TW553235U - Multilayered non-woven substrate with adhesion-free - Google Patents

Multilayered non-woven substrate with adhesion-free

Info

Publication number
TW553235U
TW553235U TW92201410U TW92201410U TW553235U TW 553235 U TW553235 U TW 553235U TW 92201410 U TW92201410 U TW 92201410U TW 92201410 U TW92201410 U TW 92201410U TW 553235 U TW553235 U TW 553235U
Authority
TW
Taiwan
Prior art keywords
adhesion
free
woven substrate
multilayered non
multilayered
Prior art date
Application number
TW92201410U
Other languages
Chinese (zh)
Inventor
Sheng-Tsai Shie
Original Assignee
Gi Hong Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gi Hong Industry Co Ltd filed Critical Gi Hong Industry Co Ltd
Priority to TW92201410U priority Critical patent/TW553235U/en
Publication of TW553235U publication Critical patent/TW553235U/en

Links

TW92201410U 2003-01-24 2003-01-24 Multilayered non-woven substrate with adhesion-free TW553235U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92201410U TW553235U (en) 2003-01-24 2003-01-24 Multilayered non-woven substrate with adhesion-free

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92201410U TW553235U (en) 2003-01-24 2003-01-24 Multilayered non-woven substrate with adhesion-free

Publications (1)

Publication Number Publication Date
TW553235U true TW553235U (en) 2003-09-11

Family

ID=31886038

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92201410U TW553235U (en) 2003-01-24 2003-01-24 Multilayered non-woven substrate with adhesion-free

Country Status (1)

Country Link
TW (1) TW553235U (en)

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees