TW584373U - Heat sink and electronics having said heat sink - Google Patents
Heat sink and electronics having said heat sinkInfo
- Publication number
- TW584373U TW584373U TW091212992U TW91212992U TW584373U TW 584373 U TW584373 U TW 584373U TW 091212992 U TW091212992 U TW 091212992U TW 91212992 U TW91212992 U TW 91212992U TW 584373 U TW584373 U TW 584373U
- Authority
- TW
- Taiwan
- Prior art keywords
- heat sink
- electronics
- sink
- heat
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW091212992U TW584373U (en) | 2002-08-21 | 2002-08-21 | Heat sink and electronics having said heat sink |
US10/247,181 US6711020B2 (en) | 2002-08-21 | 2002-09-18 | Heat dissipation apparatus and electric appliance using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW091212992U TW584373U (en) | 2002-08-21 | 2002-08-21 | Heat sink and electronics having said heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
TW584373U true TW584373U (en) | 2004-04-11 |
Family
ID=31885686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW091212992U TW584373U (en) | 2002-08-21 | 2002-08-21 | Heat sink and electronics having said heat sink |
Country Status (2)
Country | Link |
---|---|
US (1) | US6711020B2 (zh) |
TW (1) | TW584373U (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7265985B2 (en) * | 2004-12-29 | 2007-09-04 | Motorola, Inc. | Heat sink and component support assembly |
FR3104892B1 (fr) * | 2019-12-12 | 2021-11-12 | Valeo Systemes Thermiques | Ensemble d’une carte électronique et d’un dissipateur thermique, et groupe moto-ventilateur comprenant un tel ensemble |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3859570A (en) * | 1973-02-20 | 1975-01-07 | Bose Corp | Power transistor mounting |
US5838064A (en) * | 1994-04-22 | 1998-11-17 | Nec Corporation | Supporting member for cooling means and electronic package using the same |
FR2729045B1 (fr) * | 1994-12-29 | 1997-01-24 | Bull Sa | Procede et dispositif de fixation de deux elements tels qu'un radiateur de circuit integre a une carte de circuits imprimes |
US5621615A (en) * | 1995-03-31 | 1997-04-15 | Hewlett-Packard Company | Low cost, high thermal performance package for flip chips with low mechanical stress on chip |
JPH11354954A (ja) * | 1998-06-10 | 1999-12-24 | Fujitsu Ltd | 電子装置 |
-
2002
- 2002-08-21 TW TW091212992U patent/TW584373U/zh not_active IP Right Cessation
- 2002-09-18 US US10/247,181 patent/US6711020B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6711020B2 (en) | 2004-03-23 |
US20040037040A1 (en) | 2004-02-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4K | Annulment or lapse of a utility model due to non-payment of fees |