TW549477U - Fixing structure of back plate - Google Patents

Fixing structure of back plate

Info

Publication number
TW549477U
TW549477U TW091200433U TW91200433U TW549477U TW 549477 U TW549477 U TW 549477U TW 091200433 U TW091200433 U TW 091200433U TW 91200433 U TW91200433 U TW 91200433U TW 549477 U TW549477 U TW 549477U
Authority
TW
Taiwan
Prior art keywords
back plate
fixing structure
fixing
plate
Prior art date
Application number
TW091200433U
Other languages
English (en)
Inventor
Wen-Jiun Chen
Shiang-Bin Chen
Hau-Yun Ma
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW091200433U priority Critical patent/TW549477U/zh
Priority to US10/266,738 priority patent/US20030137820A1/en
Publication of TW549477U publication Critical patent/TW549477U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW091200433U 2002-01-18 2002-01-18 Fixing structure of back plate TW549477U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW091200433U TW549477U (en) 2002-01-18 2002-01-18 Fixing structure of back plate
US10/266,738 US20030137820A1 (en) 2002-01-18 2002-10-07 Heat sink securing means with back plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW091200433U TW549477U (en) 2002-01-18 2002-01-18 Fixing structure of back plate

Publications (1)

Publication Number Publication Date
TW549477U true TW549477U (en) 2003-08-21

Family

ID=21688374

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091200433U TW549477U (en) 2002-01-18 2002-01-18 Fixing structure of back plate

Country Status (2)

Country Link
US (1) US20030137820A1 (zh)
TW (1) TW549477U (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016220555B4 (de) 2016-10-20 2019-07-11 Harman Becker Automotive Systems Gmbh Kühlkörperbefestigungssystem und -verfahren
CN109152270B (zh) * 2018-11-21 2024-08-06 博罗县中科达电子有限公司 电路板固定装置

Also Published As

Publication number Publication date
US20030137820A1 (en) 2003-07-24

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees