寫入時缺 用此儲存在快 案時決定那一 愧艘時,從缺 映快取記憶體 如果使用 數據,此 隨後相同 起初在檔 放的品質 生的影響 陷對映關 取記憶體 對映方塊 陷對映記 可以儲存 在缺陷對映 缺陷對映記 導致一問 的檔案再被 案中出現的 大大的降 還要大。 係必需被儲 中的缺陷對 為不良者° 憶體更新該Another way to configure this method is to use an error correction code in each mapping block instead of just a simple total check value. This must occupy a larger ratio of capacity throughout the storage device, but has the advantage that many different types of errors can be corrected. In this method, these errors are corrected, such as part of the reading process, so the quality of the reading is at least degraded. However, the mapped block is still marked as a defective block, because the next time when data is written to the block, the defect may exceed the number that can be corrected by E c C. The device handles this process in an undetectable manner, adding no impact on quality. The use of this procedure requires the integration of high-level data use parts that can be stored in memory devices. When memory recalls the title. Such as reading, a large number of low 0 — the existing cached information. When the new cache is misused, the pair will determine the jump result. In the first place, the data will be missed. body. The mapping box is marked with the pair, and the entire pair has been lost at one time, which is worse than the original file. The reading of the file and the writing of this defect are not bad for the detection of a new defect. The image block is read to detect the defect. Therefore, the image block is not useful in making the media broadcast defect itself write once. This storage is determined in the quick case. When the cache memory is used from the missing image, if the data is used, the quality of the file that is initially stored in the file is then affected. Defective maps stored in Defective Maps led to a huge drop in the archives of a question. The defect pairs that must be stored are the bad ones.

586120 五、發明說明(24) 陣列中。因為對於此快取資訊必需要有可靠的需要儲存, 對於目錄資訊可以使用上述的多數決方法。 圖1 3中顯示此一程序,其中標示1 3 〇 1為由缺馅 圖樣所決定之缺陷對映記憶體的對映關係的内容,其中該 缺陷圖樣顯示在主記憶體陣列中,以標示i 3 〇 2表示。 ί主記憶體陣列81 ’將缺陷對映快取記憶體中 的内今被複製到多個部份可用記憶體裝置中, 1 3 0 3中所示者。維持快取數據之、^ 的某些區段標示為13ny1 記憶體裝置 串列相關的缺陷對映的部份;2與寫入之數據 獨立讀取且寫入系統中,U =不同的媒雜檔案可以 多數決控制器標示為i 取更新作業。 130Θ的讀取控制器中, …果饋入標示為 序期間產生位址予主記憶雜磷取控制器的功能為在讀取程 在圖中以標示1 3 0 7表示十f跳過具缺陷的對映方塊。 該數據時,由於儲存之總人=憶體中新的缺陷。當讀回 差異,此情況將被偵測到::查f值與所計算數據之間的 檢查的讀取。由缺陷偵測方^ 3 0 8高度顯示該總合 當偵測到新的缺陷時,改變 〇 9使用該總合檢查。 以反應將對映方塊為不良的M對映圮憶體中適當的位元 顯示此情況心;=塊2圖中以標示 在缺陷對映中,缺陷對映 變為1〇 值。因此如果再度讀取相同的媒為先前的 中的對映方塊仍包含在該:欠的讀取586120 V. Description of the invention (24) Array. Because this cached information must be stored reliably, the above-mentioned majority method can be used for directory information. This program is shown in FIG. 13, where the label 13 00 is the content of the mapping of the defect mapping memory determined by the filling pattern, and the defect pattern is displayed in the main memory array to indicate i 3 〇2 said. The main memory array 81 'copies the contents of the defect map cache into multiple partially available memory devices, as shown in 1-3. Some sections of ^ that maintain the cached data are marked as the part of the defect mapping related to the 13ny1 memory device serial; 2 are independently read from the written data and written into the system, U = different media miscellaneous The file can be marked as i by the controller for update operation. In the reading controller of 130Θ,… the result of feeding into the memory during the sequence is to generate an address to the main memory. The function of the miscellaneous phosphorus taking controller is to mark 1 3 0 7 in the reading process to indicate that 10 f skip is defective. Antipodal squares. This data is due to the total number of people stored = new defects in memory. When a difference is read back, this condition will be detected: Check the read between the f-number and the calculated data. The total is displayed by the defect detector ^ 3 0 8 When a new defect is detected, change 〇 9 to use the total check. The appropriate bit in the M-enantiomer of the antipodal block is reflected by the reaction to show the situation; = the block 2 is marked in the defect map, and the defect map becomes a value of 10. Therefore, if the same media is read again as the previous antipodal block in is still included in this:

第28頁 586120 五、發明說明 映方塊相 中,而更 映方塊時 在記 實際佈局 一的記憶 際缺陷將 元線或位 在實 所可觀測 記憶體裝 此對映係 此情 記憶體裝 14 0 1 隔的列中 整個對映 14 0 3 有可 陷的有效 A 3及A 體上執行 換之左手 稱為邏輯 (25) 同的缺陷 新缺陷的 才可避免 憶體陣列 相關之外 體記憶晶 影響整群 元線的話 際之位址 之數位位 置有一内 與該裝置 況顯示在 置的邏輯 表示。該 數據以可 方塊必需 所示,使 能經由使 區域,而 0的列位 ,甚至可 側的位址 位址空間 ο Ο ,、有 對映快 〇 中缺陷 部的影 胞。但 的相鄰 ,此將 空間中 址空間 部的扣 内記慷 圖1 4 位址空 #尸、影 靠的方 標示為 用直接 用列位 方塊1 址位元 以在一 空間稱 。實際 的分佈 蜜。在 是’在 記憶晶 為整列 缺陷位 中的缺 棣對映 晶胞的 中,Ψ 間中。 擎該裝 式儲存 不良的 的歹彳定 址空間 4 0 6 ’而且 簡單的 為貧際 上,該Page 28 586120 V. Description of the invention In the picture of the box, and when the box is updated, the memory defect of the actual layout is recorded. The element line or the observable memory is located in the actual memory. 0 1 Entire mapping in separated columns 14 0 3 There is a trappable effective A 3 and A body performs a left-handed operation called logic (25) The same defect The new defect can avoid the memory array related external body memory The digital position of the address where the crystal affects the cluster element line has a logical representation that is internal to the device condition. The data is shown as necessary squares, enabling the area through, and the column of 0, and even the side address address space ο 〇, has the shadow cell in the fast mapping 〇. But the adjacent ones, this will mark the deduction in the address space part of the space. Figure 14 The address space #### Actual distribution of honey. In YES, in the memory cell is a whole array of defect sites, in the middle of the unit cell. It ’s hard to store bad address space 4 0 6 ’and it ’s simple for the poor.

當新的數據寫入該記憶體陣列 取3己憶體以包含新決定的缺陷對 受到與内部記憶體裝置之 某些例子中,只影響到單 許多例子中,一單一的實 胞。如果所讀取者為一字 或整個行區數。 元群不總是導向為裝置外 陷位元群。此係因為許多 (topology mapping), 實際排列相關。 一行缺陷1402分佈在 記憶體裝置的缺陷以標示 置中每隔一列。因此在間 起來。不盡理想的是,兩 對映方塊。如方塊 址可得到此缺陷。 的一對一轉換而減少該缺 中所示者。此簡單地交換 因此可以相當簡單地在軟 微處理器上執行。至此轉 之位址空間且至右側者則 轉換中所示者内部晶片佈When new data is written into the memory array, three memory banks are taken to contain the newly determined defect pair. In some instances, the internal memory device is affected, and only a single cell is affected in many instances. If the reader is one word or the entire number of rows. Metagroups are not always directed to the outgroup of metagroups of devices. This is because of the many (topology mapping), the actual permutations are related. A row of defects 1402 is distributed in the memory device to indicate every other column in the center. So get up. Less than ideal, two antipodal squares. Such as the box address can get this defect. The one-to-one conversion reduces the one shown in the defect. This simple exchange can therefore be performed quite simply on a soft microprocessor. The address space turned so far and the one shown on the right

第29頁 586120 五、發明說明(26) 局的反向對映而導致如1 4 0 2所示之單一缺陷的分佈。 在實際位址空間中執行該裝置的所有定址,其中在定址該 記憶體裝置之前,將該位址空間轉換為邏輯位址空間。在 記憶體陣列1 4 0 4中顯示邏輯位址空間中缺陷的修正。 現在將行缺陷1 4 0 5只影響到相鄰的列。所以只有單一 的對映方塊必需被標示成不良的對映方塊,而部份改進可 使用之空間的總量。 經由 得到實際 置内部者 是,實際 定該拓樸 元以決定 功能記憶 得到該裝 雖然 了解可對 點。 簡單地 至邏輯 ,且製 上可經 〇 —具 在這些 體裝置 置之内 文中已 上述加 的對映 造商無 由部份 啟發性 裝置内 中不良 部拓樸 應較佳 以更改 記憶艘 功能。 法自由 記憶體 的搜尋 對於缺 對映方 對映的 實施說 及變更 取1开/u叮 不盡理想 地的出版 組件的數 演算法可 陷對映方 塊的總數 良好近似 明本發明 而不偏離 之内部 的是, 所需要 目而以 更換不 塊數目 達到最 Ο ,但熟 本發明 此對映為裝 的資訊。但 統計方式決 同的位址位 的衝擊。當 小時,可以 本技術者需 的精神及觀Page 29 586120 V. Description of the invention (26) The reverse mapping of the office results in the distribution of a single defect as shown in FIG. All addressing of the device is performed in the actual address space, where the address space is converted into a logical address space before the memory device is addressed. Corrections for defects in the logical address space are shown in the memory array 1440. Row defects 1 4 0 5 now only affect adjacent columns. Therefore, only a single map box must be marked as a bad map box, and the total amount of space available for some improvements. By getting the actual insider, the topology is actually determined to determine the functional memory to get the device, although understanding can be correct. It is simple to logic, and can be manufactured by the manufacturer. It has been added in the text of the above-mentioned devices. The manufacturer's inevitable part of the enlightenment device is partially heuristic. The topology of the bad part in the device should be better to change the memory boat function. The method of free memory search for the implementation and modification of the antipodal antipodal mapping is taken as 1 Kai / u Ding. The mathematical algorithm of the publishing component is not ideal. The total number of antipodal squares can be trapped. It is a good approximation of the present invention without departing from it. Internally, the number of blocks required for the purpose is to reach the maximum 0, but this map of the present invention is the information. However, the impact of statistically determined addresses is different. In the hour, the spirit

圖號說明: 301標示 302, 305數據框 303格樞同步 304表頭 401記憶體裝置Drawing number description: 301 indicates 302, 305 data frame 303 grid pivot synchronization 304 meter head 401 memory device

第30頁 586120 五、發明說明(27) 402位址及控制信號 403數據匯流排 404記憶體控制器 4 0 5缺陷對映記憶體 5 0 1輸入數據 502數據寫入控制器 503整個控制器 504目錄寫入控制器 505標示Page 30 586120 V. Description of the invention (27) 402 address and control signal 403 data bus 404 memory controller 4 0 5 defect map memory 5 0 1 input data 502 data write controller 503 entire controller 504 Directory write controller 505 flag

506缺陷對映記憶體 507目錄讀取控制器 508數據讀取控制器 5 1 0缺陷快取記憶體控制器 509輸出頻道 511新缺陷控制器模組 512内建自行測試(B I ST)單元 513信號506 Defect map memory 507 Directory read controller 508 Data read controller 5 1 0 Defect cache controller 509 Output channel 511 New defect controller module 512 Built-in self-test (B I ST) unit 513 signal

5 1 4系統架構標示 601,604標示 6 0 2對映方塊 603缺陷 6 0 5行缺陷 6 0 6不良的記憶晶胞 6 0 7行缺陷5 1 4 System architecture mark 601, 604 mark 6 0 2 Mapping block 603 Defect 6 0 5 line defect 6 0 6 Bad memory cell 6 0 7 line defect

第31頁 586120 五、發明說明(28) 608缺陷管理系統者 7 0 1記憶體陣列標示 7 0 2缺陷對映記憶體 703, 704標示 801,901,902 區域 1001,1 002 步驟 1003篩選的決定點 1 0 0 5通過組件的流程 1 0 0 7無效組件的流程 1 0 0 8無效製品的流程 I 0 0 9程序 II 0 1記憶體裝置 11 0 2各別的位元組 1103已從正確值遭受破壞的位元組 1104控制器 1 2 0 1記憶體陣列内個別的對映方塊 1 203箭號標示 1204在該方塊中以最後值顯示 1 2 0 5具缺陷的記憶晶胞 1 2 0 6總合檢查值 1301由缺陷囷樣所決定之缺陷對映記憶體的對映關係的内 容 1 302缺陷圖樣顯示在主記憶體陣列中 1 303複製到多個部份可用記憶體裝置Page 31 586120 V. Description of the invention (28) 608 Defect management system person 7 0 1 Memory array mark 7 0 2 Defect map memory 703, 704 mark 801, 901, 902 Area 1001, 1 002 Decision of step 1003 screening Point 1 0 0 5 Flow of passing components 1 0 0 7 Flow of invalid components 1 0 0 8 Flow of invalid products I 0 0 9 Program II 0 1 Memory device 11 0 2 Each byte 1103 has a correct value Destroyed bytes 1104 Controller 1 2 0 1 Individual mapped block in the memory array 1 203 arrow 1202 shows the last value in this block 1 2 0 5 defective memory cell 1 2 0 6 Total check value 1301 Content of the mapping of the defect mapping memory determined by the defect pattern 1 302 The defect pattern is displayed in the main memory array 1 303 is copied to multiple partially available memory devices

第32頁 586120 五、發明說明(29) 1 3 0 4維持快取數據之部份可用記憶體裝置 1305多數決控制器標示 1 3 0 6結果饋入 1307記憶體中新的缺陷 1308高度顯示該總合檢查的讀取 1 3 0 9缺陷偵測方塊 1 4 0 1記憶體裝置的缺陷 1 402單一行缺陷 1 403, 1 406 方塊 1 4 0 4記憶體陣列 1 4 0 5行缺陷 586120 圖式簡單說明 圖1示習知技術之位元平面系統,以使用具有多個缺陷記 憶晶胞位置的記憶體裝置。 圖2示一更複雜的習知技術之系統,以再顯示缺陷記憶體 部位’其中使用一具有内部記憶體資源的外部A S I C以 更正在多個各別記憶體裝置中的缺陷。 圖3示媒體數據中數據框的格式,以使用上述說明的缺陷 管理技術,而將該數據適當地儲存在該裝置内。 圖4顯示在上述說明之缺陷管理系統中使用之製品的架 構。 圖5顯示本發明的缺陷管理系統的整個架構,其中顯示配 置在軟體或硬體内以執行缺陷管理的實際記憶體方塊及控 制模組。 圖6顯示一具有多個缺陷之記憶體陣列的例子,其中顯示 一方形之記憶體缺陷方塊,以應用標示為不可使用之方塊 數說明該缺陷的衝擊。 圖7顯不與圖6相同的記憶體陣列,兩者包含相同的缺 陷’此例子中顯示應用不可抹除記憶體裝置儲存這些缺 =8顯示與圖6相同的記憶體陣列,其中該記憶體陣列包 相同的缺陷。圖中顯示一水平向延伸的對映方塊,以顯 ,而孫不為不良對映方塊中記憶晶胞的總數上對映方塊 形狀的衝擊。 、 顯示顯示與圖6相同的記憶體陣列,其中該記憶體陣 包含相同的缺陷。圖中顯示一垂直向延伸的對映方塊,Page 32 586120 V. Description of the invention (29) 1 3 0 4 The part that maintains the cached data can be marked by the memory device 1305 majority controller 1 3 0 6 The result is fed into the new defect in the 1307 memory. The 1308 height indicates the Read of total inspection 1 3 0 9 Defect detection block 1 4 0 1 Defective memory device 1 402 Single line defect 1 403, 1 406 Block 1 4 0 4 Memory array 1 4 0 5 line defect 586 120 Schematic Brief description FIG. 1 shows a bit plane system of the conventional technology to use a memory device with multiple defective memory cell locations. Figure 2 shows a more sophisticated system of conventional techniques to re-display defective memory locations', in which an external AS IC with internal memory resources is used to correct defects in multiple individual memory devices. Fig. 3 shows the format of the data frame in the media data to appropriately store the data in the device using the defect management technique described above. Fig. 4 shows the structure of an article used in the defect management system described above. Figure 5 shows the overall architecture of the defect management system of the present invention, which shows the actual memory blocks and control modules configured in software or hardware to perform defect management. Figure 6 shows an example of a memory array with multiple defects, in which a square memory defect block is shown, and the number of blocks marked as unusable is used to illustrate the impact of the defect. Fig. 7 shows the same memory array as Fig. 6, both of which contain the same defects. 'This example shows that the application cannot be erased by the memory device to store these defects. 8 shows the same memory array as in Fig. 6, where the memory Array packs the same flaw. The figure shows a horizontally extending antipodal block to show, but Sun is not the impact of the shape of the antipodal block on the total number of memory cells in the bad antipodal block. The display shows the same memory array as in FIG. 6, where the memory array contains the same defects. The figure shows an antipodal block extending vertically,

第34頁 586120 圖式簡單說明 以顯示必需標示為不良對映方塊中記憶晶胞的總數上對映 方塊形狀的衝擊。 圖1 0為一流程圖,經由該程序以篩選記憶體裝置,其中 該記憶體裝置係使用具有本發明缺陷管理系統之製品中。 圖1 1在部份缺陷記憶體系統中,目錄數據儲存的例子, 本例子中使用用於讀取數據的多數決系統以數據的完整 在各對映方塊中有 圖12顯示數個對映方塊的内部結構 一總合檢查。 =13示缺陷對映之快取機構。 y 4不在數個對映方塊中内 中该對映方塊標干片位址拓樸的衝擊,其 以啦# 為加不成不可使用者,圖中海- 六 對於位址拓樸的負衝擊產生逆。顯不-簡單的機構P.34 586120 Schematic illustration to show the impact of the shape of the antipodal block on the total number of memory cells in the box that must be marked as bad. Fig. 10 is a flow chart for screening a memory device through the program, wherein the memory device is used in a product having the defect management system of the present invention. Figure 11. An example of directory data storage in a partially defective memory system. In this example, a majority system for reading data is used to complete the data. There are several map boxes in each map box. Figure 12 shows several map boxes. A total inspection of the internal structure. = 13 shows the cache of defect mapping. y 4 is not in several of the mapping blocks. The impact of the standard block address topology of the mapping block is based on the fact that # cannot be added and cannot be used by the user. In the figure, Hai-Six has an inverse effect on the negative impact of the address topology. . Revealed-simple mechanism

Claims (1)

•一種缺陷 記憶逋裝置 抹除記憶體 陷的位置儲 缺陷管理系 記憶體的形 ,且在系統 陷加入不可 •如申請專 數據以數據 缺陷位元, 至少一 一不可 上述缺 其中該 可抹除 的位置 的新缺 2 儲存的 出現的 擾0 管理系統,該系統包含·· ,此裝置包含多個缺陷儲存記憶晶胞; ’此纪憶體具有多個記憶體方塊,以將 存在記憶體方塊内; 統測試該缺陷記憶艘裝置,且配置該不 態’以指示在各記憶體裝置中缺陷區域 使用期間,偵測新的缺陷,而將所偵測 抹除記憶體中的缺陷對映關係。 利範圍第1項之缺陷管理系統,其中該 框劃定界限,使得在製品使用期間,所 對於媒體播放的品質只產生短時間的干 如申請專利範圍第1項之缺陷管理系統,其中在 微處理器的韌體中配置該缺陷管理系統。 4如申請專利範圍第3項之缺陷管理系統,其中一 韌體ί一目錄寫入控制器,以將數據檔案的開始及結束位 址儲存在缺陷記憔體裝置中。 5·如申請專利範圍第4項之缺陷管理系統,其中該 韌體為一目錄讀取控制器,以取得由該目錄寫入控制器所 儲存之數據檔案的開始及結束位址。 6·如申請專利範圍第5項之缺陷管理系統,其中該 韌體為一缺陷快取記憶體控制器,其維持與一特定之數據 段相關之缺陷對映關係的副本。 7 ·如申請專利範圍第6項之缺陷管理系統,其中該• A defect memory device removes the location of the memory trap, stores the shape of the memory of the defect management system, and adds the system trap. The location of the new missing 2 storage of the disturbance 0 management system, the system contains ... This device contains multiple defect storage memory cells; 'This memory has multiple memory blocks to store the memory blocks Internally test the defective memory ship device, and configure the state of failure to indicate a new defect during the use of the defective area in each memory device, and map the detected defect to erase the defect mapping . The defect management system of item 1 of the profit scope, wherein the frame delimits the boundary, so that during the use of the product, the quality of the media playback will only produce a short period of time. The defect management system is configured in the processor's firmware. 4. The defect management system according to item 3 of the scope of patent application, in which a firmware and a directory are written into the controller to store the start and end addresses of the data file in the defect memory device. 5. The defect management system according to item 4 of the patent application scope, wherein the firmware is a directory reading controller to obtain the start and end addresses of the data files stored by the directory writing controller. 6. The defect management system according to item 5 of the application, wherein the firmware is a defect cache memory controller that maintains a copy of the defect mapping relationship associated with a particular data segment. 7 · If the defect management system of item 6 of the patent application scope, where 586120 六、申請專利範圍 缺陷快取記憶趙控制器在至少一記憶體裝置中儲存該缺陷 對映關係的副本。 8 ·如申請專利範圍第1項之缺陷管理系統,其中一 新的缺陷控制器作用於在該系統使用期間偵測新的缺陷, 且將新缺陷加入缺陷對映記憶體。 9 ·如申請專利範圍第1項之缺陷管理系統,其中尚 包含一内建的自行測試機構,以在開始的時候,設定缺陷 對映記憶體的狀態。 1 〇 ·如申請專利範圍第9項之缺陷管理系統,其中 在一埋入型微處理器的韌體中配置該内建自行測試機構。 工1 ·如申請專利範圍第1〇項之缺陷管理系統,其 中該由一組輸入該埋入型微處理器的外部輸入信號開始該 内建自行測試機構,在含缺陷管理系統之製品使用期間, 於正常操作時,無法產生此測試動作。 12 ·如申請專利範圍第1項之缺陷管理系統,其中 至少有一記憶體機構由記憶艘陣列所形成,且該至少一記 憶體裝置的缺陷方塊包含在該記憶體陣列之可定址之記憶 體位置陣列。 13·如申請專利範圍第12項之缺陷管理系統,其 該缺陷方塊的大小為2的次方,因此可以簡化記憶體位 址至對映方塊位址的轉換作業。 Λ — I4 ·如申請專利範圍第12項之缺陷管理系統,其 I該缺陷古祕α , 塊的大小可以經由記憶體裝置所偵測之缺陷的 形狀分佈加以調整。586120 6. Scope of patent application Defect cache memory Zhao controller stores a copy of the defect mapping relationship in at least one memory device. 8 · If the defect management system of item 1 of the patent application scope, a new defect controller is used to detect new defects during the use of the system, and add the new defects to the defect mapping memory. 9 · If the defect management system of item 1 of the patent application scope includes a built-in self-testing agency to set the status of defect mapping memory at the beginning. 10. The defect management system of item 9 in the scope of patent application, wherein the built-in self-testing mechanism is arranged in the firmware of an embedded microprocessor. Work 1 · If the defect management system of item 10 of the scope of patent application is applied, the built-in self-testing institution starts with a set of external input signals to the embedded microprocessor. During the use of the product containing the defect management system During normal operation, this test action cannot be generated. 12 · The defect management system according to item 1 of the patent application scope, wherein at least one memory mechanism is formed by a memory array, and the defect block of the at least one memory device is included in the addressable memory location of the memory array Array. 13. If the defect management system of item 12 of the patent application scope, the size of the defective block is a power of two, so the conversion of the memory address to the address of the mapped block can be simplified. Λ — I4 · If the defect management system of item 12 of the patent application scope, the defect ancient secret α, the size of the block can be adjusted by the shape distribution of the defects detected by the memory device. 第37頁 六、申請專利範圍 15·如申請專利範圍第 該缺陷記憶體t置為一篩項 機構内的最小可使用的:以的 16·如申請專利範圍第 中該篩選程序由該⑨入型微處理器 17·如申請專利範圍第 在至少一記憶體裝置中維持一= 數據提供可靠的儲存方式。几餘 18·如申請專利範圍第 中經由了多數決控制器讀取該目 資訊位元組被破壞的話,亦可得至·、 19·如申請專利範圍第 一總合檢查(checksum)與一選擇 值相關。 的 20·如申請專利範圍第 中如果總合檢查不符合儲存之數據 陷對映記憶體中標示該缺陷方塊為 21 ·如申請專利範圍第19 中在主記憶艘中以冗餘方式儲存該 取數據’使得讀取控制器不會從缺 據。 、 2 2 ·如申睛專利範圍第2 1 中新缺陷的债測導致必需即更新該 新的數據寫入該主記憶艘陣列時, 之缺陷管理系統,其中 測試輸出,以核對在該 項之缺陷管理系統,其 所執行。 之缺陷管理系統,其中 的目錄資訊,以對於此 項之缺陷管理系統,其 資訊,如果少數的目錄 有效的資訊。 之缺陷管理系統,其中 缺陷方塊内儲存的數據 項之缺陷管理系統,其 值的加總的話,則在缺 具缺陷的方塊。 項之缺陷管理系統,其 缺陷方塊之一區段為快 陷記憶體方塊中讀取數 項之缺陷管理系統,其 缺陷記憶體’但是直到 才作為該快取副本的更Page 37 6. Scope of patent application 15. If the defect scope t of the patent scope is set to be the smallest usable in a screening agency: 16. The screening procedure is included in the scope of patent scope Type microprocessor 17. As in the scope of patent application, maintaining at least one memory device = data provides a reliable storage method. More than 18 · If the byte of the information is read by the majority controller in the scope of the patent application, if the byte of the information is destroyed, you can also get ... 19 · If the first checksum of the scope of the patent application and the The selection values are related. If the total inspection in the scope of the patent application does not comply with the stored data, the defect box is marked as 21 in the mapping memory. The 'data' makes the read controller never fail. 2, 2 · If the debt measurement of the new defect in the scope of Shenyan patent No. 21 leads to the need to update the new data into the main memory ship array, the defect management system, in which the test output is checked to verify the Defect management system, its implementation. For the defect management system, the directory information in it is for the defect management system in this item, its information, if a few directories are valid information. The defect management system, in which the value of the defect management system of the data items stored in the defective block, is added to the defective block. Defect management system for items, one section of the defect block is a defect management system that reads several items in the cache memory block, its defect memory ’, but it was not used as a more updated copy of the cache. 第38頁 586120Page 586120 第39頁Page 39
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