TW537495U - The metal pad design for wire-bonding of integrated circuit - Google Patents

The metal pad design for wire-bonding of integrated circuit

Info

Publication number
TW537495U
TW537495U TW091209984U TW91209984U TW537495U TW 537495 U TW537495 U TW 537495U TW 091209984 U TW091209984 U TW 091209984U TW 91209984 U TW91209984 U TW 91209984U TW 537495 U TW537495 U TW 537495U
Authority
TW
Taiwan
Prior art keywords
bonding
wire
integrated circuit
metal pad
pad design
Prior art date
Application number
TW091209984U
Other languages
Chinese (zh)
Inventor
Chi-Yu Feng
Original Assignee
Megawin Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Megawin Technology Co Ltd filed Critical Megawin Technology Co Ltd
Priority to TW091209984U priority Critical patent/TW537495U/en
Publication of TW537495U publication Critical patent/TW537495U/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
TW091209984U 2002-07-02 2002-07-02 The metal pad design for wire-bonding of integrated circuit TW537495U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW091209984U TW537495U (en) 2002-07-02 2002-07-02 The metal pad design for wire-bonding of integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW091209984U TW537495U (en) 2002-07-02 2002-07-02 The metal pad design for wire-bonding of integrated circuit

Publications (1)

Publication Number Publication Date
TW537495U true TW537495U (en) 2003-06-11

Family

ID=29247497

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091209984U TW537495U (en) 2002-07-02 2002-07-02 The metal pad design for wire-bonding of integrated circuit

Country Status (1)

Country Link
TW (1) TW537495U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7696626B2 (en) 2004-12-16 2010-04-13 Samsung Electronics Co., Ltd. Semiconductor device and method of arranging pad thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7696626B2 (en) 2004-12-16 2010-04-13 Samsung Electronics Co., Ltd. Semiconductor device and method of arranging pad thereof

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees