555828 A7 _B7 ϊ 五、發明說明（） 發明背暑 (請先閱讀背面之注意事項再填寫本頁) 本發明係關於印刷電路，更特別地偽關於一種製造多 層印刷電路之方法。 由於在電子裝置中對於更加保留重童與空間之需求增 加，現在主要使用含一或更多個電路内層之印刷電路。 在多層印刷電路之典型製造中，首先藉由以光阻依所 需電路圖樣之正像將銅箔-鎘介電基質材料圖樣化，繼 而蝕刻暴露之銅之製程製備圖樣化電路内層。在去除光 阻時，保留所需之銅電路圖樣。 藉由將一或更多個部份固化介電基質材料層（所謂之 ”預浸料”層）插入電路内層之間以形成電路内層與介電 基質材料交錯之複合物，而將任何特定型式之電路圖樣 之一或更多個電路内層及組成接地面與電源面之電路内 層組合成多層電路。此複合物然後接受熱及壓力以將 部份固化基質材料固化及得到電咤内層之黏合。如此固 化之複合物然後具有許多鑽穿之穿孔，其然後金屬化以 提供導電地交連所有電路層之工具。在穿孔金屬化製程 時期，-般亦在多層複合物之面外層上形成所需之電路 經濟部智慧財產局員工消費合作社印製 層附像他 面上成其 表其可到 或在佈得 加，塗而 附始地件 由開複元 經質重路 為基上電 法性板之 方電路他 代導電其 替非在上 之以由鍍 成術藉上 形技。層 板些件塗 路這元像 電。路成 刷術電可 印技上在 C 層路鍍及 樣多電地層 C 圖合加塗層 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 555828 A7 B7___ 五、發明說明（2 ) (請先閱讀背面之注意事項再填寫本頁) 長久以來已知，在電路内層之銅金屬及與之接觸之硬 化預浸體層或其他非導電性塗層之間形成之黏著劑黏合 強度仍待改進，結果固化之多層複合物或塗層在後續之 處理及或使用時易於脫離。關於此問題，此技藝發展在 電路内層之銅表面（在將其與預浸體層組合成多層複合物 之前）上形成銅氣化物層之技術，如藉由化學氣化銅表面 。關於此點（所謂之”黑氣化物”黏著促進劑），最早之努 力在最終多層電路中電路内層對介電基質層之黏合比由 不提供銅氧化物所得到者産生一些些微之改良。黑氧化 物技術之後續變化包括其中首先在銅表面上製造黑氣化 物塗層，繼而以15¾硫酸將黑氧化物沈積後處理以製造 π紅氣化物π作為黏著促進劑之方法，如A . G . 0 s b 〇 r n e 之π用於内層還原氧化物之替代路徑nPC Fab, 1 9 8 4年8月 ，及涉及直接形成紅氣化物黏著促進劑之變化所掲示， 其得到不同程度之成功。此技藝之最顯著改良以Landau 之美國專利4, 409, 037及4, 844, 981為代表，其教示均在 此全部包括作為參考，其涉及由相當高氣酸鹽/相當低苛 性銅氧化組成物形成之氧化物，並且對電路内層黏著産 生實質上改良之結果。 經濟部智慧財產局員工消費合作社印製 如前所示，組合及固化之多層電路複合物具有穿孔， 其然後需要金屬化以作為導電地交連電路之電路層之工 具。穿孔之金屬化涉及孔表面之樹脂去污、催化活化、 無電銅沈積、電解銅沈積等之步驟。許多這些製程步驟 涉及使用可溶解暴露於穿孔或接近之電路内層部份上之 -4 一 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 555828 經濟部智慧財產局員工消費合作社印製 A7 B7__ 五、發明說明（3 ) 銅氧化物黏著促進劑塗層之介質，如酸。此種銅氧化物 之局部溶解，其由穿孔附近之粉紅璟或鹵（由於因而暴露 之下層銅金屬之粉紅色）證明，可依序造成多層電路之局 部脫離。 此技藝已知此種”粉紅環”現象，並且已對尋求得到不 易造成此種局部脱離之多層印刷電路製造法花費廣泛之 努力。一種建議之方法已提供厚層之黏著促進銅氧化物 以在後續之處理中僅藉所存在銅氧化物之微薄體積阻礙 此種溶解。然而，其證明為重大地反效果，因為較厚之 氣化物塗層作為黏著促進劑本質固有地較無效。其他有 關組合多層複合物之壓製/固化條件之最適化之建議僅獲 得有限之成功。 此問題之其他方法涉及在將電路内層與預浸體層組合 成多層複合物之前將銅氧化物黏著促進劑塗層後處理。 例如，C 〇 r d a n i之美國專利4 , 7 7 5 , 4 4 4掲示一種方法，其 中首先提供具有銅氧化物塗層之電路内層之銅表面，然 後在電路内層加入多層組合件之前以鉻酸水溶液接觸之 。此處理用以安定及/或保護銅氣化物不溶於在後組處理 步驟（例如，穿孔金屬化）中遭遇之酸性介質，因而使粉 紅環/脱離可能性最小。555828 A7 _B7 ϊ 5. Description of the invention () The invention of the summer (please read the precautions on the back before filling out this page) This invention is about printed circuits, and more specifically, a method for manufacturing multilayer printed circuits. Due to the increased demand for more reserved child and space in electronic devices, printed circuits with one or more inner layers of circuits are now mainly used. In a typical manufacturing of a multilayer printed circuit, a patterned circuit inner layer is first prepared by patterning a copper foil-cadmium dielectric matrix material with a photoresist in accordance with a positive image of a desired circuit pattern, and then etching the exposed copper. When removing the photoresist, keep the required copper circuit pattern. By inserting one or more layers of partially cured dielectric matrix material (so-called "prepreg" layers) between the inner layers of the circuit to form a composite of the inner layer of the circuit and the dielectric matrix material interlaced, any particular type One or more of the circuit inner layers of the circuit pattern and the inner layer of the circuit constituting the ground plane and the power plane are combined into a multilayer circuit. This composite is then subjected to heat and pressure to cure the partially cured matrix material and obtain adhesion to the inner layer of the electrode. The composite so cured then has a number of drilled through-holes, which are then metallized to provide a means for conductively interconnecting all circuit layers. During the perforated metallization process, the necessary circuits are usually formed on the outer layer of the multilayer composite. The printed layer of the employee's consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is attached to the surface as if it can be reached in Budega. The Tu Erfu ground piece is based on the square circuit of the electrical legal board on the basis of Kaifuyuan Jingyi heavy road, which conducts electricity instead of the upper one, and uses the plating technique to borrow the shape technique. Some pieces of laminate are coated with electricity. Lucheng brush technique electroplating technology on the C layer road plating and sample multi-electric stratum C drawing combined coating This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) 555828 A7 B7___ V. Invention Note (2) (Please read the precautions on the back before filling out this page) It has been known for a long time that the adhesive formed between the copper metal on the inner layer of the circuit and the hardened prepreg layer or other non-conductive coating that is in contact with it. Adhesive strength still needs to be improved. As a result, the cured multi-layer composite or coating is easy to detach during subsequent processing and / or use. Regarding this problem, this technique develops a technique for forming a copper vaporized layer on a copper surface of an inner layer of a circuit (before combining it with a prepreg layer to form a multilayer composite), such as by chemically vaporizing the copper surface. Regarding this point (the so-called "black gaseous" adhesion promoter), the earliest efforts to improve the adhesion ratio of the inner layer of the circuit to the dielectric matrix layer in the final multilayer circuit resulted in a slight improvement from the one obtained without copper oxide. Subsequent changes in black oxide technology include a method in which a black gaseous coating is first produced on a copper surface, and then black oxide is deposited and treated with 15¾ sulfuric acid to produce π red gaseous π as an adhesion promoter, such as A.G. 0 sb 〇rne π is used as an alternative pathway for the inner layer of reduced oxides nPC Fab, August 1984, and the changes involving the direct formation of red gaseous adhesion promoters have been shown to achieve varying degrees of success. The most significant improvement of this technique is represented by Landau's U.S. Patent Nos. 4,409,037 and 4,844,981, the teachings of which are hereby incorporated by reference in its entirety and involve a composition consisting of a relatively high gas acid salt / a relatively low caustic copper oxide Oxides formed by the metal and substantially improve the adhesion to the inner layer of the circuit. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs As shown previously, the assembled and cured multilayer circuit composite has perforations, which then need to be metallized as a tool to electrically connect the circuit layers of the circuit. The metalization of the perforation involves the steps of resin decontamination, catalytic activation, electroless copper deposition, electrolytic copper deposition, etc. on the surface of the hole. Many of these process steps involve the use of -4 on the inner layer of a circuit that is soluble and exposed to perforations or close to it. A paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm). Cooperative printed A7 B7__ 5. Description of the invention (3) Copper oxide adhesion promoter coating medium, such as acid. The local dissolution of this copper oxide, as evidenced by the pink tincture or halogen near the perforations (as a result of exposing the pink of the underlying copper metal), can lead to partial disengagement of the multilayer circuit in sequence. This technique is known of such a "pink ring" phenomenon, and extensive efforts have been made to find a multilayer printed circuit manufacturing method that does not easily cause such partial detachment. One proposed method has provided a thick layer of adhesion-promoting copper oxide to hinder such dissolution in subsequent processing by the small volume of copper oxide present. However, it proved to be a significant counter-effect, as thicker gaseous coatings are inherently less effective as adhesion promoters. Other suggestions for the optimization of the compression / curing conditions of the combined multilayer composites have had only limited success. Other approaches to this problem involve the post-treatment of a copper oxide adhesion promoter coating prior to combining the inner layer of the circuit and the prepreg layer into a multilayer composite. For example, U.S. Patent No. 4,775,44,4 to Cordani shows a method in which a copper surface of an inner layer of a circuit having a copper oxide coating is first provided, and then an aqueous solution of chromic acid is added before the inner layer of the circuit is added to the multilayer assembly. Touch it. This treatment is used to stabilize and / or protect the copper gaseous compounds from the acidic medium encountered in subsequent processing steps (for example, perforated metallization), thereby minimizing the possibility of pink rings / detachment.
Akahoshi等人之美國專利4,642，161、Nakaso等人之美 國專利4,902,551、及Kajihara等人之美國專利4,981，560 ，及許多其中所列之參考資料，有關其中在將電路内層 加入多層電路組合件之前，首先處理電路内層之銅表面 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ------------------：----訂"-----------AW1 (請先閱讀背面之注意事項再填寫本頁) 555828 A7 B7____ 五、發明說明（4 ) (請先閱讀背面之注意事項再填寫本頁) 以提供黏著促進銅氧化物之表面塗層之方法。然後使用 特定之還原劑及條件將如此形成之銅氣化物還原成金屬 銅。結果，使用此種電路内層之多層組合件不出現粉紅 璟形成，因為在後續之穿孔處理未出現銅氧化物之局部 溶解及下層銅之局部暴露。然而，如同其他之技術，此 型之方法關於在介電基質層與金屬銅電路内層之間得到 之黏著性受到懷疑。其在這些還原製程中特別明顯，因 為電路黏合表面不僅有金屬銅，亦存在特異相之金屬銅 (即，在（2 )銅箔之銅上之（1 )得自銅氧化物還原之銅）， 其趨於沿相邊界分離/脫離。 經濟部智慧財產局員工消費合作社印製U.S. Patent No. 4,642,161 to Akahoshi et al., U.S. Patent No. 4,902,551 to Nakaso et al., And U.S. Patent No. 4,981,560 to Kajihara et al., As well as many of the references listed therein, regarding the application of the inner layers of a circuit to a multilayer circuit assembly First, treat the copper surface of the inner layer of the circuit. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ------------------: ---- Order " ----------- AW1 (Please read the notes on the back before filling this page) 555828 A7 B7____ V. Description of the invention (4) (Please read the notes on the back before filling this page ) To provide a surface coating that promotes adhesion to copper oxides. The copper gas thus formed is then reduced to metallic copper using specific reducing agents and conditions. As a result, the multilayer assembly using the inner layer of such a circuit does not show pink pimple formation because local dissolution of the copper oxide and local exposure of the underlying copper did not occur in the subsequent perforation process. However, like other technologies, this type of method is questionable regarding the adhesion obtained between the dielectric substrate layer and the inner layer of the metal copper circuit. It is particularly obvious in these reduction processes, because not only metal copper but also metal copper with a specific phase exists on the circuit bonding surface (ie, (1) copper obtained from copper oxide reduction on (2) copper foil) It tends to separate / detach along the phase boundary. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs
Adler之美國專利4,997, 722及4, 997, 516類似地涉及在 電路内層之銅表面上形成銅氣化物，繼而以指定之還原 溶液處理以將銅氧化物還原成金屬銅。特定部份之銅氧 化物顯然不被直接還原成金颶銅（而是還原成水合氣化銅 或氫氧化亞銅），而且這些物種然後溶解於不侵蝕或溶解 已還原成金屬銅之部份之非氧化酸。如此，使用此種電 路内層之多層組合件不出現粉紅環形成，因為在後績之 穿孔處理未出現銅氣化物之局部溶解及下層銅之局部暴 露。然而，再度發生關於在介電層與金屬銅電路内層之 間之黏著性之問題，其首先因為黏合表面為金屬銅，其 次因為金屬銅主要以特異相（即，在（2 )銅箔之銅上之（1 ) 得自銅氧化物還原之銅）存在，一種趨於沿相邊界分離/ 脱離之狀況。 F e r r i e r等人之美國專利5，2 8 9，6 3 Q，其教示在此全部 -6 - 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 555828 A7 B7 五、發明說明（7 ) (請先閱讀背面之注意事項再填寫本頁) 造徹粗化轉化塗覆表面。製造之表面恃別適合以聚合材 料黏合，因為得到比未處理金屬表面大為增加之黏著性 值。此外，轉化塗覆（經處理）金屬表面隨時間保持增加 之黏著性且隨時間降低金屬與聚合材料之間發生任何不 欲反應之可能性。 提議之方法特別適合多層印刷電路板之製造。因此， 在本申請案中，以在此提議之黏著促進組成物處理内層 之金屬電路（通常為銅）。在處理後，繼而以水清洗，内 層以如預浸體或可成像介電體之聚合材料黏合在一起， 生成多層印刷電路板。 被處理之金屬表面可包括許多種金屬，如銅、銅合金 、鎳與鐵。然而，本發明之方法在金屬表面包括銅或銅 合金時産生最佳結果。聚合材料可為許多種聚合材料， 其包括預浸體材料、可成像介電體、可照相成像樹脂、 焊罩、黏著劑或聚合蝕刻光阻。 經濟部智慧財產局員工消費合作社印製 用於黏著促進組成物之氧化劑可包括任何可在黏著促 進組成物基質中氧化金屬表面之氧化劑。發明人已發現 ，過氧化氫與過硫酸鹽為用於本發明方法之特佳氧化劑 ，以過氧化氫為最佳之氧化劑。黏著促進組成物中之氣 化劑濃度範圍為每公升2至60克，但是較佳為每公升3至 30克。 用於黏著促進組成物之酸可為任何在基質中安定之酸 ，然而，發明人已發現，礦物酸特佳。硫酸特佳。黏箸 促進組成物中之酸濃度範圍為每公升5至3 6 0克，但是較 一 9 - 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 555828 A7 _B7_ 10 五、發明說明（） (請先閱讀背面之注意事項再填寫本頁) 商標銷售之環氧乙烷聚合物或環氧乙烷-環氧丙烷共聚物 亦特別有用。黏著促進組成物中之水溶性聚合物濃度範 圍為每公升1至15克，但是較佳為每公升3至6克。 因此，黏著促進組成物應含酸、氧化劑與腐蝕抑制劑 。較佳為，組成物亦包括在此所述之在1-位置具電子吸 引基之苯并三唑或腐蝕抑制劑可為在1-位置具電子吸引 基之苯并三唑。在任一情形，組成物較佳為亦包括在此 所述之黏著性增強物種，不論是否使用在1-位置具電子 吸引基之苯并三唑。 金屬表面可以許多種方式以黏著促進組成物處理，其 包括浸漬、噴灑或浸泡。處理時黏著促進組成物之溫度 範圍為8 G °F至1 5 0 °F，但是較佳為9 0 °F至1 2 0 °F。處理時 間視處理之溫度及方法而不同，但是範圍為15秒至15分 鐘，而且較佳為1至2分鐘。 以下之實例為本發明之描逑且不應視為限制： 在以下所有之實例中，使用以下之循環處理銅鎘片及 銅箔： 鐘 分 /( 間 時 酸 硫 經濟部智慧財產局員工消費合作社印製 洗 清 水 5%冷 洗克 F— 2 清{ 水浸 冷預 % 唑F 三0° 并,7 苯2) 之20 升Η 公 ％ 12 2 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 555828 A7 _B7__ 11 五、發明說明（） 試驗溶液 1 冷水清洗 1 強力風乾 1 奮例1-15 製備含2體積％之硫酸（98重量％)、0·75體積％之50重 量％過氧化氫、4克/公升之苯并三唑且其餘為水之基本 黏箸促進溶液。對於各實例，將以下表I所示之羥基苯 并三唑水合物及鉬酸之量加入以上之基本溶液中，並且 在各情形在各實例所示之溫度使用指定之試驗溶液經上 示之標準循璟處理銅箔與Η 〇各實例得到之外觀示於以 下表I。 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 555828 A7 B7 12 五、發明說明（） 經濟部智慧財產局員工消費合作社印製 表I 實 例 卜羥基苯并 三唑水合物 鉬酸 溫度 外觀 1 〇 g/L 0 fflg/L 10 0°F 不均勻暗粉紅色 2 1 g/L 0 ing/L 10 0°F 不均勻暗粉紅色 3 2 g/L 0 -mg/L 10 0°F 均勻暗粉紅色 4 3 g/L 0 mg/L 10 0°F 均勻暗粉紅色 5 3 g/L 0 fflg/L 110T 不均勻非常暗粉紅色 6 3 g/L 0 mg/L 12 0°F 均勻暗粉紅色 7 3 g/L lOmg/L 10 0°F 不均勻暗粉紅色 8 3 g/L 1 0 mg/L 110°F 均勻非常暗棕色 9 3 g/L lOmg/L 12 0°F 均勻暗棕色 10 3 g/L 2 0 mg/L 10 0°F 均勻非常暗棕色 11 3 g/L 20mg/L 110°F 均勻暗棕色 12 3 g/L 20mg/L 12 0°F 均勻暗棕色 13 3 g/L 3 0 mg/L 10 0°F 均勻棕色 14 3 g/L 30mg/L 110°F 均勻暗棕色 15 3 g/L 30mg/L 12 0°F 均勻非常暗棕色 -14 一 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 555828 A7 _U_B7_ 五、發明說明（） 在處理後，片及箔在2 3 G °F烘烤3 Q分鐘，然後使用N E L C 0 N4205-2 B Stage(FR-4)(得自 NELCO 公司）在 350 °F 及每平 合 層 力 壓 磅 鐘 分 璃之 玻量 8 2 過 6 7 除 之去 間且 之條 璃之 2 玻寬 时80时 英10英 方片一 在形 夾以 片像 一顯23 括片在 包將片 Θ S ，之 ta後條 -S合成 B層。 ο Λ®U.S. Patent Nos. 4,997,722 and 4,997,516 to Adler similarly relate to the formation of copper vapors on the copper surface of the inner layer of a circuit, followed by treatment with a designated reducing solution to reduce copper oxide to metallic copper. Certain portions of the copper oxide are obviously not directly reduced to gold hurricane (but to hydrated gasified copper or cuprous hydroxide), and these species are then dissolved in areas that do not erode or dissolve the portions that have been reduced to metallic copper. Non-oxidizing acid. In this way, the multilayer assembly using the inner layer of this circuit does not show pink ring formation, because the local dissolution of copper vapors and the local exposure of the underlying copper did not occur in the subsequent punching process. However, the problem of adhesion between the dielectric layer and the inner layer of the metal copper circuit occurred again, firstly because the bonding surface was metal copper, and secondly because metal copper was mainly in a specific phase (ie, copper in (2) copper foil). The above (1) copper derived from copper oxide) exists, a condition that tends to separate / detach along the phase boundary. US Patent 5, 2 8 9, 6 3 Q of Ferrier and others, the teachings of which are all here-6-This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 555828 A7 B7 V. Invention Note (7) (Please read the precautions on the back before filling out this page) Completely roughen the coated surface. Manufactured surfaces are not suitable for bonding with polymeric materials, as they give a significantly increased adhesion value over untreated metal surfaces. In addition, conversion-coated (treated) metal surfaces maintain increased adhesion over time and decrease the likelihood of any unwanted reactions between the metal and the polymeric material over time. The proposed method is particularly suitable for the manufacture of multilayer printed circuit boards. Therefore, in this application, the metal circuit (usually copper) of the inner layer is treated with the adhesion promotion composition proposed herein. After processing, it is then washed with water, and the inner layers are bonded together with a polymeric material such as a prepreg or an imageable dielectric to form a multilayer printed circuit board. The treated metal surface can include many metals, such as copper, copper alloys, nickel and iron. However, the method of the present invention produces the best results when the metal surface includes copper or a copper alloy. The polymeric material can be a variety of polymeric materials, including prepreg materials, imageable dielectrics, photoimageable resins, solder masks, adhesives, or polymeric etch photoresists. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The oxidant used for the adhesion promotion composition may include any oxidant which can oxidize the metal surface in the adhesion promotion composition matrix. The inventors have found that hydrogen peroxide and persulfate are particularly preferred oxidants for use in the method of the present invention, and hydrogen peroxide is the most preferred oxidant. The gasification agent concentration in the adhesion promoting composition ranges from 2 to 60 grams per liter, but preferably from 3 to 30 grams per liter. The acid used for the adhesion-promoting composition may be any acid stable in the matrix, however, the inventors have found that mineral acids are particularly preferred. Very good sulfuric acid. The acid concentration in the adhesion promotion composition ranges from 5 to 360 grams per liter, but it is more than 9-this paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 555828 A7 _B7_ 10 Description of the Invention () (Please read the notes on the back before filling out this page) Ethylene oxide polymers or ethylene oxide-propylene oxide copolymers sold under the trademark are also particularly useful. The concentration of the water-soluble polymer in the adhesion promoting composition ranges from 1 to 15 grams per liter, but preferably from 3 to 6 grams per liter. Therefore, the adhesion promoting composition should contain an acid, an oxidizing agent, and a corrosion inhibitor. Preferably, the composition also includes a benzotriazole having an electron attracting group at the 1-position or the corrosion inhibitor described herein may be a benzotriazole having an electron attracting group at the 1-position. In either case, the composition preferably also includes the adhesion-enhancing species described herein, whether or not benzotriazole having an electron-attracting group at the 1-position is used. Metal surfaces can be treated with adhesion promoting compositions in a number of ways, including dipping, spraying or dipping. The temperature of the adhesion promoting composition during processing ranges from 8 G ° F to 150 ° F, but preferably from 90 ° F to 120 ° F. The processing time varies depending on the processing temperature and method, but ranges from 15 seconds to 15 minutes, and preferably from 1 to 2 minutes. The following example is a description of the present invention and should not be considered as a limitation: In all of the following examples, the following cycles are used to treat copper-cadmium flakes and copper foil: minutes / (Timely acid and sulfur economy Intellectual Property Bureau staff consumption Cooperative prints clean water 5% cold wash gram F— 2 clear {cold immersion in water% azole F 30 ° Benzene, 7 benzene 2) of 20 liters Η% 12 2 This paper size applies Chinese National Standard (CNS) A4 Specifications (210 X 297 mm) 555828 A7 _B7__ 11 V. Description of the invention () Test solution 1 Cold water cleaning 1 Strong air drying 1 Fen example 1-15 Preparation of 2% sulfuric acid (98% by weight), 0.75% by volume 50% by weight of hydrogen peroxide, 4 g / L of benzotriazole and the rest is a basic adhesion promoting solution of water. For each example, add the amounts of hydroxybenzotriazole hydrate and molybdic acid shown in Table I below to the above basic solution, and in each case use the specified test solution at the temperature shown in each example as shown above. The appearance obtained by the standard cycle treatment of copper foil and aluminum alloy is shown in Table I below. (Please read the notes on the back before filling out this page) The paper size printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 555828 A7 B7 12 V. Description of the invention () Table I printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economics Example temperature appearance of hydroxybenzotriazole hydrate molybdic acid 1 〇g / L 0 fflg / L 10 0 ° F Uneven dark pink 2 1 g / L 0 ing / L 10 0 ° F Uneven dark pink 3 2 g / L 0 -mg / L 10 0 ° F Even dark pink 4 3 g / L 0 mg / L 10 0 ° F Even dark pink 5 3 g / L 0 fflg / L 110T uneven very dark pink 6 3 g / L 0 mg / L 12 0 ° F even dark pink 7 3 g / L 10mg / L 10 0 ° F uneven dark pink 8 3 g / L 1 0 mg / L 110 ° F evenly dark brown 9 3 g / L 10 mg / L 12 0 ° F even dark brown 10 3 g / L 2 0 mg / L 10 0 ° F even dark brown 11 3 g / L 20mg / L 110 ° F Even dark brown 12 3 g / L 20mg / L 12 0 ° F Even dark brown 13 3 g / L 3 0 mg / L 10 0 ° F Even brown 14 3 g / L 30mg / L 110 ° F Even dark brown 15 3 g / L 30mg / L 12 0 ° F Even very Brown-14 I (Please read the precautions on the back before filling this page) This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 555828 A7 _U_B7_ V. Description of the invention () After processing, the sheet And foil were baked at 2 3 G ° F for 3 Q minutes, then using NELC 0 N4205-2 B Stage (FR-4) (available from NELCO) at 350 ° F and pressing force per lamination. Glass volume 8 2 through 6 7 Divide the time and the number of the glass 2 when the width is 80 hours British 10 British square film one clip in the shape of a picture 23 display the film in the package Θ S, -S Synthesis B layer. ο Λ®
烘 T 兩成 小樹告 及 十 零 漬 浸 中 錫 焊 度 強 之 合 黏 脂 樹 對 0 量 測 5 5 而 在條 後箔 然除 ， 条 時脂 秒 藉 2 自 烤由 報 31/ 身 結 且 而 表 下 以 於 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 555828 A7 B7 14 五、發明說明（） 經濟部智慧財產局員工消費合作社印製 表II 實 外觀 焊接後之 剝除強度焊 剝除強度焊 剝除強度焊 例 外觀 錫中0秒 錫中10秒 錫中20秒 1 不均勻暗粉 不均勻暗粉 3.5磅/吋 3.2磅/吋 3.8磅/吋 紅色 紅色 2 不均勻非常 不均勻非常 4.2磅/时 3.8磅/吋 3.8磅/吋 暗粉紅色 暗粉紅色 3 均勻棕/ 均勻棕/ 4.8磅/时 4.5磅/吋 4.2磅/吋 粉紅色 粉紅色 4 均勻棕/ 均勻棕/ 5.5磅/吋 5.0磅/吋 5.0磅/吋 粉紅色 粉紅色 5 均句暗掠粉 均勻暗棕粉 6.0磅/时 4.8磅/时 4.8確/吋 6 均勻暗棕粉 均勻暗棕粉 3.0磅/吋 2.0磅/时 1.8磅/吋 7 均勻暗棕粉 均勻暗棕粉 5.2磅/时 4.8磅/吋 4.8磅/时 8 均勻紫/ 均勻紫/ 6.2磅/时 5.5磅/时 5/2磅/吋 棕色 棕色 9 均勻紫/ 均勻紫/ 6.2磅/时 5.8磅/时 5.0磅/时 棕色 棕色 10 均勻紫/ 均勻紫/ 5.5磅/时 5.0磅/吋 4.8磅/吋 棕色 棕色 11 均勻紫/ 均勻紫/ 5.8磅/时 5.2磅/时 5.2磅/吋 棕色 棕色 12 均勻紫/ 均勻紫/ 6.0磅/吋 5.2磅/吋 4.8磅/时 棕色 棕色 13 均勻紫/ 均勻紫/ 5.5磅/吋 5.0磅/吋 4.8磅/吋 棕色 棕色 14 均勻紫/ 均勻紫/ 5.5磅/吋 5.0磅/时 5.0磅/吋 棕色 棕色 15 均勻紫/ 均勻紫/ 5.5磅/时 5.0磅/时 4.2磅/时 棕色 棕色 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）-16- (請先閱讀背面之注意事項再填寫本頁) 導 •線· 555828 A7 _B7_ 五、發明說明（15 ) 實例明確地證明使用本發明之方法在外觀及黏著性可 得之優點。 比較例 重複實例1，除了在此情形，試驗溶液中之苯并三唑 濃度由4克/公升增至7克/公升。如同實例1,不使用 1-羥基苯并三唑或鉬酸。結果為均勻之粉紅色外觀。在 5 5 0 °F焊錫中得到之剝除強度對0秒、10秒及20秒各為2 . 8 磅/吋、2 · 5磅/吋及2 · 5磅/吋。 -------------------r---訂----------- (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 7 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）Bake T 20% of the tree and ten-spot immersion in the combination of strong adhesion and sticky tree of 0. Measure 5 5 and remove the foil after the strip. The time of the strip is 2 and the self-baking is reported by 31 / body knot. And the table below is (Please read the notes on the back before filling this page) Printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 555828 A7 B7 14 V. Description of the invention () Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. II Real peeling strength after welding. Solder peeling strength. Solder peeling strength. Second 1 Non-uniform dark powder Non-uniform dark powder 3.5 lb / inch 3.2 lb / inch 3.8 lb / inch red red 2 Non-uniform very uneven Very 4.2 lb / hour 3.8 lb / inch 3.8 lb / inch dark pink dark pink 3 Even Brown / Even Brown / 4.8 lbs / hour 4.5 lbs / Inch 4.2 Pink / Inches Pink Pink 4 Even Brown / Even Brown / 5.5 lbs / Inches 5.0 lbs / Inches 5.0 lbs / Inches Pink Pink 5 Powder Dark Brown Powder 6.0 lbs / hour 4.8 lbs / hour 4.8 true / inches 6 even dark brown powder uniform dark brown powder 3.0 lbs / inch 2.0 lbs / hour 1.8 lbs / inch 7 even dark brown powders uniform dark brown powder 5.2 lbs / hour 4.8 lbs / inch 4.8 lbs / hour 8 even violet / even violet / 6.2 pounds / hour 5.5 pounds / hour 5/2 pounds / hour brown brown 9 even violet / even violet / 6.2 pounds / hour 5.8 pounds / hour 5.0 pounds / hour brown brown 10 even violet / even violet / 5.5 lbs / hour 5.0 lbs / inch 4.8 lbs / inch brown brown 11 even purple / even purple / 5.8 lbs / hour 5.2 lbs / hour 5.2 lbs / inch brown brown 12 even purple / even purple / 6.0 lbs / inch 5.2 lbs / 4.8 pounds / hour brown brown 13 even purple / even violet / 5.5 pounds / inch 5.0 pounds / inch 4.8 pounds / inch brown brown 14 even purple / even violet / 5.5 pounds / inch 5.0 pounds / hour 5.0 pounds / hour brown brown 15 Uniform purple / Uniform purple / 5.5 lbs / hour 5.0 lbs / hour 4.2 lbs / hour brown brown This paper is sized for China National Standard (CNS) A4 (210 X 297 mm) -16- (Please read the precautions on the back first (Fill in this page again.) Guideline 555828 A7 _B7_ V. Description of the invention (15) The example clearly proves the use of the present invention. The method of the appearance and adhesion of the advantages available. Comparative Example Example 1 was repeated except that in this case, the benzotriazole concentration in the test solution was increased from 4 g / liter to 7 g / liter. As in Example 1, no 1-hydroxybenzotriazole or molybdic acid was used. The result is a uniform pink appearance. The peel strengths obtained in solder at 550 ° F were 2.8 lbs, 2.5 lbs, and 2.5 lbs, respectively for 0, 10, and 20 seconds. ------------------- r --- Order ----------- (Please read the notes on the back before filling this page) Ministry of Economic Affairs Printed by the Intellectual Property Bureau's Consumer Cooperatives 7 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)