TW551542U - Sealing chamber structure improvement of heat dissipation copper pillar - Google Patents

Sealing chamber structure improvement of heat dissipation copper pillar

Info

Publication number
TW551542U
TW551542U TW91216759U TW91216759U TW551542U TW 551542 U TW551542 U TW 551542U TW 91216759 U TW91216759 U TW 91216759U TW 91216759 U TW91216759 U TW 91216759U TW 551542 U TW551542 U TW 551542U
Authority
TW
Taiwan
Prior art keywords
heat dissipation
chamber structure
sealing chamber
structure improvement
copper pillar
Prior art date
Application number
TW91216759U
Other languages
Chinese (zh)
Inventor
Cheng-Jie Yang
Original Assignee
Yeh Chiang Technology Corp
Cheng-Jie Yang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yeh Chiang Technology Corp, Cheng-Jie Yang filed Critical Yeh Chiang Technology Corp
Priority to TW91216759U priority Critical patent/TW551542U/en
Publication of TW551542U publication Critical patent/TW551542U/en

Links

TW91216759U 2002-10-21 2002-10-21 Sealing chamber structure improvement of heat dissipation copper pillar TW551542U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW91216759U TW551542U (en) 2002-10-21 2002-10-21 Sealing chamber structure improvement of heat dissipation copper pillar

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91216759U TW551542U (en) 2002-10-21 2002-10-21 Sealing chamber structure improvement of heat dissipation copper pillar

Publications (1)

Publication Number Publication Date
TW551542U true TW551542U (en) 2003-09-01

Family

ID=31493701

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91216759U TW551542U (en) 2002-10-21 2002-10-21 Sealing chamber structure improvement of heat dissipation copper pillar

Country Status (1)

Country Link
TW (1) TW551542U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107557825A (en) * 2017-07-21 2018-01-09 林进东 The copper powder coat of metal, metal substrate, energy-saving prevention are swollen quick-fried heat abstractor and its preparation technology
CN111867322A (en) * 2020-06-08 2020-10-30 广州大学 Fin radiator

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107557825A (en) * 2017-07-21 2018-01-09 林进东 The copper powder coat of metal, metal substrate, energy-saving prevention are swollen quick-fried heat abstractor and its preparation technology
CN107557825B (en) * 2017-07-21 2019-11-05 林进东 The copper powder coat of metal, metal substrate, energy-saving prevention are swollen quick-fried radiator and its preparation process
CN111867322A (en) * 2020-06-08 2020-10-30 广州大学 Fin radiator

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model