TW570309U - Memory chip stacking structure - Google Patents

Memory chip stacking structure

Info

Publication number
TW570309U
TW570309U TW91200816U TW91200816U TW570309U TW 570309 U TW570309 U TW 570309U TW 91200816 U TW91200816 U TW 91200816U TW 91200816 U TW91200816 U TW 91200816U TW 570309 U TW570309 U TW 570309U
Authority
TW
Taiwan
Prior art keywords
memory chip
stacking structure
chip stacking
memory
stacking
Prior art date
Application number
TW91200816U
Other languages
Chinese (zh)
Inventor
Nai-Hua Ye
Jen-Bin Peng
Original Assignee
Kingpak Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kingpak Tech Inc filed Critical Kingpak Tech Inc
Priority to TW91200816U priority Critical patent/TW570309U/en
Publication of TW570309U publication Critical patent/TW570309U/en

Links

TW91200816U 2002-01-24 2002-01-24 Memory chip stacking structure TW570309U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW91200816U TW570309U (en) 2002-01-24 2002-01-24 Memory chip stacking structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91200816U TW570309U (en) 2002-01-24 2002-01-24 Memory chip stacking structure

Publications (1)

Publication Number Publication Date
TW570309U true TW570309U (en) 2004-01-01

Family

ID=32590661

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91200816U TW570309U (en) 2002-01-24 2002-01-24 Memory chip stacking structure

Country Status (1)

Country Link
TW (1) TW570309U (en)

Similar Documents

Publication Publication Date Title
IL156854A0 (en) A multiple use memory chip
HK1051600A1 (en) Memory cell structure
GB0205751D0 (en) Improvements relating to memory devices
AU2003235106A1 (en) Semiconductor memory
AU2003282394A8 (en) Chip antenna
EP1542237A4 (en) Semiconductor memory
AU2003243244A8 (en) Stacked 1t-nmemory cell structure
TW586677U (en) Stack structure of chip package
EP1598829A4 (en) Semiconductor memory
EP1605468A4 (en) Semiconductor memory
AU2003209564A8 (en) Chip stack with intermediate cavity
GB2396963B (en) Semiconductor packaging structure
EP1406267A4 (en) Semiconductor memory
AU2003227363A1 (en) Semiconductor memory
GB0227203D0 (en) Memory tag
AU2003270392A8 (en) Assemblies having stacked semiconductor chips
TW570309U (en) Memory chip stacking structure
TW549579U (en) Chip stacking structure
TW549593U (en) Central-pad memories stack package
TW549581U (en) Semiconductor chip stacking structure
TW549574U (en) High capacity memory stacking structure
GB2409072B (en) Memory module
GB0329027D0 (en) Stacked small memory card
GB0222271D0 (en) Memory devices
TW570385U (en) Improved memory card structure

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model