TW540269B - Method for producing thin film circuit board - Google Patents

Method for producing thin film circuit board Download PDF

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Publication number
TW540269B
TW540269B TW91116310A TW91116310A TW540269B TW 540269 B TW540269 B TW 540269B TW 91116310 A TW91116310 A TW 91116310A TW 91116310 A TW91116310 A TW 91116310A TW 540269 B TW540269 B TW 540269B
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Taiwan
Prior art keywords
circuit board
thin film
film circuit
printed
key
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TW91116310A
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Chinese (zh)
Inventor
Tian-Min Liu
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Zippy Tech Corp
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Publication of TW540269B publication Critical patent/TW540269B/en

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  • Manufacturing Of Printed Wiring (AREA)

Abstract

A method for producing a thin film circuit board comprises: in a situation without jumping wire and avoiding formation of ghost keys, laying out the push button location circuit and matrix; while producing a thin film circuit board, performing a PET heating pre-shrinking on the thin film circuit board; printing a circuit silver slurry on the thin film circuit board; printing an insulative layer or a carbon powder on the printed circuit silver slurry; folding the thin film circuit board in half and performing an ultrasonic joining; pressing a structure hole on the thin film circuit board to complete the production of the thin film circuit board.

Description

540269 五、發明說明⑴ "" "— --— -- ,不ί :f係有關一種薄膜電路板之製造方法,尤指-種 跳線h形及避免龙鍵產生下進行按鍵位置線路及矩陣 板作排列’在根據排列後之鍵位及矩陣進行薄膜電路 般除面上所使用之筆記型電腦上所使用的鍵540269 V. Description of the invention quot " " "-----, not ί: f is related to a method of manufacturing a thin film circuit board, especially-a jumper h-shape and avoid the key position when the key is generated Circuits and matrix boards are arranged 'Keys used on notebook computers used for thin film circuit-like removal of surfaces based on the arranged key positions and matrix

Zcu κ S的按鍵、基板、架橋外,還包含有一薄膜電路 板(Membrane)。此薄膜雷玖六剧仏士 、、 位置佈W春—Μ 1 在^乍時’⑩胃會先將按鍵 爰,再將定義成形之按鍵位置佈局 紐仃按鍵的矩陣(Matrix)排列(如第1圖所 填寫於晶片中。矩陣排列後,再將每-按鍵的位置瑪 由於製造商依據廠商所提供 完成的矩陣位置後,製抨^ i ;; 佈局圖所編排 電路板製作,咖電路板在製作時,首 :反之PET加熱預縮,待前述之pET加熱預縮後,於薄膜J路 ?上P刷線路銀漿,在前述印刷線路銀漿 ^銀漿上印刷絕緣層,在前述之印刷絕 完=線 印刷覆蓋層上印刷跳線之刷完成,再於 後,再印刷跳線之絕緣層及;刷;:跳,銀漿印刷完成 步驟完成後,在進行薄;ΐ:::拼ff述之各種印刷 結構孔等步驟後,即:成薄膜電反波接合與沖壓 此種具有跳線的薄膜電路柘A制 較多,相對製作步驟繁雜;;不但印刷工程 議y作成本提高,相對產能減 540269 五、發明說明(2) $ ’且不良率也高,同時跳線部位產生電路游離現象,造 二:短路比例:’產品的可靠度低,而且跳線印刷處將造 成潯膜電路厚薄不均而影響key in。 ^ β另外,依上述所完成的鍵盤,在使用者操作時,鍵盤 尸二5微處”會不%對掃#㊣Ρ車進行按鍵是否被按下之 ),、s f =疋,用者在按下複合鍵(有三個按鍵被按下 也被按下(如第5m设合鍵時,皆會誤認第四個鍵 造成電腦顯示幕所‘ _:一由所以導致有鬼鍵訊號輸出’ ,在解決上、龙值ί 便;羑是,本發明之主要目的 線的薄膜電路板製:j去避免缺失存纟’本發明利用不跳 低製作成本、提可以減少電路板印刷工程、降 良率所產生之相對也減少製作步驟,而降低不 現象造成微短路,可=夺言:避”線部位產生電路游離 印刷電路更可避免因跳線 鬼鍵產生二ί發明主要是在不跳線情形及避免 製作薄膜電路板日士 Ύ置線路及矩陣(Matrix)排列後,在 待—預縮, 層或印刷碳粉,在ίΓ 刷線路銀聚上印刷絕緣 路板對折進行超立各項印刷步驟完成後’將薄膜電 後,再對薄;ί;ΐ;在薄膜電路板之超音接合完成 ^路板進行沖壓結構孔,在沖壓結構孔完成 第5頁 540269 五、發明說明(3) 時,即完成薄膜電路板之製作。 兹有關本發明之詳細内容及技術說明,現配合圖式說 明如下: ° 請蒼閱「第2、3圖所示」,係本發明之按鍵位置分 佈及薄膜電路板示意圖。如圖所示:本發明之薄膜電路板 之製造方法,主要是在薄膜電路板在排列或安排 (Membrane Layout)製作時,先考慮薄膜電路板在不跳線 情形及避免鬼鍵產生下進行線路的安排(Lay〇ut)後,再定 義矩陣(Matrix)排列後,再提供廠商將每一鍵位的碼填入 於晶片中;此種製作方法可以減少電路板印刷工程、降低 製作成本、提高產能,相對也減少製作步驟,而降低不良 率所產生之損失,同時也可避免跳線部位產生電路游離現 象造成微短路,可增進產品的可靠度,更可避免因跳線印 刷造成薄膜電路厚薄不均影響^乂 in。 首先,讓薄膜式電路板(Membrane Lay〇ut)多声設計 上無任何跳線時,先定義出一按鍵位置佈局圖a,^按鍵 位置佈局,a是將一些相鄰的按鍵a 1集中在一個族群3 2中 再利用溥膜電路多層設計下,再將每一族群心中的每一 按f al之線路a3牽連至薄膜電路板之, 跳線之問題。 |w 二參閱「第2、4圖所示」,係本發明之按鍵位置分 ίifϊ位置的矩陣排列示意圖。如圖所示:在上述每一 的排二i佈局圖a設計完成後,再進行掃描矩陣(Matrix) 、1 ,此矩陣(Matrix)的排列是讓使用者在按下複合鍵Zcu κ S also includes a membrane circuit board (Membrane) outside the keys, substrate, and bridge. In this film, there are six drama warriors, and position cloths in the spring-M1. At the beginning, the stomach will arrange the keys first, and then arrange the matrix that defines the position of the formed keys. Figure 1 is filled in the chip. After the matrix is arranged, the position of each button is determined by the manufacturer based on the matrix position provided by the manufacturer, and the system is criticized. ^ I; During production, first: on the contrary, PET is heated and pre-shrinked. After the aforementioned pET is heated and pre-shrinked, P circuit silver paste is brushed on the film J road ?, and an insulating layer is printed on the aforementioned printed circuit silver paste ^ silver paste. Printing must be finished = the brushes for printing the jumpers on the line printing cover are completed, and then the insulation layer and the brushes of the jumpers are printed; brushes:: jump, thinner after the completion of the silver paste printing steps; ΐ ::: After spelling the various printed structure holes and other steps, that is: forming a thin film electrical reverse wave joint and stamping such a thin film circuit with a jumper. There are more A systems and relatively complicated manufacturing steps; not only does the printing project increase cost , The relative production capacity is reduced by 540269 (2) $ ', and the defect rate is also high. At the same time, the circuit jump phenomenon occurs in the jumper part. The second is the short circuit ratio:' The reliability of the product is low, and the printed circuit of the jumper will cause uneven thickness of the film circuit and affect the key in. ^ Β In addition, according to the keyboard completed above, when the user operates, the keyboard body 5 micrometers "will not% press the key of the scan # ㊣Ρ 车 have been pressed), sf = 疋, the user When pressing the composite key (three keys were pressed and also pressed (for example, when the 5m key is set, the fourth key will mistakenly recognize that the fourth key causes the computer display screen to _: one reason is that there is a ghost key signal output '', In terms of solution, it is convenient; 羑 Yes, the main purpose line of the present invention is the thin film circuit board system: j to avoid the lack of storage 纟 The present invention utilizes non-jumping down production costs, which can reduce circuit board printing engineering and improve quality. The relative rate of production also reduces the number of manufacturing steps, and reduces the phenomenon of micro-short circuit. It can be a jerk: avoiding the “line” circuit. The free printed circuit can avoid the occurrence of jumper ghost keys. Situations and avoid making thin film After the board and the circuit are arranged in the matrix (Matrix), wait for-pre-shrinking, layer or print the toner, and fold the insulating circuit board on the silver line of the brush circuit to fold it in half. After each printing step is completed, the film will be After the electricity is applied, thin; ΐ; ΐ; the ultrasonic bonding of the thin-film circuit board is completed. The circuit board is punched with a structural hole, and the punched structural hole is completed on page 5 540269 5. When the invention is described (3), the thin-film circuit is completed. The detailed content and technical description of the present invention are described below in conjunction with the drawings: ° Please read "shown in Figures 2 and 3", which is a schematic diagram of the key position distribution and thin-film circuit board of the present invention. Shown: The manufacturing method of the thin-film circuit board of the present invention is mainly when the thin-film circuit board is manufactured in an arrangement or arrangement (Membrane Layout), and the thin-film circuit board is first considered to be wired without jumpers and to avoid ghost keys. After the arrangement (Layout), and then define the matrix arrangement, then provide the manufacturer to fill the code of each key in the chip; this production method can reduce circuit board printing engineering and reduce production costs Increasing the production capacity will also reduce the number of manufacturing steps, and reduce the loss caused by the defective rate. At the same time, it can avoid the micro-short circuit caused by the circuit free phenomenon at the jumper position, which can improve the reliability of the product and avoid the thin film circuit caused by jumper printing Uneven thickness affects ^ 乂 in. First of all, let membrane layout design without any jumpers, first define a key position layout a, ^ key position layout, a is to concentrate some adjacent keys a 1 on Under the multi-layer design of the tritium membrane circuit in one group 32, each line in the heart of each group is connected to the thin film circuit board by the line a3, and the problem of jumpers. | w Second, refer to "shown in Figs. 2 and 4", which is a schematic diagram of a matrix arrangement of key positions according to the present invention. As shown in the figure: After the design of the layout i of row two i of each of the above is completed, the scanning matrix (Matrix) and 1 are performed. The arrangement of this matrix is for the user to press the composite key

540269 五、發明說明(4) ~ —1— 1 f會產生任何的鬼鍵訊號輸出,以避免使用者輸入 1曰為之子元。而在編排矩陣(tr丨χ)前,會於上述之按鍵 位置佈局圖a的每一按鍵al上編制有但不限於〇1至丨26的號 碼,=這些號碼即代表每一按鍵“預以填寫的位置。然: ,在這些號碼中,有些未出現之號碼乃是因應不同國家古五 言的使用,才會有些號碼未出現於按鍵位置佈局圖a中厂 且矩陣(Matrix)的排列也是依據所編排之號碼直接編排於 掃描矩陣(Matrix)的x、y軸陣列中,而在編排時,首 要將各種狀態的複合鍵。先定義出,再將複合鍵c中不能 共線或呈十字共線排列之按鍵al先排列後,再將其餘的 鍵依序編排於矩陣(Matrix)之X、y軸上。 而所謂的複合鍵c,就是當使用者在鍵盤上操作,必 須於電腦顯示幕上執行特殊功能、文字(語言)、數據或 符號顯示時,使用必須同時執行至少兩個按鍵以上時,此 特殊功能、文字(語言)、數據或符號才會顯現出來,例 如,目4電腦在重新開機時,使用者會於鍵盤上執行 CTRL、ALT、DEL按鍵,在此複合鍵c執行後,電腦便會自 動重新開機,或者按下SHIFT、ALT、D按鍵時,在電腦^頁 不幕上則會出現當日日期的字串顯示。所以,在編排矩陣 (Matrix)時,有兩個按鍵CTRL、ALT或SHIFT、UT就不能 編排在同一條x軸或y軸的掃描線上,或者口叽、从丁此 DEL鍵或SHIFT、ALT、D按鍵是不能呈一十字共線的排列, 因為CTRL、ALT或SHIFT、ALT同在X軸或y軸,或者 CTRL、ALT、DEL鍵或SHIFT、ALT、D按鍵呈十字共線,在540269 V. Description of the invention (4) ~ — 1— 1 f will produce any ghost key signal output to avoid user inputting 1 as its son. Before the matrix (tr 丨 χ) is arranged, numbers on the buttons a1 of the above-mentioned key position layout a are programmed but are not limited to 〇1 to 丨 26, = these numbers represent each key "pre- Fill in the position. However: Among these numbers, some of the numbers that do not appear are due to the use of ancient Wuyan in different countries, and some numbers do not appear in the key position layout a. The arrangement of the matrix is also According to the number arranged, it is directly arranged in the x and y-axis arrays of the scanning matrix (Matrix), and when it is arranged, the composite keys of various states are first defined. Then, the composite key c cannot be collinear or crossed. The collinear keys al are arranged first, and then the remaining keys are sequentially arranged on the X and y axes of the matrix. The so-called compound key c is when the user operates on the keyboard and must be displayed on the computer. When performing a special function, text (language), data or symbol display on the screen, this special function, text (language), data or symbol will only appear when you use at least two keys at the same time. When the computer is restarted, the user will execute the CTRL, ALT, and DEL keys on the keyboard. After the compound key c is executed, the computer will automatically restart, or when the SHIFT, ALT, and D keys are pressed, the computer ^ If the page is off the screen, the date of the day will be displayed. Therefore, when you arrange the matrix, you cannot arrange it on the same x-axis or y-axis scan line with two keys CTRL, ALT or SHIFT, and UT. , Or the word of mouth, the DEL key or the SHIFT, ALT, D keys cannot be arranged in a cross line, because CTRL, ALT or SHIFT, ALT are on the X or y axis, or CTRL, ALT, DEL Or the SHIFT, ALT, and D keys are collinear.

第7頁 540269 五、發明說明(5) --------—-一~-一_,一 二個按鍵同時被按下後,在微處理器對掃描矩陣(Matrix) 二X阳y軸作掃描時,微處理器會誤認第四個按鍵也被按 ,因此就會產生鬼鍵訊號輸出,此時在電腦顯示幕之字 t ^就會多一個字元顯示,而此字元也非是使用者所需的 :肊、文字、數據或符號’導致使用者必須再執行或操作 ,、他按鍵’才可將多出來之字元刪除,造成使用者的使用 不便。 請參閱「第5圖所示」,係為CTRL、ALT、DEL鍵呈十 字共線示意圖。如圖所示:為了讓審查委員能更加瞭解為 何CTRL、ALT或SHIFT、ALT就不能編排在同一條1軸或7 軸的掃描線上,或者CTRL、ALT、DEL鍵或SHIFT、ALT、D 按鍵是不能呈一十字共線的排列,因為CTRL、alt鍵若是 在同條x軸或y軸知描線上’或C T R L、A L T ' D E L鍵呈十 字共線排列時,在CTRL、ALT、DEL鍵被同時按下,在微處 理器作矩陣之掃描時,會誤認第四個按鍵也被按下,因此 產生一鬼鍵訊號輸出,結果在電腦顯示幕之字串上便會多 出一個字元’此字元將造成使用者在使用上諸多不便。 在上述之複合鍵c的位置編排後,再進行其他按鍵a 1的編排。如是,在按鍵位置佈局圖a及掃描矩陣 (Matr iX)編排完成後’再將這兩部份交給廠商,廠商再自 行將每一按鍵的碼填寫入於晶片中,即完成一個無任何跳 線及產生鬼鍵訊號輸出之薄膜鍵盤製作。 請參閱第6圖所示」’係本發明之薄膜電路板製作 流程示思圖。如圖所示·依上述之條件在製作薄膜電路板Page 7 of 540269 V. Description of the invention (5) ------------- One ~ -One_, after one or two keys are pressed at the same time, the microprocessor scans the matrix (Matrix) X X When the y-axis is scanned, the microprocessor will mistakenly recognize that the fourth key is also pressed, so a ghost key signal output will be generated. At this time, the character t ^ on the computer display screen will be displayed by one more character, and this character It ’s not what the user needs: 肊, text, data, or symbols' cause the user to perform or operate again, and he presses the key to delete the extra characters, causing inconvenience to the user. Please refer to "shown in Figure 5", which is a cross-line diagram of the CTRL, ALT, and DEL keys. As shown in the figure: In order for the review committee to better understand why CTRL, ALT or SHIFT, ALT cannot be arranged on the same 1-axis or 7-axis scan line, or CTRL, ALT, DEL or SHIFT, ALT, D are Can not be in a collinear arrangement, because if the CTRL and alt keys are on the same x-axis or y-axis tracing line, or the CTRL, ALT, and DEL keys are in a collinear arrangement, the CTRL, ALT, and DEL keys are simultaneously When pressed, when the microprocessor scans the matrix, it will mistakenly recognize that the fourth key is also pressed, so a ghost key signal output is generated. As a result, one more character will be added to the string on the computer display screen. Characters will cause users a lot of inconvenience. After the position of the composite key c is arranged, the other keys a 1 are arranged. If so, after the layout of the key position layout a and the scanning matrix (Matr iX) are completed, then the two parts are handed over to the manufacturer, and the manufacturer then fills in the code of each key into the chip by itself, which completes a jump without any The production of thin-film keyboards that produce line and ghost key signal output. Please refer to FIG. 6 "'is a schematic diagram of the manufacturing process of the thin film circuit board of the present invention. As shown in the figure, the thin film circuit board is manufactured under the above conditions

第8頁 540269 五、發明說明(6) 時,首先,先進行舊 之pet加熱預縮於m之^加熱預縮1 ,待前述 在前述印刷線路銀槳、'寻膜包路板上印刷線路銀漿2, 緣層3或印刷碳粉^^丄再於印刷線路銀漿2上印刷絕 薄膜電路板對折進行=述之各項印刷步驟完成後,將 接合完成後,在對每胺:/妾合5 ’在薄膜電路板之超音 結構孔6完成時以!路板進行沖麼結構孔6,在沖厂堅 由於薄臈電路製作。 件下,在製作薄膜電路柄/跳線及避免鬼鍵產生之條 製作步驟,讓製作±更加^工^的步驟較傳,统省去多項 大幅降。 更力名工4,省工序,更讓製作成本 發明ΐΪΞί二發,並非用來限定本 變化細…=範圍所做的均等 540269 圖式簡單說明 【圖式說明】 第1圖,為傳統矩陣編排示意圖。 第2圖,係本發明之按鍵位置分佈示意圖。 第3圖,係本發明之薄膜電路板示意圖。 第4圖,係本發明之按鍵位置的矩陣排列示意圖。 第5圖,係為CTRL、ALT、DEL鍵呈十字共線示意圖。 第6圖,係本發明之薄膜電路板製作流程示意圖。 【圖式之標號說明】 按鍵位置佈局圖............a 按鍵................a 1 族群................a 2 線路................a 3 排線.............. · · · b 才复I鍵................c PET加熱預縮.............1 印刷線路銀漿.............2 印刷絕緣層..............3 印刷石炭粉··.......······ 4 對折進行超音波接合· · · · 5 沖壓結構孔..............6Page 540269 V. Description of the invention (6), first, the old pet heating pre-shrinking to m ^ heating pre-shrinking 1 is to be printed on the silver paddle of the aforementioned printed circuit, and the printed circuit on the 'finding membrane board' Silver paste 2, edge layer 3 or printing toner ^^ 丄 and then printed on the printed circuit silver paste 2 to fold the insulating film circuit board in half. After the printing steps described above are completed, after the bonding is completed, for each amine: / Coupling 5 'at the completion of the supersonic structure hole 6 of the thin film circuit board! The circuit board is punched with structural holes 6, which are made in the punching plant due to the thin concrete circuit. In the process of making thin-film circuit handles / jumpers and strips that avoid ghost keys, the production steps make the steps of making ± more workable, which saves a lot of reductions. Even more famous workers 4, save the process, let the production cost invented twice, not used to limit the details of this change ... = range of equal 540269 simple illustration [illustration of the diagram] Figure 1, is a schematic diagram of traditional matrix layout . Fig. 2 is a schematic diagram showing the distribution of key positions of the present invention. FIG. 3 is a schematic diagram of a thin film circuit board of the present invention. FIG. 4 is a matrix arrangement diagram of key positions according to the present invention. Figure 5 is a cross-line diagram of the CTRL, ALT, and DEL keys. FIG. 6 is a schematic diagram of a manufacturing process of a thin film circuit board of the present invention. [Explanation of Labels in the Drawings] Button Position Layout ......... a Button ... a 1 Group ... .... a 2 circuit ... a 3 cable ......... b only I key ... c PET heating pre-shrinking ... 1 printed circuit silver paste ... ....... 2 Printed insulation layer .............. 3 Printed charcoal powder ............... 4 Ultrasonic bonding by folding in half · · · · 5 Punching structural holes .............. 6

第10頁Page 10

Claims (1)

540269 、申請專利範圍 1 、一種薄膜電路板之制 避免鬼鍵產生下進行按鍵位I磕 要疋在不跳線情形及 a b 後,在製作薄膜電: = = ;矩嶋r耐 先進行薄膜電路=加熱預縮,· 路銀漿'月J之⑽加熱預縮後,於薄膜電路板上印刷線 層在前述印刷線路銀浆I,再於印刷線路銀裝上印刷 η ί前述之各項印刷步驟完成後’將薄膜電路板對拼 進仃超音波接合; 包吟攸對折 二在前述之薄膜電路板之超音接合完成後, ::板進行沖壓結構孔,在沖壓結構 以 腠電路板之製作。 λ 了即凡成缚 【、如申請專利範圍第1項所述之薄臈電路板之制 忐,該印刷絕緣層後,可再印刷一層碳粉。 D万540269, application patent scope 1, a system of a thin film circuit board to avoid the occurrence of ghost keys to perform the key position I should be in the case of no jumper and ab, in the production of thin film electricity: = =; = Heating pre-shrinking. · After heating and pre-shrinking the silver paste on the road, the printed wire layer is printed on the thin-film circuit board on the aforementioned printed circuit silver paste I, and then printed on the printed circuit silver. After the steps are completed, the thin film circuit board is spliced into the ultrasonic bonding; Bao Yinyou folds in two. After the aforementioned ultrasonic bonding of the thin film circuit board is completed, the :: plate is punched with structural holes. Production. λ If you get a binding, [such as the thin 臈 circuit board made of 所述 mentioned in the first patent application scope, after printing the insulating layer, you can print another layer of toner. D million 第11頁Page 11
TW91116310A 2002-07-23 2002-07-23 Method for producing thin film circuit board TW540269B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI391842B (en) * 2009-04-08 2013-04-01 Silitek Electronic Guangzhou Method and system of detecting hidden ghost keys in the keyboard matrix
CN106373817A (en) * 2015-07-21 2017-02-01 祯信股份有限公司 Thin film switch and circuit setting method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI391842B (en) * 2009-04-08 2013-04-01 Silitek Electronic Guangzhou Method and system of detecting hidden ghost keys in the keyboard matrix
CN106373817A (en) * 2015-07-21 2017-02-01 祯信股份有限公司 Thin film switch and circuit setting method thereof

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