TW583738B - Housing and frame of hermetic package - Google Patents

Abstract

A frame of infra-ray hermetic package has a housing, a cover, and a hermetic portion. The housing has a base with non-homogenous thickness for reduction of material cost. The cover is positioned on the housing, and the hermetic portion is between the housing and the cover. Without in the circumstance of inert gases, the hermetic effect is performed by the deformation of hermetic portion caused by the force of a clamp, which would reduce the consumptions of package process and apparatus.

Description

583738 V. Description of the invention (l) ---- 1. [Technical field to which the invention belongs] The present invention relates to a packaging structure of an array sensing element and its base, and particularly to a packaging structure of an airtight chamber of an infrared element. · 2. [Previous technology] Used in room temperature infrared imaging system, no need to cool the infrared focal plane array. iM 牛, # encapsulated copy, is one of the important keys that affect whether it can be widely used in consumer electronics. The current package architecture, such as automatic insertion type (AID), flat pack, solid sidewall, or hybrid transistor outline (TO), etc. Wait. For example, the first A diagram is a partially exploded schematic diagram of a conventional package architecture, including a base U0 (using), a hard glass sealant 112 (hard gUss perfom), a pin n4 (pin), and A cover 116 (Cover). One of the reasons for the expensive packaging costs is the use of a high unit price κ ο V a r alloy material for the 'base 110'. Another reason is the sealing process of the package and its expensive sealing machine. Referring to FIG. 1B, a schematic cross-sectional view of a conventional package architecture is shown. The base 118 (base) of the Luji platform 110 has a number of vias to accommodate the pins 114. In a hermetic seai manner, the hard glass sealing material M 2 is melted at the south temperature, and the sealing pins 11 are sealed. 4 and the base 118, the base 11 8 need to have the best degree to maintain the small leakage length nt, (1 eakage 1 ength

Page 583738 5. Description of the invention (2)) On the other side ^ 1 1 〇 and the upper cover 丄 丨 6 on the face of the first surface is plated with a layer of solder 1 2 0, 4 e A 按 口 幻 Like Sn- Au, In-Ag, etc., and then use resistance (resistance welH; nn. \. Θ ,, t 1, ..H. Ί,. G), * dry material welding (s ο 1 derwe 1 ding), seam welding ( seam welding) 辇 古, ++ 丄 人., +1 j and other methods. In order to avoid sealing on the joint surface, the main ΛΑ ^ > sexual milk or vacuum environment requires expensive equipment and machines. 3. Summary of the Invention In view of the above, in order to reduce the cost of packaging materials for M / * traditional infrared components,

-^ ^ A base is provided to be used as a part of a housing for the infrared green element. The uneven thickness is used to balance the effective run-length and reduce the consumption of base material. aB Secondly, in order to reduce the packaging process cost of traditional infrared components, the other purpose of this issue is to provide a kind of infrared component airtight chamber seal 22: in a general vacuum environment, 'enclose people with a box' Deformation to achieve hermetic sealing ...

Gas vacuum environment and hermetic sealing machine. U In order to achieve the above-mentioned object, the present invention provides an airtight chamber packaging structure, which includes a base, an upper cover (cover) located at, and a sealing portion. The abutment includes a base with a thickness of 7 mm. The base has a # -area and a -thickness. The first area is adjacent to the first area, and the second area contains a number of perforations for receiving pins and sealing solder. Of which the first

Page 6 583738 V. Description of the invention (3) The second thickness is greater than the first thickness. The sealing portion is located between the abutment and the upper cover, and when an external force is applied to the sealing portion to cause a deformation, an air-tight sealing effect can be achieved. _ Followed by detailed descriptions with specific embodiments and accompanying drawings, it will be easier to understand the purpose, technical content, features and functions of the present invention. 4. [Embodiment] The packaging structure of the infrared component of the present invention can be widely used in many vacuum environment processes, and can be made with many suitable materials. When the present invention is described in a preferred embodiment, When inventing the architecture, those who are familiar with this field should recognize that many parts can be changed and the materials can be replaced. These general replacements undoubtedly do not depart from the spirit and scope of the present invention. Secondly, the present invention is described in detail with a schematic diagram as follows. In the detailed description of the embodiment of the present invention, the cross-sectional view and front view showing the packaging structure of the infrared component will not be partially enlarged according to the general scale for the convenience of explanation, but it should not be limited Cognition. In addition, in actual production, three-dimensional space dimensions of length, width and depth should be included. _ According to the above, the present invention provides an infrared component hermetically sealed package structure for use in a vacuum environment, which includes a base, an upper cover, a sealing portion, and a clamp. The abutment includes a base having a first thickness

583738 V. Description of the invention (4) A first region and a second region are adjacent to the first region, and the second region includes a plurality of perforations for receiving pins and sealing solder, wherein a second thickness of the second region is greater than that of the first region. One thickness. The upper cover is located on the abutment and cooperates with the abutment to form a joint area in the form of a KF flange. The sealing part is located between the abutment and the upper cover. The clamp surrounds the joint area in the form of a KF flange, and is used to deform the sealing part to achieve the effect of hermetic sealing. Based on the extension of the second 8t, the first part is

FIG. 2A is a schematic cross-sectional view of an infrared component hermetically sealed package platform according to one of the present invention. The abutment 10 has a base 18, and the base 18 can be divided into a region 20 and a second region 22. The first region 20 has a thickness n 11π to place components such as a wafer. The second region 22 is adjacent to the first region 20. The second region 22 includes a plurality of through holes 24 for receiving pins and sealing solder. Figure B is a schematic front view of Figure A. The first area 20 is on the base, such as a concave groove portion, and the second area 22 is a convex platform. It can be understood that the first area 2 The geometric shape of 0 is not limited to the drawing, and under consideration of processing convenience and cost, the first region 20 may also extend between the periphery of the perforation 24, which is not limited to that shown in the drawing. One of the characteristics of the present invention is that the thickness n 12 π of the second region 22 is greater than the thickness of the first region 20 " t Γ, the thickness of the base around the perforation, and the minimum thickness required to maintain the leakage distance || That is "12π. The other parts of the base 1 8 which are not provided with pins, that is, the first area 20, need only support the minimum thickness of the required mechanical strength, and this thickness, which is n 11π, can be Less than the missing length. According to the above, the present invention uses a non-uniform thickness

Page 8 583738 V. Description of the invention (5) ~ " -----, abutment 10 using K〇var alloy as material, the thickness of its base 18 " U "is thicker than- Small, can save the amount of alloy material =, and thus reduce the material cost of the infrared element. Figure 3 A is a cross-sectional view of the infrared element structure according to the present invention * intention. Except for the base 10, pin 14, sealing solder ^ The outer shell further includes a top collar 16, a sealing portion 30, and a clamp 32. In a preferred embodiment of the towel, a feature of the present invention is that the base 10 cooperates with the top collar 16 to The joint area forming a KF flange < is shown as the part enclosed by the dashed line in the figure, and the sealing part 30 is located in the joint area of the KF flange. Another feature of the invention is that it is surrounded by the clamp 32 ^ The joint area in the form of a flange is clamped by the clamp 32 to apply an external force to the sealing portion 30, and the sealing portion 30 will deform to achieve the effect of hermetic sealing. Furthermore, the sealing portion 30 can be deformed. Materials and structures, such as gold made of oxygen-free copper metal The gasket can be selected. The dense 1 part 3 0 can also be a cymbal ring made of a polymer material, sleeved with a metal ring, or a ring-shaped groove can be dug out on the abutment. The O-ring can also be used. And the material of the O-ring can be Viton, Zalak, Kalrez ^, or a combination of the above polymer materials. Figure 2B is a schematic diagram of the front view of the clamp 32. The use of the clamp 3 2 Circle the joint area in the form of a KF flange and tighten the screw 34 to produce a pressing external force, which will deform the metal gasket or 0-ring to achieve a hermetic sealing effect.

Page 583738 5. Description of the invention (6) According to the above-mentioned "hermetic sealing method of the present invention", there is no need to consider the problem of solder oxidation, so there is no need to use the machine in a general vacuum environment. This reduces the process cost and equipment cost of hermetically sealing the infrared components. Therefore, in the present invention, the joint area in the form of a KF flange is used, and the sealing portion and the inflammation band are matched to achieve the purpose of reducing costs. The above-mentioned embodiments are only for explaining the technical ideas and features of the present invention. The purpose is to enable those skilled in the art to understand the various aspects of the present invention and implement them accordingly. : Revealed; determine the patent scope of the present invention, that is, it is within the patent scope of the present invention. Equal changes or modifications should still be covered

583738 Simple illustration of the diagram 5. [Simplified illustration of the diagram] The first diagram A is a partial exploded diagram of the conventional package architecture. Figure B is a schematic cross-sectional view of a conventional package architecture. FIG. 2A is a schematic cross-sectional view of the abutment of an infrared component airtight chamber packaging structure according to the present invention. Figure B is a schematic front view of Figure 2A. FIG. 3A is a schematic cross-sectional view of a packaging structure of an airtight chamber of an infrared component according to the present invention. Figure B is a schematic front view of the clamp.

Description of drawing number: 10 abutment 14 pins 16 upper cover 18 base 20 first area 22 second area 24 perforation 26 sealing solder 30 sealing part 32 clamp 34 screw 110 abutment 112 hard glass sealing material 114 pin

Page 11 583738 Simple illustrations 116 Cover 118 Base

Page 12

Claims (1)

583738 VI. Scope of patent application 1. A base for use as part of a housing of an infrared component airtight packaging structure under vacuum environment, the base includes: a first area The first region has a first thickness; and a second region is adjacent to the first region, the second region includes a plurality of vias to receive the pins (pi η) and the sealing solder, wherein A second thickness of the second region is greater than the first thickness. 2. The base as described in item 1 of the scope of patent application, further comprising a Kovar alloy material. 3. The base according to item 1 of the scope of patent application, wherein the second thickness is substantially equal to a leakage path. 4. An airtight room packaging structure for infrared components, comprising: a base; a cover located on the base; and a sealing portion located between the base and the cover, wherein when an external force is applied to the base When a seal is deformed, the effect of hermetic sealing can be achieved. 5. The hermetically sealed package structure for an infrared component as described in item 4 of the scope of patent application, wherein the abutment includes: a first region, the first region having a first thickness; and r Page 13 583738 6. Scope of patent application A second area is adjacent to the first area. The second area contains a plurality of perforations for receiving pins and sealing solder. A second thickness of the second area is greater than First thickness. 6. The hermetically sealed package structure of the infrared component as described in item 4 of the patent application scope, wherein the abutment can be made of Kovar alloy material. 7. The infrared component hermetically sealed package structure described in item 4 of the scope of patent application, wherein the abutment cooperates with the upper cover to form a joint area in the form of a KF flange, and the close part is located in the KF flange form. In the joint area. 8. The hermetically sealed package structure of the infrared component as described in item 4 of the patent application scope further comprises a cl amp surrounding the joint area in the form of a KF flange to provide the external force. Page 14 583738 6. Scope of patent application 1 2. The airtight chamber packaging structure of infrared component as described in item 11 of the scope of patent application, wherein the 0-ring can be made of a polymer material. 1 3. The hermetically sealed package structure of an infrared component as described in Item 12 of the scope of patent application, wherein the polymer material is selected from one of the following groups: V it ο η®, Z a 1 ak®, Ka 1 rez®, or a combination of the above. 14. The air-tight chamber packaging structure of the infrared component according to item 11 of the scope of patent application, further comprising a metal ring sleeved in the ring. 15. The hermetically sealed package structure of infrared components according to item 11 of the scope of patent application, wherein the abutment further includes an annular groove (s 1 ot) to receive and fix the 0-ring. 16. A kind of infrared component airtight room packaging structure for use in a vacuum environment. The infrared component airtight packaging structure includes: a base; an upper cover, which is located on the base and cooperates with the base to form a KF flange joint area; a sealing portion located between the abutment and the upper cover; and a clip surrounding the KF flange joint area to deform the seal portion to achieve a hermetic seal合 的 结果。 The effect. 1 7. The hermetically sealed package of infrared components as described in item 16 of the scope of patent application Page 15 583738 6. The patent application framework, wherein the abutment includes: a first region, the first region having a first thickness; and a second region adjacent to the first region, the second region including The plurality of through holes are used to receive the pins and the sealing solder, wherein a second thickness of the second region is greater than the first thickness. 1 8. The hermetically sealed package structure of an infrared component as described in item 17 of the scope of the patent application, wherein the second thickness is substantially equal to a run-length. 1 9. The infrared component hermetically sealed package structure according to item 16 of the scope of the patent application, wherein the sealed portion is located in a joint area in the form of a KF flange. 20. The hermetically sealed package structure of an infrared component according to item 16 of the scope of patent application, wherein the sealing portion includes a metal gasket. 2 1. The hermetically sealed package structure of an infrared component as described in item 20 of the scope of patent application, wherein the metal gasket can be made of an oxygen-free copper metal material. 2 2. The hermetically sealed package structure of an infrared component as described in item 16 of the scope of patent application, wherein the sealing portion includes a 0-ring. 2 3. The airtight chamber packaging structure of infrared components according to item 22 of the scope of patent application, wherein the 0-ring can be made of a polymer material. Page 16 583738 6. Application for patent scope 2 4. The airtight chamber packaging structure of infrared components as described in item 23 of the scope of patent application, wherein the polymer material is selected from one of the following groups: V it ο η⑩Z a 1 ak®, Ka a 1 rez®, or a combination of the above. 25. The hermetically sealed package structure of the infrared component according to item 16 of the scope of patent application, further comprising a metal ring sleeved in the ring. 26. The infrared component hermetically sealed package structure described in item 16 of the scope of patent application, wherein the base further includes an annular groove (s 1 ot) to receive and fix the O-ring. Page 17