TW565708B - Micro-mirror structure and its manufacturing method, and spatial light modulator and its manufacturing method - Google Patents

Abstract

The present invention provides a micro-mirror structure and its manufacturing method, and spatial light modulator and its manufacturing method. The inventive micro-mirror structure includes: a transparent base having a first surface; a conductor layer formed on a partial surface of the transparent base; a supporting structure connected to a partial surface of the transparent base; and a deflectable element supported by the supporting structure and deflected to couple with the transparent base, wherein the deflectable element and the conductor layer have the same polarity of charge to resist the deflectable element to tilt down on the transparent base.

Description

565708 V. Description of the invention (1) 1 [Field of the invention] The present invention relates to a micro-electromechanical system (MEMS), and more particularly to a spatial light modulator (SLM) structure, and more particularly The invention relates to a structure of a spatial light modulator that can avoid deflectable element (ti It down) on a transparent substrate. [Known Technical Description] A spatial light modulator (SLM) is a converter that can modulate the incident beam of light in a spatial scheme through the input of light or electricity. For example, modulate the phase, intensity, polarity, or direct ion of incident light. Spatial light modulators use a variety of materials with magneto-optic, electro-optic, or elastic properties to modulate incident light. Spatial light modulators can be used in many areas, such as optical information processing, display systems, and electrostatic printing. In U.S. Patent No. 6,356,378 to Reflectivity, there is disclosed a dual-substrate reflective spatial light modulator (Double

Substrate Reflective Spatial Light Modulator). Furthermore, U.S. Patent No. 6,396,619 of the Reflectivity Company discloses that there is disclosed a dual-substrate reflective spatial light modulator structure with a stopping mechanism.

0503-8256TW; TSMC2002-0293; Jacky.ptd page 4 565708 5. Description of the invention (2) The f mechanism is used to increase the accuracy of the deflection angle. Please refer to FIG. 1. FIG. 1 is a cross-sectional view showing a cell structure of a conventional (US Patent No. 6 3 6 6 1 9) spatial light modulator. The symbol 100 is a micro-mirror structure. The symbol 11〇 is a transparent substrate. Symbol 120 is a mirror plate. Symbol 130 is an electrode formed on the mirror panel 120. The symbol 140 is a hinge support. The symbol 145 is a stopper formed at the top of the hinge pillar 14o. Symbol 150 is a semiconductor substrate. The symbol 16 is an attraction electrode. When a bias voltage is applied between the attraction electrode 160 and the electrode 130, an electrostatic force (FC electrostatic force) is generated so that the mirror panel 120 is biased toward the semiconductor substrate 150 at an angle $. In this way, as shown in Fig. I, the incident light 170 will be deflected. However, referring to FIG. 2, in the conventional micromirror structure 100, the mirror panel 120 of the conventional micromirror structure 100 may be tilted on a transparent substrate, and the mirror panel 120 may be The electrostatic adhesion force is attracted to the transparent substrate 110, so it will cause the error of the space light to make the controller, or the error of the space light tone 120. The above problem is generally solved. The geometric design of the panel 120 reduces the contact with the transparent substrate " 〇 when the mirror falls down, and the method of reducing the adhesion characteristics of the panel 20. Of course ... the product method or tilt_down issue of the antistatic plate μο fed by two or two materials. ..., King Wang avoids mirrors Overview of the invention:

565708

With this in mind, manufacturing methods can avoid the quality of work. The purpose of the present invention is to provide a micro-mirror structure and the problem of tilting of its mirror-free panel, and to ensure a spatial light modulation agency. Another object is to provide a spatial light modulator (slm) ::: manufacturing method, which can avoid Among them, the tilting of the mirror panel ensures the quality of the spatial light modulation operation. According to the above object, the present invention provides a micromirror structure including a transparent substrate having a first surface; a conductive layer formed on a portion of the transparent substrate and the first surface A support structure connected to the first surface of a portion of the transparent substrate; and a deflectable element supported by the support structure, and the deflective element is biasedly coupled to the transparent substrate. Wherein, the biased component has the same charge polarity as the conductor layer. A repulsive electric field is generated between the deflection element and the conductor layer due to the same charge polarity to resist the tilting element from tilting down on the transparent substrate. Furthermore, the present invention provides a spatial light modulator (SLM) structure including a first substrate having a first surface; a conductor layer formed on a portion of the first substrate and the first surface; and a deflection element (Def lectaMe element), which is biased to be coupled to the first substrate; and a second substrate, which is opposite to the first surface of the first substrate, the second substrate has an attraction electrode for biasing the first substrate Biasing components. Wherein, the deflection element has the same charge polarity as the conductive layer. And the deflection element and the conductor layer have the same

0503-8256TWF »TSMC2002-0293» Jacky.ptd Page 6 565708 V. Description of the Invention (4), a repulsive electric field generated by the polarity of the charge is used to resist (ti 11 down) the bias element Transparent substrate. Example: In the following detailed description, in order to facilitate the explanation of the differences between the present invention and the conventional one, descriptions of process examples will be described in the following paragraphs to avoid confusing the features of the present invention. In addition, the third figure below shows a part of a mirror array, that is, the actual mirror array system may include micro-structures of the present invention in a number of ways. The micromirror structure (m 丨 c r 〇-m Γ Γ Γ Γ Γ structure) sectional view shown in FIG. 3 is used below to explain the present invention. Referring to FIG. 3, a transparent substrate 31 is provided, which has a first surface 311 °, wherein the transparent substrate 310 is, for example, a quartz substrate or a heat-resistant glass substrate. Referring to FIG. 3, a conductive layer 320 is formed on the transparent substrate 31 0 and part of the first surface 311. The conductive layer 32 is a metal layer such as a copper layer or an aluminum layer. In addition, the conductor layer 32o is connected to a peripheral circuit (not shown) for providing electric charges to the conductor layer 32o. Referring to FIG. 3, a supporting structure 330 is connected to a portion of the first surface 31 i of the transparent substrate 310. A def lectable element 340 is supported by the supporting structure mo, and the deflectable element 340 is biasedly coupled to the transparent substrate 31. The supporting structure 330 is made of a conductive material, such as silicon nitride and aluminum. In addition, the supporting structure 3 30 is connected to a peripheral circuit (not shown), and is used to provide electric charges to the biasing element 34 through the supporting structure 33.

0503-8256TW; TSMC2002-0293; Jacky.ptd 565708 V. Description of the invention (5) " -------, Zhonghai deflection element 340 includes: a mirror plate (mirror plate) ^ connected to part of the support structure 330, and the mirror panel 342 is biased toward the coupling substrate = transparent substrate 31; and an electrode 344 is formed on part of the mirror panel. The mirror panel 342 is rigid, and is, for example, a laminate of a plurality of layers including silicon nitride and aluminum. In addition, the electrode 4 is a conductive layer such as a metal layer containing nitride nitride and aluminum. There is a charge that is transferred to the deflection element through the supporting structure 33. In addition, it is to be specifically explained here that the micromirror structure of the present invention also includes a method of directly using the mirror panel 342 as an electrode. The main feature of the present invention is that the electrode 344 (ie, the biasing element 34) has the same polarity of charge as the conductor layer 311 by the peripheral circuit; therefore, the electrode 344 and the conductor layer 311 have the same polarity. A repulsive electric field E generated by the polarity of the charges is used to resist and tilt down the transparent element 310 toward the element 340. Next, a demonstration example is used to describe the method for manufacturing the micromirror structure of the present invention, but it is not limited to the present invention. Fig. 4 is a flowchart showing the steps of the micromirror structure of the present invention. Figures 5A to 5C are perspective views showing part of the manufacturing process corresponding to the micromirror structure of the present invention corresponding to Figure 4. First, a transparent substrate 510, such as quartz or thermal glass, is provided. Then, step S410 is performed to deposit a metal thin film (not shown, for example, a 500A aluminum or copper layer) on the transparent substrate 5m. Next, step S420 'is performed to obtain a patterned metal thin film 51 through a photolithography etching process. Next, step S430 is performed to deposit a first sacrificial layer 512 (for example,

565708 V. Description of the invention (6) ----- 8000 A amorphous silicon layer) on a transparent substrate 51 and a metal film 5 ι. Thereafter, a planarization process is performed to flatten the surface of the first sacrificial layer. Next, step S440 is performed to deposit a mirror sheet (mirror laminate) (not shown) on the first sacrificial layer 512. The mirror sheet is, for example, a sandwich structure in which an aluminum layer is sandwiched by two layers of nitride nitride layers. The thickness of each silicon nitride layer is, for example, 1400 A, and the thickness of the aluminum layer is, for example, 70 (A). Next, step S450 is performed to pattern the mirror sheet to form a mirror plate 513. Please refer to FIG. 5A at this time, which shows the solid solid circle after step S450 is performed. Reference numeral 51 is a transparent substrate, reference numeral 511 is a metal thin film, reference numeral 512 is a first sacrificial layer, and reference numeral 513 is a mirror panel. It is to be noted here that in the ordinary manufacturing process of the spatial light modulator, the micromirror array is formed together and simultaneously. In order to simplify the illustration and description, other mirror panels are not shown here. Next, step S460 is performed to deposit a second sacrificial layer (not shown, for example, an amorphous silicon layer of 疋 4000 A) on the first sacrificial layer 512 and the mirror panel 513. After that, a planarization process is performed to planarize the surface of the second sacrificial layer. Next, step S470 is performed to obtain a patterned second sacrificial layer 514 through the lithography etching process to expose a part of the mirror panel 513, and simultaneously form holes 51 6,518 so that the next layer can be attached to On a transparent substrate. Please refer to FIG. 5B at this time, which shows a perspective view of the structure after step S470 is performed. Symbol 51 0 is a transparent substrate, symbol 511 is a metal thin film, symbol 512 is a first sacrificial layer, symbol 513 is a mirror panel, symbol 514 is a first sacrificial layer, and symbols 516 and 518 are through the first sacrificial layer 512 and the second sacrificial layer.

565708

The bottom of the holes 5 1 6 and 5 1 8 are exposed at the bottom of the transparent base layer 5 1 4 and the bottom of the hole 5 10 4. Next, step 5480 is performed to deposit a thin film of a hub and an electrode, 3 laminate (not shown) on the second The portion of the mirror panel 513 of the path of the sacrificial layer 514 and the holes 516 and 518 are filled in. The sheet with the electrode is, for example, a nitride layer including 500A and a tin layer of 50 ". After a long time, step S490 is performed to pattern the sheet of the hinge and the electrode to define the supporting structure of the mirror panel 513. 515 and electrodes 519 on the mirror panel 513. At this time, please refer to FIG. 5 (: figure, which shows a perspective view of the structure after performing step 49). Symbol 510 is a transparent substrate, symbol 511 is a metal thin film, and symbol 512 is the first. The sacrificial layer, symbol 513 is a mirror panel (not exposed), the symbol 514 is a second sacrificial layer, the symbol 515 is a support structure, and the symbol 519 is an electrode. It should be particularly noted that the electrode 519 is connected to the support structure 515 ' The supporting structure 515 is connected to the transparent substrate 51. Next, step S499 is performed to remove the sacrificial layers 512 and 514 by etching and release the mirror panel 513 and the electrode 519 (collectively referred to as a deflection element). The figure is as shown in Figure 3. Next, the micromirror structure obtained by the above steps can be combined with a semiconductor substrate with an attracting electrode and a circuit to form a light valve element similar to a sandwich structure (1 丨 6) 11 valve device). Among them, the manufacturing process of the semiconductor substrate with attracting electrodes and circuits has been disclosed in US Pat. No. 5,835,256 and related patents, so as not to confuse the features of the present invention, it will not be discussed. In addition, provided here will be The micromirror structure of the present invention is applied to a double substrate

565708 V. Description of the invention (8). A schematic diagram of the structure of the spatial light modulator, and as shown in Figure 6, what is explained here is that Figure 6 only shows the cell structure of the spatial light modulator with dual substrates, that is, the actual The spatial light modulator structure can include numerous cell structures. Please refer to FIG. 6 ', which provides a semiconductor substrate β with a CMOS, which has an attracting electrode 620 thereon. A transparent substrate 650 is provided, on which a deflection element 630 and a metal layer 640 are formed (that is, the stop mechanism structure of the present invention). Then, the semiconductor substrate 61 and the transparent substrate 650 are separated from each other by a spacer 6 70 and assembled into a dual-substrate spatial light modulator. The symbol 660 indicates incident light. In the present invention, a repulsive electric field is generated between the biasing element 630 and the metal layer 640 due to the same charge polarity (eg, negative electrical property), so as to resist the biasing element 63 from tilting down to Transparent substrate 650. [Features and Effects of the Case] The features and effects of the present invention are as shown in FIG. 3, and the peripheral circuit makes the electrode 344 and the conductor layer 311 have the same polarity of charge; therefore, the electrode 344 and There is a repulsive electric field E generated between the conductive layers 311 due to the same charge polarity to resist the tilt element 340 from tilting to the transparent substrate 3 1 0. Although the present invention has The above is disclosed in a preferred embodiment, but it is not intended to limit the invention. Any person skilled in the art can change and retouch without departing from the essence 2 and the scope of the present invention. Therefore, the scope of protection of the present invention is not limited. Subject to the scope of the attached patent application.

The part of the micromirror structure 565708 is briefly explained with the following drawings and preferred embodiments to explain the present invention in more detail. Fig. 1 is a cross-sectional view showing the cell structure of a conventional spatial light modulator; Fig. 2 is a diagram showing Schematic diagram of the disadvantages of the conventional micromirror structure when the mirror panel is poured on a transparent substrate; Figure 3 is a cross-sectional view showing the micromirror structure of the present invention; Figure 4 is a flowchart showing the steps of the micromirror structure of the present invention; Figures A ~ 5C are perspective views showing the manufacturing process corresponding to Figure 4 of the present invention; and Figure 6 is a schematic diagram showing the structure of the micromirror structure of the present invention. ^ Tuning symbol description of the conventional part (the first 1 ~ 100 ~ micromirror structure; 110 ~ transparent substrate; 120 ~ mirror panel; 130 ~ electrode; 140 ~ pivot support column; 145 ~ stopper; 150 ~ semiconductor substrate; 160 ~ attraction electrode; 170 ~ incident light; F ~ electrostatic force. Part of this case (Figures 3 ~ 6)

0503-8256TWF; TSMC2002-0293; Jacky.ptd

Page 12 565708 The diagram briefly explains 310, 510, 650 ~ transparent substrate; 3 11 ~ first side; 320, 511, 640 ~ conductor layer / metal film; 330,515 ~ support structure; 340,630 ~ biasing element; 342, 513 ~ mirror panel; 344, 519 ~ electrode, 512 ~ first sacrificial layer; 514 ~ second sacrificial layer; 51 6, 51 8 ~ holes; 610 ~ semiconductor substrate; 620 ~ attraction electrode; 660 ~ incident light; 670 ~ spacer; E ~ repulsive electric field.

0503-8256TWF; TSMC2002-0293; Jacky.ptd page 13

Claims (1)

565708 6. Scope of patent application 1. A micro-mirror structure including: a transparent substrate having a first surface; a conductor layer formed on a portion of the first surface of the transparent substrate; a A support structure connected to the first surface of a portion of the transparent substrate; and a deflectable element supported by the support structure, and the deflective element is biasedly coupled to the transparent substrate; wherein the biased element The element and the conductor layer have the same polarity of charge. 〇2. The micromirror structure described in item 1 of the patent application scope, wherein the deflection element and the conductor layer have the same charge polarity due to the same A repulsive electric field is generated to resist the biasing element from ti it down on the transparent substrate. 3. The micromirror structure according to item 1 of the scope of patent application, wherein the material of the transparent substrate is quartz or glass. 4. The micromirror structure according to item 1 of the scope of the patent application, wherein the deflection element includes: a mirror plate 'connected to a part of the branch structure, and the deflection surface of the 6 mysterious mirror panel is connected to the transparent substrate And an electrode formed on part of the mirror panel; wherein the electrode and the conductor layer have the same charge polarity. 5. The micromirror structure according to item 4 of the scope of the patent application, wherein the electrode and the conductor layer have a repulsive electric field due to the same charge polarity, which is used to resist the biasing element from falling over the transparent Substrate. 565708 6. Scope of patent application ^ — ----- ----- 6 总 总 The micromirror structure described in item 1 of the scope of patent application ‘where the guide bottle! 1 糸 Metal layer. Si js L is the micromirror structure described in item 6 of the scope of patent application, wherein the metal layer: the village quality includes copper or Shao. "The micromirror structure described in item 4 of the scope of patent application, wherein the panel comprises silicon nitride and aluminum. 9. The micromirror structure according to item 4 of the patent application, wherein the electrode system comprises silicon nitride and aluminum. 10 types of spatial light modulator (SLM) structures, including a first substrate with a first surface; a conductor layer formed on a portion of the first substrate on the first surface; Element (deflectable element), biasedly coupled to the first substrate; and a second substrate, opposite to the first surface of the first substrate, the second substrate has an attract ion electrode for The biasing element is biased; wherein the biasing element has the same polarity of charge as the conductor layer. 11 · The spatial light modulator structure described in item 10 of the scope of the patent application, wherein the polarizing element and the conductor layer have a repulsive electric field due to the same charge polarity to resist the resist The deflection element is tilted down on the transparent substrate. 1 2 · The structure of the spatial light modulator as described in item 10 of the scope of patent application 0503-8256TWF; TSMC2002-0293; Jacky.ptd page 15 565708 'Wherein the first substrate is a transparent substrate. 13. The spatial light modulator structure according to item 10 of the scope of the patent application, wherein the first substrate is a quartz or glass substrate. 14. The spatial light modulator structure described in item 10 of the scope of patent application, wherein the deflection element includes: a mirror plate, which is deflectedly coupled to the first substrate, and-, an electrode formed on Part of the mirror panel; where 'the electrode and the conductor layer have the same charge polarity. 15. The spatial light modulator structure described in item 14 of the scope of the patent application 'wherein' the electrode and the conductor layer have a repulsive electric field due to the same charge polarity, to resist the deflection of the biasing element On the _ base. 16 · The spatial light modulator structure described in item 10 of the scope of patent application, wherein the conductor layer is a metal layer. 17. The spatial light modulator structure described in item 16 of the scope of patent application, wherein the material of the metal layer includes copper or aluminum. 1 8 · The spatial light modulator structure described in item 4 of the scope of the patent application ′, wherein the mirror panel comprises silicon nitride and aluminum. 19 · The spatial light modulator structure described in item 4 of the patent application scope, wherein the electrode system comprises silicon nitride and aluminum. 20. The spatial light modulator structure as described in item 10 of the scope of patent application, wherein the second substrate is a semiconductor substrate. 21 · —Manufacturing of a micro-mirror structure 0503-8256W: TSMC2002-0293; Jacky.ptd page 16 565708 The method includes the steps of: providing a transparent substrate having a first surface; forming a conductor layer on the first surface of a portion of the transparent substrate; forming a supporting structure and connecting a portion of the transparent substrate to the transparent substrate; First side: forming a deflectable element (deflectable element) on a transparent substrate; wherein the deflective element is supported by the support structure; and the deflectable element and the conductor layer have the same charge polarity (Polarity of charge). 22. The manufacturing method of the micromirror structure as described in item 21 of the scope of patent application ^ wherein 'the deflection element and the conductor layer have a repulsive electric field caused by the same charge electrode II to resist (resist ) The deflection element is tilted down on the transparent substrate. 23. The manufacturing method of the micromirror structure according to item 21 of the scope of the patent application, wherein the step of forming the deflection element includes: forming a mirror panel and connecting to a part of the supporting structure; and the mirror The panel is biasedly coupled to the transparent substrate; an electrode is formed on a part of the mirror panel; and the electrode and the conductor layer have the same charge polarity. 24. The method for manufacturing a micromirror structure according to item 23 of the scope of the patent application, wherein the electrode and the conductor layer have a repulsive electric field due to the same charge polarity to resist the deflection of the biasing element. In this Suiming base. 0503-8256TW; TSMC2002-0293; Jacky.ptd 565708 6. Scope of patent application * 25. Manufacturing methods of a spatial light modulator (SLM) structure, the steps include: providing a first substrate, the first The substrate has a first surface; a conductor layer is formed on a portion of the first substrate on the first surface; a defiectable element is formed to be biasedly coupled to the first substrate; a second substrate is provided opposite to the first substrate; The first side of the first substrate, the first substrates having an extraction electrode for biasing the biasing element; and Make the deflection element and the conductor layer have the same charge polarity, 2 6. Manufacture of the spatial light modulator structure as described in item 25 of the scope of application for patent: Method 'wherein' between the deflection element and the conductor layer A repulsive electric field generated by the same force and polarity is used to resist (old ... the deflection element is ti 11 down) on the transparent substrate. Low; forming an electrode on part of the mirror panel; making the electrode and the conductor layer the same , And the same polarity. The spatial light modulator structure described above has a repulsive electric field between the conductor layers due to the same ′ to resist the polarity of the charges tilted by the biasing element, 0503-8256TWF; TSMC2002-0293; Jacky.ptd Page 18 565708 6. Scope of patent application Pour on the first substrate. 2 9. The method for manufacturing a spatial light modulator structure according to item 25 of the scope of the patent application, wherein the first substrate is transparent quartz or glass. 30. The method for manufacturing a spatial light modulator structure according to item 25 of the scope of the patent application, wherein the second substrate is a semiconductor substrate. 0503-8256TWF; TSMC2002-0293; Jacky.ptd page 19