TW569498B - Modular jack assembly with signal conditioning - Google Patents

Abstract

An electrical connector assembly comprises a housing (26) including a beam platform (170) having a front mating section (176), a rear platform section (186), and a pair of opposite side edges (192, 194). A plurality of electrical contacts (28) are carried by the housing, the contacts being arranged in an upper row and a lower row. The contacts in each of the rows have mating contact portions (271b-278b) exposed along the front mating section, and circuit board connecting sections (271d-278d). The circuit board connecting sections of the upper row of contacts extend beyond one of the side edges, and the circuit board connecting sections of the lower row of contacts extend beyond the other of the side edges. Signal conditioning devices (16) including circuit cards (18) having signal conditioning components (22, 24) thereon are mounted to the side edges and are electrically connected to the circuit board connecting sections of the contacts.

Description

569498 5. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a connection combination that provides a multi-port connection. [Prior art] It is known that the existing connector combination has a plurality of receiving connectors located in a common housing, which can make the aforementioned receiving connectors have a small configuration. The aforementioned connection group is very useful for providing multi-port, so the aforementioned connector combination can be used as a multi-port connector combination. In a preferred array, the aforementioned housings have sockets overlapping one another, forming an array of a plurality of stacked configurations, also referred to as a stacked socket configuration. Receiving connectors, also known as modular jacks, each have electrical contacts configured as a terminal array and have plug-receiving recesses. In particular, the receiving connector belongs to the R J _ 4 5 module socket style, and can be mated with the corresponding R J-4 5 module plug. For example, as disclosed in U.S. Patent No. 5,5 3 1,6 1 2, a connector combination has two rows of receiving connectors arranged in parallel and the following rows arranged in parallel in a common housing, that is, module sockets. This can advantageously double the number of receiving connectors without increasing the length of the housing. The receiving connector has a plug-receiving section, and the receiving section has a plug-receiving cavity to surround a module plug to be inserted into the cavity. The aforementioned module plug has a spring latch, which can be snapped into the latch section of the module socket. The aforementioned latches can be grasped by hand and can be flexed inwardly towards the plug at a right angle to exit from the latch section of the module socket. This connector combination can be used in the field of telephone technology, where the modular jack provides a port for connection to a telephone switching network of a telephone service provider, such as a regional telephone company or a national telephone company. corresponding

Page 6 569498 5. Description of the invention (2) The RJ-1 1 module socket is connected to the telephone line extending from the telephone socket on the building wall, and the telephone socket is connected to the telephone line outside the building and then to the telephone Service provider's telephone switching network 0 In addition, this connection system is also common in office computer networks, where computers use delicate wiring to connect to the office server. This network has many types of data transmission media, including coaxial Optical fiber cables and telephone lines. One of the network topologies is the well-known Ethernet1. It has many communication standards, such as IEEE 802.3 and others. This type of network has the need to provide a large number of distributed connections and It ’s best to have a small space to accommodate the connected devices. Going further *, this type of network operates at speeds of 1 GB or more For example, it is usually necessary to install a shield to control electromagnetic radiation in accordance with FCC standards, and at the same time control the electromagnetic interference (ΕΜΙ) in the combination between adjacent connections. Therefore, 1 also needs to provide something like magnetic in the combination. Coil inductors, chip capacitors, etc. are used to modulate the signal. Although there is no technology to regulate the signal, there is no connection device that can handle this speed while being able to package the signal modulation / Sr / r required to maintain this speed, which is the component. Other taxis 4- δχ at are shown in US Pat. No. 6, 2 2 7, 91 1 filed by Boutros et al., Which reveals that "%--has" multiple ports can be connected to. Xi Xi The modular socket group of each modular socket. This combination further reveals the packaged magnetic combination, or other components that are connected to other signals. This design easily adds components to known connecting devices. Therefore, theThe volume is not enough for the signal adjustment required by § before the high speed, that is, the device needs 0

Page 7 569498 V. Description of the invention (3) [Summary of the invention] Therefore, the problem to be solved is how to provide an electrical connector combination capable of processing high-speed signals in a small package. The electrical connector combination according to the scope of patent application No. 1 can solve this problem. The invention relates to an electrical connector assembly including a housing, the housing comprising: a beam platform with a front matching section, a rear platform section and a pair of opposite sides. The housing carries a plurality of electrical contacts, and the contacts are arranged in the above and below. The contacts in each column have matching sections exposed along the front matching section and board connection sections. The circuit board connection section listed above the contact extends one of the sides, and the circuit board connection section below the contact extends the other side. A signal conditioning device including a circuit board having a signal conditioning component thereon is fixed to the side and electrically connected to a circuit board connection section of a contact. [Embodiment] The present invention will now be described by way of examples with reference to the accompanying drawings. First refer to the first figure. The stacked module sockets are shown as reference number 2, including a plurality of module socket sub-combinations 4, a main housing element 6, and an external shielding element 8. The module socket sub-combination 4 can be set in the main housing 6, and the adjacent module socket sub-combination 4 is provided with an insulating cover 10, and is arranged under a pair of adjacent module socket sub-combinations 4. The forming plate 12 will be described in detail below. In the preferred embodiment of the present invention, the module socket belongs to the R J-4 5 structure, but other R J structures consistent with the present invention (for example

Page 8 569498 V. Description of the invention (4) Such as R J-1 1) or non-R J structure. Please refer to the second figure at this time, and the module socket sub-assembly 4 will be explained in more detail here. The module socket sub-assembly 4 is generally composed of a module socket connector element 1 4 which can be arranged in the housing 6. Here, the aforementioned module socket connector 1 4 can be modified to receive two signal adjustment combinations 1 6 from both sides. . The aforementioned filtering and combining 16 usually includes a circuit board with a right-angled contact 20 interconnected with a circuit board 18 through a hole 21 and a passive filtering device such as components 2 2 and 24. I can understand that the circuit board package contains a through hole 25, which is connected to the contact 20 through a conductive line (not shown) on the circuit board. The modular socket connector 1 4 usually includes a housing 2 6 having a plurality of contacts 2 8, so that the filter combination 16 can be fixed to the housing 2 6, and the contacts 2 8 are interconnected to the penetration hole 2 5 . Furthermore, I can understand that in the specific embodiment described, passive filtering is used. The electronic components 2 2, 24 can include any kind of electronic device, including a distributed resistor, a capacitor, an inductor, and a semiconductor device (such as a transistor or two Polar body) or even integrated circuits. At this time, please refer to the third drawing, the third A drawing, the fourth drawing, and the fourth A drawing, and the main housing element 6 will be described in more detail here. As shown in the fourth figure, the housing element 6 generally includes a front matching surface 30, an upper wall 32, a lower wall 34, a rear surface 36, and an end wall 38 (only one of which can be seen in the third A and fourth A drawings). One). Please refer to FIGS. 4A and 5, which show that the front mating surface 3 0 of the housing 6 includes the above-mentioned module plug receiving openings 40 and the following module plug receiving openings 42. The opening 40 includes a lower surface 44, an inner parallel side surface 46, and a latch receiving groove 48 with a latching surface 500 facing the rear. Similarly, the lower opening 4 2 column includes a top wall 5 4 (fifth figure) and an inner wall 56. Provides a bottom with a rear latch surface 6 0 on 5 8

569498 5. Description of the invention (5) The square latch accepts the recess. Each of the openings 40, 42 also includes a groove 62 in the side wall 46, and a groove 64 in the side wall 56 to accommodate the module plug. However, I can understand that any modification can be made to the module plug receiving opening to change the structure of the plug or to accommodate different key structures.

At this time, please refer to the third diagram, the third A diagram, the seventh diagram, and the eighth diagram. Here, a specific embodiment of the module socket receiving area 70 will be described in more detail. The module socket receiving area 70 extends forward from the intermediate wall 72 to the inner surface of the front matching surface 30. As shown in FIGS. 3A and 8, the tapered groove is labeled 74 and extends forward from the intermediate wall 72 to the front matching surface 30. The aforementioned progressively finer grooves also include narrow receiving grooves 76, which will be further described herein. The tapering grooves 7 4 extend forward, and then pass through the front wall 30 to form an oval opening 78 (third A). At this time, please refer to the third, seventh, and eighth pictures. The enlarged space on the back will be marked as 90 and extend backward from the middle wall 72. The enlarged area 90 is separated by an intermediate wall 92. In a preferred embodiment, the foregoing intermediate wall 72 is used to separate a pair of connected openings 40 and 42. This enlarged volume exists between the inside surface 94 of the upper wall 32, the inside surface 96 of the end wall 38, and the intermediate wall 92.

As shown in FIG. 3A, FIG. 6 and FIG. 7, a plurality of calibration devices will be provided here, and the connector subassembly 4 and the intermediate cover 10 are aligned with the housing 6. As shown in the sixth and seventh figures, a pair of ribs 9 8 extend rearward from the middle wall 72 and are arranged in the corners defined by the inner surface 96 and the upper surface 94, and define the groove by partitioning 100. In the adjacent corner, it is defined between the upper surface 9 4 and the middle wall 92, and the rib 1 0 2 also defines an intermediate groove.

Page 10 569498 V. Description of the invention (6) 1 0 4. In addition, a pair of ribs are also concentratedly disposed between the inner surface 96 and the intermediate wall 92, that is, a pair of ribs 1 1 0 are collectively defined, which defines the middle groove 1 1 2 and the outer ribs 1 1 4 which cover the middle The ribs 1 1 0 define two intermediate grooves, namely 1 1 6 and 1 1 8. This structure is repeated in each of the adjacent enlarged regions 90 between the intermediate walls 92, so this region is described only once. Please refer to Figures 3A and 7 and extend from the lower wall 34 to provide complementary calibration functions to merge with the positioning function of the above-mentioned connector sub-combination 4 and mask 10. As shown in FIG. 3A, the connector housing 6 includes T-shaped projections 1 2 0, and the aforementioned T-shaped projections include a lateral portion 1 2 2 and a plate supporting portion 1 2 4 and has a supporting bolt 1 2 5 . A rib 1 2 6 (seventh figure) is provided here, so a groove 1 2 8 is defined between the rib 1 2 6 and the side wall 1 3 0 of the lateral portion 1 2 2. Still referring to the seventh figure, a groove 138 is defined between the two ribs 136, and the groove 140 further extends into the back wall 72. I can understand that the trenches 138 and 140 are aligned vertically with the trenches 1 2. Further, the groove 1 4 2 is defined between the side surface 1 4 4 of the lateral portion 1 2 2 and the rib 1 3 6, and the groove 1 4 6 is defined between the rib 1 3 6 and the adjacent protrusion 1 2 0 The side surface is between 1 3 0. I can also understand that the grooves 1 1 6 and 1 4 2 and the grooves 1 1 8 and 1 4 6 are aligned perpendicular to each other. The housing 6 also includes an upper contour recess 150 having a hole 152 and a lower contour recess 154 having a hole 156, as shown in the seventh figure. Finally, as shown in the first figure, the housing 6 includes a plurality of cavities 160 on the top surface of the upper wall 32 and a cavity 162 extending into the end wall 38. Further, the housing 6 includes a printed circuit board positioning tab 164 extending downward, and as shown in the fourth A diagram, it includes a cavity 166 surrounding two adjacent pairs of elliptical cavities 78.

569498 5. Invention. Explanation (7) Please refer to the ninth figure at this time, where the module socket connector 14 is shown, which has a housing 26 including an extended platform housing part, or a beam-like part 1 70, which usually extends at Between the front matching surface 172 and the end surface 174. The extended housing portion 170 including the front mating section 176 has an upper surface 178 and a lower surface 180 (Figures 12 and 13), an upper transverse wall 182 extends upward from the surface 178, and a lower transverse wall 184 extends from the surface 180 Extend down. The extended platform portion 170 further includes a rear platform portion 186 including an upper surface 188, a lower surface 190 (FIG. 12), and two lateral surfaces 192, 194 (FIG. 9), which will be described in more detail herein. As shown in the tenth figure, the module socket housing 26 includes a plurality of grooves 201-208, and the grooves extend rearwardly from the front surface 172 to the end surface 174. The grooves 201-208 include linear portions 201a-208a that extend rearwardly through the upright wall 182, as shown in the tenth and eighth figures. As shown in the eleventh figure, the grooves 2 0 1-2 0 8 also include the upper vertical portion 201b_2 0 8 b, which has been described to form a contact alignment groove. After extending over the upper lateral wall 1 8 2, the linear groove portions 201A-208A include turning sections, such as 201c to 208c, and the subsequent right-angle sections 201d-208d. The aforementioned right-angle sections enter the side surface 192, such as the tenth As shown. I can understand that the lower surface 190 contains an array of grooves consistent with 201-208, with the exception that the aforementioned groove is a mirror configuration, so that the groove extends through the lower transverse wall 1 8 4 and enters the transverse surface 1 9 4. Please refer to the ninth to thirteenth drawings, and the holding function of the module socket housing 26 will be described in more detail here. First, as shown in the ninth figure, the housing 2 6 includes side extensions 2 2 0 extending along the front matching section 1 7 6 and includes side surfaces tapering toward the front surface 1 7 2 at an angle Ai 2 2 2 (tenth picture), and include,

569498 V. Description of the invention (8) Contains the top surface 2 2 4 and the bottom surface 226 which are tapered toward the front surface 17 2 at an angle A2 (Figure 12). Each side surface 222 further includes a pawl mechanism 2 2 8 adjacent to the end of the side extension 2 2 0. Each side extension 2 2 0 further includes at least one positioning element (in the illustrated embodiment, it is an elliptical thermoplastic tab 2 3 0 extending from the front surface 2 3 2 of the side extension 2 2), In particular, it is used to position the housing 26 when inserted into the outer housing 6. However, I can understand that many other positioning element configurations can also be used, such as non-elliptical thermoplastic tabs, grooves and grooves, or even using tabs extending from the inner surface of the outer shell 6 to communicate with The corresponding openings formed in the front surface 172 of the housing 26 are matched, and specific embodiments of these changes are well known to those skilled in the art. As shown in the ninth and eleventh figures, the lateral wall 182 includes a contoured wall portion 2 4 0 with extending tabs 2 4 2, and the lower lateral wall portion 184 includes a contoured wall section with a tab element 246 2 44. Furthermore, the lateral surface 192 includes positioning tabs 250, and the lateral surface 194 includes positioning tabs 2 5 2. Finally, as shown in FIGS. 11 and 13, the housing 26 includes the extension groove element 2. 6 0, which extends laterally through the terminal receiving groove 2 0 1-2 0 8 (Figure 11) and extends between the front surface 172 and the rear surface 174 (Figure 13). As shown in the eleventh figure, the groove 260 includes a plurality of fastening pawls 262 on the top and bottom surfaces of the groove 260. See Figures 9 and 14 for a more detailed description of the plurality of electrical contacts 28. First, please refer to the fourteenth figure. The contact is defined as the module socket contact, and is formed by stamping a metal plate, so that a right-angle contact can be formed.

Page 13 569498 5. Description of the invention (9) Printed circuit board interconnection. Therefore, the contacts 2 8 have base portions 2 7 1 a-2 7 8 a, and these portions are changed in length due to well-known right-angle characteristics. These base portions 2 7 1 a-2 7 8 a are positioned in the individual channels 201a-208a of the housing (tenth figure). As shown in the fourteenth figure, the contact 28 also includes a plurality of reversely bent contact portions 2 7 1 b_ 2 7 8 b, which are reversely bent and extend obliquely backward away from the module socket housing 14. Front surface 1 7 2. These reverse curved sections 2 7 lb- 2 7 8 b extend over the included upright groove 20 lb-20 8 b to provide side alignment and are resiliently loaded. Thereafter, the contacts are converted into printed circuit board contacts 2 7 1 d-2 7 8 d as shown in the ninth figure, and extend beyond the lateral surface 192. When only one side of the connector housing 1 4 is exposed, I can understand that the contacts on both sides of the connector channel should be the same, but they are mirrored to each other, so the printed circuit board contacts such as 2 7 1 d-2 7 8d, it extends beyond the transverse surface 194, as shown in Figures 14 and 15. Referring to the sixteenth figure, the outer shield element 8 includes a box-shaped stamped metal ring enclosure formed by a top wall 290, a side wall 292, a front matching surface 294, a rear wall 296, and a lower wall 298. I understand that this mask is stamped and formed from a single metal plate in the preferred embodiment, but any mask can be used. Referring to the sixteenth figure, the rear wall 296 and the top wall 290 are shown connected together, and are already in a position to receive the housing 6, so they can rotate relative to the hinge connection 300. I can understand that the mask 8 is intended to be fixed on a printed circuit board, so the side wall 2 9 2 contains integrated printed circuit board teeth 302, the rear wall 296 contains a plurality of printed circuit board teeth 304, and the front wall 294 contains printed circuits Plate teeth 306 (nineteenth figure). I can also understand that the mask 8 is used to receive into the panel opening, so it contains a plurality of rebound fingers, like

Page 14 569498 V. Description of the invention (ίο) refers to the finger 308 integratedly connected to the top wall 290 and the finger 310 integratedly connected to the side wall 292. Furthermore, as shown in the nineteenth figure, the mask 8 includes a plurality of stamped openings 3 1 2 and 3 1 4, and these openings generally conform to the shapes of the openings 40 and 42 in the open casing 6 (fourth A diagram). ). Furthermore, the rear wall 296 (sixteenth figure) includes a plurality of horizontal grooves 3 1 6, which will be described in detail later. Referring to the seventeenth figure, the masking element 10 shown here includes a generally rectangular metal element 3 2 0, which has tabs 3 2 2 and 3 2 4 extending from the leading edge. Referring to the eighteenth figure, the masking element 3 3 0 shown here includes a rectangular metal element 3 3 2 which has ears 3 3 4 that are bent from the edge together with the foldable tab 3 3 6. For many components of the above combination, the combination of many components will be explained in more detail here. First, referring to the second figure, the connector element 24 is assembled first, so that the plurality of contacts are located in their respective channels, and the reversely bent contact portions extend through their respective grooves. As shown in the second picture, the plurality of printed circuit board contacts 2 7 1 d-2 7 8 d (ninth picture) will be positioned beyond the lateral surface 1 9 2, 1 9 4. At this time, many signal conditioning sub-combinations 16 are combined by positioning many components 2 2, 2 4 on or through the board 18 to cover the penetration holes 25. I can understand that the through hole 25 is a flat perforation, so that the printed circuit board contacts 2 7 1 d-2 7 8 d can be soldered to the through hole 25 to form an electrical connection. I can also understand that the penetrating holes 2 5 series are electrically connected to the conductive lines (not shown) of the board 18, and are then interconnected with the signal conditioning components 2 2, 2 4. Thereafter, these components are also interconnected to the plane penetrating holes 21 using conductive lines on the board 16. Thereafter, the right-angle contact 20 is interconnected to the through-hole 21, and it is preferable to electrically connect the contact 20 to the printed circuit board 18 by a soldering process. So I can understand that

569498 5. Description of the invention (11) Several modular socket contacts 2 8 are electrically connected to the right-angle contact 20 through the serially connected components 2 2, 2 4. The second diagram A shows a combination diagram of the module socket sub-combination 4. As shown, because of the low profile characteristics of the housing 26, especially above and below the surfaces 188, 190, there is ample space to accommodate the signal conditioning components. The module socket 4 can be completed by using a pair of insulating shields 3 3 0 in their corresponding grooves 2 6 0 and sliding the shields to a position adjacent to the front surface 17 2. For the modular socket subassembly, it can be inserted into the connector housing element 6. The aforementioned combination 4 is arranged in many recesses, so that the extension element 2 2 0 (ninth figure) can be aligned with the tapered groove 7 4, and at the same time, it can be aligned with many accompanying grooves 1 0 0, 1 1 6 The edge card 1 of the 8 edge (seventh picture). I can also understand that this will also locate the round wall part 2 4 0 in its corresponding opening 1 50 (seventh picture), and the protrusion 2 4 2 is positioned in the corresponding opening 1 5 2 . I can understand that when the module socket sub-assembly 4 is fully inserted into the housing 6, the oval-shaped thermoplastic tabs 2 3 0 extend through the corresponding openings 7 8 and beyond the front surface of the housing 6. In this way, these protrusions can be matched with the plastic material that melts to form the plastic head around the opening 1 6 (Figure 4A). 0 The masking element 1 0 can be installed in the middle of the adjacent module socket sub-assembly 4, so as to cover The cover 10 is aligned with the middle groove 1 1 2 (seventh figure) and also locates the extension 3 2 4 in the corresponding groove 1 4 0 (third A). At this time, the calibration plate 12 can slide to accept the adjacent sub-combination 4, so the hole 3 5 0 is the sliding receiving contact 20, and the hole 3 5 2 is sliding to the receiving protrusion 1 2 5 (third A) s position. I can understand that at this time, the shielding element 8 can accept the above-mentioned module socket 4 and the shell.

Page 16 569498

569498 5. Description of the invention (13) The device is matched to the connector combination 2. The conductors 20, 28 use a forming punch or a machine well known in the industry to form the desired shape. In particular, as far as the specific embodiment of the first figure is concerned, the first group of contacts 28 and 8 are deformed to produce parallel, right-angled planes, as described earlier. The second group of contacts 20 is deformed to produce the desired parallel, non-coplanar array, which is used to match with PCB / external devices, as shown in Figures 2 and A. Please also note that one or all of the above contact groups can form a notch (not shown) on their farthest end, so that the wires provided with the electronic component (such as thin wires around the magnetic signal conditioning element) can surround the notch separately Or in conjunction with welding or other joining techniques to provide tight electrical connections. Next, a circuit board 18 for the connector combination 2 is formed, and the aforementioned circuit board includes any penetrating holes 21 or holes. The method of forming a substrate is well known in the electronics industry and will not be described further here. Any conductive circuit on the substrate that needs special design is also added, so that when the individual contacts 20, 28 are located in the through hole, they will be connected to the circuit when needed. Next, a tissue plate 12 will be formed and a plurality of penetrating holes or holes 3 50 of a predetermined size will be formed thereon. The aforementioned holes are arranged in an array, each hole accepts one of the corresponding second contacts 20, and the holes of the tissue board are used to temporarily store and increase the mechanical stability of the second group of contacts 20. Alternatively, these holes may be formed at the same time as the tissue plate 12 itself is formed. Next, one or more electronic components 2 2, 2 4 will be formed and prepared (if used for design), such as the aforementioned signal conditioning devices. The manufacture and preparation of such electronic components are well known in the industry and will not be described further here. The aforementioned electronic components are then matched to the circuit board 18. Please note that if groups are not used

Page 18 569498 5. Description of the invention (14) The conductive path formed on / in the circuit board forms a conductive path between the first group of contacts 28 and one of the second group of contacts 20. Component 2 2, 2 4 can be selected as (i) received in a hole designed to receive the component part (for example for mechanical stability), (ii) like surface fixation or different bonding with adhesive or capsule The substrate, (iii) fixed in "free space" (that is, fixed at a fixed point by the tension generated on the electronic component wires when it is later terminated on the circuit board's conductive lines and / or contacts) or (iv) using Other ways are fixed in position. In the illustrated specific embodiment, the components 2 2, 2 4 are electrically coupled to P C B 1 8 using a fusible solder reflow process known in the industry. The electronic components 20 and 24 are optionally fixed with silicon capsules or other materials. The formed module socket contacts 28 are deposited in the individual grooves 2 0-2 0 8 of the housing element 26, so that the contacts are correctly positioned and aligned with the grooves, as shown in the ninth figure. Next, the appropriate end of the circuit board contact 20 is inserted into the circuit board 18, so when the circuit board is mated to the module socket sub-assembly 4, the contact from the contact array is perpendicular to the circuit board 18 Down projection, align the corresponding tissue plate 12 penetrating holes 3 50. The ends 2 7 1 d-2 7 8 d of the first contact 2 8 are respectively sunk to a predetermined depth in the hole 2 5 of the circuit board 18 and are selectively pasted (for example, soldered to the contact with fusible solder and surround the circuit) Board contact pads or circuits) to receive additional friction in the individual holes 25, and the holes must be slightly smaller to produce the aforementioned friction relationship. Still other aspects, the ends of contacts 2 8 can be gradually tapered, so that the phenomenon of gradually rubbing tight can be produced. Adjusting the degree of tapering can make the conductor

Page 19 569498 V. Description of the invention (15) It extends into the circuit board 18 (for example, depth). Next, as before, add the tissue board 12 to the module socket sub-combination 4, so that the end of the circuit board contact 20 is vertically downward from the sub-assembly through the penetration hole 3 5 of the tissue board 12 0. Next, insert the noise shielding component 3 3 0 horizontally into the combined module socket in the groove formed between the upper and lower module socket contact groups 28 in the sub-assembly 4. The completed module socket sub-assembly 4 is then inserted into the housing 6, so that each sub-assembly 4 enters its individual receiving area 70, and the positioning protrusions on the front surface 1 72 of the housing element 2 6 The 2 3 0 series is stuck in the corresponding opening 7 8 formed by the main connector housing 6. In addition, any insulating shield 10 used in the connector is inserted between the sub-combinations 4, as shown in the first figure. Finally, the positioning tab 2 30 is thermoplastic (that is, melted) in the cavity surrounding the opening 7 0: 1 6 6. In this case, the combination 4 is tightly fixed in the casing 6.

Page 569498 Brief description of the drawings [Simplified illustration of the drawings] The first diagram shows a connector assembly perspective view showing many components in an exploded view of the present invention; the second diagram is an enlarged perspective view connector assembly showing many components in an exploded view; Figure A is an enlarged perspective view of the connector assembly of the second figure, and the third perspective view of the main housing part;

Figure A is a partially enlarged perspective view of the main housing portion shown in Figure 3. Figure 4 is a front perspective view of the main housing portion. Figure 4A is a portion of the main housing portion shown in Figure 4. Sectional view; the fifth view is a front view of the housing shown in the third and fourth views; the sixth view is a bottom view of the housing shown in the fifth view; the seventh view is a view of the housing shown in the fifth view Rear view; Figure 8 is a cross-sectional view of line 8-8 of Figure 5; Figure 9 is a front perspective view of the module socket; Figure 10 is a top view of the connector housing without contacts in Figure 9 Figure 11 is a front view of the casing shown in Figure 10; Figure 12 is a side view of the casing shown in Figures 10 and 11;

The thirteenth figure is a cross-sectional view of line 13-13 of the tenth figure; the fourteenth figure is a top view of the module socket shown in the ninth figure; the fifteenth figure is the line 15-15 of the fourteenth figure A cross-sectional view; FIG. 16 is a rear perspective view of the outer cover shown in FIG. 1;

Page 21 569498 Brief description of the drawings Figure 17 is a perspective view of a side shield located between adjacent connector combinations; Figure 18 is a view of an insulating shield provided between module sockets through a contact array Plan view; Figure 19 is a front view of the complete assembly; Figure 20 is a lower plan view of the combination shown in Figure 19; Figure 21 is a side view of the combination of Figure 19, which has a flat plate opening Within the combination; and Figure 22 is a partial cross-section of the plan view after the combination shown in Figure 20. 〔Comparison explanation of main component symbols〕 2… Module socket 4… Module socket sub-combination 6… Housing 8… External cover 10 · • Insulation cover 12 · • Forming plate 14 · • Modular socket connector 16 · • Filter combination 18 • • circuit board 20 • • right-angle circuit board contacts 30 • • front mating surface 32 • • upper wall 34 • • lower wall

Page 22 569498 Brief description of drawings 36 ... Rear surface 38 ... End wall 40 ... Modular plug receiving opening 42 ... Modular plug receiving opening 44 ... Lower surface 46 ... Inner parallel side surface 48 ... Latch receiving groove 70 ... Module socket receiving area female

Page 23

Claims (1)

569498 VI. 1 · 2. 3. 4. Scope of patent application --- An electrical connector combination including a housing (26), including: a beam platform (17) with a front matching section (176). Section ( 186) and a pair of opposite side edges (192, 194Λ, // moxibustion platform area contacts (28) are carried by the aforementioned housing 'the aforementioned contacts H two columns' the contacts in each of the foregoing columns have along The matching contact part (271b-2 78b) and the circuit °° f (271d-278d) from the aforementioned front ^ fI are characterized by: & & & The circuit board connection section listed above the aforementioned contact It extends beyond one of the front edges, and the circuit board connection area J below the aforementioned contacts extends beyond the other side of Lishu, and is fixed on the aforementioned side and has a signal conditioning component (2 2, 2 4). The letter of the circuit board (丨 8), the second device (1 6), and the circuit board connection area that is electrically connected to the aforementioned contact # ° p For the electrical connector combination of the first scope of the patent application, go further & The outer casing (6) V ,, S with upper and lower plug receiving openings (40, 42), and the aforementioned casing (26) may be provided in Inside the aforementioned outer housing (6), the 0-row contact is listed in the upper plug receiving opening, and the front ^ = the following is positioned in the aforementioned lower plug receiving opening. The electrical connector combination is arranged on the point above the beam surface (丨 86) of the aforementioned beam-type platform (丨 1-2〇8), and the following contacts are arranged on the beam type = below The surface (190) is in a group of grooves (201-208). Σ, such as / shen, the electrical connector combination of item 3 of the patent, the point is formed to have a groove arranged in the aforementioned groove The module socket contacts of the inner base part ^ (2 7 1 a 2 7 8 a), and the aforementioned matching contact part 569498 6. Scope of patent application, points (271b-278b) extend from the aforementioned upper and lower surfaces by reverse bending. 5. For the electrical connector combination of the first scope of the application for a patent, wherein the contact tip (20) is connected to the aforementioned circuit board (18), and the aforementioned contact tip is transmitted through the printed circuit board and through The aforementioned signal conditioning components are interconnected to the aforementioned _ board connection section. 6. For the electrical connector combination of item 1 of the patent application scope, wherein the shielding element (332) is placed in a beam-type platform between the above-mentioned contacts and below the aforementioned contacts. Page 25