TW574743B - Building-in-reliability diagnosis system for semiconductor manufacturing - Google Patents

Description

No. 574743 No. 91120000 Revised January 5, Description of the Invention (1) [Field of the Invention] The present invention relates to the application of the dry reliability analysis system for semiconductor products, especially // iagn〇Sis SyStem, BIRDS ) Said in ® you rf! 疋 ~ 疋 Reliability analysis using an implanted reliability analysis system at a wafer-level 1 J. [Background of the Invention] Conventional Technology Individual die packaging and quality control testing. Reliability, analysis of the data obtained from extensive testing and test steps related to packaging, the use of semiconductor products will be determined by the degree of analysis, if not done to obtain timeliness, and at the same time, with the number of samples required for analysis, the individual Most of the machines and equipment are tested and analyzed after the wafer is completed, which is generally called the pjun layer. It is not only related to the analysis results, but also has a level of reliability analysis. The dilemma of the rapid contraction of the product life cycle: if the reliability of a certain product is consumed, the entire package level cannot be determined, and the steps required for the production of this product's semiconductor product will increase significantly. Because individual samples have been completed by individual engineers, chip (chi ρ) cutting, and semiconductor component reliability analysis level reliability (package-level 5), and because the packaging level reliability technology and products have matured, the test has sufficient credibility. An unavoidable deficiency: months long. Therefore, with the short, package-level reliability analysis takes months to perform package-level reliability. This product often misses the market-time analysis and allows a product to go to market with reliability. Complex, package-level reliability is used in the machine and required testing know-how, although individual steps are responsible, this step / machine / sample

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Case No. 91120000 5. Description of the invention (2) The quality control and reliability of the product are optimized, but the quality control and reliability of the machine / sample are not integrated. As a result, the reliability of the seal V / cannot often be optimized (because the θ-gate analysis of different parts is eliminated), and different individuals cannot share each other's experience; each other's reliability analysis of the packaging level is time-consuming For a long time, companies such as Texas ’have gradually developed a round-level reliability analysis of test speed. By performing reliability tests during the day and day 0 of a or after they are formed, wait for = yang Granular, c " the time required for the reliability test of the cut and package before passing the verification package. Of course, the steps of the reduction and the reliability analysis of the packaging level are not the same. The practical application of the round-level reliability analysis will still encounter the following two shortcomings: No. 1, the conventional wafer-level reliability method effectively integrates each step / machine, and the quality and reliability of the sample: = the overall quality control and reliability Optimization; some wafer level; crime / scoring analysis lacks experimental data and theoretical basis, and reliability analysis is equivalent. 〃 For equipment increase, and, in summary, the same as the semiconductor process product f Related to reliability "The conventional technology" has unresolved shortcomings that remain to be solved. [Objective and Summary of the Invention] One of the main objectives of the present invention is to provide the yield and reliability of various steps / machines / samples that can be effectively integrated, and then the overall quality control And reliability optimization methods

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The other main purpose of the invention is to provide data that can prove the equivalence and correspondence between the wafer-level guilty / knife analysis and the package-level reliability analysis. The basic feature of the present invention is to integrate the reliability analysis of each level by using the implantable reliability analysis that has only been proposed in recent years. In particular, the database and analysis tools built on various kinds of stinginess analysis test data are used to effectively exert the reliability analysis of various levels. Since the implantable reliability analysis system is a known technology, it will not be introduced here. The relevant details can be found at least: W.K.T. Kary Chien & Charles H.J. Huang, Practical Building-In Reliability (BIR)

Approaches for Semiconductor Manufacturing ", IEEE

Transactions on Reliability, vol · 51, no 3

September 2 002. The application of the present invention can also have at least the following features: (1) Using BIRDS, one can grasp the relationship between any parameter and the final result, whether this parameter is the parameter of the final measurement / final product or an intermediate measurement虿 / Intermediate product parameters. Therefore, by referring to BIRDS, each detail and its impact on the highest quality can be effectively evaluated at the product design stage, and u waits until the product is formed before ^: = quantity- and correction. (2) Any problem related to guilty can be traced back to the past through B I R, and the root cause can be effectively found through experience and the reasoning engine. 0 (3) Because BIRDS is an integrated system, existing technology can be established

574743 Case No. 91120000 Revision V. Description of the invention (4) A database containing all the items related to reliability under the operation. Provide important reference for new technology development, process optimization, process monitoring, reliability monitoring and yield improvement. ° [Details of the invention First of all, the sign: only the measurement and no share of these are often scattered relative to the ground sign: the use of all known methods, etc., with each step 1 2 and each machine 1 1 adjustment; can The quantity data and resources can be integrated or the whole product can be shown in the figure according to the implanted type used above. Explanation] The first A and B diagrams show the relevant information for each machine 11 and step 12 respectively. 1 3, but this information is different for different machines 1 3, and different machines are slightly different, but these data have no purpose μ, 丨 soil μ rice? Recorded, just different systems. 'The first C diagram and the first D diagram show a basic basic reliability of a basic knowing technology of the present invention (or quality control). There is also an interaction between the machine 11 and the different steps 12 and the sexual performance. Before recording the overall operation of the individual implants, the basic reliability points of each production line in each step warehouse 1 4 include at least information 1 3 reliability and reliability. In this way, we will examine the comparison between step 12 and 11 and each optimization. The concept analysis system includes the following real-time integrated analysis 1 5 and the analysis of the distribution results. The amount of the invention may affect the pre-judgment results of each machine 11 2 Individual reliability. "Complete a computer" and not only the reliability, the reliability adjustment, the database 14, and the combined tools and statistics are fed to each machine 1 1 to carry out the factors in each step 1 2 according to the test and the real-time Amendment; In order to pursue the final production, a preferred embodiment of the present invention is a method that should be applied to the basic steps of semiconductor production. Such as

Page 9 2003.10.30.009 574743 ___Case No. 91120000 _ V. Description of the invention (5) As shown in the first background square 21, the circle. Any machine is used here for the alignment analysis process, and any wafer is at least as shown in the second background box 22, system. This implantable reliability analysis system, evaluation assembly (Ass es smen t as se assemb 1 y), control assembly (C ο ntro (Development assembly), search 'Query assembly (Assembly) assembly) ° If adjusted As shown in block 23, refer to these machines and these reliability analyses as shown in the reliability measurement box 24. Perform these reliability analysis procedures in sequence, including any machine and any wafer except for at least any reliability. Analyze the working parameters of the analysis and any problems found or occurred in the analysis process of any wafer. As shown in the feedback box 25, analyze the crime degree analysis system to obtain the process reliability system of the semiconductor product manufacturing process. Here, it must be emphasized that the details of the actual analysis procedure are as follows. In this embodiment, ____ prepare a plurality of machines and a large number of wafers for at least one reliability and one machine for processing. Prepare an implantable reliability analysis system including at least a database (Database mb 1 y), a baseline assembly (Base 1 ine 1 assembly), and a development assembly Search assembly (Search assembly) and an analysis assembly (A na 1 ysis implantable reliability analysis system, adjust the parameters of the program. Use these machines to record any number of reliability analysis procedures for these wafers at the same time. Here, the operating parameters of these information programs, any The results of the machine measurement also include the reliability score and the way to solve the problem. This information is integrated into the product reliability and semiconductivity of the implantable body product, and the implantable reliability analysis examples are not limited to use. Reliable can be applied to traditional packaging levels

Page 10 2003.10.30. 010 574743 _________ Case No. 91120000_ year month day amendment _ V. Description of the invention (6) Reliability analysis program or wafer-level reliability analysis program for new products. The reliability analysis program used in this embodiment may be at least one of the following (but not limited to this): process qualification related procedures, product qualification related procedures, process evaluation (Process Eva 1 uat) ion) related procedures, product evaluation (Product Evaluation) related procedures, process monitoring (Prcess Moni t0r) related procedures, periodic product monitoring (Routine PrOduct Monitor) related procedures, online process evaluation and monitoring (In -Line Process Evaluation & Monitor) related procedures ° Process Qua 1 ifi cat ion and monitoring (Moni tor) related procedures can be at least one of the following (but not limited to): hot carrier injection test (Η 〇 〇 t C arri er Injection Test), Time Dependent Dielectric Breakdown Test, Voltage Ramp Test, Bias Temperature Test, Electromigration test, Ion Ion Mobile Test, Stress Migration Test Plasma Induced Damage Test (Wafer-Level-Reliability Control) and monitoring (Mon it or) are related to In-Line Process Evaluation & Monitor The program can be at least one of the following (but not limited to this): Hot Carrier Injection Test (Ho t

Carrier Injection Test), Voltage Ramp Test, Isothermal

Page 11 2003.10.30.011 574743 __Case No. 91120000_ Year Month Amendment __ V. Description of the invention (7)

Electromigration Test) ° The procedures related to product verification can be at least one of the following (but not limited to this): High Temperature Operating Life Test, Low Temperature Operating Life Test, Early Failure Rate Test (Early Failure Rate

Test), Highly Accelerated Stress Test, Pre-conditioning Test, Pressure Cooker Test, Temperature & Humidity With Bias Test, Thermal Shock Test (Thermal Shock Test), Temperature Cycling Test, High Temperature Storage Test, Low Temperature Stress Test, Accelerated Soft Error Rate Test , Electrostatic Discharge Test, Latch UP Test, System Soft Error Rate Test (System s〇ft Err〇r Rate Test) ° In addition, due to the implantable reliability cited in this embodiment Analysis is the way of in (time) response. Analysis and integration in reliability measurement = Qiaoxun. Further ...: Unification procedures often fail to perform production-side measurement, production-side measurement ... This embodiment is particularly suitable for wafer level reliability i

Page 12 2003.10.30.012 574743 __Serial No. 91120000 Month, day, you don't_ V. Explanation of invention (8). Here, 'as implantable reliability analysis is a newly proposed concept in recent years', it is different from the concept of known technology, but has not been applied in detail. Here, the details of implantable reliability analysis will not be explained. It simply summarizes some of the main features of the reliability analysis system based on implantable reliability analysis used in this embodiment: (1) Instead of passively measuring the final product, it directly measures and controls the majority of the final product manufacturing process. parameter. For example, the working parameters of each machine or the process parameters of each step to predict the reliability of the product. (2) The vertical integration of the majority of the sub-flOW (or most steps) in the complete process (f 1 ow), to overcome the individual quality control of different sub-processes in the conventional technology / Disadvantage of the failure to systematically communicate reliability-related information. (3) Horizontally integrate most of the data of most units (such as most machines) in the same process at the same time, in order to overcome the shortcomings of individual quality control / reliability related information of different units in the conventional technology that cannot be systematically communicated. (4) Evaluate the reliability of any source and the overall impact of changes from any source by continuously recording and analyzing multiple pieces of data from multiple sources. (5) Establish the relationship between reliability and other parameters through data analysis. The data analysis that may be applied here includes at least Bayes theorem, Statistica 1 Contro1 Chart, Factor Analysis, Analysis of Variances, and Multivariate Analysis

Page 13 2003. 10.30.013 574743 _ Case No. 91120000 _ year month and month amendment_ V. Description of the invention (9) (Multivariate Analysis), Discriminant Analysis, Principal component analysis, Experimental design / Designs of Experments / Response Surface Method, Regression Analysis, Decision Tree, Dirichlet Process, Mixed Integer Programming, Linear and Nonlinear Programming (Linear / Non-linear Programming), waiting theory (Queuing Theory), stochastic process (Stochastic

Process), Resources pianning, and other possible parameters include at least process monitoring parameters, yield, specific wafer acceptance test parameters, online machine parameters, and chip probing Parameters, final test parameters, reliability test parameters. (6) The relationship between the reliability and other parameters established through data analysis, including the relationship between the parameter value of any of these parameters and the reliability of the final product. Therefore, when this parameter value is found abnormal during the process, it is possible to predict the possible lack and reliability of the final product, and then modify it accordingly. (7) Through data analysis methods, compare the changes in the relationship between the reliability under different process technologies and certain specific parameters, and provide a way to rely on the reliability of existing process technologies and the reliability of new process technologies. For example, based on the test data of the mature 0.30'025, 0.20 micron process and 0.018 micron process, such as electron migration test and dielectric breakdown test, the relationship between the parameters of different processes and the finished product is estimated, and then it is estimated that the road is fart ^ π start and stop in the development of 0.15 and 0.13 micron

574743

Cheng and ο. When the examples can separate and separate the data, the original data can be used to root the system, and the rule is 18 microns. In order to allow the plant analysis software to actively use the example library, Searching according to previous changes in the search process is compatible with its introspection. In order to provide the search parameters and search engine query parameters and finished products, other technologies and reliability analysis systems such as EX ce 1 allow any use of wafers and These search assemblies get the artificial intelligence you need, keyword usage rules, and relationships. Its computer software has a common data format, JMP, and MATLAB. People can obtain the reliability analysis process and query assembly and information channels. When it is best to have the learning process integrated with the final search for different users, this is actually common with other SAS. Any previous information related to the sequence provides the user with the function of searching the general practice, and the search of the results related to the personalized search. In addition, the implementation of the workday report, the actual product test information, such as parameter values and estimates Reliability is required to produce output at the desired time, and the other is to pass the pre-analysis report, which is further related to the report weekly, and the production line enters a different complete system. 'It can also be provided immediately when quantified, and implantable reliability can also be used by example.' For example, graphic reports (Graphical actively provides product designers and R & D before production can consider the reliability parameter values and the reliability of the final product. The relationship between the reliability of the process and the current test, of course, the production of the graphics and reports here should be the reliability information when the product designer and the R & D are actively providing the test results at any time. The in-line reliability analysis system can analyze the reports reported by the system. The relationship between the personnel's productivity factors, the unquantified results, and the prediction, can be the difference report and failure of the required results of the personnel to record any

Page 15 2003.10.30.015 574743 Month Amendment No. 91120000 V. Description of the Invention (11): Details of the test procedure and any machine-implantable reliability analysis system to perform these machines 22: This embodiment can also be used according to Registered job, taxi (work progress). Tests to be performed; can be based on registered workers; the production operator will provide test-related information (such as how long it takes) and stored materials, provide information related to any test, and provide relevant information for those preparations. These tests are important information related to the machine's gas. For example, when a machine number 'screens out wafers produced by the machine to understand the reliability issues that the failure may cause. In addition, the test shell material is bad, in addition to this, this embodiment can use the implantable reliable production foolproof function. By referring to the stored reliability of the implanted reliability analysis system, if the operator of a certain machine or a certain step adjusts the parameters of the reliability analysis program of the machine disk, the set parameter value has a format error or is related to the data. If there is a significant deviation in the acceptable standard value of the library, an active warning will be issued. Another preferred embodiment of the present invention is a system for applying implantable reliability analysis to the production of semiconductor products. As shown in Figure 3A, at least: implanted reliability analysis assembly 31, failure processing assembly 3 2, failure report assembly 33, scheduling assembly 34, product verification / monitoring / evaluation (Prduct Qualification) report assembly 35, process verification / monitoring / evaluation (Process Qual ifi cat ion) report assembly 36, wafer level reliability control / online process evaluation / monitoring (Wafer Level rel iab i 1 i ty Control) 30, report 38, and 39 analysis.

Page 16 2003.10.30.016 574743 Call No. 91120000 V. Description of the invention (12) The revised implantable reliability analysis assembly 3 1 At the same time, it exchanges most data with most machines, most products and most process steps, and uses the known Implantable reliability analysis processes this data to produce most operationally relevant information. Failure handling assembly 3 2 Receives implanted reliability analysis assembly 3 1 Most failure messages related to these machines, these product verifications, and these process verifications are transmitted and analyzed. Failure report assembly 33 Based on most failure-related messages generated by the failure treatment assembly 3 2, it is related to these machines, these product verifications, and these manufacturing schedule assemblies 3 4 According to these products, these processes are related to the engineering of these process steps. Most job-related messages can be optimized as much as possible. For example, when the historical data of the relevant test machine, (Accuracy) and accuracy (pre tracked to the relatively problematic machine; obviously, the 'schedule assembly will actively notify the current status and utilization of a machine using the same machine Taiwan, will actively make use of various resources to achieve the best use of product verification / assessment / monitoring analysis assembly 3 1 and quality information of most products related to these operations. Process inspection implanted reliability analysis assembly 3 1 Validation-related most processes Validation-related most failure reports. Provide relevant information to arrange these machines, this process, and provide and schedule workflows, so that the schedule assembly can be tracked when the machine utilization rate and manpower configuration data are abnormal. In order to understand the accuracy of the machine), and then use these materials to track which tests each tester has done; when the testers test; and to display the relevant personnel for negotiation if there are multiple applicants applying for the same time Report the assembly 3 to 5 through the implanted reliability sub-messages to generate the certification / evaluation / monitoring report assembly 36 related to these products and these operations. Message, produce and process performance information. Wafer level reliability

Page 17

2003.10.30.017) / 4743 Case No. 911200flf) V. Description of the invention (13) Modified control / online process evaluation / monitoring 31 and these operation related information 3 3 7 J reliability analysis is always related to most of these process steps ;, == Second product, forcing some opportunity report assembly 38 is based on autonomy and sinfulness. Pay attention to the input of the product to the assembly 35, process verification / monitoring / i measurement / evaluation report can be checked itch / /, Taiwanese &j; ° evaluation report assembly 36 and wafer level crime Degree Control / Online Process Evaluation / Politics: 丨 I say this slaying, ancient and this time 〇 person dish test, xincheng 37 7 related data, generate and verify the system • Button heart: In & recognition, some comprehensive reports related to private verification, the report assembly is automatically entered into the original Shen Zugan _ shang t 7 Shibei, the method is to automatically generate key #, automatic reconnaissance Whether there is new test data in the fixed storage area. If there is new test data, the data is automatically entered into the database to reduce errors caused by manual input and reduce the burden on testers. In addition, the report assembly uses automatically generated data. Keywords, you can query and quickly find the required comprehensive report and related documents. Analysis assembly 3 9 At least according to product / monitoring / evaluation report assembly 3 5. Manufacturing / monitoring / evaluation report assembly 3 6. Wafer level reliability control / online manufacturing evaluation / monitoring assembly 3 7 and failure report The assembly 3 3 generates comprehensive data analysis related to these machines, these product verifications and these process verifications. Based on the schedule assembly 34 and / or failure report assembly 33, as required, comprehensive data analysis related to these machines, these product verifications, and these process verifications can be generated. Here, because the product / monitoring / evaluation report assembly 35, process verification / monitoring / evaluation report assembly 36, and wafer-level reliability control / online process evaluation / monitoring assembly 3 7 are the main functions of generating product quality information , These process performance information, these reliability information, so the report assembly 3 8 can

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V. Description of the invention (14) To generate a comprehensive report based on only these messages, the analysis assembly 3g also conducts comprehensive data analysis based on these. Μκ 91120000 成 21 'As the schedule assembly 24 has received all the operational-related information generated by the implantable reliability analysis assembly, as shown in the third β diagram, this and == product verification / monitoring / evaluation report assembly 35 is connected to the implantable reliability analysis assembly 31 through schedule two 34; the process / = assembly 36 can be connected to the implantable reliability analysis through schedule assembly 34, and the total is: = =, class I Round-level reliability control / in-line, process evaluation / monitoring ~, k schedule assembly 3 4 is connected to implantable reliability analysis assembly 31, 3 I = let t analysis assembly ⑽ pass failure report assembly 33 and failure handling assembly. Although the third diagram B shows only one possible architecture, the > m: 疋 implantable reliability analysis assembly 31 must pass the schedule verification i verification / monitoring / evaluation report assembly 35 through, process verification /; Assessment / 告 The assembly 36 and the wafer-level reliability control / online process 7 estimation / monitoring assembly 37 are connected, but can be received individually as 3 4. In order to provide feedback, as shown in the third figure C, the implant analysis assembly 31 can receive the comprehensive report, and integrate the comprehensive report. This = 1 makes relevant information; the implant reliability analysis total Cheng 31 can also access the data analysis, and integrate the comprehensive data to analyze the critical information; and get involved in the master — one-^, stubborn people ^ sin degree analysis assembly 31 can also receive failure reports ° positive _5 Failure report analysis to these operations related information. When it is absent, Figure c shows only one possible architecture. This embodiment does not embed the criminality analysis assembly 31. It must receive comprehensive reports and operation-related information at the same time.

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As well as failure reports, they can be received individually. Furthermore, wafer-level reliability control / on-line process evaluation / age 37 can perform wafer-level reliability analysis, which is not in this embodiment; manufacturing: this detail. However, in order to make use of the performance of the implantable reliability analysis, this embodiment is more suitable for the wafer-level reliability analysis that can be monitored in real time. For example, various reliability analysis procedures that can be performed at the wafer level reliability control / on-line process evaluation / monitoring assembly can be selected from various tests: hot carrier / main entry test, electron migration test, breakdown voltage Test. Next, in order to succinctly emphasize the impact of the application of the present invention on the production process of semiconductor products, Figures 4A to 4 respectively show the basic flow of a conventional semiconductor manufacturing process and a semiconductor manufacturing process to which the present invention is applied. Figure A and Figure ―The conventional semiconductor manufacturing process can usually be divided into four major step blocks (R & D design step block 41, manufacturing step block 42, test block 43 and reliability analysis block 44) and two related information blocks (Manufacturing steps related data box 45 and output related data box 46). R & D design step box 41 refers to all actions before formal production, such as product specification development of the product to be manufactured, testing of the product to be manufactured, and to be carried out. The adjustment test of the manufacturing steps, etc. The manufacturing step block 42 refers to the formal production of the product to be manufactured. Production — cutting operations, such as wafer cleaning, oxidation, thermal treatment, photography, etching, doping , Diffusion, metallization, and so on.

Amendment No. 91120000 V. Description of the Invention (! 6) 574743 Test Block 4 3 refers to the test operation of the product quality after the product is manufactured, such as wafer acceptance test (wafer accePtance test) and die probe test (Chipprobingtest). The reliability analysis block 44 refers to the V-reliability analysis of a large number of products and related manufacturing steps. At least the reliability of the two parts of the process guilty degree and the product reliability. Manufacturing step related data box 45 refers to all the data generated during the manufacturing step box 42 when all the actions in the manufacturing step box 42 are performed, the machine performing these actions, the operator performing these actions, and so on. Output of relevant data box 4 6 refers to all the data generated in the test box 43, the execution of all the actions in the test box 43, the machine performing these actions, the operator performing these actions, and so on. As shown in Figures 4C and 4D, in addition to the conventional three major process blocks (R & D design step block 4i, manufacturing step block 42 and test block 43) and two major related messages, the semiconductor manufacturing process to which the present invention is applied. In addition to the blocks (data box 45 related to the manufacturing steps and the data box 46 related to the output), there are additionally an embedded reliability analysis block 47, an online reliability monitoring sub-block 48, and a reliability control sub-block 49. Here, the implantability analysis block 47 replaces the reliability analysis block 44 of the conventional technology, and the online reliability monitoring sub-block 4 8 can be at least a wafer-level reliability analysis. The implanted reliability analysis block 47 is a block for performing the implanted reliability analysis. Compared with the reliability analysis block 44 of the conventional technology, ^ ^ has the following characteristics:

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(1) The implanted reliability analysis block 47 receives the manufacturing step-related data block 45 and the output-related data block 46, and performs the implanted reliability analysis based on these data. (2) The implantable guilt analysis block 47 will systematically interact with both the manufacturing step block 42 and the test block 43, such as data exchange, real-time correction, and real-time status report. (3) The implantable guilty degree analysis block 47 will systematically transmit the operational results to the R & D and design step block 41. This allows the operation of the R & D and design step block 41 to introduce reliability considerations. • (4) Implantable guilty analysis block 4 γ can perform at least the following actions: process reliability assessment, wafer-level reliability analysis, product reliability: leveling, data analysis, scheduling, report generation, The failure analysis and failure are divided into eight parts on this line. The crime monitoring sub-block 48 is used as the interface between the implantable reliability starting block 47 and the manufacturing step block 42, and the reliability control power Α 糸 is used as an implantable Sin degree analysis block 4 7 and the manufacturing step block 4 2 of the "naturally" conventional technology in the different step blocks (4 丨 / 4 2 4 3 4 4) Six levels 2 are one-way streets. The content of the block that is made after the block is not returned to the block that was made first. What's more, the message-related blocks (4 5/4 6) are not only independent of each other, but also…, and return to each message-related block (4 1/42/43/44). In contrast, the present invention can make the relationship between the blocks of different steps (41/4 2/4 3/44) back and forth in two directions.

Page 22 2003. 10.30. 022 574743 S1_9U20000 Λ ___ 3. Revision V. Description of the Invention (18) Block, and then carried out and analysis of crimes related to different messages Block 4 7 Mutual analysis of blocks 4 7 Feedback to the end, we must emphasize the species The possible functions and various structures are subject to special explicit restrictions. The above-mentioned changes and functions are only within the scope of equivalent patents completed under the spirit of the patent application of the present invention. The content of the box can also be fed back to the first box. The box (4 5/4 6) can be integrated not only through implantation, but also through the reliability of the message (41/42/43/44). The ground is that all possible variations and components of the above embodiments are independent of each other, unless each embodiment is used in the above description, it can be selected and configured according to actual needs. The preferred embodiments of the invention are only intended to limit the scope; all other changes or modifications that do not depart from the disclosure of the present invention should be included in the following applications

Page 23 2003.10.30.023 574743 _Case No. 91120000_Year Month and Day__ Brief Description of Drawings [Simplified Description of Drawings] Figures A through B are schematic cross-sectional views of the main features of the conventional technology; Figures C to D are schematic cross-sectional views of the main features of the present invention; Figure 2 is a basic flowchart of a preferred embodiment of the present invention; Figures A, B and C The basic configuration diagram of another preferred embodiment of the invention, and the fourth A, fourth B, fourth C, and fourth D diagrams respectively show the basic semiconductor manufacturing process and the basic flow of the semiconductor manufacturing process to which the present invention is applied. . [Representative symbols of main parts] 11 Machine 12 Step 13 Information 14 Database 15 Implanted reliability analysis 21 First background block 22 Second background block 23 Adjustment block 24 Reliability measurement block 25 Feedback block 31 Implanted reliability Analysis assembly 3 2 Failure handling assembly 33 Failure report assembly

Page 24 2003. 10.30.024 574743 Case No. 91120000_Year Month Day_Amendment of the simple diagram 34 Schedule Assembly 35 Product Verification / Monitoring / Evaluation Report Assembly 36 Process Verification / Monitoring / Evaluation Report Assembly 37 Wafers Hierarchical Reliability Control / Online Process Evaluation / Monitoring Assembly 38 Report Assembly 39 Analysis Assembly 41 R & D Design Step Block 42 Manufacturing Step Block 43 Test Block 44 Reliability Analysis Block 45 Manufacturing Process Related Data Box 46 Output Related Data Box 47 Implantable reliability analysis block 48 Online reliability monitoring sub-block 49 Reliability control sub-block

Page 25 2003.10.30.025

Claims (1)

574743 Case No. 91120000 6. Scope of patent application 1. An application reliability analysis method includes: preparing a plurality of machines and a plurality of machines for performing at least one of the wafers to at least one of the wafers in order. The preparation-implanted reliability analysis analysis system includes at least a database, a control assembly, a development assembly, and a query assembly; refer to the parameters of the reliability analysis program with reference to the implantable reliability analysis ; Using these machines for these wafers, and at the same time § has recorded most of the information of any of the reliability of any of the wafer, the operating parameters of the reliability analysis program, the measurement results of any of the wafer, the method ; And analyze and integrate the information into the process reliability and system to obtain the manufacturing process of the semiconductor product. 2 · If the method of applying for the first item in the scope of patent application is related to the production of semiconductor products, the reliability analysis at the wafer level. Correct the system for the production of semiconductor products in Japanese yen, where any one of the machines is a reliability analysis program that is processed by the machine; system, the implantable reliability is divided into an evaluation assembly, a baseline assembly, and a search Assembly, an analysis system, adjust the machines and perform the reliability analysis program analysis procedures, any of the machines and the information include at least any of the problems of the operating parameters of the machine, and solve the problems Problem Implantable reliability analysis system, product reliability and the semiconductor product update The implantable reliability analysis implantable reliability analysis system These reliability analysis programs belong to page 26 2003.30 · 30 * 026 574743 _ Case No. 91120000_ 年月 日 __ VI. Patent Application Range 3. For the method of applying the implantable reliability analysis system to the production of semiconductor products in the first scope of the patent application, any of the reliability analysis programs is selected from the following One: hot carrier injection test, dielectric breakdown time test, breakdown voltage test, bias temperature test, electron migration test, ion migration Test, stress migration test, plasma induced damage test, hot carrier injection test, breakdown voltage test, constant temperature electron migration, high temperature life test, low temperature life test, early failure rate test, accelerated aging test, pre-condition test, pressure cooker test, Constant temperature and humidity test, thermal shock test, temperature change cycle test, high temperature storage test, low temperature stress test, accelerated soft error rate test, electrostatic discharge test, latchup test, system soft error rate test. 4. If the method of applying the implantable reliability analysis system in the scope of patent application No. 1 to the production of semiconductor products is to perform any of the reliability analysis procedures, analyze and integrate at least one piece of corresponding information. 5. For the method of applying the implantable reliability analysis system to the production of semiconductor products in the first scope of the patent application, the implantable reliability analysis system is a system that uses the conventional implantable reliability analysis. The characteristic is not to measure the final product passively, but to directly measure and control most parameters of the manufacturing process of the final product. 6. The method of applying the implantable reliability analysis system to the production of semiconductor products according to item 1 of the scope of patent application, the implantable reliability analysis system is a system that uses a conventional implantable reliability analysis, which has a large It is characterized by vertical integration of most of the sub-processes in a complete process Page 27 2003.10.30.027 574743 _Case No. 91120000_Year_Month__ Sixth, most of the information in the scope of patent application, in order to overcome the shortcomings of individual quality control / reliability related information of different sub-processes in the conventional technology cannot be systematically integrated . 7. The method of applying the implantable reliability analysis system to the production of semiconductor products, as described in item 1 of the scope of patent application, the implantable reliability analysis system is a system that uses the conventional implantable reliability analysis. It is characterized by horizontally integrating most of the data of most units that are carried out simultaneously in the same process, thereby overcoming the shortcomings of individual quality control / reliability related information of different units in the conventional technology that cannot be systematically communicated. 8. If the method of applying the implantable reliability analysis system to the production of semiconductor products in the first scope of the patent application, a major feature of the implantable reliability analysis system is that it comes from most sources through continuous recording and analysis and comparison The majority of the data used to assess the reliability of any of the sources and the overall impact of changes in any of the sources. 9. If the method of applying the implantable reliability analysis system to the production of semiconductor products in item 1 of the scope of patent application, the implantable reliability analysis system establishes the relationship between reliability and other parameters through data analysis methods, here Possible statistical methods include at least Bayes theorem, control chart, factor analysis, variation analysis, multivariate analysis, discriminant analysis, principal component analysis, experimental design / response surface, regression analysis, decision tree, Dick Wright program, mixed integer programming, linear and nonlinear programming, waiting theory, stochastic process, resource planning, etc., and other possible parameters include at least process monitoring parameters, yield, specific wafer acceptance test parameters, online machine parameters, Wafer pin test parameters, final test parameters, reliability test Page 28 2003.10.30.028 574743 Case No. 91120000 6. Scope of patent application Test parameters. For example, if the patent application range No. 9 for semiconductor product production is established through statistics, the parameter values and the parameter values may be statistically calculated based on the reliability of some specific parameters. Process technology 1 2 · If the patent application scope of the data format for semiconductor product production is in line with other Excel, JMP, MATLAB I3 · If the patent application scope is for the semiconductor product production, the check δ ten assembly is used for a Amend the application method of item 10 11, the application method of the reliability and its final product item, the relatively unchanged change, the application method of technically reliable item, the common information and the application method of SAS item 0 Reliable implantable implants and other parameters of the implantable implantation process and the same process to provide the degree of reliability of the implantable implantation analysis of the relationship between the soft reliability reliability and the reliability of the existing technology . Reliability Reliability is compatible with the machines, the wafers, and the information. The implantable reliability database, the searcher can get any reliability analysis, analysis system, analysis system, including the system. Analytical system Analytical system Analytical system Analytical system Reliability and process technology Analytical system Analytical system, such as the analysis of the application of the system to find the assembly and the procedures related to the application of the previous method, method and method are still displayed and reported on the production line. Implantable reliability can be used for product designers to analyze systemic reliability before production.14. For example, the map generated by the knife analysis system for semiconductor product production in the scope of patent application i. References for reliability factors Page 29 2003.10.30. 〇29 574743 _ Case No. 91120000_ year month date __ VI. Patent application scope 1 5. Application of the implantable reliability analysis system to the production of semiconductor products as described in the first patent application scope You can still use the icons and reports generated by the implantable reliability analysis system to provide test result reports and failure analysis reports at any time to provide real-time reliability information. 16. If the method of applying the implantable reliability analysis system to the production of semiconductor products in the first scope of the patent application, the implantable reliability analysis system can still be used to schedule the machines, and the implantable reliability In addition to recording the work progress of all these machines; it can proactively inform the operator of the tests to be performed and determine when the machine has enough space to test; it can also provide information related to any test, such as those tests Measured by those machines, so that when the machine has a problem, you can also trace these data to the relatively problematic machine; remind the operator when to make those preparations; when multiple testers apply to use the same machine at the same time , The relevant personnel will be proactively notified to negotiate to improve the utilization rate of the machine and optimize the manpower allocation. 1 7. If the method of applying the implantable reliability analysis system to the production of semiconductor products in item 1 of the scope of patent application, the implantable reliability analysis system can still be used to provide fool-proof function, and the operator adjusts these machines and # When these parameters of the reliability analysis program are used, 'If the set parameter value has a format error or there is a significant deviation from the acceptable normal range recorded in the database, an active warning will be issued. 1 8. —A system for the application of implantable reliability analysis in the production of semiconductor products ’includes: An implantable reliability analysis assembly, the internal application of implantable reliability Page 30 2003.10.30.030 574743 Correction and analysis of the assembly at the same time with the majority ^ Six Twice; the number of machines, most products and the majority, and the use of the conventional implantable reliability of two ^ to generate the majority of operation information; "" Processing assembly, the failure processing assembly receives the majority of failure information related to the machines and the d step from the passed round, and analyzes the _ At t report assembly, the failure report assembly is based on the = Most of the failure-related information generated, and the majority of the failure reports related to the two products and the 4b system 5¾ Λ Μ ^. Two I spear king steps can be quickly obtained through fuzzy query; a schedule assembly, the The ordering assembly is arranged according to the operation phases = the machines, the products and the process steps, and most of the work related to the scheduling workflow. When the shell material is abnormal, the scheduling assembly can track the relevant test machine data. To understand the accuracy and precision of the machine, and then track these data to the relative machine; show what tests each tester did; In addition, the 'schedule assembly will actively communicate When the tester displays the current status and utilization of each machine, if there are multiple applications for the same machine at the same time, they will actively inform for negotiation 'so that various resources can make the best use of a product verification / monitoring / Evaluation report assembly, the product / assessment report assembly analyzes and processes the implantable products and the messages through the implantable reliability analysis process steps, and processes the failures of some machines, reports, and procedures for failing the message. If there is a problem with the historical accuracy of the platform; and the relevant personnel of the applicant 9 will verify / monitor the L and these operations. Page 31 2003.10. 30. 031 574743 = Reliability information for most products related to product verification / monitoring / evaluation; 6. Scope of patent application / ΐ ", J / .tf # °% ^ ^ ^ t t. / M ,, j for correlation 1 From the mouth to "over / sea implantable reliability analysis assembly and most of the process related to these process steps" = control / online process evaluation / monitoring assembly, manufacturing / online process evaluation / monitoring assembly through ΐίΐί Analyze the assembly and the operation-related information, and directly monitor it on the 'i' to generate most reliability signals related to the product verification, the machines and the process steps;-The report assembly 38 is based on automatic The input production verification / monitoring / assessment assembly 35, process verification / monitoring / assessment report assembly 36, and j-level reliability control / online process assessment / monitoring assembly 3? Relevant two items related to production ΐ Γ Some machines 2. These product verifications and these process inspections = related reports; the report assembly automatically enters the original data, and the second method is to automatically generate keywords and automatically detect whether the fixed storage area is new test data '# There are new test data, Then the data is automatically =: Material library to reduce errors caused by manual input and reduce the burden on testers; In addition, the 'Report Assembly' uses the automatically generated key 3 to query and quickly find the required comprehensive report and related documents; an analysis assembly , The analysis assembly is based on the product report verification / monitoring evaluation / assembly, the process verification / monitoring / evaluation report assembly, the wafer-level reliability control / online process evaluation / monitoring / assembly, and failure Page 32 2003.10. 30.032 574743 Case No. 91120000 Amendment of general analysis J. Special application, sub-application, six steps to produce the product and the product The device and the production of the analysis and analysis can be used in plant applications. The analysis points are divided into 8 materials: the first one is the fan, the second is the comprehensive benefit, the one is the special application, please apply for the relevant product, and the information can be obtained by the report. Systematic production of some systems. Produce the report, report the production of interest, and integrate the information. The semi-product is born to analyze the product to divide the interest. The information can be based on the type and can be integrated into the plant. Based on this information, can the system of 00 system 1 produce some Fan Sheng products, specializing in production? Please report the quality of the application, such as semi-finished products, which can be used for planting applications. 8 points are analyzed, and the general information is required. The application bank will also analyze the points as a general operation. The degree to which the report can be integrated into the plant should be integrated, and the whole system should be integrated, and the report will be integrated and the product will be integrated. 8th round Fanley. For specific information, please contact the applicants. If you also analyze the ingredients, materials, capital, and the degree of analysis, you can integrate the integration and integration, and analyze the system. Information on the material and interest of the product, the production of bio-products, the comprehensive production of the body, the connection of the half-day to the head of the project, and then the analysis will be divided into two parts, the total amount of money, the number of points, and the degree of reliance. Can report the effect of planting the loss of this combination should be planted, the whole system is integrated, the first report of the production report is effective, the product is lost, the product is dedicated, and the application will be received. Excessive reliance is the item that can be made into the reportable planting supplies, and the 8 series and 1 series are the perinatal fan products. Specialty information please inform the body Page 33 2003.10.30.033 574743 Process assembly 25 · If applying for semiconductor process assembly 2 6 · If applying for semiconductor scheduling total 2 7 · If applying for semiconductor wafer layer 28 · If applying for semiconductor at least one test, degree test test, pressure test test, early pressure cooker cycle test Error rate test. The reliability of the production of the implantable patent range product and the production of the implantable patent range product and the implantable patent range product are divided into the reliability analysis of the patent range product and the dielectric breakdown. , Electromigration plasma induced damage, constant temperature electronic phase failure rate test, constant temperature test, high temperature storage test, electrostatic discharge reliability analysis system of item 18 reliability analysis system of item 18 reliability The system should be divided into 18 items. 5 The analysis system can be packaged or packaged. The 18 items can be selected for the time test test \ ion breakdown test \ 孰 migration, warm-type accelerated old constant humidity test storage test \ low power test \ Bolt assembly connection. Use the implantable programmable report assembly connection. Use the implantable reliability measurement assembly to analyze the total connection reliability. Use the implantable reliability measurement to measure the total level of reliability. Use the implantable reliability measurement to measure one of the following: Crash voltage test, mobility test, carrier injection test, and test. The test, the preheat shock test, the thermal stress test, the lock test, and the system reliability analysis can be performed through the row reliability analysis and the system through the 0 reliability analysis. Sin degree analysis was performed by the hot carrier injection test, bias temperature, stress migration test, breakdown voltage, low temperature life test, condition test, temperature change, accelerated soft error, and soft error rate. Page 34